ST VB326SP User Manual

®

VB326SP

HIGH VOLTAGE IGNITION COIL DRIVER

POWER I.C.

TYPE V

cl

I

cl

I

CC

VB326SP 360V 10A 150mA

■ PRIMARY COIL VOLTAGE INTERNALLY SET

■ COIL CURRENT LIMIT INTERNALLY SET

■ LOGIC LEVEL COMPATIBLE INPUT

■ DRIVING CURRENT QUASI PROPORTIONAL

TO COLLECTOR CURRENT

■ SINGLE FLAG-ON COIL CURRENT

■ LOW VOLTAGE CLAMP THERMAL

SHUTDOWN

DESCRIPTION

The VB326 SP is a hi gh vol tage po wer inte grated
circuit made using the STMicroelectronics

VIPower™ M1-3 tec hnology, with v ertical curre nt
flow power darlington and logic level compatible
driving c ircuit. T he enable pin all ows to ex ter nally
block the switch when the input is on. Built-in
protection circuit for coil current limiting and
collector voltage clamping allows the device to be
used as smart, high voltage, high current interface

BLOCK DIAGRAM

V

CC

10

1

PowerSO-10™

in advanced electronic ignition system. If the input
signal from the micro happens to remain high, the
device protects itself against over-heating by
forcing collect or current to smooth decr ease (low
voltage clamp feature ) and no undesi dered spark
occurs (see figure 4).

BD

HV

V

IN

DIAGNOSTIC
OUTPUT

DRIVER

QUASI PROP.

BASE CURRENT

R

LIMITER

V

CC

V

F1

V

V

R

E

-

REFERENCE

LIM

V

TH

LGND

THERMAL

PROTECTION

SENSE

SN

GND

C

November 2003 1/9

VB326SP

ABSOLUTE MAXIMUM RATING

Symbol Parameter Value Unit

C

CC

s

IN

s/b

BD

stg

E

Collect or voltage (Internally limited) -0.3 to V

c

clamp

Collect or curren t (Internally limi ted) 10 A
DC current on Emitter Power ± 10.5 A
Driving stage su pply volt age -0.3 to 7 V
Driving circuitry suppl y current ± 200 mA
DC current on Ground pin ± 1A
Input voltage -0.3 to V

+ 0.3 V

CC

Maximum Input Current 100 mA
Logic In put Frequency in Ope rative Mod e DC to 150 Hz
Output Voltage Primary Threshold Cu rrent Level -0.3 to V

+ 0.3 V

CC

Flag Output Current 100 mA
Power Dissi pation (Tc=25°C) 125 W

Self Cla m ped Energy during Ou tput Power Clamping (See figure 2) 275 mJ
ESD voltage (HVc pin) ± 4KV
ESD voltage (Enable pin) + 1.5 ; -2 KV
ESD voltage (Other pins) ± 2KV
Input Darlington Base Current 150 mA
Input Dar lington Base Voltage Internally limited V
Operating Junction Temperature -40 to 150 °C

j

Storage temperature Range -55 to 150 °C
Maximum Enable Voltage -0.3 to 5.5 V

E

Maximum Enable Current ± 150 µA

HV

I

I

C(gnd)

V

I

I

s(gnd)

V

I

IN

f

IN

V

OUT(flag)

I

OUT(flag)

P

max

E

V

ESD

V

ESD

V

ESD

I

BD

V

T

T

V

I

V

THERMAL DAT A

Symbol Parameter Value Unit

R

thj-case

R

thj-amb

Thermal resistance junction-case (MAX) 1 °C/W
Thermal resista nc e ju nctio n- am b ie nt (MAX) 51 °C/W

PIN FUNCTION

No Name Function

1 - 5 LGND Signal Ground

2 - 3 - 4 GND Emitter Pow e r Groun d

6E Enable (*)
7V

CC

Logic Supply Voltage
8 BD Base Darlington
9 INPUT Logic input channel (Internal Pull Down)

10 FLAG Diagnostic Output Signal (Ope n Em itter)

TAB HV

(*) When grounded the Input is Enabled

C

Primary Coil Output Driver (Open Colle ctor)

CONNECTION DIAGRAM ( TOP VIEW)

LGND
GND
GND
GND
LGND

Pin 1 and Pin 5 must be ex ternally co nnected to Pins 2÷4.

E
V

CC

BD
INPUT
FLAG

6
7
8
9

10

TAB

HV

C

5
4
3
2
1

2/9

VB326SP

ELECTRICAL CHARACTERISTICS (5.3V < V

=3.75mH unless otherwise specified; See note 1)

L

coil

< 24V; VCC=5V ± 10%; -40ºC < Tj < 125ºC; R

bat

=580mΩ;

coil

Symbol Parameter Test Conditions Min Typ Max Unit

High Voltage Clamp I

V

cl

V

V

ce(sat)

I

CC(stdby)

I

CC

I

CC(peak)

V

I

I

c(off)

T

Ic_ctr

V

INH

V

V

IN(hyst)

I

INH

I

INL

I

INpd

V

diagH

V

diagL

I

diagTH

I

diagTD

I

diag

I

diag(l eak)

V

E

t

ON

t

OFF

T

V

V

Note 1: param etric degratation are allowed with 5.3<Vb<10V an d Vb>24V.
Note 2: the primary coil current value I
Note 3: no inte r nal Pull-down .
Note 4: if ENAB LE pin is floating OUT =Off for every input status.
(*) Internally Limited

Low Voltage Clamp I

lcl

Power Stage Saturation
Voltage

Stand-by Supply Current IN=Of f 11 mA
DC Logic Curr ent
Peak DC Logic Current

during On Phase

DC Logic Vo ltage 4.5 5.5 V

CC

Coil Current Limit

cl

Output Off State Current IN=Off; V
Thermal Temperature

Output Current Control
High Level Input Volt age VCC=4.5V 4 V
Low Level Input Voltage VCC=5.5V -0.3 0.8 V

INL

Input Threshold Hy steresi s 0.4 V
High Level Input Current VIN=4V 100 µA
Low Level Input Current VIN=0.8V 0 30 µA
Inpu t A ctive Pull Down VIN=4V 10 100 µA
High Level Flag Output

Voltage
Low Level Flag Output

Voltage

Coil Current Level T hresho ld Tj=25ºC 6.15 6.5 6.85 A

Coil Curre nt Level Thres hold
Drift

High Level Flag Output
Current

Leakage C urrent on Flag
Output

Antipara ll el Diode Fo rward

F

Voltage
Sing le Pulse Avalanche

s/b

Ener gy
Turn-on time

Turn-off time
Ther ma l sh ut-down

sd

intervention
High Level Enable Voltage VIN=V

EH

Low Level Enable Voltage V

EL

must be measured 1ms after desaturation of the power stage.

cl

=6.5A 320 360 420 V

coil

=6.5A; Tj=T

coil

sd

30 40 50 V

IC=6A; VIN=4V 1.5 2 V

Vb=16V; IC=6.5A; f=100Hz; Load = Coil;
VCC=5.5V

40 mA

IC=6.5A 100 150 mA

-40ºC < T
(See no te 2)

< 125ºC

j

=24V; VCC=5V; Tj=25ºC 5 mA

HVC

911A

OUT=On 150 (*) ºC

CC

R

EXT

R

EXT

=22KΩ; C

=22KΩ; C

=1nF (S ee note 3) V

EXT

=1nF (S ee note 3) 0.5 V

EXT

- 1 V

CC

CC

(See figure 1)

IC > I

diagTH

; V

=3V 0.5 mA

diag

VIN=Low; VCC=5.5V 10 µA

= -1A 2 V

I

C

L=6mH; IC= 8A (See figure 2) 180 mJ
Rc=0.5Ω; Lc=3.75m H ; Tj=25ºC;

V

=13V (S ee figure 6)

bat

Rc=0.5Ω; Lc=3.75mH; IC=6.5A; Tj=25ºC;
V

=13V (S ee figure 6)

bat

15µs

15 25 µs

150 ºC

; OUT=Off (See Note 4) 2 V

INH

free to follow V

OUT

IN

0.40 V

V

V

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1

VB326SP

ELECTRICAL CHARACTERISTICS (continued)

Symbol Parameter Test Conditions Min Typ Max Unit

I

EH

I

EL

V

BD(off)

V

BD(on)

High Level Sinked Enable
Current

Low Level Sinked Enable
Current

Base Darlington Voltage Off VE=V
Base Darlington Voltage On VIN=V

VE=5V 500 µA

VE<0.4V - 200 µA

EH

; VE=VEL; IC=6.5A 1.8 V

INH

1V

PRINCIPLE OF OPERATION

The VB326SP is mainly intended as a high voltage
power switch device driven by a logic le vel input
and interfaces directl y to a hi gh energ y electro nic
ignition coil.

The input VIN of the VB326S P is fed from a low
power signa l generated by an external con troller
that determinesb oth dwell time an d ignition point .
During Vin high (≥ 4V) the VB326SP increases
current in the coil to the desired, internally set
current level.

After reachi ng this level, the coil current r emains
constant until the ignition point, that corresponds
to the transiti on of Vin fr om hig h to low (ty p. 1.9V
threshold).

During the coil current switch-off, the primary

Vcl, typical ly 380V. T he transiti on from sa turation
to desaturation, coil current limiting phase, must
have the ability to accomodate an overvoltage.

A maximum overshoot of 20V is allowed.

FEEDBACK

When the collector current exceeds 6.5A, the
feedback sign al is turne d high and it remains so,
until the input voltage is turned-off.

OVERVOLTAGE

The VB326SP can withstand the following
transients of the battery line:

-100V/2msec(Ri =10 Ω)
+100V/0.2msec (Ri =10 Ω)
+50V/400msec (Ri = 4.2 Ω, with VIN= 3V)

voltage HVC is clamped at an internal ly set value

Figure 1: Flag current Vs. temperature Figure 2: Single pulse avalanche energy cap ability

4/9

1

700
650
600
550
500
450
400
350
300

E (mJ )

250
200
150
100

50

0

0 102030405060708090100110

Tc=25º

Tc=150º

L (mH)

VB326SP

Figure 3: Self Clamped Inductive Switching

Current Vs. Time

10

8

6

4

Inductive Current (A)

2

0

200 3 00 400 500 600 700 800 900 1000

T=25º

T=150º

Time in Clamp (µsec)

Figur e 5: Typical application diagram

Figure 4: Low voltage clamp feature

+5V

1µF

100nF

1K

V

1K

E

µP

1nF

ENABLE pin can be alternatively connected to LGND

1K

FLAG

18K

V

bat

V

CC

IN

LGND

BD

GND

HV

C

5/9

VB326SP

Figur e 6: Switching time for inductive load

V

bat

V

V

CC

100V

gen

R

gen

V

gen

C

D.U.T

E

t

6/9

V

bat

3V

t

t

OFF

ON

t

PowerSO-10™ MECHANICAL DATA

VB326SP

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

mm. inch

A 3.35 3.65 0.132 0.144

A (*) 3.4 3.6 0.134 0.142

A1 0.00 0.10 0.000 0.004

B 0.40 0.60 0.016 0.024

B (*) 0.37 0.53 0.014 0.021

C 0.35 0.55 0.013 0.022

C (*) 0.23 0.32 0.009 0.0126

D 9.40 9.60 0.370 0.378

D1 7.40 7.60 0.291 0.300

E 9.30 9.50 0.366 0.374

E2 7.20 7.60 0.283 300

E2 (*) 7.30 7.50 0.287 0.295

E4 5.90 6.10 0.232 0.240

E4 (*) 5.90 6.30 0.232 0.248

e 1.27 0.050
F 1.25 1 .35 0.049 0.053

F (*) 1.20 1.40 0.047 0.055

H 13.80 14.40 0.543 0.567

H (*) 13.85 14.35 0.545 0.565

h 0.50 0.002
L 1.20 1.80 0.047 0.070

L (*) 0.80 1.10 0.031 0.043

α 0º 8º 0º 8º

α (*) 2º 8º 2º 8º

(*) Muar only POA P013P

HE

h

A

F

A1

10

1

eB

0.25

D

= =

D1

= =

E2

DETAIL "A"

DETA IL "A"

B

0.10 A

SEATING

PLANE

A

C

α

B

E4

SEATING
PLANE

A1

L

P095A

7/9

VB326SP

PowerSO-10™ SUGGESTED PAD LAYOUT

14.6 - 14.9

10.8 - 11

6.30

0.67 - 0.73
1
2
3

9.5
4

5

10

0.54 - 0.6

9
8

7

1.27

6

TAPE AND REEL SHIPMENT (suffix “13TR”)

TUBE SHIPMENT (no suffix)

C

A

B

A

All dimensi ons ar e in mm.

Base Q.ty Bulk Q.ty Tube length (± 0. 5) A B C (± 0.1 )

Casablanca 50 1000 532 10.4 16.4 0.8

Muar 50 1000 532 4.9 17.2 0.8

MUARCASABLANCA

B

REEL DIMENSIONS

Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13

F 20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4

C

TAPE DIMENSIONS

According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986

Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartm ent Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm.

Top

cover

tape

End

500mm min

All dimensions are in mm.

Empty components pockets
saled with cover tape.

User direction of feed

Start

No componentsNo components Components

500mm min

8/9

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1

1

VB326SP

Information furnished is believed to be accurate and r eliable. Ho wev er, STMicroelectr onics assume s no r es ponsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specif ic ations mentioned in this publication are
subject to c hange withou t notice. This publicatio n s upersedes and replaces all information previous ly s upplied. STM icroelect r on ics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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The ST logo is a trademark of ST M ic r oelectronic s

 2003 STMicroelectronics - Printed in ITALY- All Rights Reserved.

STMicroelectronics GROUP OF COMPANIES

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