ST VND830MSP User Manual

VND830MSP

Double channel high-side driver

Features

Type	RDS(on)	IOUT	VCC
VND830MSP	60 mΩ(1)	6 A(1)	36 V

1. Per each channel.

■CMOS compatible inputs

■Open drain status outputs

■On-state open-load detection

■Off-state open-load detection

■Shorted load protection

■Undervoltage and overvoltage shutdown

■Loss of ground protection

■Very low standby current

■Reverse battery protection

10

1

PowerSO-10

Description

The VND830MSP is a monolithic device designed in STMicroelectronics™ VIPower™ M0-3 Technology. The VND830MSP is intended for driving any type of multiple load with one side connected to ground.

The Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart protects the device against overload.

The current limitation threshold is aimed at detecting the 21 W / 12 V standard bulb as an overload fault.

The device detects the open-load condition in both the on and off-state. In the off-state the device detects if the output is shorted to VCC. The device automatically turns off in the case where the ground pin becomes disconnected.

Table 1.	Device summary
	Package		Order codes
		Tube		Tape and reel
	PowerSO-10	VND830MSP		VND830MSP13TR
October 2010		Doc ID 7379 Rev 4	1/27
				www.st.com

Contents	VND830MSP

Contents

1	Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 5
2	Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 6
	2.1	Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	6
	2.2	Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	2.3	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	2.4	Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	13
3	Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		16
	3.1	GND protection network against reverse battery . . . . . . . . . . . . . . . . . . .	16

3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 16

3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 17

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.5 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 19

4	Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		20
	4.1	PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	20
5	Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		23
	5.1	ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	23
	5.2	PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	23
	5.3	PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	25
6	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		26

2/27	Doc ID 7379 Rev 4

VND830MSP	List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 7. VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 8. Switching (VCC = 13 V; Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 10. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 11. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 13. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 14. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 15. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Doc ID 7379 Rev 4

3/27

List of figures	VND830MSP

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 10. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 11. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 19. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 20. Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 21. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 22. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 23. Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 26. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 27. PowerSO-10 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 28. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 29. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . 21 Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 32. PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 33. PowerSO-10 tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4/27	Doc ID 7379 Rev 4

VND830MSP	Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

			Vcc
	Vcc	OVERVOLTAGE
	CLAMP
		UNDERVOLTAGE
	GND	CLAMP 1
	INPUT1	DRIVER 1	OUTPUT1
	STATUS1		CLAMP 2
		CURRENT LIMITER 1	DRIVER 2
		LOGIC
	OVERTEMP. 1		OUTPUT2
		OPEN LOAD ON 1
	INPUT2		CURRENT LIMITER 2
		OPEN LOAD OFF 1	OPEN LOAD ON 2
	STATUS2
			OPEN LOAD OFF 2
	OVERTEMP. 2

Figure 2. Configuration diagram (top view)

GROUND

INPUT 1

STATUS 1

STATUS 2

INPUT 2

VCC

6	5	OUTPUT 1
7	4	OUTPUT 1
8	3	N.C.
9	2	OUTPUT 2
10	1	OUTPUT 2
	11

Table 2.	Suggested connections for unused and not connected pins
Connection / pin		Status	N.C.	Output	Input
Floating		X	X	X	X
To ground			X		Through 10 KΩ
					resistor

Doc ID 7379 Rev 4

5/27

Electrical specifications	VND830MSP

2 Electrical specifications

2.1Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document.

Table 3.	Absolute maximum ratings
Symbol		Parameter				Value	Unit
VCC	DC supply voltage					41	V
- VCC	Reverse DC supply voltage					-0.3	V
- IGND	DC reverse ground pin current					-200	mA
IOUT	DC output current					Internally limited	A
- IOUT	Reverse DC output current					-6	A
IIN	DC input current					+/-10	mA
ISTAT	DC Status current					+/-10	mA
	Electrostatic discharge (human body model: R = 1.5 KΩ;
	C = 100 pF)
VESD	– INPUT					4000	V
	– STATUS					4000	V
	– OUTPUT					5000	V
	– VCC					5000	V
	Maximum switching energy
EMAX	(L = 1.8 mH; R = 0 Ω; V	bat	= 13.5 V; T	jstart	= 150 °C;	100	mJ
	L
	IL = 9 A)
Ptot	Power dissipation (per island) at Tlead = 25 °C					73.5	W
Tj	Junction operating temperature					Internally limited	°C
Tc	Case operating temperature					-40 to 150
Tstg	Storage temperature					-55 to 150	°C

6/27	Doc ID 7379 Rev 4

VND830MSP	Electrical specifications

2.2Thermal data

Table 4.	Thermal data (per island)
Symbol	Parameter	Value			Unit
Rthj-lead	Thermal resistance junction-lead	1.7			°C/W
Rthj-amb	Thermal resistance junction-ambient	51.7(1)		37(2)	°C/W

1.When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.

2.When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.

2.3Electrical characteristics

Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless otherwise stated.

Figure 3. Current and voltage conventions

IS

IIN1

VF1

(*)

VCC

INPUT 1

VCC

VIN1

ISTAT1

IOUT1

STATUS 1

OUTPUT 1

VSTAT1

IIN2

VOUT1

INPUT 2

IOUT2

VIN2

ISTAT2

OUTPUT 2

STATUS 2

VOUT2

GND

VSTAT2

IGND

Note:

VFn = VCCn - VOUTn during reverse battery condition.

Doc ID 7379 Rev 4

7/27

Electrical specifications						VND830MSP
	Table 5.	Power output
	Symbol	Parameter	Test conditions	Min.	Typ.		Max.	Unit
	VCC	Operating supply		5.5	13		36	V
		voltage
	VUSD	Undervoltage shutdown		3	4		5.5	V
	VOV	Overvoltage shutdown		36				V
	RON	On-state resistance	IOUT = 0.5 A; Tj = 25 °C				60	mΩ
			IOUT = 0.5 A; VCC > 8 V				120	mΩ
			Off-state; VCC = 13 V;		12		40	µA
			VIN = VOUT = 0 V
	IS	Supply current	Off-state; VCC = 13 V;		12		25	µA
			VIN = VOUT = 0 V; Tj = 25 °C
			On-state; VCC = 13 V; VIN = 5 V;		5		7	mA
			IOUT = 0 A
	IL(off1)	Off-state output current	VIN = VOUT = 0 V	0			50	µA
	IL(off2)	Off-state output current	VIN = 0 V; VOUT = 3.5 V	-75			0	µA
	IL(off3)	Off-state output current	VIN = VOUT = 0 V; VCC = 13 V;				5	µA
			Tj = 125 °C
	IL(off4)	Off-state output current	VIN = VOUT = 0 V; VCC = 13 V;				3	µA
			Tj = 25 °C

	Table 6.	Protections
	Symbol	Parameter	Test conditions	Min.	Typ.	Max.	Unit
	TTSD	Shutdown temperature		150	175	200	°C
	TR	Reset temperature		135			°C
	Thyst	Thermal hysteresis		7	15		°C
	tSDL	Status delay in overload	Tj > TTSD			20	µs
		conditions
	Ilim	Current limitation	VCC = 13 V	6	9	15	A
			5.5 V < VCC < 36 V			15	A
	Vdemag	Turn-off output clamp voltage	IOUT = 2 A; L = 6 mH	VCC -	VCC -	VCC -	V
				41	48	55
Note:	To ensure long term reliability under heavy overload or short circuit conditions, protection
	and related diagnostic signals must be used together with a proper software strategy. If the
	device is subjected to abnormal conditions, this software must limit the duration and number
	of activation cycles.

8/27	Doc ID 7379 Rev 4

VND830MSP

Electrical specifications

Table 7.

VCC - output diode

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

VF

Forward on voltage

- IOUT = 1.3 A; Tj = 150 °C

—

—

0.6

V

Table 8.

Switching (VCC = 13 V; Tj = 25 °C)

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

td(on)

RL = 6.5 Ω from VIN rising

Turn-on delay time

edge to VOUT = 1.3 V

5

30

60

µs

(see Figure 5)

td(off)

RL = 6.5 Ω from VIN falling

Turn-off delay time

edge to VOUT = 11.7 V

10

30

70

µs

(see Figure 5)

dVOUT/dt(on)

RL = 6.5 Ω from VOUT = 1.3 V

See

Turn-on voltage slope

to VOUT = 10.4 V

0.15

Figure 10

1.5

V/µs

(see Figure 5)

RL = 6.5 Ω from VOUT = 11.7 V

See

dVOUT/dt(off)

Turn-off voltage slope

to VOUT = 1.3 V

0.1

Figure 12

0.75

V/µs

(see Figure 5)

Table 9.

Logic inputs

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

VIL

Input low level

1.25

V

IIL

Low level input current

VIN = 1.25 V

1

µA

VIH

Input high level

3.25

V

IIH

High level input current

VIN = 3.25 V

10

µA

VI(hyst)

Input hysteresis voltage

0.5

V

VICL

Input clamp voltage

IIN = 1 mA

6

6.8

8

V

IIN = -1 mA

-0.7

V

Table 10.

Status pin

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

VSTAT

Status low output voltage

ISTAT = 1.6 mA

0.5

V

ILSTAT

Status leakage current

Normal operation; VSTAT = 5 V

10

µA

CSTAT

Status pin Input capacitance

Normal operation; VSTAT = 5 V

100

pF

VSCL

Status clamp voltage

ISTAT = 1 mA

6

6.8

8

V

ISTAT = - 1 mA

-0.7

V

Doc ID 7379 Rev 4

9/27