ST VND810P-E User Manual

VND810P-E

Double channel high-side driver

Features

Type	RDS(on)	IOUT	VCC
VND810P-E	160 mΩ(1)	3.5 A(1)	36 V

1. Per each channel.

■ECOPACK®: lead free and RoHS compliant

■Automotive Grade: compliance with AEC Guidelines

■Very low standby current

■CMOS compatible input

■On-state open-load detection

■Off-state open-load detection

■Thermal shutdown protection and diagnosis

■Undervoltage shutdown

■Overvoltage clamp

■Output stuck to VCC detection

■Load current limitation

■Reverse battery protection

■Electrostatic discharge protection

SO-16

Description

The VND810P-E is a monolithic device designed in STMicroelectronics™ VIPower™ M0-3 technology, intended for driving any kind of load with one side connected to ground.

Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table).

Active current limitation combined with thermal shutdown and automatic restart protect the device against overload.

The device detects open-load condition both in on-state and off-state. Output shorted to VCC is detected in the off-state. Device automatically turns off in case of ground pin disconnection.

Table 1.	Device summary
	Package		Order codes
		Tube		Tape and reel
	SO-16	VND810P-E		VND810PTR-E

July 2010

Doc ID 17606 Rev 1

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www.st.com

Contents	VND810P-E

Contents

1	Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 5
2	Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 6
	2.1	Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	6
	2.2	Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	2.3	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	2.4	Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	14
3	Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		17
	3.1	GND protection network against reverse battery . . . . . . . . . . . . . . . . . . .	17

3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 17

3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 18

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.5 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 20

4	Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		21
	4.1	SO-16 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	21
5	Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		24
	5.1	ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
	5.2	SO-16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
	5.3	SO-16 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
6	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		27

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VND810P-E	List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 7. VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 8. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 9. Switching (VCC = 13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 10. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 11. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 13. Electrical transient requirements (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 14. Electrical transient requirements (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 15. Electrical transient requirements (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 16. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 17. SO-16 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

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List of figures	VND810P-E

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 10. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 11. Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 12. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 13. On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 14. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 15. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 16. Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 17. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 19. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 20. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 21. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 22. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 23. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 26. Maximum turn-off current versus load inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 27. SO-16 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 28. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 21 Figure 29. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 30. Thermal fitting model of a quad channel HSD in SO-16. . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 31. SO-16 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 32. SO-16 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 33. SO-16 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

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VND810P-E	Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

			Vcc
	Vcc	OVERVOLTAGE
	CLAMP
		UNDERVOLTAGE
	GND	CLAMP 1
	INPUT1	DRIVER 1	OUTPUT1
	STATUS1		CLAMP 2
		CURRENT LIMITER 1	DRIVER 2
		LOGIC
	OVERTEMP. 1		OUTPUT2
		OPEN LOAD ON 1
	INPUT2		CURRENT LIMITER 2
		OPEN LOAD OFF 1	OPEN LOAD ON 2
	STATUS2
			OPEN LOAD OFF 2
	OVERTEMP. 2

Figure 2. Configuration diagram (top view)

				VCC
VCC		1	16
N.C.				VCC
GND				OUTPUT 1
INPUT 1				OUTPUT 1
STATUS 1				OUTPUT 2
STATUS 2				OUTPUT 2
INPUT 2				VCC
VCC		8	9	VCC

Table 2.	Suggested connections for unused and not connected pins
Connection / pin		Status	N.C.	Output	Input
Floating		X	X	X	X
To ground			X		Through 10KΩ
					resistor

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Electrical specifications	VND810P-E

2 Electrical specifications

2.1Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document.

	Table 3.	Absolute maximum ratings
	Symbol	Parameter	Value	Unit
	VCC	DC supply voltage	41	V
	- VCC	Reverse DC supply voltage	- 0.3	V
	- IGND	DC reverse ground pin current	- 200	mA
	IOUT	DC output current	Internally limited	A
	- IOUT	Reverse DC output current	- 6	A
	IIN	DC input current	+/- 10	mA
	ISTAT	DC Status current	+/- 10	mA
		Electrostatic discharge (human body model: R=1.5KΩ;
		C = 100pF)
	VESD	– INPUT	4000	V
		– STATUS	4000	V
		– OUTPUT	5000	V
		– VCC	5000	V
	EMAX	Maximum switching energy	26	mJ
		(L = 1.5mH; RL = 0Ω; Vbat = 13.5V; Tjstart = 150ºC; IL = 5A)
	Ptot	Power dissipation (per island) at Tlead = 25°C	8.3	W
	Tj	Junction operating temperature	Internally limited	°C
	Tc	Case operating temperature	- 40 to 150
	Tstg	Storage temperature	- 55 to 150	°C

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VND810P-E	Electrical specifications

2.2Thermal data

Table 4.	Thermal data (per island)
Symbol	Parameter	Value			Unit
Rthj-lead	Thermal resistance junction-lead	15			°C/W
Rthj-amb	Thermal resistance junction-ambient	77(1)		57(2)	°C/W

1.When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.

2.When mounted on a standard single-sided FR-4 board with 4 cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.

2.3Electrical characteristics

Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless otherwise stated.

Figure 3. Current and voltage conventions

				IS
IIN1			VF1	(1)
				VCC
	INPUT 1	VCC
VIN1	ISTAT1	OUTPUT 1		IOUT1
	STATUS 1
VSTAT1	IIN2			VOUT1
	INPUT 2		IOUT2
VIN2	ISTAT2
		OUTPUT 2		VOUT2
	STATUS 2
	GND
	VSTAT2
		IGND
1. VFn = VCCn - VOUTn during reverse battery condition.

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Electrical specifications

VND810P-E

Table 5.

Power output

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

(1)

Operating supply

VCC

voltage

5.5

13

36

V

(1)

Undervoltage shutdown

3

4

5.5

V

VUSD

(1)

Overvoltage shutdown

36

V

VOV

RON

On-state resistance

IOUT = 1 A; Tj = 25 °C

160

mΩ

IOUT = 1 A; VCC > 8 V

320

mΩ

Off-state; VCC = 13 V;

12

40

µA

VIN = VOUT = 0 V

I (1)

Off-state; VCC = 13 V;

Supply current

V

IN

= V

= 0 V;

12

25

µA

S

OUT

Tj = 25 °C

On-state; VCC = 13 V; VIN = 5 V;

5

7

mA

IOUT = 0 A

IL(off1)

Off-state output current

VIN = VOUT = 0 V

0

50

µA

IL(off2)

Off-state output current

VIN = 0 V; VOUT = 3.5 V

-75

0

µA

IL(off3)

Off-state output current

VIN = VOUT = 0 V; VCC = 13 V;

5

µA

Tj = 125 °C

IL(off4)

Off-state output current

VIN = VOUT = 0 V; VCC = 13 V;

3

µA

Tj = 25 °C

1. Per device.

Table 6.

Protections(1)

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

TTSD

Shutdown temperature

150

175

200

°C

TR

Reset temperature

135

°C

Thyst

Thermal hysteresis

7

15

°C

tSDL

Status delay in overload

Tj > TTSD

20

µs

conditions

Ilim

Current limitation

VCC = 13 V

3.5

5

7.5

A

5.5 V < VCC < 36 V

7.5

A

Vdemag

Turn-off output clamp voltage

IOUT = 1 A; L = 6 mH

VCC-41

VCC-48

VCC-55

V

1.To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.

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VND810P-E

Electrical specifications

Table 7.

VCC - output diode

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

VF

Forward on voltage

-IOUT = 0.5 A; Tj = 150 °C

—

—

0.6

V

Table 8.

Status pin

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

VSTAT

Status low output voltage

ISTAT = 1.6 mA

0.5

V

ILSTAT

Status leakage current

Normal operation; VSTAT = 5 V

10

µA

CSTAT

Status pin Input capacitance

Normal operation; VSTAT = 5 V

100

pF

VSCL

Status clamp voltage

ISTAT = 1mA

6

6.8

8

V

ISTAT = - 1mA

-0.7

V

Table 9.

Switching (VCC = 13V)

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

td(on)

Turn-on delay time

RL = 13 Ω from VIN rising edge

—

30

—

µs

to VOUT = 1.3 V (see Figure 5)

RL = 13 Ω from VIN falling

td(off)

Turn-off delay time

edge to VOUT = 11.7 V

—

30

—

µs

(see Figure 5)

RL = 13 Ω from VOUT = 1.3 V

See

dVOUT/dt(on)

Turn-on voltage slope

to VOUT = 10.4 V (see

—

Figure 21

—

V/µs

Figure 5)

dVOUT/dt(off)

Turn-off voltage slope

RL = 13 Ω from VOUT = 11.7 V

—

See

—

V/µs

to VOUT = 1.3 V (see Figure 5)

Figure 22

Table 10.

Open-load detection

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

IOL

Open-load on-state detection threshold

VIN = 5 V

20

40

80

mA

tDOL(on)

Open-load on-state detection delay

IOUT = 0 A

200

µs

VOL

Open-load off-state voltage detection

VIN = 0 V

1.5

2.5

3.5

V

threshold

tDOL(off)

Open-load detection delay at turn-off

1000

µs

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