ST T610H User Manual
Features
■ Medium current TRIAC
■ Logic level sensitive TRIAC
■ 150 °C max. T
■ Clip bounding
■ RoHS (2002/95/EC) compliant package
turn-off commutation
j
T610H
High temperature 6 A sensitive TRIACs
A2
G
A1
Applications
■ The T610H is designed for the control of AC
actuators in appliances and industrial systems.
■ The multi-port drive of the microcontroller can
control the multiple loads of such appliances
and systems through this sensitive gate
TRIAC.
Description
Specifically designed to operate at 150 °C, the
new 6 A T610H TRIAC provides an enhanced
performance in terms of power loss and thermal
dissipation. This allows the optimization of the
heatsink size, leading to space and cost
effectiveness when compared to electromechanical solutions.
Based on ST logic level technology, the T610H
offers an I
minimal commutation and high noise immunity
levels valid up to the T
lower than 10 mA and specified
GT
max.
j
A2
A2
A1
TO-220AB
T610H-6T
Table 1. Device summary
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT MAX
6A
600 V
10 mA
G
May 2009 Doc ID 15713 Rev 1 1/9
www.st.com
9
Characteristics T610H
1 Characteristics
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
I
T(RMS)
I
TSM
²
tI
I
dI/dt
V
DSM/VRSM
I
GM
P
G(AV)
T
stg
T
Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
On-state rms current (full sine wave) Tc = 138 °C 6 A
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25 °C)
²
t Value for fusing tp = 10 ms 24 A²s
Critical rate of rise of on-state current
I
= 2 x IGT , tr ≤ 100 ns
G
Non repetitive surge peak off-state
voltage
F = 60 Hz t = 16.7 ms 63
F = 50 Hz t = 20 ms 60
F = 120 Hz T
= 10 ms Tj = 25 °C
t
p
= 150 °C 50 A/µs
j
V
DRM/VRRM
Peak gate current tp = 20 µs Tj = 150 °C 4 A
Average gate power dissipation Tj = 150 °C 1 W
Storage junction temperature range
Operating junction temperature range
j
- 40 to + 150
- 40 to + 150
+ 100
Symbol Test conditions Quadrant Min. Max. Unit
I
GT
V
GT
V
GD
(1)
I
H
VD = 12 V RL = 33 Ω
VD = V
, RL = 3.3 kΩ I - II - III 0.15 V
DRM
IT = 100 mA 25 mA
I - II - III 1 10 mA
I - II - III 1.0 V
I - III 30
I
L
dV/dt
(dI/dt)c
1. For both polarities of A2 referenced to A1.
IG = 1.2 I
(1)
VD = 67% V
Logic level, 0.1 V/µs, Tj = 150 °C 8.7
(1)
Logic level, 15 V/µs, T
GT
II 35
gate open, Tj = 150 °C 75 V/µs
DRM,
= 150 °C 2.3
j
A
V
°C
mA
A/ms
2/9 Doc ID 15713 Rev 1
T610H Characteristics
(A)
Table 4. Static characteristics
Symbol Test conditions Value Unit
(1)
V
T
V
t0
R
d
ITM = 8.5 A, tp = 380 µs Tj = 25 °C MAX. 1.5 V
(1)
Threshold voltage Tj = 150 °C MAX. 0.8 V
(1)
Dynamic resistance Tj = 150 °C MAX. 62 mΩ
Tj = 25 °C MAX. 5 µA
V
= V
I
DRM
I
RRM
V
DRM
D/VR
D/VR
RRM
= 150 °C MAX. 2.7
T
j
= 400 V (at peak mains voltage) Tj = 150 °C MAX. 2.2
= 200 V (at peak mains voltage) Tj = 150 °C MAX. 1.8
1. for both polarities of A2 referenced to A1.
Table 5. Thermal resistance
Symbol Parameter Value Unit
R
th(j-c)
R
th(j-a)
Figure 1. Maximum power dissipation versus
Junction to case (AC) 1.8
Junction to ambient 60
Figure 2. On-state rms current versus case
on-state rms current (full cycle)
temperature (full cycle)
mAV
°C/W
P(W)
7
6
5
4
3
2
1
0
0123456
I
T(RMS)
(A)
Figure 3. On-state rms current versus
ambient temperature (free air
convection, full cycle)
I
T(RMS)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125 150
Ta(°C)
I
(A)
T(RMS)
7
6
5
4
3
2
1
0
0 25 50 75 100 125 150
TC(°C)
Figure 4. Relative variation of thermal
impedance, versus pulse duration
K=[Zth/Rth]
1.E+00
Zth(j-c)
1.E-01
Zth(j-a)
1.E-02
tp(s)
1.E-03
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Doc ID 15713 Rev 1 3/9
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