ST VND5004B-E, VND5004BSP30-E User Manual
Features
Parameters Symbol Value
VND5004B-E
VND5004BSP30-E
Double 4mΩ high side driver with analog current sense
for automotive applications
PQFN
12x12 Power lead-less
Max transient supply voltage V
Operating voltage range V
Max on-state resistance R
Current limitation (typ) I
Off-state supply current I
1. Typical value with all loads connected.
■ General
– Inrush current active management by
power limitation
– Very low standby current
– 3.0 V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
European directive
■ Diagnostic functions
– Proportional load current sense
– Current sense disable
– Thermal shutdown indication
■ Protection
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Thermal shutdown
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of V
CC
Table 1. Devices summary
Package
PQFN-12x12 power lead-less - VND5004BTR-E VND5004B-E
MultiPowerSO-30 VND5004BSP30-E VND5004BSP30TR-E -
CC
CC
ON
LIMH
S
41 V
4.5 to 28 V
MultiPowerSO-30
4mΩ
100 A
2µA
(1)
– Reverse battery protection with self switch
on of the Power MOSFET
(see Figure 22)
– Electrostatic discharge protection
application
■ All types of resistive, inductive and capacitive
loads
■ Suitable for power management applications
Description
The VND5004BTR-E and VND5004BSP30-E are
devices made using STMicroelectronics VIPower
technology. They are intended for driving resistive
or inductive loads with one side connected to
ground. Active V
dump protection circuit protect the devices
against transients on the Vcc pin (see ISO7637
transient compatibility table). These devices
integrate an analog current sense which delivers
a current proportional to the load current
(according to a known ratio) when CS_DIS is
driven low or left open. When CS_DIS is driven
high, the CURRENT SENSE pin is high
impedance. Output current limitation protects the
devices in overload condition. In case of long
duration overload, the devices limit the dissipated
power to a safe level up to thermal shutdown
intervention. Thermal shutdown with automatic
restart allows the device to recover normal
operation as soon as a fault condition disappears.
Order codes
Tube Tape and reel Tray
pin voltage clamp and load
CC
May 2009 Doc ID 15702 Rev 1 1/33
www.st.com
1
Contents VND5004B-E, VND5004BSP30-E
Contents
1 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 19
4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 PQFN - 12x12 power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 22
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.3 PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 27
5.4 MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.5 PQFN - 12x12 power lead-less packing information . . . . . . . . . . . . . . . . 30
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2/33 Doc ID 15702 Rev 1
VND5004B-E, VND5004BSP30-E List of tables
List of tables
Table 1. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 8. Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 10. Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 12. Thermal parameters for PQFN - 12x12 power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 13. MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 14. PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 15. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Doc ID 15702 Rev 1 3/33
List of figures VND5004B-E, VND5004BSP30-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. On-state resistance vs T
Figure 14. On-state resistance vs V
Figure 15. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. I
LIMH
vs T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
case
Figure 18. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 21. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 23. Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 24. MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. Rthj-amb vs PCB copper area in open box free air condition (one channel on). . . . . . . . . 20
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel on). . . 21
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21
Figure 28. 12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 29. Rthj-amb vs PCB copper area in open box free air condition (one channel on). . . . . . . . . 23
Figure 30. PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse
(one channel on) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-less . . . . . 24
Figure 32. MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 33. PQFN - 12x12 power lead-less outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 34. MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 36. PQFN - 12x12 power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 37. PQFN - 12x12 power lead-less tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . 31
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CC
4/33 Doc ID 15702 Rev 1
VND5004B-E, VND5004BSP30-E Block diagram and pin configurations
1 Block diagram and pin configurations
Figure 1. Block diagram
V
CC
V
CC
clamp
GND
Reverse
battery
protection
INPUT1
INPUT2
CS_DIS
Table 2. Pin functions
Name Function
V
CC
Battery connection
OUTPUT1,2 Power output
GND Ground connection
Under
voltage
LOGIC
Pwr
Pwr
LIM
LIM
DRIVER
Overtemp.
DRIVER
Overtemp.
PwCLAMP
I
I
OUT1
CS_DIS
PwCLAMP
I
I
OUT2
CS_DIS
LIM
LIM
OUTPUT1
K
CURRENT
SENSE1
OUTPUT2
K
CURRENT
SENSE2
INPUT1,2
Voltage controlled input pin with hysteresis, CMOS compatible. Controls
output switch state
CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current
CS_DIS Active high CMOS compatible pin, to disable the current sense pins
Doc ID 15702 Rev 1 5/33
Block diagram and pin configurations VND5004B-E, VND5004BSP30-E
Figure 2. Configuration diagram (not in scale)
1 NC
2 NC
3 NC
4 GND
5 CS_DIS
6 CURRENT SENSE 2
7 CURRENT SENSE 1
8 INPUT 2
9 INPUT 1
10 NC
11 NC
12 NC
13 FOR TEST ONLY
14 V
CC
15 OUTPUT 1
PQFN -12x12 Power
less
lead -
(bottom view)
11
10
9
8
7
6
5
4
3
2
1
12
13
15
14
16
16 OUTPUT 2
V
CC
NC
1
FOR TEST ONLY
NC
NC
GND
CURRENT SENSE 2
CS_DIS
CURRENT SENSE 1
INPUT 2
V
CC
Heat Slug1
INPUT 1
NC
FOR TEST ONLY
NC
V
CC
Table 3. Suggested connections for unused and not connected pins
15 16
30
V
CC
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
NC
OUTPUT 1
OUTPUT 1
MultiPowerSO-30
(top view)
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
V
CC
Connection/pin Current sense N.C. Output Input CS_DIS For test only
Floating Not allowed X X X X X
To ground
Through 1 kΩ
resistor
X
Not
allowed
Through
10 kΩ resistor
Through
10 kΩ resistor
Not allowed
6/33 Doc ID 15702 Rev 1
VND5004B-E, VND5004BSP30-E Electrical specifications
2 Electrical specifications
Figure 3. Current and voltage conventions
I
S
V
CC
V
CC
I
CSD
I
V
IN1,2
IN1,2
V
CSD
CS_DIS
INPUT1,2
2.1 Absolute maximum ratings
Stress values that exceed those listed in the “Absolute maximum ratings” table can cause
permanent damage to the device. These are stress ratings only, and operation of the device
at these, or any other conditions greater than those, indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics sure
program and other relevant quality documents.
Table 4. Absolute maximum ratings
Symbol Parameter Value Unit
OUTPUT1,2
CURRENT
SENSE1,2
GND
I
GND
I
OUT1,2
I
SENSE1,2
V
SENSE1,2
V
OUT1,2
V
CC
V
CCPK
-V
I
OUT
- I
OUT
I
IN
I
CSD
V
CSENSE
CC
DC supply voltage 28 V
Transient supply voltage (T<400 ms, R
>0.5 Ω) 41 V
load
Reverse DC supply voltage 16 V
DC output current Internally limited A
Reverse DC output current 70 A
DC input current -1 to 10 mA
DC current sense disable input current -1 to 10 mA
Current sense maximum voltage (Vcc>0 V)
Vcc-41
+V
CC
V
V
Maximum switching energy (single pulse)
E
V
MAX
ESD
(L=0.3 mH; R
= I
I
OUT
limL
(typ.))
=0 Ω; V
L
=13.5 V; T
bat
jstart
=150 ºC;
Electrostatic discharge (Human Body Model: R=1.5 kΩ;
C=100 pF)
342 mJ
2000 V
Doc ID 15702 Rev 1 7/33
Electrical specifications VND5004B-E, VND5004BSP30-E
Table 4. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
V
T
ESD
T
STG
Charge device model (CDM-AEC-Q100-011) 750 V
Junction operating temperature -40 to 150 °C
j
Storage temperature -55 to 150 °C
2.2 Thermal data
Table 5. Thermal data
Symbol Parameter
R
thj-case
R
thj-amb
1. PCB FR4 area 58 mmx58 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout.
2. PCB FR4 area 78 mmx78 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout.
Thermal resistance junction-case (MAX)
(with one channel ON)
Thermal resistance junction-ambient (MAX) 58
Value
MultiPowerSO-30 12x12 PLLP
0.35 0.35 °C/W
(1)
39
(2)
Unit
°C/W
8/33 Doc ID 15702 Rev 1
VND5004B-E, VND5004BSP30-E Electrical specifications
2.3 Electrical characteristics
Values specified in this section are for 8 V<VCC<24 V, -40 °C<Tj<150 °C, unless otherwise
stated.
Table 6. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
Power section
V
CC
V
USD
V
USDhyst
R
ON
R
ON REV
V
clamp
I
S
I
L(off)
Switching (V
t
d(on)
t
d(off)
(dV
/dt)onTurn-on voltage slope RL= 0.87 Ω
OUT
Operating supply
voltage
Undervoltage
shutdown
Undervoltage
shutdown hysteresis
I
=15 A; Tj=25 °C
On-state
resistance
R
dson
(1)
in reverse
battery condition
OUT
=15 A; Tj=150 °C
I
OUT
I
=15 A; VCC=5 V; Tj=25 °C
OUT
=-13 V; I
V
CC
VCC clamp voltage ICC=20 mA; I
Off-state; V
Supply current
V
IN=VOUT=VSENSE=VCSD
On-state; VCC=13 V; VIN=5 V; I
Off-state output
(1)
current
= 13V; Tj= 25°C)
CC
VIN=V
V
IN=VOUT
OUT
=-15 A; Tj=25 °C 4 mΩ
OUT
=0 A 41 46 52 V
OUT1,2
=13 V; Tj=25 °C;
CC
=0 V
=0 A
OUT
=0 V; VCC=13 V; Tj=25 °C
=0 V; VCC=13 V; Tj=125 °C
4.5 13 28 V
3.5 4.5 V
0.5 V
4
mΩ
8
mΩ
6
mΩ
(2)
2
3.5
0
0.01 3
0
(2)
5
µA
6
mA
µA
5
Turn-on delay time RL= 0.87 Ω (see Figure 5)25µs
Turn-on delay time RL= 0.87 Ω (see Figure 5)35µs
See
Figure 16
V/µs
/dt)
(dV
OUT
off
W
ON
W
OFF
Logic inputs
V
IL1,2
I
IL1,2
V
IH1,2
Turn-off voltage slope RL= 0.87 Ω
Switching energy
losses during t
won
Switching energy
losses during t
woff
RL= 0.87 Ω (see Figure 5)5.4mJ
RL= 0.87 Ω (see Figure 5)2.3mJ
Input low level
voltage
Low level input
current
=0.9 V 1 µA
V
IN
Input high level
voltage
Doc ID 15702 Rev 1 9/33
See
Figure 18
V/µs
0.9 V
2.1 V
Electrical specifications VND5004B-E, VND5004BSP30-E
Table 6. Electrical characteristics (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
IH1,2
V
I(hyst)1,2
V
ICL1,2
V
CSDL
I
CSDL
V
CSDH
I
CSDH
V
CSD(hyst)
V
CSCL
High level input
current
Input hysteresis
voltage
Input clamp voltage
CS_DIS low level
voltage
Low level CS_DIS
current
CS_DIS high level
voltage
High level CS_DIS
current
CS_DIS hysteresis
voltage
CS_DIS clamp
voltage
Protections and diagnostics
I
limH
Short circuit current
Short circuit current
I
limL
during thermal
cycling
T
TSD
T
T
T
HYST
V
DEMAG
R
RS
Shutdown
temperature
Reset temperature TRS+1 TRS+5 °C
Thermal reset of
STATUS
Thermal hysteresis
TSD-TR
)
(T
Turn-off output
voltage clamp
(3)
=2.1 V 10 µA
V
IN
0.25 V
IIN=1 mA
IIN=-1 mA
5.5
7V
-0.7
0.9 V
=0.9 V 1 µA
V
CSD
2.1 V
V
=2.1 V 10 µA
CSD
0.25 V
=1 mA
I
CSD
=-1 mA
I
CSD
V
=13 V
CC
5V<V
V
<24 V
CC
=13 V; TR<Tj<T
CC
TSD
5.5
-0.7
70 100 140
40 A
7V
140
150 175 200 °C
135 °C
7°C
=2 A; VIN=0; L=6 mH VCC-28 VCC-32 VCC-35 V
I
OUT
V
V
A
A
Current sense (8 V<V
K
0
K
1
I
OUT/ISENSE
I
OUT/ISENSE
CC
<16 V)
I
=10 A; V
OUT
= -40°C...150°C
T
j
= 25 °C...150 °C
T
j
I
=15 A; V
OUT
= -40°C...150°C
T
j
T
= 25 °C...150 °C
j
SENSE
SENSE
10/33 Doc ID 15702 Rev 1
=4 V; V
=4 V; V
CSD
CSD
=0 V;
=0 V;
7500
11000
10300
12500
16000
16000
16000
16000
23000
20900
19500
19500
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