ST VND920 User Manual

VND920

Double channel high-side solid-state relay

Features

Type	RDS(on)	IOUT	VCC
VND920	16 mΩ	35 A(1)	36 V

1.Per channel with all the output pins connected to the PCB.

■CMOS compatible input

■Proportional load current sense

■Shorted load protection

■Undervoltage and overvoltage shutdown

■Overvoltage clamp

■Thermal shutdown

■Current limitation

■Protection against loss of ground and loss of VCC

■Very low standby power dissipation

■Reverse battery protected

SO-28 (double island)

Description

The VND920 is a double chip device designed in STMicroelectronics™ VIPower™ M0-3 technology. The VND920 is intended for driving any type of load with one side connected to ground. The active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart protects the device against overload.

The device integrates an analog current sense output which delivers a current proportional to the load current. The device automatically turns off in the case where the ground pin becomes disconnected.

Table 1.	Device summary
	Package		Order codes
		Tube		Tape and reel
	SO-28	VND920		VND92013TR

February 2011

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www.st.com

Contents	VND920

Contents

1	Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 5
2	Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 7
	2.1	Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	2.2	Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	8
	2.3	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	9
	2.4	Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
3	Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		17
	3.1	GND protection network against reverse battery . . . . . . . . . . . . . . . . . . .	17

3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 17 3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 18

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19

4	Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		20
	4.1	SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	20
5	Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		23
	5.1	ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	23
	5.2	SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
6	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		25

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VND920	List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 6. Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 7. VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 8. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 9. Current sense (9 V £ VCC £ 16 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 10. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 13. Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 14. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 15. SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

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List of figures	VND920

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 5. IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 8. High-level input current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 10. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 11. Over-voltage shutdown. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 15. Input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 18. Input low-level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 20. Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 21. SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 22. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 21 Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 24. Thermal fitting model of a double channel HSD in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 25. SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 26. SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 27. SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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VND920	Block diagram and pin description

1 Block diagram and pin description

Figure 1.	Block diagram
			VCC 1
	VCC	OVERVOLTAGE
	CLAMP	DETECTION
		UNDERVOLTAGE
		DETECTION
GND 1		Power CLAMP
		DRIVER
INPUT 1		LOGIC	OUTPUT 1
		CURRENT LIMITER
		VDS LIMITER
		IOUT	CURRENT
		K	SENSE 1
	OVERTEMPERATURE
		DETECTION
			VCC 2
	VCC	OVERVOLTAGE
	CLAMP	DETECTION
		UNDERVOLTAGE
		DETECTION
GND 2		Power CLAMP
		DRIVER
INPUT 2		LOGIC	OUTPUT 2
		CURRENT LIMITER
		VDS LIMITER
		IOUT	CURRENT
		K	SENSE 2
	OVERTEMPERATURE
		DETECTION

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Block diagram and pin description								VND920
	Figure 2. Configuration diagram (top view)
	VCC 1							VCC1
						1	28
	GND 1							OUTPUT 1
	INPUT 1							OUTPUT 1
	CURRENT SENSE 1							OUTPUT 1
	NC							OUTPUT 1
	NC							OUTPUT 1
	VCC 1							OUTPUT 1
	VCC 2							OUTPUT 2
	GND 2							OUTPUT 2
	INPUT 2							OUTPUT 2
	CURRENT SENSE 2							OUTPUT 2
	NC							OUTPUT 2
	NC							OUTPUT 2
	VCC 2					14	15	VCC 2

Table 2.	Suggested connections for unused and not connected pins
Connection / pin		Current Sense	N.C.	Output	Input
Floating			X	X	X
To ground		Through 1KΩ	X		Through 10KΩ
		resistor			resistor

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VND920	Electrical specifications

2 Electrical specifications

Figure 3. Current and voltage conventions

IS1		IS2
VCC1	VCC2	VF1	(*)	VCC2
VCC1
IIN1	OUTPUT1	IOUT1
INPUT1				VOUT1
		ISENSE1
VIN1
CURRENT SENSE 1		VSENSE1
IIN2	OUTPUT2	IOUT2
		VOUT2
INPUT2
VIN2		ISENSE2
CURRENT SENSE 2		VSENSE2
GROUND1	GROUND2
IGND1	IGND2

Note:

VFn = VCCn - VOUTn during reverse battery condition.

2.1Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document.

	Table 3.	Absolute maximum ratings
	Symbol	Parameter	Value	Unit
	VCC	DC supply voltage	41	V
	-VCC	Reverse DC supply voltage	- 0.3	V
	-Ignd	DC reverse ground pin current	- 200	mA
	IOUT	DC output current	Internally limited	A
	-IOUT	Reverse DC output current	- 21	A
	IIN	DC input current	+/- 10	mA
	VCSENSE	Current sense maximum voltage	- 3	V
			+ 15	V
		Electrostatic discharge
		(human body model: R = 1.5 KΩ; C = 100 pF)
	VESD	– INPUT	4000	V
		– CURRENT SENSE	2000	V
		– OUTPUT	5000	V
		– VCC	5000	V

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Electrical specifications				VND920
	Table 3.	Absolute maximum ratings (continued)
	Symbol	Parameter	Value		Unit
		Maximum switching energy
	EMAX	(L = 0.25 mH; RL = 0 Ω; Vbat = 13.5 V;	355		mJ
		Tjstart = 150 °C; IL = 45 A)
	Ptot	Power dissipation TC ≤ 25 °C	6.25		W
	Tj	Junction operating temperature	Internally limited		°C
	Tc	Case operating temperature	- 40 to 150		°C
	Tstg	Storage temperature	- 55 to 150		°C

2.2Thermal data

Table 4.	Thermal data (per island)
Symbol	Parameter	Value			Unit
Rthj-lead	Thermal resistance junction-lead	20			°C/W
Rthj-amb	Thermal resistance junction-ambient (one chip ON)	60(1)		45(2)	°C/W
Rthj-amb	Thermal resistance junction-ambient (two chips ON)	46(1)		32(2)	°C/W

1.When mounted on a standard single-sided FR-4 board with 1cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.

2.When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.

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