Designed to interface logic to a wide variety of
high current, high voltage loads, these devices
each contain four NPN Darlington switches
delivering up to 1.5 A with a specified minimum
breakdown of 50 V and a sustaining voltage of 35
V measured at 100 mA. The ULN2067B and
ULN2069B contain integral suppression diodes
for inductive loads have common emitters. The
ULN2075B feature isolated Darlington pinouts
and is intended for applications such as emitter
ULN2065B, ULN2067B
ULN2069B, ULN2075B
PowerDIP-16
follower configurations.
Inputs of the ULN2065B, ULN2069B and
ULN2075B are compatible with popular 5 V logic
families and the ULN2067B is compatible with 615 V CMOS and PMOS. Type ULN2069B
includes a pre-driver stage to reduce loading on
the control logic.
can be reduced by soldering the GND pins to a suitable copper area of the printed
thJA
circuit board (Figure 14) or to an external heatsink (Figure 15).
The diagram of Figure 16 shows the maximum dissipated power P
function of the side "α" of two equal square copper areas having a thickness of 35 µ (1.4
mils).
During soldering the pins temperature must not exceed 260 °C and the soldering time must
not be longer than 12 seconds.
The external heatsink or printed circuit copper area must be connected to electrical ground.
Figure 14. Example of P.C. board area which
is used as heatsink
and the R
TOT
thJA
Figure 15. External heatsink mounting
example
as a
Figure 16. Maximum dissipated power and
junction to ambient thermal
resistance vs. side "α"
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
10/13
ULN2065B, ULN2067B, ULN2069B, ULN2075BPackage mechanical data
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