VN750
High-side driver
Features
Type |
RDS(on) |
IOUT |
VCC |
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VN750 |
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VN750S |
60 mΩ |
6 A |
36 V |
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VN750PT |
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VN750-B5 |
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■CMOS compatible input
■On-state open-load detection
■Off-state open-load detection
■Shorted load protection
■Undervoltage and overvoltage shutdown
■Protection against loss of ground
■Very low standby current
■Reverse battery protection
Datasheet − production data
SO-8 PENTAWATT
P2PAK |
PPAK |
Description
The VN750 is a monolithic device designed using STMicroelectronic® VIPower® M0-3 technology. The VN750 is intended for driving any type of load with one side connected to ground. The active VCC pin voltage clamp protects the device against low energy spikes.
Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device detects the openload condition in both the on-state and
off-state. In the off-state the device detects if the output is shorted to VCC. The device automatically turns off where the ground pin becomes disconnected.
Table 1. |
Device summary |
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Package |
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Order codes |
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Tube |
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Tape and reel |
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PENTAWATT |
VN750 |
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— |
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SO-8 |
VN750S |
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VN750S13TR |
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P2PAK |
VN750-B5 |
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VN750-B513TR |
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PPAK |
VN750PT |
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VN750PT13TR |
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May 2012 |
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Doc ID 6942 Rev. 4 |
1/46 |
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This is information on a product in full production. |
www.st.com |
Contents |
VN750 |
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Contents
1 |
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 7 |
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2 |
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
8 |
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2.1 |
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
8 |
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2.2 |
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
9 |
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2.3 |
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
10 |
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2.4 |
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
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2.5 |
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . |
19 |
2.5.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 19 2.5.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 20
2.6 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.7 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.8 Open-load detection in Off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.9 SO-8 maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . 22 2.10 PPAK/P2PAK maximum demagnetization energy (VCC = 13.5V) . . . . . . 23
3 |
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
24 |
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3.1 |
SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
24 |
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3.2 |
P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
26 |
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3.3 |
PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
29 |
4 |
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
32 |
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4.1 |
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
32 |
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4.2 |
SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
32 |
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4.3 |
PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
34 |
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4.4 |
P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
36 |
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4.5 |
PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
38 |
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4.6 |
SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
40 |
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4.7 |
PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
41 |
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4.8 |
P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
41 |
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4.9 |
PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
43 |
2/46 |
Doc ID 6942 Rev. 4 |
VN750 |
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Contents |
5 |
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . 45 |
Doc ID 6942 Rev. 4 |
3/46 |
List of tables |
VN750 |
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List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 7. Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 8. VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 9. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 11. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 13. Electrical transient requirements on VCC pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 14. Electrical transient requirements on VCC pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 15. Electrical transient requirements on VCC pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 16. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 17. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 18. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 19. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 20. PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 21. P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 22. PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 23. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4/46 |
Doc ID 6942 Rev. 4 |
VN750 |
List of figures |
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List of figures
Figure 1. |
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 7 |
Figure 2. |
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 7 |
Figure 3. |
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 8 |
Figure 4. |
Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
12 |
Figure 5. |
Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
12 |
Figure 6. |
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
15 |
Figure 7. |
Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
Figure 8. |
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
Figure 9. |
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
Figure 10. |
Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
Figure 11. |
Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
Figure 12. |
Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
Figure 13. |
On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
Figure 14. |
On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
Figure 15. |
Open-load On-state detection threshold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
Figure 16. |
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
Figure 17. |
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
Figure 18. |
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
Figure 19. |
Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
Figure 20. |
Open-load Off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
Figure 21. |
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
Figure 22. |
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
Figure 23. |
Ilim vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
Figure 24. |
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
19 |
Figure 25. |
Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
21 |
Figure 26. |
SO-8 maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
22 |
Figure 27. |
PPAK /P2PAK maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . |
23 |
Figure 28. |
SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
24 |
Figure 29. |
Rthj-amb vs PCB copper area in open box free air condition. . . . . . . . . . . . . . . . . . . . . . . |
24 |
Figure 30. |
SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . |
25 |
Figure 31. |
Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
25 |
Figure 32. |
P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
26 |
Figure 33. |
Rthj-amb vs PCB copper area in open box free air condition. . . . . . . . . . . . . . . . . . . . . . . |
27 |
Figure 34. |
P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . |
27 |
Figure 35. |
Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
28 |
Figure 36. |
PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
29 |
Figure 37. |
Rthj-amb vs PCB copper area in open box free air condition. . . . . . . . . . . . . . . . . . . . . . . |
29 |
Figure 38. |
PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . |
30 |
Figure 39. |
Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
30 |
Figure 40. |
SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
32 |
Figure 41. |
PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
34 |
Figure 42. |
P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
36 |
Figure 43. |
PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
38 |
Figure 44. |
SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
40 |
Figure 45. |
SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
40 |
Figure 46. |
PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
41 |
Figure 47. |
P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
41 |
Figure 48. |
P2PAK tape and reel (suffix “13TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
42 |
Doc ID 6942 Rev. 4 |
5/46 |
List of figures |
VN750 |
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Figure 49. PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 50. PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 51. PPAK tape and reel (suffix “13TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6/46 |
Doc ID 6942 Rev. 4 |
VN750 |
Block diagram and pin description |
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VCC
VCC |
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OVERVOLTAGE |
CLAMP |
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DETECTION |
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UNDERVOLTAGE |
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DETECTION |
GND |
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Power CLAMP |
INPUT |
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DRIVER |
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OUTPUT |
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LOGIC |
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CURRENT LIMITER |
STATUS |
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ON STATE OPENLOAD |
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DETECTION |
OVERTEMPERATURE |
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OFF STATE OPENLOAD |
DETECTION |
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AND OUTPUT SHORTED TO VCC |
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DETECTION |
VCC |
5 |
4 |
N.C. |
OUTPUT |
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STATUS |
OUTPUT |
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INPUT |
VCC |
8 |
1 |
GND |
SO-8
5 |
OUTPUT |
5 |
OUTPUT |
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STATUS |
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4 |
STATUS |
4 |
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3 |
V |
3 |
VCC |
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CC |
2 |
INPUT |
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2 |
INPUT |
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1 |
GND |
1 |
GND |
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PC10000 |
PPAK / P2PAK |
PENTAWATT |
Table 2. |
Suggested connections for unused and not connected pins |
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Connection / pin |
Status |
N.C. |
Output |
Input |
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Floating |
X |
X |
X |
X |
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To ground |
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X |
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Through 10KΩ resistor |
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Doc ID 6942 Rev. 4 |
7/46 |
Electrical specifications |
VN750 |
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IIN |
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VF |
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INPUT |
VCC |
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ISTAT |
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IOUT |
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STATUS |
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OUTPUT |
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VCC |
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VIN |
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GND |
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VOUT |
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IGND |
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VSTAT |
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2.1Absolute maximum ratings
Stressing the device above the rating listed in the Table 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability.
Table 3. |
Absolute maximum ratings |
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||
Symbol |
Parameter |
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Value |
|
Unit |
||
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SO-8 |
PENTAWATT |
P2PAK |
PPAK |
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VCC |
DC supply voltage |
|
41 |
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|
V |
|
-VCC |
Reverse DC supply voltage |
|
-0.3 |
|
|
V |
|
-Ignd |
DC reverse ground pin current |
|
-200 |
|
|
mA |
|
IOUT |
DC output current |
|
Internally limited |
|
A |
||
-IOUT |
Reverse DC output current |
|
-6 |
|
|
A |
|
IIN |
DC input current |
|
+/- 10 |
|
|
mA |
|
ISTAT |
DC Status current |
|
+/- 10 |
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|
mA |
|
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Electrostatic discharge |
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(human body model: R = 1.5 KΩ; |
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C = 100 pF) |
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VESD |
– INPUT |
|
4000 |
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V |
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– STATUS |
|
4000 |
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V |
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– OUTPUT |
|
5000 |
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V |
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– VCC |
|
5000 |
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V |
8/46 |
Doc ID 6942 Rev. 4 |
VN750 |
|
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Electrical specifications |
|||||
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Table 3. |
Absolute maximum ratings (continued) |
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Symbol |
Parameter |
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Value |
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Unit |
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|||
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SO-8 |
PENTAWATT |
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P2PAK |
PPAK |
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Maximum switching energy |
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EMAX |
(L = 1.8 mH; RL = 0 Ω; |
100 |
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mJ |
|
Vbat = 13.5 V; Tjstart = 150°C; |
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IL = 9 A) |
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Maximum switching energy |
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EMAX |
(L = 2.46 mH; RL = 0 Ω; |
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138 |
138 |
mJ |
|
Vbat = 13.5 V; Tjstart = 150°C; |
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IL = 9 A) |
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Ptot |
Power dissipation TC = 25°C |
4.2 |
60 |
|
60 |
60 |
W |
|
Tj |
Junction operating temperature |
|
Internally limited |
|
°C |
||
|
Tc |
Case operating temperature |
|
-40 to 150 |
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°C |
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Tstg |
Storage temperature |
|
-55 to 150 |
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°C |
2.2Thermal data
Table 4. |
Thermal data |
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Symbol |
Parameter |
|
Max. value |
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Unit |
||
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S0-8 |
PENTAWATT |
P2PAK |
PPAK |
||||
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Rthj-case |
Thermal resistance junction-case |
- |
2.1 |
2.1 |
2.1 |
°C/W |
|
Rthj-lead |
Thermal resistance junction-lead |
30 |
- |
- |
- |
°C/W |
|
Rthj-amb |
Thermal resistance junction-ambient |
93(1) |
62.1 |
52.1(2) |
77.1(2) |
°C/W |
|
82(3) |
62.1 |
37(4) |
44(4) |
°C/W |
|||
|
|
1.When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.
2.When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick). Horizontal mounting and no artificial air flow.
3.When mounted on a standard single-sided FR-4 board with 2 cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.
4.When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick). Horizontal mounting and no artificial air flow.
Doc ID 6942 Rev. 4 |
9/46 |
Electrical specifications |
VN750 |
|
|
Values specified in this section are for 8 V < VCC < 36 V; -40°C < Tj < 150°C, unless otherwise stated.
Table 5. |
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Power |
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Symbol |
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Parameter |
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Test conditions |
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Min. |
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Typ. |
|
Max. |
Unit |
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VCC |
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Operating supply voltage |
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5.5 |
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13 |
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36 |
|
V |
||
VUSD |
|
Undervoltage shutdown |
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3 |
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4 |
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5.5 |
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V |
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VUSDhyst |
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Undervoltage shutdown |
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0.5 |
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V |
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hysteresis |
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VOV |
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Overvoltage shutdown |
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36 |
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V |
||
RON |
|
On state resistance |
IOUT = 2 A; Tj = 25°C; VCC > 8 V |
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60 |
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mΩ |
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IOUT = 2 A; VCC > 8 V |
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120 |
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mΩ |
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Off-state; VCC = 13 V; |
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10 |
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25 |
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µA |
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VIN = VOUT = 0 V |
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IS |
|
Supply current |
Off-state; VCC = 13 V; |
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10 |
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20 |
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µA |
|||
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VIN = VOUT = 0 V; Tj = 25°C |
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On-state; VCC = 13 V; VIN = 5 V; |
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2 |
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3.5 |
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mA |
||
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IOUT = 0 A |
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IL(off1) |
|
Off-state output current |
VIN = VOUT = 0 V |
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0 |
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50 |
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µA |
|||
IL(off2) |
|
Off-state output current |
VIN = 0 V; VOUT = 3.5 V |
|
|
-75 |
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0 |
|
µA |
||||
IL(off3) |
|
Off-state output current |
VIN = VOUT = 0 V; VCC = 13 V; |
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5 |
|
µA |
|||
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Tj = 125°C |
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IL(off4) |
|
Off-state output current |
VIN = VOUT = 0 V; VCC = 13 V; |
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3 |
|
µA |
|||
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Tj = 25°C |
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Table 6. |
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Switching (VCC = 13 V) |
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||||
Symbol |
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Parameter |
|
Test conditions |
|
|
Min. |
|
Typ. |
|
Max. |
Unit |
|||||
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td(on) |
|
Turn-on delay time |
RL = 6.5 Ω from VIN rising edge to |
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40 |
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µs |
||||
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VOUT = 1.3V |
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td(off) |
|
Turn-off delay time |
RL = 6.5 Ω from VIN falling edge to |
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30 |
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µs |
||||
|
VOUT = 11.7 V |
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|||
dVOUT/dt(on) |
Turn-on voltage slope |
RL = 6.5 Ω from VOUT = 1.3 V to |
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|
See Figure 21 |
V/µs |
|||||||||||
VOUT=10.4 V |
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|||
dVOUT/dt(off) |
Turn-off voltage slope |
RL = 6.5 Ω from VOUT = 11.7 V to |
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|
See Figure 22 |
V/µs |
|||||||||||
VOUT=1.3 V |
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Table 7. |
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Input pin |
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|||||
Symbol |
|
Parameter |
|
Test conditions |
|
Min. |
|
Typ. |
|
Max. |
|
Unit |
|||||
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VIL |
Input low level |
|
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|
1.25 |
|
V |
|||
IIL |
Low level input current |
|
VIN = 1.25 V |
|
1 |
|
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|
|
|
|
µA |
||||
VIH |
Input high level |
|
|
|
3.25 |
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|
|
V |
10/46 |
Doc ID 6942 Rev. 4 |
VN750 |
|
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|
|
|
Electrical specifications |
||||||||||
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Table 7. |
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Input pin (continued) |
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Symbol |
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Parameter |
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Test conditions |
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Min. |
|
Typ. |
|
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Max. |
|
Unit |
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IIH |
High level input current |
|
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VIN = 3.25 V |
|
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10 |
|
µA |
|||||
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Vhyst |
Input hysteresis voltage |
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|
0.5 |
|
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|
V |
||||
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VICL |
Input clamp voltage |
|
|
IIN = 1 mA |
|
|
6 |
6.8 |
|
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8 |
|
V |
||||||||
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IIN = -1 mA |
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-0.7 |
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V |
|||||||
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Table 8. |
|
VCC output diode |
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Symbol |
|
Parameter |
|
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|
|
Test conditions |
|
|
|
Min. |
|
Typ. |
|
|
Max. |
|
Unit |
||
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|||
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VF |
|
Forward on voltage |
|
-IOUT = 1.3 A; Tj = 150°C |
|
|
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— |
|
— |
|
|
0.6 |
|
V |
|||||
|
Table 9. |
|
Status pin |
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Symbol |
|
Parameter |
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|
Test conditions |
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Min. |
|
Typ. |
|
|
Max. |
|
Unit |
|||
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||||
|
VSTAT |
Status low output voltage |
|
|
|
ISTAT = 1.6 mA |
|
|
|
|
|
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|
|
|
|
0.5 |
|
V |
|||
|
ILSTAT |
Status leakage current |
|
|
|
Normal operation; VSTAT = 5 V |
|
|
|
|
|
|
|
|
10 |
|
µA |
|||||
|
CSTAT |
Status pin input capacitance |
Normal operation; VSTAT = 5 V |
|
|
|
|
|
|
|
|
100 |
|
pF |
||||||||
|
VSCL |
Status clamp voltage |
|
|
|
ISTAT = 1 mA |
|
|
|
6 |
|
6.8 |
|
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|
8 |
|
V |
||||
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|
|
|
ISTAT = -1 mA |
|
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|
-0.7 |
|
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|
V |
||||||
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|||||
|
Table 10. |
|
Protections(1) |
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Symbol |
|
Parameter |
|
|
|
Test conditions |
Min. |
|
|
Typ. |
|
|
|
Max. |
|
Unit |
|||||
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|
|||||||
|
TTSD |
|
Shutdown temperature |
|
|
|
|
|
150 |
|
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175 |
|
200 |
|
°C |
||||||
|
TR |
|
Reset temperature |
|
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|
135 |
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|
°C |
||
|
Thyst |
|
Thermal hysteresis |
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7 |
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15 |
|
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|
°C |
||
|
t |
|
Status delay in overload |
|
T |
> T |
|
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|
20 |
|
ms |
||||
|
SDL |
|
condition |
|
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j |
|
jsh |
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||||||
|
Ilim |
|
Current limitation |
|
9 V < VCC < 36 V |
6 |
|
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|
|
9 |
|
15 |
|
A |
|||||||
|
|
|
5 V< VCC < 36 V |
|
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15 |
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A |
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Vdemag |
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Turn-off output clamp |
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IOUT = 2 A; VIN = 0 V; |
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VCC - 48 |
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VCC - 55 |
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V |
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voltage |
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L = 6 mH |
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1.To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles.
Table 11. |
Open-load detection |
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Symbol |
Parameter |
Test conditions |
Min. |
Typ. |
Max. |
Unit |
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IOL |
Open-load ON-state |
VIN = 5 V |
50 |
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200 |
mA |
detection threshold |
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tDOL(on) |
Open-load ON-state |
IOUT = 0 A |
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200 |
µs |
detection delay |
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Doc ID 6942 Rev. 4 |
11/46 |
Electrical specifications |
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VN750 |
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Table 11. |
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Open-load detection (continued) |
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Symbol |
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Parameter |
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Test conditions |
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Min. |
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Typ. |
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Max. |
Unit |
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VOL |
Open-load OFF-state |
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VIN = 0 V |
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1.5 |
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3.5 |
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V |
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voltage detection threshold |
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tDOL(off) |
Open-load detection delay |
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1000 |
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at turn-off |
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Figure 4. |
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Status timings |
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OPEN LOAD STATUS TIMING (with external pull-up) |
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OVERTEMP STATUS TIMING |
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V > V |
OL |
IOUT< IOL |
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OUT |
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VIN |
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Tj > Tjsh |
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VSTAT |
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VIN |
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VSTAT |
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tDOL(off) |
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t |
DOL(on) |
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t |
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t |
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SDL |
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SDL |
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Figure 5. |
Switching time waveforms |
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VOUT |
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90% |
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80% |
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dVOUT/dt(on) |
dVOUT/dt(off) |
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10% |
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t |
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VIN |
td(on) |
t |
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d(off) |
t
12/46 |
Doc ID 6942 Rev. 4 |
VN750 |
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|
Electrical specifications |
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Table 12. Truth table |
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Conditions |
Input |
Output |
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Status |
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Normal operation |
L |
L |
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H |
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H |
H |
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H |
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L |
L |
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H |
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Current limitation |
H |
X |
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(Tj < TTSD) H |
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H |
X |
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(Tj > TTSD) L |
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Overtemperature |
L |
L |
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H |
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H |
L |
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L |
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Undervoltage |
L |
L |
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X |
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H |
L |
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X |
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Overvoltage |
L |
L |
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H |
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H |
L |
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H |
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Output voltage > VOL |
L |
H |
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L |
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H |
H |
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H |
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Output current < IOL |
L |
L |
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H |
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H |
H |
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L |
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Doc ID 6942 Rev. 4 |
13/46 |
Electrical specifications |
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VN750 |
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Table 13. |
Electrical transient requirements on VCC pin (part 1) |
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ISO T/R 7637/1 |
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Test levels |
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Test pulse |
I |
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II |
III |
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IV |
Delays and |
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impedance |
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1 |
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- 25 V |
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- 50 V |
- 75 V |
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- 100 V |
2 ms 10 Ω |
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2 |
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+ 25 V |
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+ 50 V |
+ 75 V |
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+ 100 V |
0.2 ms 10 Ω |
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3a |
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- 25 V |
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- 50 V |
- 100 V |
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- 150 V |
0.1 µs 50 Ω |
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3b |
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+ 25 V |
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+ 50 V |
+ 75 V |
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+ 100 V |
0.1 µs 50 Ω |
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4 |
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- 4 V |
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- 5 V |
- 6 V |
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- 7 V |
100 ms, 0.01 Ω |
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5 |
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+ 26.5 V |
+ 46.5 V |
+ 66.5 V |
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+ 86.5 V |
400 ms, 2 Ω |
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Table 14. |
Electrical transient requirements on VCC pin (part 2) |
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ISO T/R 7637/1 |
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Test levels results |
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test pulse |
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I |
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II |
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III |
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IV |
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1 |
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C |
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C |
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C |
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C |
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2 |
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C |
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C |
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C |
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C |
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3a |
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C |
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C |
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C |
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C |
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3b |
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C |
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C |
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C |
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C |
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4 |
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C |
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C |
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C |
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C |
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5 |
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C |
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E |
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E |
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E |
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Class |
Contents |
C All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
14/46 |
Doc ID 6942 Rev. 4 |