The VND810MSP is a monolithic device designed
in STMicroelectronics VIPower M0-3 Technology,
intended for driving any kind of load with one side
connected to ground.
Activ e V
against low energy spikes (see ISO7637 transient
pin voltage clamp protects the device
CC
compatibility table). Active current limitation
BLOCK DIAGRAM
10
1
PowerSO-10™
ORDER CODES
PACKAGETUBET&R
PowerSO-10™ VND810MSP VND810MSP13TR
combined with thermal shutdown and automatic
restart protects the device agai nst overload. The
current limitation threshold is aimed at detecting
the 21W/12V st andard bulb as an overload f ault.
The device detects open load condition both in on
and off state. Output shorted to V
the off state. Device automatically turns off in case
is detected in
CC
of ground pin disconnection.
V
cc
V
cc
CLAMP
GND
INPUT1
STA TUS1
OVERTEMP. 1
INPUT2
STATUS2
OVERTEMP. 2
(**) See app l i cation sche m at i c at page 8
LOGIC
OVERVOLTAGE
UNDERVOLTAGE
CLAM P 1
DRIVER 1
CURRENT LIMITER 1
OPENLOAD ON 1
OPENLOAD OFF 1
CLAMP 2
DRIVER 2
CURRENT LIMITER 2
OPENLOAD ON 2
OPENLOAD OFF 2
OUTPUT1
OUTPUT2
Rev . 1
July 20041/19
1
VND810MSP
ABSOLUTE MAXIMUM RATING
SymbolParameterValueUnit
DC Supply Voltage41V
Reverse DC Supply Voltage- 0.3V
CC
DC Reverse Ground Pin Current- 200mA
DC Output CurrentInternally LimitedA
Reverse DC Output Current - 6A
DC Input Current+/- 10mA
DC Status Current+/- 10mA
Electrostatic Discharge (Human Body Model: R=1.5KΩ; C=100pF)
- INPUT
- STATUS
- OUTPUT
- V
CC
Maximum Switching Energy
(L=400mH; R
=0Ω; V
L
=13.5V; T
bat
=150ºC; IL=0.9A)
jstart
4000
4000
5000
5000
225mJ
Power Dissipation TC=25°C52W
Junction Operating TemperatureInternally Limited°C
j
Case Operating Temperature- 40 to 150°C
c
Storage Temperature- 55 to 150°C
- V
- I
- I
V
E
V
CC
GND
I
OUT
OUT
I
IN
I
stat
ESD
MAX
P
T
T
T
stg
tot
V
V
V
V
CONFIGURATION DIAGRAM (TOP VIEW) & SUGGESTED CONNECTIONS FOR UNUSED AND N.C.
PINS
GROUND
INPUT 1
STATUS 1
STATUS 2
INPUT 2
6
7
8
9
10
11
V
CC
5
4
3
2
1
OUTPUT 1
OUTPUT 1
N.C.
OUTPUT 2
OUTPUT 2
Connection / Pin StatusN.C.OutputInput
FloatingXXXX
To GroundXThrough 10KΩ resistor
CURRENT AND VOLTAGE CONVENTIONS
I
S
I
IN1
I
V
IN1
V
STAT1
STAT1
I
IN2
I
V
STAT2
IN2
V
STAT2
INPUT 1
STATUS 1
INPUT 2
STATUS 2
GND
V
CC
OUTPUT 1
OUTPUT 2
I
GND
I
OUT2
V
(*)
V
F1
V
I
OUT1
V
OUT2
CC
OUT1
(*) VFn = V
2/19
1
CCn
- V
during reverse battery condition
OUTn
VND810MSP
THERMAL DATA
SymbolParameterValueUnit
R
thj-case
R
thj-amb
(1) When mounted on a standard single-sided FR -4 board wi th 0.5 cm2 of Cu (at least 35µm thick). Horizontal mounting and no arti ficial air
flow.
(2) When mounted on a standard single-sided FR-4 board with 6 cm
Conditions
Current limitation
Turn-off Output Clamp
Voltage
Tj>T
TSD
0.60.91.2
5.5V<VCC<36V
I
=0.5A; L=6mHVCC-41 VCC-48 VCC-55V
OUT
8V
20µs
1.2
V
A
A
Note 1: To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signal s mu st be us ed
together with a prope r software strategy. If t he device is subjected to abnormal conditions, this sof tware must l i m i t t he duration and numbe r
of activati on cycles
OPENLOAD DETECTION
SymbolParameterTest ConditionsMinTypMaxUnit
I
OL
t
DOL(on)
V
OL
t
DOL(off)
Openload ON State
Detection Threshold
Openload ON State
Detection Delay
Openload OFF State