ST VND920 User Manual
Double channel high-side solid-state relay
Features
Typ e R
VND920 16 mΩ 35 A
1. Per channel with all the output pins connected to the
PCB.
)I
DS(on
OUT
(1)
V
CC
36 V
VND920
■ CMOS compatible input
■ Proportional load current sense
■ Shorted load protection
■ Undervoltage and overvoltage shutdown
■ Overvoltage clamp
■ Thermal shutdown
■ Current limitation
■ Protection against loss of ground and loss of
V
CC
■
Very low standby power dissipation
■ Reverse battery protected
Table 1. Device summary
SO-28 (double island)
Description
The VND920 is a double chip device designed in
STMicroelectronics™ VIPower™ M0-3
technology. The VND920 is intended for driving
any type of load with one side connected to
ground. The active V
protects the device against low energy spikes
(see ISO7637 transient compatibility table). Active
current limitation combined with thermal
shutdown and automatic restart protects the
device against overload.
The device integrates an analog current sense
output which delivers a current proportional to the
load current. The device automatically turns off in
the case where the ground pin becomes
disconnected.
pin voltage clamp
CC
Order codes
Package
Tube Tape and reel
SO-28 VND920 VND92013TR
February 2011 Doc ID 7767 Rev 5 1/26
www.st.com
1
Contents VND920
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 17
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 18
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26 Doc ID 7767 Rev 5
VND920 List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 6. Switching (V
Table 7. V
Table 8. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 9. Current sense (9 V £ VCC £ 16 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 13. Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 14. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 15. SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
= 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
Doc ID 7767 Rev 5 3/26
List of figures VND920
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. I
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Over-voltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 15. Input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 18. Input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 21. SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 22. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 21
Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 24. Thermal fitting model of a double channel HSD in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 25. SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 26. SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 27. SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
OUT/ISENSE
versus I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
OUT
4/26 Doc ID 7767 Rev 5
VND920 Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
V
1
CC
GND 1
INPUT 1
GND 2
V
CC
CLAMP
OVERTEMPERATURE
DETECTION
V
CC
CLAMP
LOGIC
OVERVOLTAGE
DETECTION
UNDERVOLTAGE
DETECTION
DRIVER
CURRENT LIMITER
VDS LIMITER
I
OVERVOLTAGE
DETECTION
UNDERVOLTAGE
DETECTION
Power CLAMP
OUTPUT 1
OUT CURRENT
Power CLAMP
K
SENSE 1
V
CC
2
DRIVER
INPUT 2
LOGIC
OVERTEMPERATURE
DETECTION
CURRENT LIMITER
VDS LIMITER
I
OUT CURRENT
K
OUTPUT 2
SENSE 2
Doc ID 7767 Rev 5 5/26
Block diagram and pin description VND920
Figure 2. Configuration diagram (top view)
V
1
CC
1
GND 1
INPUT 1
CURRENT SENSE 1
NC
NC
1
V
CC
V
2
CC
GND 2
INPUT 2
CURRENT SENSE 2
NC
NC
2
V
CC
Table 2. Suggested connections for unused and not connected pins
Connection / pin Current Sense N.C. Output Input
Floating X X X
14
28
15
V
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
V
CC
CC
1
2
To ground
Through 1KΩ
resistor
X
Through 10KΩ
resistor
6/26 Doc ID 7767 Rev 5
VND920 Electrical specifications
2 Electrical specifications
Figure 3. Current and voltage conventions
I
S1
V
CC1
I
Note: V
Fn
= V
CCn
- V
IN1
V
IN1
I
IN2
V
IN2
during reverse battery condition.
OUTn
INPUT1
INPUT2
GROUND1
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to Absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics sure
program and other relevant quality document.
Table 3. Absolute maximum ratings
I
GND1
V
CC2
OUTPUT1
OUTPUT2
GROUND2
V
CC1
CURRENT SENSE 1
CURRENT SENSE 2
I
GND2
I
OUT1
I
SENSE1
I
OUT2
I
SENSE2
V
SENSE2
V
V
V
OUT2
I
S2
(*)
F1
SENSE1
V
OUT1
V
CC2
Symbol Parameter Value Unit
V
-V
-I
I
OUT
-I
OUT
I
V
CSENSE
CC
gnd
IN
DC supply voltage 41 V
Reverse DC supply voltage - 0.3 V
CC
DC reverse ground pin current - 200 mA
DC output current Internally limited A
Reverse DC output current - 21 A
DC input current +/- 10 mA
Current sense maximum voltage
- 3
+ 15
V
V
Electrostatic discharge
(human body model: R = 1.5 KΩ; C=100pF)
V
ESD
–INPUT
– CURRENT SENSE
–OUTPUT
–V
CC
4000
2000
5000
5000
V
V
V
V
Doc ID 7767 Rev 5 7/26
Electrical specifications VND920
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Maximum switching energy
E
MAX
P
T
T
T
stg
(L = 0.25 mH; R
T
= 150 °C; IL=45A)
jstart
Power dissipation TC≤ 25 °C 6.25 W
tot
Junction operating temperature Internally limited °C
j
Case operating temperature - 40 to 150 °C
c
=0Ω; V
L
=13.5V;
bat
Storage temperature - 55 to 150 °C
355 mJ
2.2 Thermal data
Table 4. Thermal data (per island)
Symbol Parameter Value Unit
R
thj-lead
R
thj-amb
R
thj-amb
1. When mounted on a standard single-sided FR-4 board with 1cm2 of Cu (at least 35 µm thick) connected to
all VCC pins. Horizontal mounting and no artificial air flow.
2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to
all VCC pins. Horizontal mounting and no artificial air flow.
Thermal resistance junction-lead 20 °C/W
Thermal resistance junction-ambient (one chip ON) 60
Thermal resistance junction-ambient (two chips ON) 46
(1)
(1)
45
32
(2)
(2)
°C/W
°C/W
8/26 Doc ID 7767 Rev 5
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