How it Works
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VND830MSP-E
User Manual
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ST VND830MSP-E User Manual

Features
Typ e R
DS(on)
VND830MSP-E 60 mΩ 6A
1. Per channel
■ ECOPACK
■ Automotive Grade: compliance with AEC
®
guidelines
■ Very low standby current
■ CMOS compatible input
■ On-state open-load detection
■ Off-state open-load detection
■ Thermal shutdown protection and diagnosis
■ Undervoltage shutdown
■ Overvoltage clamp
■ Output stuck to V
■ Load current limitation
■ Reverse battery protection
■ Electrostatic discharge protection
detection
CC
I
OUT
(1)
V
CC
36 V
VND830MSP-E
Double channel high-side driver
10
1
PowerSO-10
Description
The VND830MSP-E is a monolithic device made using STMicroelectronics™ VIPower™ M0-3 technology. It is intended for driving any kind of load with one side connected to ground. Active V
pin voltage clamp protects the device against
CC
low energy spikes (see ISO7637 transient compatibility table).
Active current limitation combined with thermal shutdown and automatic restart protects the device against overload.
The device detects open-load condition both in on-state and off-state. Output shorted to V detected in the off-state. The open-load threshold is aimed at detecting the 5 W/12 V standard bulb as an open-load fault in the on-state.
Device automatically turns off in case of ground pin disconnection.
CC
is

Table 1. Device summary

Order codes
Package
Tube Tape and reel
PowerSO-10™ VND830MSP-E VND830MSPTR-E
February 2011 Doc ID 10903 Rev 3 1/28
www.st.com
1
Contents VND830MSP-E
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 17
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 18
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.5 PowerSO-10 maximum demagnetization energy (V
= 13.5 V) . . . . . . . 20
CC
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2/28 Doc ID 10903 Rev 3
VND830MSP-E List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Switching (V
Table 7. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 8. V
- output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
Table 9. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 10. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 11. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 13. Electrical transient requirements on V Table 14. Electrical transient requirements on V Table 15. Electrical transient requirements on V
Table 16. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 17. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
= 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
CC
pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
CC
pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
CC
pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
CC
Doc ID 10903 Rev 3 3/28
List of figures VND830MSP-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 11. Status low output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. Satus clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13. On-state resistance vs T Figure 14. On-state resistance vs V
Figure 15. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 16. Open-load off-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 17. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 19. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 20. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 21. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 22. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 23. I
LIM
vs T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
case
Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 26. Maximum turn- off current versus load inductance Figure 27. PowerSO-10 PC board
Figure 28. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 29. PowerSO-10 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . 22
Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . 22
Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 32. PowerSO-10 suggested pad layout and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . 26
Figure 33. Tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
CC
(1)
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4/28 Doc ID 10903 Rev 3
VND830MSP-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

V
cc
V
GND
INPUT1
STATUS1
INPUT2
STATUS2
cc
CLAMP
OVER TEMP. 1
OVER TEMP. 2
LOGIC
OVERVO LTAGE
UNDERVOLTAGE
CLAMP 1
DRIVER 1
CURRENT LIMITER 1
OPEN LOAD ON 1
OPEN LOAD OFF 1
CLAMP 2
DRIVER 2
CURRENT LIMITER 2
OPEN LOAD ON 2
OPEN LOAD OFF 2
OUTPUT1
OUTPUT2

Figure 2. Configuration diagram (top view)

GROUND INPUT 1
STATUS 1 STAT US 2 INPUT 2
6 7
8 9
10
5 4 3
2
1
11
V
CC
OUTPUT 1 OUTPUT 1 N.C. OUTPUT 2 OUTPUT 2
PowerSO-10

Table 2. Suggested connections for unused and not connected pins

Connection / pin Status N.C. Output Input
Floating X X X X
To ground X
Through 10KΩ
resistor
Doc ID 10903 Rev 3 5/28
Electrical specifications VND830MSP-E

2 Electrical specifications

Figure 3. Current and voltage conventions

I
S
V
CC
I
IN1
V
IN1
V
STAT1
I
STAT1
I
IN2
V
IN2
I
STAT2
V
STAT2
INPUT1
STATUS 1
INPUT2
STATUS 2
GND
OUTPUT1
OUTPUT2
I
GND
I
OUT1
I
OUT2
V
OUT2
(1)
V
F1
V
OUT1
V
CC
1. VFn = V
CCn
- V
during reverse battery condition.
OUTn

2.1 Absolute maximum ratings

Stressing the device above the rating listed in Tabl e 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit
V
-V
- I
I
-I
I
V
CC
GND
OUT
OUT
I
IN
STAT
ESD
DC supply voltage 41 V
Reverse DC supply voltage -0.3 V
CC
DC reverse ground pin current -200 mA
DC output current Internally limited A
Reverse DC output current -6 A
DC input current +/- 10 mA
CD status current +/- 10 mA
Electrostatic discharge (Human Body Model: R=1.5KΩ; C=100pF)
– INPUT –STATUS –OUTPUT –V
CC
4000 4000 5000 5000
V V V V
6/28 Doc ID 10903 Rev 3
VND830MSP-E Electrical specifications
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Maximum switching energy
E
T
MAX
P
T
T
STG
(L = 0.18 mH; R T
= 150 °C; IL=9A)
jstart
Power dissipation at Tc= 25 °C 73.5 W
tot
Junction operating temperature Internally limited °C
j
Case operating temperature -40 to 150 °C
c
=0Ω; V
L
=13.5V;
bat
Storage temperature -55 to 150 °C
100 mJ

2.2 Thermal data

Table 4. Thermal data

Symbol Parameter Value Unit
R
thj-case
R
thj-amb
1. When mounted on a standard single sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick). Horizontal mounting and no artificial air flow.
2. When mounted on a standard single sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick). Horizontal mounting and no artificial air flow.
Thermal resistance junction-case 1.7 °C/W
Thermal resistance junction-ambient 51.7
(1)
37
(2)
°C/W
Doc ID 10903 Rev 3 7/28
Electrical specifications VND830MSP-E

2.3 Electrical characteristics

Values specified in this section are for 8 V < V
< 36 V; -40 °C < Tj < 150 °C, unless
CC
otherwise specified. (Per each channel).

Table 5. Power output

Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
V
V
USD
V
R
I
I
L(off1)
I
L(off2)
I
L(off3)
I
L(off4)
Operating supply voltage 5.5 13 36 V
CC
(1)
Undervoltage shutdown 3 4 5.5 V
(1)
Overvoltage shutdown 36 V
OV
I
=2A; Tj=25°C 60 mΩ
On-state resistance
ON
(1)
Supply current
S
Off-state output current VIN=V
Off-state output current VIN=0V; V
Off-state output current
Off-state output current
OUT
=2A; V
I
OUT
Off-state; V V
IN=VOUT
Off-state; V V
IN=VOUT
On-state; V I
=0A
OUT
OUT
V
IN=VOUT
=125°C
T
j
V
IN=VOUT
Tj =25°C
8V 120 mΩ
CC >
=13V;
CC
=0V
=13V;
CC
=0V; Tj=25°C
=13V; VIN=5V;
CC
12 40 µA
12 25 µA
57mA
= 0 V 0 50 µA
=3.5V -75 0 µA
OUT
=0V; VCC=13V;
=0V; VCC=13V;
5µA
3µA
1. Per device.

Table 6. Switching (VCC=13V)

Symbol Parameter Test conditions Min Typ Max Unit
t
d(on)
t
d(off)
(dV
OUT
(dV
OUT

Table 7. Logic input

Turn-on delay time
Turn-on delay time
/dt)onTurn-on voltage slope
/dt)
Turn-off voltage slope
off
L
to V
R edge to V
R to V
R to V
=1.3V
OUT
=6.5Ω from VIN falling
L
=6.5Ω from V
L
OUT
=6.5Ω from V
L
OUT
=11.7V
OUT
=10.4V
=1.3V
OUT
OUT
=1.3V
=11.7V
53060µs
10 30 70 µs
0.15
0.1
See
Figure 21
See
Figure 22
1.5 V/µs
0.75 V/µs
=6.5Ω from VIN rising edge
R
Symbol Parameter Test conditions Min Typ Max Unit
V
I
Input low level 1.25 V
IL
Low level input current VIN=1.25V 1 µA
IL
8/28 Doc ID 10903 Rev 3
VND830MSP-E Electrical specifications
Table 7. Logic input (continued)
Symbol Parameter Test conditions Min Typ Max Unit
V
I
V
I(hyst)
V
Tabl e 8. V
Input high level 3.25 V
IH
High level input current VIN= 3.25 V 10 µA
IH
Input hysteresis voltage 0.5 V
I
=1mA 6 6.8 8 V
Input clamp voltage
ICL
- output diode
CC
IN
I
=-1mA -0.7 V
IN
Symbol Parameter Test conditions Min Typ Max Unit
V

Table 9. Status pin

Forward on voltage -I
F
= 1.3 A; Tj= 150 °C - - 0.6 V
OUT
Symbol Parameter Test conditions Min Typ Max Unit
Status low output voltage I
V
STAT
I
LSTAT
C
V
Status leakage current Normal operation; V
Status pin input
STAT
capacitance
Status clamp voltage
SCL
= 1.6 mA 0.5 V
STAT
= 5 V 10 mA
STAT
Normal operation; V
I
= 1 mA 6 6.8 8 V
STAT
= -1 mA -0.7 V
I
STAT
= 5 V 100 pF
STAT

Table 10. Protection

(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
T
t
V
demag
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
Shutdown temperature 150 175 200 °C
TSD
Reset temperature 135 °C
T
R
Thermal hysteresis 7 15 °C
hyst
Status delay in overload
SDL
conditions
I
Current limitation
lim
Turn-off output clamp voltage
diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.
T
> T
j
TSD
V
=13V 6 9 15 A
CC
5.5 V < V
I
OUT
<36V 15 A
CC
=2A; L=6mH VCC-41 VCC-48 VCC-55 V
20 µs
Doc ID 10903 Rev 3 9/28
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