The VND830LSP is a monolith ic device made by
usingSTMicroelectronics VIPower M0-3
Technology, i ntended for dr iving any ki nd of load
with one side connected to ground.
Active VCC pin voltage clamp protec ts the device
against low energy spikes (see ISO7637 transient
BLO C K DIAGRA M
10
1
PowerSO-10
™
compatibility table). Active current limitation
combined with thermal shutdown a nd automatic
restart protects the device against over load. The
device detects open load condition both in on and
off state. The openload threshold is aimed at
detecting the 5W/12V standard bulb as an
openload fault in the on state. Device
automatically turns off in case of ground pin
disconnection.
V
CC
V
CC
CLAMP
GND
INPUT1
STATUS1
OVERTEMP. 1
INPUT2
STATUS2
OVERTEMP. 2
(**) See application schematic at page 8
LOGIC
OVERVOLTAGE
UNDERVOLTAGE
CLAMP 1
DRIVER 1
CURRENT LIMITER 1
OPENLOAD ON 1
OPENLOAD OFF 1
CLAMP 2
DRIVER 2
CURRENT LIMITER 2
OPENLOAD ON 2
OPENLOAD OFF 2
OUTPUT1
OUTPUT2
March 20 031/18
VND830LSP
ABSOLUTE MAXIMUM RATI NG
SymbolParameterValueUnit
tot
DC Supply Voltag e41V
Reverse DC Supply Voltage- 0.3V
CC
DC Reverse Ground Pin Current- 200mA
DC Output CurrentInternally LimitedA
Reverse DC Output Current - 6A
DC Input Current+/- 10mA
DC Status Cur rent+/- 10mA
Electros tatic Dischar ge (Human Bod y Model: R=1.5K Ω; C=100pF)
- INPUT
- STATUS
- OUTPU T
- V
CC
4000
4000
5000
5000
Powe r Dissipation TC=25°C74W
Maximum Switching Energy
(L=0.14m H; R
Junction Operating TemperatureInternally Limited°C
j
Case Operating Temperature- 40 to 150°C
c
=0Ω; V
L
=13.5V ; T
bat
=150ºC ; IL=14A)
jstart
52mJ
Storage Temperature- 55 to 150°C
V
CC
- V
- I
GND
I
OUT
- I
OUT
I
IN
I
STAT
V
ESD
P
E
MAX
T
T
T
stg
CONNECTION DIAGRAM (TOP VIEW)
V
V
V
V
GROUND
INPUT 1
STATUS 1
STATUS 2
INPUT 2
V
CC
CURRENT AND VOLTAGE CONVENTIONS
I
IN1
I
V
IN1
V
STAT1
STAT1
I
IN2
I
V
STAT2
IN2
V
STAT2
INPUT 1
STATUS 1
INPUT 2
STATUS 2
6
7
8
9
10
11
5
4
3
2
1
V
CC
OUTPUT 1
OUTPUT 1
N.C.
OUTPUT 2
OUTPUT 2
I
OUT1
I
S
V
CC
OUTPUT 1
V
OUT1
I
OUT2
V
OUT2
GND
OUTPUT 2
I
GND
2/18
1
VND830LSP
THERMAL DATA
SymbolParameterValueUnit
R
thj-case
R
thj-amb
(*) When mounted on a standard single-sided FR-4 board with 50mm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial air
CAll functions of the device are performed as designed after exposure to disturbance.
EOne or more functions of the device is not performed as designed after exposure and cannot be returned
to proper operation without replacing the device.
IIIIIIIVDela ys and
IIIIIIIV
TEST LEVELS
TEST LEVELS R ESULTS
Impedance
Ω
Ω
6/18
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