ST VND830MSP-E User Manual

VND830MSP-E

Double channel high-side driver

Features

Type	RDS(on)	IOUT	VCC
VND830MSP-E	60 mΩ	6 A(1)	36 V

1. Per channel

■ECOPACK®: lead free and RoHS compliant

■Automotive Grade: compliance with AEC guidelines

■Very low standby current

■CMOS compatible input

■On-state open-load detection

■Off-state open-load detection

■Thermal shutdown protection and diagnosis

■Undervoltage shutdown

■Overvoltage clamp

■Output stuck to VCC detection

■Load current limitation

■Reverse battery protection

■Electrostatic discharge protection

10

1

PowerSO-10

Description

The VND830MSP-E is a monolithic device made using STMicroelectronics™ VIPower™ M0-3 technology. It is intended for driving any kind of load with one side connected to ground. Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table).

Active current limitation combined with thermal shutdown and automatic restart protects the device against overload.

The device detects open-load condition both in on-state and off-state. Output shorted to VCC is detected in the off-state. The open-load threshold is aimed at detecting the 5 W/12 V standard bulb as an open-load fault in the on-state.

Device automatically turns off in case of ground pin disconnection.

Table 1.	Device summary
	Package		Order codes
		Tube		Tape and reel
	PowerSO-10™	VND830MSP-E		VND830MSPTR-E

February 2011

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Contents	VND830MSP-E

Contents

1	Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 5
2	Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 6
	2.1	Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	6
	2.2	Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	2.3	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	8
	2.4	Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	14
3	Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		17
	3.1	GND protection network against reverse battery . . . . . . . . . . . . . . . . . . .	17

3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 17 3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 18

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.5 PowerSO-10 maximum demagnetization energy (VCC = 13.5 V) . . . . . . . 20

4	Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		21
	4.1	PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	21
5	Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		24
	5.1	ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
	5.2	PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
	5.3	PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
6	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		27

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VND830MSP-E	List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 6. Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 7. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 8. VCC - output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 10. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 11. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 13. Electrical transient requirements on VCC pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 14. Electrical transient requirements on VCC pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 15. Electrical transient requirements on VCC pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 16. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 17. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

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List of figures	VND830MSP-E

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 10. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 11. Status low output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 12. Satus clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 13. On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 14. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 15. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 16. Open-load off-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 17. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 19. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 20. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 21. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 22. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 23. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 26. Maximum turnoff current versus load inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 27. PowerSO-10 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 28. Rthj-amb vs PCB copper area in open box free air condition. . . . . . . . . . . . . . . . . . . . . . . 21 Figure 29. PowerSO-10 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . 22 Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . 22 Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 32. PowerSO-10 suggested pad layout and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . 26 Figure 33. Tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

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VND830MSP-E	Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

			Vcc
	Vcc	OVERVOLTAGE
	CLAMP
		UNDERVOLTAGE
	GND	CLAMP 1
	INPUT1	DRIVER 1	OUTPUT1
	STATUS1		CLAMP 2
		CURRENT LIMITER 1	DRIVER 2
		LOGIC
	OVERTEMP. 1		OUTPUT2
		OPEN LOAD ON 1
	INPUT2		CURRENT LIMITER 2
		OPEN LOAD OFF 1	OPEN LOAD ON 2
	STATUS2
			OPEN LOAD OFF 2
	OVERTEMP. 2

Figure 2. Configuration diagram (top view)

GROUND	6	5	OUTPUT 1
INPUT 1	7	4	OUTPUT 1
STATUS 1	8	3	N.C.
STATUS 2	9	2	OUTPUT 2
INPUT 2	10	1	OUTPUT 2
	11
	VCC
	PowerSO-10

Table 2.	Suggested connections for unused and not connected pins
Connection / pin		Status	N.C.	Output	Input
Floating		X	X	X	X
To ground			X		Through 10KΩ
					resistor

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Electrical specifications	VND830MSP-E

2 Electrical specifications

Figure 3. Current and voltage conventions

IS

VCC

VCC

V

(1)

IIN1

INPUT1

OUTPUT1

IOUT1

F1

VIN1

V

ISTAT1

OUT1

STATUS 1

VSTAT1

IOUT2

IIN2

OUTPUT2

INPUT2

VIN2 I

VOUT2

STAT2

STATUS 2

VSTAT2

GND

IGND

1. VFn = VCCn - VOUTn during reverse battery condition.

2.1Absolute maximum ratings

Stressing the device above the rating listed in Table 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document.

	Table 3.	Absolute maximum ratings
	Symbol	Parameter	Value	Unit
	VCC	DC supply voltage	41	V
	-VCC	Reverse DC supply voltage	-0.3	V
	- IGND	DC reverse ground pin current	-200	mA
	IOUT	DC output current	Internally limited	A
	-IOUT	Reverse DC output current	-6	A
	IIN	DC input current	+/- 10	mA
	ISTAT	CD status current	+/- 10	mA
		Electrostatic discharge (Human Body Model:
		R = 1.5 KΩ; C = 100 pF)	4000	V
		– INPUT
	VESD		4000	V
		– STATUS
		– OUTPUT	5000	V
			5000	V
		– VCC

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VND830MSP-E						Electrical specifications
	Table 3.	Absolute maximum ratings (continued)
	Symbol	Parameter				Value	Unit
		Maximum switching energy
	EMAX	(L = 0.18 mH; R = 0 Ω; V	bat	= 13.5 V;		100	mJ
		L
		Tjstart = 150 °C; IL = 9 A)
	Ptot	Power dissipation at Tc = 25 °C				73.5	W
	Tj	Junction operating temperature				Internally limited	°C
	Tc	Case operating temperature				-40 to 150	°C
	TSTG	Storage temperature				-55 to 150	°C

2.2Thermal data

Table 4.	Thermal data
Symbol	Parameter	Value			Unit
Rthj-case	Thermal resistance junction-case	1.7			°C/W
Rthj-amb	Thermal resistance junction-ambient	51.7(1)		37(2)	°C/W

1.When mounted on a standard single sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick). Horizontal mounting and no artificial air flow.

2.When mounted on a standard single sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick). Horizontal mounting and no artificial air flow.

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Electrical specifications	VND830MSP-E

2.3Electrical characteristics

Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless otherwise specified. (Per each channel).

Table 5.

Power output

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

(1)

Operating supply voltage

5.5

13

36

V

VCC

(1)

Undervoltage shutdown

3

4

5.5

V

VUSD

(1)

Overvoltage shutdown

36

V

VOV

RON

On-state resistance

IOUT = 2 A; Tj = 25 °C

60

mΩ

IOUT = 2 A; VCC > 8 V

120

mΩ

Off-state; VCC = 13 V;

12

40

µA

VIN = VOUT = 0 V

IS(1)

Supply current

Off-state; VCC=13V;

12

25

µA

VIN = VOUT = 0 V; Tj = 25 °C

On-state; VCC = 13 V; VIN = 5 V;

5

7

mA

IOUT = 0 A

IL(off1)

Off-state output current

VIN = VOUT = 0 V

0

50

µA

IL(off2)

Off-state output current

VIN = 0 V; VOUT = 3.5 V

-75

0

µA

IL(off3)

Off-state output current

VIN = VOUT = 0 V; VCC = 13 V;

5

µA

Tj = 125 °C

IL(off4)

Off-state output current

VIN = VOUT = 0 V; VCC = 13 V;

3

µA

Tj = 25 °C

1. Per device.

Table 6.

Switching (VCC = 13 V)

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

td(on)

Turn-on delay time

RL = 6.5 Ω from VIN rising edge

5

30

60

µs

to VOUT = 1.3 V

td(off)

Turn-on delay time

RL = 6.5 Ω from VIN falling

10

30

70

µs

edge to VOUT = 11.7 V

(dVOUT/dt)on

Turn-on voltage slope

RL = 6.5 Ω from VOUT = 1.3 V

0.15

See

1.5

V/µs

to VOUT = 10.4 V

Figure 21

(dVOUT/dt)off

Turn-off voltage slope

RL = 6.5 Ω from VOUT = 11.7 V

0.1

See

0.75

V/µs

to VOUT = 1.3 V

Figure 22

Table 7.

Logic input

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

VIL

Input low level

1.25

V

IIL

Low level input current

VIN = 1.25 V

1

µA

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VND830MSP-E

Electrical specifications

Table 7.

Logic input (continued)

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

VIH

Input high level

3.25

V

IIH

High level input current

VIN = 3.25 V

10

µA

VI(hyst)

Input hysteresis voltage

0.5

V

VICL

Input clamp voltage

IIN = 1 mA

6

6.8

8

V

IIN = -1 mA

-0.7

V

Table 8.

VCC - output diode

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

VF

Forward on voltage

-IOUT = 1.3 A; Tj = 150 °C

-

-

0.6

V

Table 9.

Status pin

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

VSTAT

Status low output voltage

ISTAT = 1.6 mA

0.5

V

ILSTAT

Status leakage current

Normal operation; VSTAT = 5 V

10

mA

CSTAT

Status pin input

Normal operation; VSTAT = 5 V

100

pF

capacitance

VSCL

Status clamp voltage

ISTAT = 1 mA

6

6.8

8

V

ISTAT = -1 mA

-0.7

V

Table 10.

Protection(1)

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

TTSD

Shutdown temperature

150

175

200

°C

TR

Reset temperature

135

°C

Thyst

Thermal hysteresis

7

15

°C

tSDL

Status delay in overload

Tj > TTSD

20

µs

conditions

Ilim

Current limitation

VCC = 13 V

6

9

15

A

5.5 V < VCC < 36 V

15

A

Vdemag

Turn-off output clamp

IOUT = 2 A; L = 6 mH

VCC-41

VCC-48

VCC-55

V

voltage

1.To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.

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