ST STULPI01A, STULPI01B User Manual

Features
Fully compl iant wi th :
2.0, On-The-Go Supplement to the USB 2.0 Spec. Rev. 1.0a, UTMI+ Low Pin Interface transceiver specification 1.1
Fully compliant with ULPI 1.1 register set
Supports high-speed (480 Mbit/s), full-speed
(12 Mbit/s) and low-speed (1.5 Mbit/s) modes of operation
Integrated HS termination and FS/LS/OTG
pull-up/ pull-down resistors
Supports both single (SDR) and Dual-edge
data rate (DDR) on ULPI interface
Supports Session Request Protocol (SRP) and
Host Negotiation Protocol (HNP) for dual-role­device features
Ability to control ext. charge pump for higher
V
currents
BUS
External square wave clock with 1V8VIO
amplitude must be applied to oscillator input XI
On request 19.2 MHz or 26 MHz oscillator
frequency, external crystal version, can be provided
Supports 2.7 V UART mode
Single supply, +3 V to +4.5 V voltage range
Integrated dual voltage regulator to supply
internal circuits with stable 3.3 V and 1.2 V
Integrated over current detector
Integrated USB2.0 §7.1.1 "Short Circuit
Withstand" protection
Power down mode with very low power
consumption for battery-powered devices
-40°C to 85°C operating temperature range
Available in µTFBGA36 RoHS package
STULPI01A STULPI01B
HS USB ULPI transceiver
Data Brief
µTFBGA36
Lead-free Package
Applications
Mobile phones
PDAs
MP3 players
Digital still cameras
Video camera
Printer
Navigation system
Set top box
Description
The STULPI01 is a high-speed ULPI (UTMI+ Low Pin Interface), USB OTG transceiver which provides complete physical layer solution for any high speed USB host, device or OTG dual role core. It allows USB ASICs to interface with the physical layer of the USB through 12-pin or 8-pin interface. It contains V detector, complete ULPI register map and interrupt generator, and the USB differential driver and receivers. The STULPI01 transceiver is suitable for mobile applications and battery powered devices thanks to its low power consumption and power down operating mode.
comparators, ID line
BUS
August 2007 Rev. 1 1/6
For further information contact your local STMicroelectronics sales office.
www.st.com
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Package mechanical data STULPI01A - STULPI01B

1 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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STULPI01A - STULPI01B Package mechanical data
TFBGA36 mechanical data
mm. mils.
Dim.
Min. Typ. Max. Min. Typ. Max.
A 1.0 1.1 1.16 39.4 43.3 45.7
A1 0.25 9.8
A2 0.78 0.86 30.7 33.9
b 0.25 0.300.35 9.8 11.8 13.8
D 3.5 3.6 3.7 137.8 141.7 145.7
D1 2.5 98.4
E 3.5 3.6 3.7 137.8 141.7 145.7
E1 2.5 98.4
e0.5 19.7
F 0.55 21.7
7941410/B
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Order code STULPI01A - STULPI01B

2 Order code

Table 1. Order code

Part numbers Key differences Package Packaging
STULPI01ATBR f
STULPI01BTBR f
=19.2MHz, CSn/PWRDN=0 “ON” µTFBGA36 (3.6x3.6mm Typ) 3000 parts per reel
OSC
=26MHz, CSn/PWRDN=0 “ON” µTFBGA36 (3.6x3.6mm Typ) 3000 parts per reel
OSC
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STULPI01A - STULPI01B Revision history

3 Revision history

Table 2. Document revision history

Date Revision Changes
31-Aug-2007 1 First Issue
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STULPI01A - STULPI01B
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