ST VND810 User Manual

®	VND810

DOUBLE CHANNEL HIGH SIDE DRIVER

TYPE	RDS(on)	IOUT	VCC
VND810	160 mΩ (*)	3.5 A (*)	36 V

(*)Per each channel

■CMOS COMPATIBLE INPUTS

■OPEN DRAIN STATUS OUTPUTS

■ON STATE OPEN LOAD DETECTION

■OFF STATE OPEN LOAD DETECTION

■SHORTED LOAD PROTECTION

■UNDERVOLTAGE AND OVERVOLTAGE SHUTDOWN

■PROTECTION AGAINST LOSS OF GROUND

■VERY LOW STAND-BY CURRENT

■REVERSE BATTERY PROTECTION (**)

DESCRIPTION

The VND810 is a monolithic device designed in STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to ground.

Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation

SO-16

ORDER CODES

PACKAGE	TUBE	T&R

SO-16	VND810	VND81013TR

combined with thermal shutdown and automatic restart protects the device against overload. The device detects open load condition both in on and off state. Output shorted to VCC is detected in the off state. Device automatically turns off in case of ground pin disconnection.

BLOCK DIAGRAM

		Vcc
Vcc	OVERVOLTAGE
CLAMP
	UNDERVOLTAGE
GND	CLAMP 1
INPUT1	DRIVER 1	OUTPUT1
INPUT1	DRIVER 1
STATUS1		CLAMP 2
STATUS1
	CURRENT LIMITER 1	DRIVER 2
	LOGIC	DRIVER 2
OVERTEMP. 1	LOGIC	OUTPUT2
		OUTPUT2
	OPENLOAD ON 1
	OPENLOAD ON 1
INPUT2		CURRENT LIMITER 2
INPUT2
	OPENLOAD OFF 1	OPENLOAD ON 2
STATUS2
		OPENLOAD OFF 2
OVERTEMP. 2

(**) See application schematic at page 8

July 2002

1/19

VND810

ABSOLUTE MAXIMUM RATING

Symbol	Parameter	Value	Unit

VCC	DC Supply Voltage	41	V
- VCC	Reverse DC Supply Voltage	- 0.3	V
- IGND	DC Reverse Ground Pin Current	- 200	mA
IOUT	DC Output Current	Internally Limited	A
- IOUT	Reverse DC Output Current	- 6	A
IIN	DC Input Current	+/- 10	mA
Istat	DC Status Current	+/- 10	mA
	Electrostatic Discharge (Human Body Model: R=1.5KΩ; C=100pF)
	- INPUT	4000	V
VESD	- STATUS	4000	V
	- OUTPUT	5000	V
	- VCC	5000	V
EMAX	Maximum Switching Energy	26	mJ
EMAX	(L=1.5mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=5A)	26	mJ
	(L=1.5mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=5A)
Ptot	Power Dissipation TC=25°C	8.3	W
Tj	Junction Operating Temperature	Internally Limited	°C
Tc	Case Operating Temperature	- 40 to 150	°C
Tstg	Storage Temperature	- 55 to 150	°C

CONNECTION DIAGRAM (TOP VIEW)

VCC	1	16	VCC


N.C.			VCC

GND			OUTPUT 1

INPUT 1			OUTPUT 1


STATUS 1			OUTPUT 2


STATUS 2			OUTPUT 2


INPUT 2			VCC


VCC	8	9	VCC

CURRENT AND VOLTAGE CONVENTIONS

IIN1

VCC

INPUT 1

VCC

VIN1

ISTAT1

STATUS 1

IOUT1

STAT1

IN2

INPUT 2

OUTPUT 1

VOUT1

IN2

ISTAT2

STATUS 2 GND

OUT2

OUTPUT 2

VOUT2

STAT2

IGND

2/19

			VND810
THERMAL DATA

Symbol	Parameter	Value		Unit

Rthj-lead	Thermal Resistance Junction-lead	15		°C/W
Rthj-amb	Thermal Resistance Junction-ambient	75 (*)		°C/W

(*)When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35μm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.

ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40°C < T j <150°C, unless otherwise specified) (Per each channel)

POWER OUTPUTS

Symbol	Parameter	Test Conditions	Min		Typ	Max	Unit

VCC (**)	Operating Supply Voltage		5.5	13		36	V
VUSD (**)	Under Voltage Shut-down		3	4		5.5	V
VOV (**)	Overvoltage Shut-down		36				V
RON	On State Resistance	IOUT=1A; Tj=25°C				160	mΩ
RON	On State Resistance	IOUT=1A; VCC>8V				320	mΩ
		IOUT=1A; VCC>8V				320	mΩ
		Off State; VCC=13V; VIN=VOUT=0V		12		40	μA
IS (**)	Supply Current	Off State; VCC=13V; VIN=VOUT=0V;
IS (**)	Supply Current	Tj=25°C		12		25	μA
		Tj=25°C		12		25	μA
		On State; VCC=13V; VIN=5V; IOUT=0A		5		7	mA
IL(off1)	Off State Output Current	VIN=VOUT=0V	0			50	μA
IL(off2)	Off State Output Current	VIN=0V; VOUT=3.5V	-75			0	μA
IL(off3)	Off State Output Current	VIN=VOUT=0V; Vcc=13V; Tj =125°C				5	μA
IL(off4)	Off State Output Current	VIN=VOUT=0V; Vcc=13V; Tj =25°C				3	μA
(**) Per device
SWITCHING (VCC=13V)

Symbol	Parameter	Test Conditions	Min		Typ	Max	Unit

td(on)	Turn-on Delay Time	RL=13Ω from VIN rising edge to			30		μs
td(on)	Turn-on Delay Time	VOUT=1.3V			30		μs
		VOUT=1.3V
td(off)	Turn-off Delay Time	RL=13Ω from VIN falling edge to			30		μs
td(off)	Turn-off Delay Time	VOUT=11.7V			30		μs
		VOUT=11.7V
		RL=13Ω from VOUT=1.3V to			See
dVOUT/dt(on)	Turn-on Voltage Slope	RL=13Ω from VOUT=1.3V to			relative		V/μs
dVOUT/dt(on)	Turn-on Voltage Slope	VOUT=10.4V			relative		V/μs
		VOUT=10.4V			diagram

		RL=13Ω from VOUT=11.7V to			See		V/μs
dVOUT/dt(off)	Turn-off Voltage Slope	RL=13Ω from VOUT=11.7V to			relative
dVOUT/dt(off)	Turn-off Voltage Slope	VOUT=1.3V			relative
		VOUT=1.3V			diagram

LOGIC INPUT

Symbol	Parameter	Test Conditions	Min		Typ	Max	Unit

VIL	Input Low Level					1.25	V
IIL	Low Level Input Current	VIN = 1.25V	1				μA
VIH	Input High Level		3.25				V
IIH	High Level Input Current	VIN = 3.25V				10	μA
VI(hyst)	Input Hysteresis Voltage		0.5				V
VICL	Input Clamp Voltage	IIN = 1mA	6	6.8		8	V
VICL	Input Clamp Voltage	IIN = -1mA		-0.7			V
		IIN = -1mA		-0.7			V

3/19

VND810

ELECTRICAL CHARACTERISTICS (continued)

STATUS PIN

Symbol	Parameter	Test Conditions	Min	Typ	Max	Unit

VSTAT	Status Low Output Voltage	ISTAT= 1.6 mA			0.5	V
ILSTAT	Status Leakage Current	Normal Operation; VSTAT= 5V			10	μA
CSTAT	Status Pin Input	Normal Operation; VSTAT= 5V			100	pF
CSTAT	Capacitance	Normal Operation; VSTAT= 5V			100	pF
VSCL	Status Clamp Voltage	ISTAT= 1mA	6	6.8	8	V
VSCL	Status Clamp Voltage	ISTAT= - 1mA		-0.7		V
		ISTAT= - 1mA		-0.7		V

PROTECTIONS

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

TTSD

Shut-down Temperature

150

175

200

°C

Reset Temperature

135

°C

Thyst

Thermal Hysteresis

°C

tSDL

Status Delay in Overload

Tj>TTSD

μs

Conditions

Ilim

Current limitation

3.5

7.5

5.5V<VCC<36V

7.5

Vdemag

Turn-off Output Clamp

IOUT=1A; L=6mH

VCC-41

VCC-48

VCC-55

Voltage

OPENLOAD DETECTION

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

IOL

Openload ON State

VIN=5V

Detection Threshold

tDOL(on)

Openload ON State

IOUT=0A

200

μs

Detection Delay

Openload OFF State

VOL

Voltage Detection

VIN=0V

1.5

2.5

3.5

Threshold

tDOL(off)

Openload Detection Delay

1000

μs

at Turn Off

OPEN LOAD STATUS TIMING (with external pull-up)

OVERTEMP STATUS TIMING

> V

IOUT < IOL

OUT

Tj > TTSD

VINn

VSTAT n

tSDL

tDOL(off)

tDOL(on)

4/19

VND810

Switching time Waveforms
VOUTn
		90%
	80%
	dVOUT/dt(on)	dVOUT/dt(off)
		10%
		t
VINn	td(on)	t
		d(off)

TRUTH TABLE

CONDITIONS	INPUT	OUTPUT	STATUS
Normal Operation	L	L	H
Normal Operation	H	H	H
	H	H	H

	L	L	H
Current Limitation	H	X	(Tj < TTSD) H
	H	X	(Tj > TTSD) L
Overtemperature	L	L	H
Overtemperature	H	L	L
	H	L	L

Undervoltage	L	L	X
Undervoltage	H	L	X
	H	L	X

Overvoltage	L	L	H
Overvoltage	H	L	H
	H	L	H

Output Voltage > VOL	L	H	L
Output Voltage > VOL	H	H	H

Output Current < IOL	L	L	H
Output Current < IOL	H	H	L

5/19

VND810

ELECTRICAL TRANSIENT REQUIREMENTS ON VCC PIN

ISO T/R 7637/1			TEST LEVELS
ISO T/R 7637/1	I	II	III		IV	Delays and
Test Pulse	I	II	III		IV	Delays and
Test Pulse						Impedance
						Impedance
1	-25 V	-50 V	-75 V		-100 V	2 ms 10 Ω
2	+25 V	+50 V	+75 V		+100 V	0.2 ms 10 Ω
3a	-25 V	-50 V	-100 V		-150 V	0.1 μs 50 Ω
3b	+25 V	+50 V	+75 V		+100 V	0.1 μs 50 Ω
4	-4 V	-5 V	-6 V		-7 V	100 ms, 0.01 Ω
5	+26.5 V	+46.5 V	+66.5 V		+86.5 V	400 ms, 2 Ω

ISO T/R 7637/1		TEST LEVELS RESULTS
Test Pulse	I	II		III		IV
1	C	C		C		C
2	C	C		C		C
3a	C	C		C		C
3b	C	C		C		C
4	C	C		C		C
5	C	E		E		E

CLASS			CONTENTS
C	All functions of the device are performed as designed after exposure to disturbance.

EOne or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device.

6/19

+ 13 hidden pages