ST VND810PEP-E User Manual
Features
Type R
VND810PEP-E 160mW
DS(on)
(1)
I
OUT
3.5A
(1)
V
CC
36V
VND810PEP-E
Double channel high-side driver
1. Per each channel.
■ CMOS compatible inputs
■ Open drain status outputs
■ On-state open-load detection
■ Off-state open-load detection
■ Shorted load protection
■ Undervoltage and overvoltage shutdown
■ Loss of ground protection
■ Very low standby current
■ Reverse battery protection
■ In compliance with the 2002/95/EC european
directive
Table 1. Device summary
PowerSSO-12
Description
The VND810PEP-E is a monolithic device made
using| STMicroelectronics
Technology. The VND810PEP-E is intended for
driving any type of multiple load with one side
connected to ground.
The active V
pin voltage clamp protects the
CC
device against low energy spikes (see ISO7637
transient compatibility table).
Active current limitation combined with thermal
shutdown and automatic restart protects the
device against overload. The device detects the
open-load condition in both the on and off-state.
In the off-state the device detects if the output is
shorted to V
. The device automatically turns off
CC
in the case where the ground pin becomes
disconnected.
®
VIPower™ M0-3
Order codes
Package
Tub e Tap e and r eel
PowerSSO-12 VND810PEP-E VND810PEPTR-E
November 2011 Doc ID 10858 Rev 5 1/25
www.st.com
1
Contents VND810PEP-E
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 14
3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 14
3.1.2 Solution 2: a diode (D
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
) in the ground line . . . . . . . . . . . . . . . . . . . . 15
GND
3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 PowerSSO-12 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/25 Doc ID 10858 Rev 5
VND810PEP-E List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. V
Table 8. Switching (V
Table 9. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 10. Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 11. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 12. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 13. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 14. Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 15. Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 16. Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 17. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 18. PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 19. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
- output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
= 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
Doc ID 10858 Rev 5 3/25
List of figures VND810PEP-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 9. PowerSSO-12 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. Rthj-amb vs. PCB copper area in open box free air condition (one channel ON). . . . . . . . 17
Figure 11. PowerSSO-12 thermal impedance junction ambient single pulse (one channel ON). . . . . 18
Figure 12. Thermal fitting model of a double channel HSD in PowerSSO-12 . . . . . . . . . . . . . . . . . . . 18
Figure 13. PowerSSO-12 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 14. PowerSSO-12 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 15. PowerSSO-12 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4/25 Doc ID 10858 Rev 5
VND810PEP-E Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
V
cc
V
GND
INPUT1
STATUS1
INPUT2
STATUS2
cc
CLAMP
OVERTEMP. 1
OVERTEMP. 2
LOGIC
OVERVOLTAGE
UNDERVOLTAGE
CLAMP 1
DRIVER 1
CURRENT LIMITER 1
OPEN-LOAD ON 1
OPEN-LOAD OFF 1
CLAMP 2
DRIVER 2
CURRENT LIMITER 2
OPEN-LOAD ON 2
OPEN-LOAD OFF 2
OUTPUT1
OUTPUT2
Figure 2. Configuration diagram (top view)
GND
NC
INPUT1
STATUS1
STATUS2
INPUT2
Table 2. Suggested connections for unused and not connected pins
Connection / pin Status Not connected Output Input
Floating X X X X
To ground X
1
2
3
4
5
6
12
11
10
9
8
7
V
cc
OUTPUT1
OUTPUT1
OUTPUT2
OUTPUT2
V
cc
TAB = V
cc
Through 10KΩ
resistor
Doc ID 10858 Rev 5 5/24
Electrical specifications VND810PEP-E
2 Electrical specifications
2.1 Absolute maximum ratings
Stressing the device above the rating listed in Table 3: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document available on www.st.com.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
V
- V
- I
I
- I
I
V
T
CC
CC
GND
OUT
OUT
I
IN
STAT
ESD
P
tot
T
T
c
stg
DC supply voltage 41 V
Reverse DC supply voltage - 0.3 V
DC reverse ground pin current - 200 mA
DC output current Internally limited A
Reverse DC output current - 6 A
DC input current +/- 10 mA
DC Status current +/- 10 mA
Electrostatic discharge (human body model: R=1.5KΩ;
C = 100pF)
- INPUT
- STATUS
- OUTPUT
- V
CC
4000
4000
5000
5000
Power dissipation (per island) at TC = 25°C 54 W
Junction operating temperature Internally limited °C
j
Case operating temperature - 40 to 150 °C
Storage temperature - 55 to 150 °C
V
V
V
V
6/24 Doc ID 10858 Rev 5
VND810PEP-E Electrical specifications
2.2 Thermal data
Table 4. Thermal data (per island)
Symbol Parameter Maximum value Unit
R
thj-case
R
thj-amb
1. When mounted on a standard single-sided FR-4 board with 1cm2 of Cu (at least 35 µm thick) connected to
all V
2. When mounted on a standard single-sided FR-4 board with 8cm2 of Cu (at least 35 µm thick) connected to
all V
Thermal resistance junction-case 2.3 °C/W
Thermal resistance junction-ambient
(one chip ON)
pins.
CC
pins.
CC
2.3 Electrical characteristics
Values specified in this section are for 8V < V
otherwise stated.
Figure 3. Current and voltage conventions
I
INn
V
INn
V
STATn
I
STATn
INPUTn
STATUSn
(1)
61
< 36V; -40°C < Tj < 150°C, unless
CC
V
(*)
F1
V
CC
I
OUTn
OUTPUTn
V
GND
50
OUTn
(2)
°C/W
I
S
V
CC
Note: V
Fn
= V
CCn
- V
during reverse battery condition.
OUTn
Doc ID 10858 Rev 5 7/24
I
GND
Electrical specifications VND810PEP-E
Table 5. Power outputs
Symbol Parameter Test conditions Min Typ Max Unit
V
CC
V
USD
V
OV
R
ON
I
S
I
L(off1)
I
L(off2)
I
L(off3)
I
L(off4)
Operating supply
voltage
5.5 13 36 V
Undervoltage shutdown 3 4 5.5 V
Overvoltage shutdown 36 V
12
12
5
160
320mΩmΩ
40
µA
25
µA
7
mA
5µA
3µA
On-state resistance
Supply current
Off-state output current V
Off-state output current V
Off-state output current
Off-state output current
I
= 1A; Tj = 25°C
OUT
= 1A; V
I
OUT
Off-state; V
= V
V
IN
OUT
Off-state; V
= V
V
IN
OUT
Tj = 25°C
On-state; V
= 0A
I
OUT
= V
IN
OUT
= 0V; V
IN
V
= V
IN
OUT
Tj = 125°C
V
= V
IN
OUT
Tj = 25°C
> 8V
CC
= 13V;
CC
= 0V
= 13V;
CC
= 0V;
= 13V; V
CC
IN
= 5V;
= 0V 0 50 µA
= 3.5V -75 0 µA
OUT
= 0V; V
= 0V; V
CC
CC
= 13V;
= 13V;
Table 6. Protections and diagnostics
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
T
t
SDL
I
V
demag
Shutdown temperature 150 175 200 °C
TSD
T
Reset temperature 135 °C
R
Thermal hysteresis 7 15 °C
hyst
Status delay in overload
conditions
Current limitation
lim
Turn-off output clamp
voltage
T
j
V
CC
5.5V < V
I
= 1A; L = 6mH
OUT
> T
= 13V
CC
TSD
< 36V
3.5 5 7.5
V
-41V
CC
CC
-48V
20 µs
7.5AA
-
CC
55
V
Note: To ensure long term reliability under heavy overload or short circuit conditions, protection
and related diagnostic signals must be used together with a proper software strategy. If the
device is subjected to abnormal conditions, this software must limit the duration and number
of activation cycles.
8/24 Doc ID 10858 Rev 5
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