ST VND810-E User Manual

VND810-E
DOUBLE CHANNEL HIGH SIDE DRIVER
Table 1. General Features
Type R
VND810-E 160 m
(*) Per each channel
CMOS COMPATIBLE INPUTS
ON STATE OPEN LO AD DETECTION
OFF STATE OPEN LOAD DETECTION
SHOR T E D L O A D PROT E C TION
UNDERVOLTAGE AND OVERVOLTAGE
DS(on)
(*) 3.5A (*) 36 V
I
out
V
CC
SHUTDOWN
PROTECTION AGAINST LOSS OF GROUND
VERY LOW STAND-BY CURRENT
REVERSE BATTERY PROTECTION (**)
IN COMPLIANCE WITH THE 2002/95/EC
EUROPEAN DIRECT IVE
DESCRIPTION
The VND810-E is a monolithic device designed in STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to ground.
Activ e V
pin voltage clamp pro tects the device
CC
against low energy spikes (see ISO7637 transient compatibility table).
Figure 1. Package
SO-16
Active current limitation combined with thermal shutdown and automatic restart protects the device against overload. The device detects open load condition both in on and off state. Output shor te d to V
is detected in the off state. Device
CC
automatically turns off in case of ground pin disconnection.
Table 2. Order Codes
Package Tube Tape and Reel
SO-16
Note: (**) See application schematic at page 9
VND810-E VND810TR-E
Rev. 1
1/20October 2004
VND810-E
Figure 2. Block Diagram
V
cc
CLAMP
OVERVOLTAGE
UNDERVOLTAGE
V
cc
GND
INPUT1
STATUS1
INPUT2
STATUS2
OVERTEMP. 1
OVERTEMP. 2
LOGIC
DRIVER 1
CURRENT LIMITER 1
OPENLOAD ON 1
OPENLOAD OFF 1
CLAMP 1
CLAMP 2
DRIVER 2
CURRENT LIMITER 2
OPENLOAD ON 2
OPENLOAD OFF 2
Table 3. Absolute Maximum Ratings
Symbol Parameter Value Unit
DC Supply Voltage 41 V Reverse DC Supply Voltage - 0.3 V DC Reverse Ground Pin Current - 200 mA DC Output Current Internally Limited A Reverse DC Output Current - 6 A DC Input Current +/- 10 mA DC Status Current +/- 10 mA Electrostatic Discharge (Human Body Model:
R=1.5KΩ; C=100pF)
- INPUT
- STATUS
- OUTPUT
- V
CC
4000 4000 5000 5000
Maximum Switching Energy (L=1.5mH; R
I
=5A)
L
=0; V
L
=13.5V; T
bat
jstart
=150ºC;
26 mJ
Power Dissipation TC=25°C 8.3 W Junction Operating Temperature Internally Limited °C Case Operating Temperature - 40 to 150 °C Storage Temperature - 55 to 150 °C
- V
- I I
- I
V
E
V
CC
GND
OUT
OUT
I
IN
I
stat
ESD
MAX
P
tot
T
T
T
stg
CC
j
c
OUTPUT1
OUTPUT2
V V V V
2/20
VND810-E
Figure 3. Con fig urat i on Dia g ra m (Top View) & Sugg est ed C o nnections for Unused and N.C. Pins
V
CC
N.C.
GND
INPUT 1 STATUS 1 STATUS 2
INPUT 2
V
CC
Connection / Pin Status N.C. Output Input
Floating X X X X To Ground X Through 10Kresistor
Figure 4. Current and Voltage Conventions
1
8
16
9
V
CC
V
CC
OUTPUT 1 OUTPUT 1 OUTPUT 2 OUTPUT 2 V
CC
V
CC
I
S
V
(*)
F1
I
OUT2
V
I
OUT1
V
OUT2
OUT1
V
CC
(*) VFn = V
CCn
V
- V
I
IN1
I
IN1
V
STAT1
STAT1
I
IN2
I
V
STAT2
IN2
STATUS 2
V
STAT2
during reverse battery condition
OUTn
INPUT 1
STATUS 1
INPUT 2
GND
V
CC
OUTPUT 1
OUTPUT 2
I
GND
Table 4. Thermal Data
Symbol Parameter Value Unit
R
thj-lead
R
thj-amb
Note: 1. When mounted on a standard single-sided FR-4 board with 0.5cm
Note: 2. When mounted on a standard single-sided FR-4 board with 4cm
Thermal Resistance Junction-lead 15 °C/W
Thermal Resistance Junction-ambient 77
2
mounting and no art i f i cial air flow .
mounting and no art i f i cial air flow.
of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
2
of Cu (at least 3 5µm thick) connected to all VCC pins. Hori zontal
(1)
57
(2)
°C/W
3/20
VND810-E
ELECTRICAL CHARACTERISTICS
(8V<V
(Per each channel)
Table 5. Po we r Ou t put
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
V
Note: (**) Per device.
<36V; -40°C < Tj <150°C, unless otherwise specified)
CC
(**) Operating Supply Voltage 5.5 13 36 V
CC
(**) Undervoltage Shut-down 3 4 5.5 V
USD
(**) Overvoltage Shut- down 36 V
OV
I
R
ON
(**) Supply Current
I
S
I
L(off1)
I
L(off2)
I
L(off3)
I
L(off4)
On State Resistance
Off State Output Current VIN=V Off State Output Current VIN=0V; V Off State Output Current VIN=V Off State Output Current VIN=V
=1A; Tj=25°C
OUT
I
=1A; VCC>8V
OUT
Off State; V Off State; V
Tj=25°C
On State; V
OUT
OUT OUT
=13V; VIN=V
CC
=13V; VIN=V
CC
OUT OUT
=0V =0V;
12
12
=13V; VIN=5V; I
CC
OUT
=0A
5
=0V 0 50 µA
=3.5V -75 0 µA
OUT
=0V; VCC=13V; Tj =125°C 5 µA =0V; VCC=13V; Tj =25°C 3 µA
160 320
40
25
7
m m
µA
µA
mA
Table 6. Protection (see note 1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
T
TSD
T
T
hyst
t
SDL
I
lim
V
demag
Note: 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be
Shut-down Temperature 150 175 200 °C Reset Temperature 135 °C
R
Thermal Hysteresis 7 15 °C Status Delay in Overload
Conditions
Current limitation
Turn-off Output Clamp Voltage
used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles
Tj>T
TSD
5.5V<VCC<36V
=1A; L=6mH
I
OUT
3.5 5 7.5
-
V
CC
V
41
CC
-48
V
20 µs
7.5
-
CC
55
A A
V
Table 7. VCC - Output Diode
Symbol Parameter Test Conditions Min Typ Max Unit
V
Forward on Voltage -I
F
=0.5A; Tj=150°C 0.6 V
OUT
4/20
VND810-E
ELECTRICAL CHARACTERISTICS (continued) Table 8. Status Pin
Symbol Parameter Test Conditions Min Typ Max Unit
V
STAT
I
LSTAT
C
STAT
V
SCL
Status Low Output Voltage I
= 1.6 mA 0.5 V
STAT
Status Leakage Current Normal Operation; V Status Pin Input
Capacitance Status Clamp Voltage
Normal Operation; V I
= 1mA
STAT
= - 1mA
I
STAT
= 5V 10 µA
STAT
= 5V 100 pF
STAT
66.8
8V
-0.7
V
Table 9. Switching (V
CC
=13V)
Symbol Parameter Test Conditions Min Typ Max Unit
=13from VIN rising edge to
R
L
V
=1.3V
OUT
=13from VIN falling edge to
R
L
V
=11.7V
OUT
=13from V
R
L
V
=10.4V
OUT
=13from V
R
L
V
=1.3V
OUT
=1.3V to
OUT
=11.7V to
OUT
30 µs
30 µs
See
relative
diagram
See
relative
diagram
dV
dV
t
t
OUT
OUT
d(on)
d(off)
Turn-on Delay Time
Turn-off Delay Time
/dt
Turn-on Voltage Slope
(on)
/dt
Turn-off Voltage Slope
(off)
Table 10. Openload Detection
Symbol Parameter Test Conditions Min Typ Max Unit
I
OL
t
DOL(on)
V
OL
t
DOL(off)
Openload ON State Detection Threshold Openload ON State Detection Delay Openload OFF State
Voltage Detection Threshold
Openload Detection Delay at Turn Off
=5V 20 40 80 mA
V
IN
I
=0A 200 µs
OUT
V
=0V 1.5 2.5 3.5 V
IN
1000 µs
V/µs
V/µs
Table 11. Logic Input
Symbol Parameter Test Conditions Min Typ Max Unit
V
I(hyst)
V
V
I
V
I
IH
ICL
Input Low Level 1.25 V
IL
Low Level Input Current VIN = 1.25V 1 µA
IL
Input High Level 3.25 V
IH
High Level Input Current VIN = 3.25V 10 µA Input Hysteresis Voltage 0.5 V
Input Clamp Voltage
I
= 1mA
IN
= -1mA
I
IN
66.8
-0.7
8V
V
5/20
VND810-E
Figure 5.
OPEN L OAD STATUS TIMING (with ex terna l pu ll-u p)
V
> V
OUT
OL
V
INn
V
STAT n
t
DOL(off)
t
DOL(on)
Tabl e 12. Truth Table
CONDITIONS INPUT OUTPUT SENSE
Normal Operation
Current Limitation
Overtemperature
Undervoltage
Overvoltage
Output Voltage > V
OL
L
H
L H H
L H
L H
L H
L H
I
OUT
< I
OVERTEMP STA TUS TIMING
OL
V
INn
V
STAT n
L
H
L X X
L
L
L
L
L
L H
H
t
SDL
Tj > T
TSD
(T
(T
< T
j
> T
j
t
TSD
TSD
SDL
H H
H
) H
) L
H L
X X
H H
L H
Output Current < I
6/20
OL
L
H
L H
H L
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