ST VND5004A-E, VND5004ASP30-E User Manual
Features
VND5004A-E
VND5004ASP30-E
Double 4mΩ high side driver with analog current sense
for automotive applications
Max transient supply voltage V
Operating voltage range V
Max On-State resistance (per ch.) R
Current limitation (typ) I
Off state supply current I
1. Typical value with all loads connected
CC
CC
ON
LIMH
S
41V
4.5 to 27V
4 mΩ
100A
(1)
2 µA
PQFN - 12x12 Power lead-less
MultiPowerSO-30
Application
■ General
– Inrush current active management by
power limitation
– Very low stand-by current
– 3.0V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
European directive
■ Diagnostic functions
– Proportional load current sense
– Current sense disable
– Thermal shutdown indication
■ Protection
– Undervoltage shut-down
– Overvoltage clamp
– Load current limitation
– Thermal shut down
– Self limiting of fast thermal transients
– Protection against loss of ground and loss of V
CC
– Reverse battery protection with self switch
on of the PowerMOS
(see Application
schematic on page 18)
– Electrostatic discharge protection
Table 1. Devices summary
Package
PQFN-12x12 Power lead-less - VND5004ATR-E VND5004A-E
MultiPowerSO-30 VND5004ASP30-E VND5004ASP30TR-E -
Tube Tape and Reel Tray
■ All types of resistive, inductive and capacitive
loads
■ Suitable for power management applications
Description
The VND5004ATR-E and VND5004ASP30-E are
devices made using STMicroelectronics VIPower
technology. They are intended for driving resistive
or inductive loads with one side connected to
ground. Active V
dump protection circuit protect the devices
against transients on the Vcc pin (see ISO7637
transient compatibility table). These devices
integrate an analog current sense which delivers
a current proportional to the load current
(according to a known ratio) when CS_DIS is
driven low or left open. When CS_DIS is driven
high, the CURRENT SENSE pin is high
impedance. Output current limitation protects the
devices in overload condition. In case of long
duration overload, the devicesa limit the
dissipated power to a safe level up to thermal
shut-down intervention. Thermal shut-down with
automatic restart allows the device to recover
normal operation as soon as a fault condition
disappears.
Order codes
pin voltage clamp and load
CC
December 2007 Rev 5 1/34
www.st.com
34
Contents VND5004A-E / VND5004ASP30-E
Contents
1 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19
4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 PQFN - 12x12 Power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 23
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.2 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.3 PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 28
5.4 MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.5 PQFN - 12x12 Power lead-less packing information . . . . . . . . . . . . . . . . 31
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2/34
VND5004A-E / VND5004ASP30-E List of tables
List of tables
Table 1. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Suggested connections for unused and n.c. pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 9. Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Current sense (8V<VCC<16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 13. Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 14. Thermal parameters for PQFN - 12x12 Power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 15. MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 16. PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3/34
List of figures VND5004A-E / VND5004ASP30-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. On state resistance vs. T
Figure 14. On state resistance vs. V
Figure 15. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Turn-On voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. I
LIMH
vs. T
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 18. Turn-Off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 21. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 23. Maximum turn off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 24. MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . . 20
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) . . 21
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21
Figure 28. 12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 29. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . . 23
Figure 30. PQFN - 12x12 Power lead-less package thermal impedance junction ambient single pulse
(one channel ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 Power lead-less . . . . . 24
Figure 32. MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 33. PQFN - 12x12 Power lead-less outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 34. MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 36. PQFN - 12x12 Power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 37. PQFN - 12x12 Power lead-less tape and reel shipment (suffix “TR”). . . . . . . . . . . . . . . . . 32
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4/34
VND5004A-E / VND5004ASP30-E Block diagram and pin configurations
1 Block diagram and pin configurations
Figure 1. Block diagram
V
CC
V
CC
clamp
GND
Reverse
battery
protection
INPUT1
INPUT2
CS_DIS
Table 2. Pin functions
Name Function
VCC Battery connection
OUTPUT1,2 Power output
GND Ground connection
Under
voltage
LOGIC
Pwr
Pwr
LIM
LIM
DRIVER
Overtemp.
DRIVER
Overtemp.
PwCLAMP
I
I
OUT1
CS_DIS
PwCLAMP
I
I
OUT2
CS_DIS
LIM
LIM
OUTPUT1
K
K
CURRENT
SENSE1
OUTPUT2
CURRENT
SENSE2
INPUT1,2
Voltage controlled input pin with hysteresis, CMOS compatible. Controls
output switch state
CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current
CS_DIS Active high CMOS compatible pin, to disable the current sense pins
5/34
Block diagram and pin configurations VND5004A-E / VND5004ASP30-E
Figure 2. Configuration diagram (not in scale)
PQFN -12x12 Power
less
lead -
(bottom view)
FOR TEST ONLY
CURRENT SENSE 2
CURRENT SENSE 1
FOR TEST ONLY
CS_DIS
INPUT 2
INPUT 1
V
CC
NC
NC
NC
GND
NC
NC
V
CC
12
11
10
9
8
7
13 14
6
5
4
3
2
1
1
V
Heat Slug1
15 16
CC
1 NC
2 NC
3 NC
15
16
30
4 GND
5 CS_DIS
6 CURRENT SENSE 2
7 CURRENT SENSE 1
8 INPUT 2
9 INPUT 1
10 NC
11 NC
12 NC
13 FOR TEST ONLY
14 V
CC
15 OUTPUT 1
16 OUTPUT 2
V
CC
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
NC
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
V
CC
MultiPowerSO-30
(top view)
Table 3. Suggested connections for unused and n.c. pins
Connection /
Pin
Floating N.R.
To ground
1. Not recommended.
6/34
Current
Sense
(1)
Through 1kΩ
resistor
N.C. Output Input CS_DIS
XX X X X
X N.R.
Through 10kΩ
resistor
Through 10kΩ
resistor
For test
only
N.R.
VND5004A-E / VND5004ASP30-E Electrical specifications
2 Electrical specifications
Figure 3. Current and voltage conventions
I
S
V
CC
V
CC
I
CSD
I
V
IN1,2
IN1,2
V
CSD
CS_DIS
INPUT1,2
2.1 Absolute maximum ratings
Stressing the device above the ratings listed in the “Absolute maximum ratings” tables may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to the conditions in this section for extended
periods may affect device reliability. Refer also to the STMicroelectronics SURE Program
and other relevant quality documents.
Table 4. Absolute maximum ratings
Symbol Parameter Value Unit
V
V
CCPK
-V
I
OUT
- I
I
CSD
V
CSENSE
E
V
V
DC supply voltage 27 V
CC
Transient supply voltage (T<400ms, R
Reverse DC supply voltage 16 V
CC
DC output current Internally limited A
Reverse DC output current 70 A
OUT
I
DC input current -1 to 10 mA
IN
DC current sense disable input current -1 to 10 mA
Current sense maximum voltage (Vcc>0V)
Maximum switching energy (single pulse)
MAX
(L=0.3mH; R
Electrostatic discharge (Human Body Model: R=1.5kΩ;
ESD
C=100pF)
Charge device model (CDM-AEC-Q100-011) 750 V
ESD
=0Ω; V
L
=13.5V; T
bat
GND
jstart
I
OUTPUT1,2
CURRENT
SENSE1,2
I
GND
>0.5Ω) 41 V
load
OUT1,2
I
SENSE1,2
V
SENSE1,2
V
OUT1,2
Vcc-41
+Vcc
=150ºC; I
OUT
= I
limL
(Typ.) )
342 mJ
2000 V
V
V
7/34
Electrical specifications VND5004A-E / VND5004ASP30-E
Table 4. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
T
Junction operating temperature -40 to 150 °C
j
T
Storage temperature -55 to 150 °C
STG
2.2 Thermal data
Table 5. Thermal data
Value
Symbol Parameter
MultiPowerSO-30 12x12 PLLP
Unit
R
thj-case
R
thj-amb
1. PCB FR4 area 58mmX58mm , PCB thickness 2mm, Cu thickness 35 µm, minimum pad layout.
2. PCB FR4 area 78mmX78mm , PCB thickness 2mm, Cu thickness 35 µm, minimum pad layout.
Thermal resistance junction-case (MAX)
(with one channel ON)
0.35 0.35 °C/W
Thermal resistance junction-ambient (MAX) 58
(1)
39
(2)
°C/W
8/34
VND5004A-E / VND5004ASP30-E Electrical specifications
2.3 Electrical characteristics
Values specified in this section are for 8V<VCC<24V, -40°C<Tj<150 °C, unless otherwise
stated.
Table 6. Power section
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
USDhyst
R
R
ON REV
V
I
L(off)
1. For each channel.
2. PowerMOS leakage included.
Table 7. Switching (VCC=13V; Tj=25°C)
Operating supply
CC
voltage
Undervoltage shutdown 3.5 4.5 V
USD
Undervoltage shut-down
hysteresis
I
=15A; Tj=25°C
OUT
On-state resistance
ON
R
dson
condition
clampVCC
I
Supply current
S
Off-state output
current
in reverse battery
clamp voltage ICC=20 mA; I
(1)
(1)
=15A; Tj=150°C
I
OUT
=15A; VCC=5V; Tj=25°C
I
OUT
=-13V; I
V
CC
Off state; V
VIN=V
On state; V
VIN=V
V
IN=VOUT
OUT
OUT1,2
=13V; Tj=25°C;
CC
OUT=VSENSE=VCSD
=13V; VIN=5V; I
CC
=0V; VCC=13V; Tj=25°C
OUT
=0V; VCC=13V; Tj=125°C
4.5 13 27 V
0.5 V
4
mΩ
8
mΩ
6
mΩ
=-15A; Tj=25°C 4 mΩ
=0A 414652 V
(2)
3.5
(2)
5
6µAmA
5
µA
=0V
OUT
2
=0A
000.01 3
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
t
d(off)
Turn-on delay time RL=0.87Ω (see Figure 5.)25µs
Turn-on delay time RL=0.87Ω (see Figure 5.)35µs
See
/dt)onTurn-on voltage slope RL=0.87Ω
(dV
OUT
Figure
16.
See
(dV
OUT
/dt)
Turn-off voltage slope RL=0.87Ω
off
Figure
18.
W
W
ON
OFF
Switching energy
losses during t
won
Switching energy
losses during t
woff
RL=0.87Ω (see Figure 5.)5.4mJ
RL=0.87Ω (see Figure 5.)2.3mJ
V/µs
V/µs
9/34
Electrical specifications VND5004A-E / VND5004ASP30-E
Table 8. Logic input
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
IL1,2
I
IL1,2
V
IH1,2
I
IH1,2
V
I(hyst)1,2
V
ICL1,2
V
CSDL
I
CSDL
V
CSDH
I
CSDH
V
CSD(hyst)
V
CSCL
Table 9. Protection and diagnostics
Input low level voltage 0.9 V
Low level input current VIN=0.9V 1 µA
Input high level voltage 2.1 V
High level input current VIN=2.1V 10 µA
Input hysteresis
voltage
Input clamp voltage
IIN=1mA
IIN=-1mA
CS_DIS low level
voltage
Low level CS_DIS
current
=0.9V 1 µA
V
CSD
CS_DIS high level
voltage
High level CS_DIS
current
V
=2.1V 10 µA
CSD
CS_DIS hysteresis
voltage
I
=1mA
CS_DIS clamp voltage
CSD
I
CSD
=-1mA
(1)
0.25 V
5.5
7V
-0.7
0.9 V
2.1 V
0.25 V
5.5
7V
-0.7
V
V
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
limH
Short circuit current
V
CC
5V<V
=13V
CC
<24V
70 100 140
140
Short circuit current
I
limL
during thermal
=13V; TR<Tj<T
V
CC
TSD
40 A
cycling
T
T
T
V
DEMAG
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
Shutdown
TSD
temperature
Reset temperature TRS+1 TRS+5 °C
T
R
Thermal reset of
RS
STATUS
Thermal hysteresis
HYST
(T
Turn-off output
voltage clamp
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
TSD-TR
)
=2A; VIN=0; L=6mH VCC-27 VCC-30 VCC-33 V
I
OUT
150 175 200 °C
135 °C
7°C
A
A
10/34
VND5004A-E / VND5004ASP30-E Electrical specifications
Table 10. Current sense (8V<VCC<16V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
K
K
I
SENSE0
V
SENSE
V
SENSEH
I
SENSEH
I
1
OUT/ISENSE
I
2
OUT/ISENSE
Analog sense
current
Max analog sense
output voltage
Analog sense
output voltage in
overtemperature
condition
Analog sense
output current in
overtemperature
condition
=15A; V
OUT
Tj=-40°C
=25°C...150°C
T
j
I
=30A; V
OUT
=-40°C
T
j
=25°C...150°C
T
j
=0A; V
I
OUT
=5V; VIN=0V; Tj=-40°C to 150°C
V
CSD
V
=0V; VIN=5V; Tj=-40°C to 150°C00
CSD
I
=45A; V
OUT
=13V; R
V
CC
Vcc=13V; V
SENSE
SENSE
SENSE
=4V; V
=4V; V
=0V;
CSD
CSD
=0V;
=0V;
11530
12730
13430
14500
16000
16000
16150
16150
19340
19270
17880
17880
5
400µAµA
=0V; R
CSD
=3.9kΩ 9V
SENSE
=5V 8 mA
SENSE
=3.9kΩ 5V
SENSE
t
DSENSE1H
t
DSENSE1L
t
DSENSE2H
t
DSENSE2L
Delay response
time from falling
edge of CS_DIS
pin
Delay response
time from rising
edge of CS_DIS
pin
Delay response
time from rising
edge of INPUT pin
Delay response
time from falling
edge of INPUT pin
V
I
(see Figure 4.)
V
I
(see Figure 4.)
V
I
(see Figure 4.)
V
I
(see Figure 4.)
<4V, 5A<Iout<30A
SENSE
=90% of I
SENSE
<4V, 5A<Iout<30A
SENSE
=10% of I
SENSE
<4V, 5A<Iout<30A
SENSE
=90% of I
SENSE
<4V, 5A<Iout<30A
SENSE
=10% of I
SENSE
SENSE max
SENSE max
SENSE max
SENSE max
Figure 4. Current sense delay characteristics
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
t
DSENSE2H
t
DSENSE1L
t
DSENSE1H
50 100 µs
520µs
270 600 µs
100 250 µs
t
DSENSE2L
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