ST STTH3R02 User Manual

Main product characteristics

STTH3R02

Ultrafast recovery diode

I

F(AV)

V

RRM

T

(max) 175° C

j

(typ) 0.7 V

V

F

(typ) 16 ns

t

rr

3 A

200 V

Features and benefits

■ Very low conduction losses

■ Negligible switching losses

■ Low forward and reverse recovery times

■ High junction temperature

Description

The STTH3R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.

Packaged in DO-201AD, DO-15, and SMC, this
device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection.

K

K

A

A

DO-201AD
STTH3R02

K

STTH3R02S

K

K

SMC

KA

A

A

DO-15

STTH3R02Q

A

Order codes

Part Number Marking

STTH3R02 STTH3R02

STTH3R02RL STTH3R02

STTH3R02Q STTH3R02

STTH3R02QRL STTH3R02

STTH3R02S 3R2S

October 2006 Rev 2 1/9

www.st.com

Characteristics STTH3R02

1 Characteristics

Table 1. Absolute ratings (limiting values at T

= 25° C, unless otherwise specified)

j

Symbol Parameter Value Unit

V

I

RRM

FRM

Repetitive peak reverse voltage 200 V

Repetitive peak forward current

(1)

tp = 5 µs, F = 5 kHz

110 A

DO-201AD / DO-15 70

I

F(RMS)

I

F(AV)

I

FSM

T

T

1. On infinite heatsink with 10 mm lead length

Table 2. Thermal parameters

RMS forward current

SMC 70

DO-15 T

Average forward current, δ = 0.5

SMC T

= 50° C

lead

lead

= 110° C

c

= 90° C

Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A

Storage temperature range -65 to + 175 ° C

stg

Maximum operating junction temperature

T

j

Maximum lead temperature for soldering during 10 s at 4 mm from case 230 ° C

L

(1)

3ADO-201AD T

175 ° C

Symbol Parameter Value Unit

DO-15 45

R

th(j-l)

Junction to lead Lead Length = 10 mm on infinite heatsink

A

° C/WDO-201AD 30

R

th(j-c)

Table 3. Static electrical characteristics

Junction to case SMC 20

Symbol Parameter Test conditions Min. Typ Max. Unit

(1)

I

R

V

1. Pulse test: tp = 5 ms, δ < 2 %

2. Pulse test: t

Reverse leakage current

(2)

Forward voltage drop

F

= 380 µs, δ < 2 %

p

= 25° C

j

= 125° C 3 30

T

j

= 25° C IF = 9 A 1.20

T

j

T

= 25° C

j

Tj = 100° C 0.76 0.85

= 150° C 0.70 0.80

T

j

V

R

I

= 3 A

F

= V

RRM

0.89 1.0

3

T

To evaluate the conduction losses use the following equation:
P = 0.68 x I

F(AV)

+ 0.04 I

F2(RMS)

µA

V

2/9

STTH3R02 Characteristics

Table 4. Dynamic characteristics

Symbol Parameter

t

rr

I

RM

t

fr

V

FP

Reverse recovery time

Reverse recovery current

Forward recovery time

Forward recovery voltage

Test conditions

I

= 1 A, dIF/dt = -50 A/µs,

F

VR = 30 V, Tj = 25° C

= 1 A, dIF/dt = -100 A/µs,

I

F

= 30 V, Tj = 25° C

V

R

= 3 A, dIF/dt = -200 A/µs,

I

F

VR = 160 V, Tj = 125° C

I

= 3 A, dIF/dt = 100 A/µs

F

VFR = 1.1 x V

, Tj = 25° C

Fmax

IF = 3 A, dIF/dt = 100 A/µs,

= 25° C

T

j

Min. Typ Max. Unit

24 30

16 20

3.5 4.5 A

40 ns

1.9 V

Figure 1. peak current versus duty cycle Figure 2. Forward voltage drop versus

forward current (typical values)

IM(A)

100

80

60

δ

P = 10 WP = 10 W

P = 5 WP = 5 W

P = 3 WP = 3 W

40

20

0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

T

T

I

I

M

M

=tp/T

=tp/T

d

δ

tp

tp

IFM(A)

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0

Tj=150°C

Tj=25°C

VFM(V)

ns

Figure 3. Forward voltage drop versus

forward current (maximum values)

IFM(A)

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0

Tj=150°C

Tj=25°C

VFM(V)

Figure 4. Relative variation of thermal

impedance junction to ambient
versus pulse duration - DO-201AD
(Epoxy printed circuit board FR4,
e

=35µm)

CU

Z

th(j-a)/Rth(j-a)

1.0

DO-201AD

L

=10mm

0.9

leads

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

3/9

tP(s)

Characteristics STTH3R02

Q

Figure 5. Relative variation of thermal

impedance junction to ambient
versus pulse duration - DO-15
(Epoxy printed circuit board FR4,
e

=35µm)

CU

Z

th(j-a)/Rth(j-a)

1.0

DO-15

L

=10mm

0.9

leads

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tP(s)

Figure 7. Junction capacitance versus

reverse applied voltage (typical
values)

C(pF)

100

10

1

1 10 100 1000

V

osc

F=1MHz

=30mV

Tj=25°C

VR(V)

RMS

Figure 6. Relative variation of thermal

impedance junction to ambient
versus pulse duration - SMC
(Epoxy printed circuit board FR4,
e

=35µm)

CU

Z

th(j-a)/Rth(j-a)

1.0

SMC

S

=1cm²

0.9

cu

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tP(s)

Figure 8. Reverse recovery charges versus

dI

/dt (typical values)

F

(nC)

RR

80

IF=3A

V

=160V

70

R

60

50

40

30

20

10

0

10 100 1000

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

Figure 9. Reverse recovery time versus dIF/dt

60

50

40

30

20

10

0

10 100 1000

(typical values)

tRR(ns)

Tj=125°C

Tj=25°C

IF=3A

V

=160V

R

dIF/dt(A/µs)

Figure 10. Peak reverse recovery current

versus dI

IRM(A)

8

IF=3A

V

=160V

R

7

6

5

4

3

2

1

0

10 100 1000

/dt (typical values)

F

Tj=125°C

Tj=25°C

dIF/dt(A/µs)

4/9

STTH3R02 Ordering information scheme

Q

/Q

Figure 11. Dynamic parameters versus

junction temperature

]

RR;IRM[Tj

1.4

IF=3A

VR=160V

1.2

1.0

0.8

0.6

0.4

0.2

0.0

25 50 75 100 125 150

RR;IRM[Tj

I

RM

=125°C]

Q

RR

Tj(°C)

Figure 13. Thermal resistance versus copper

surface under each lead for SMC
(Epoxy printed circuit board FR4,
e

= 35µm)

CU

R

(°C/W)

th(j-a)

100

80

60

40

20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SCU(cm²)

SMC

Figure 12. Thermal resistance junction to

ambient versus copper surface
under each lead for DO-15 and
DO-201AD (Epoxy printed circuit
board FR4, e

R

(°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

= 35µm)

CU

DO-15

DO-201AD

SCu(cm²)

Figure 14. Thermal resistance versus lead

length for DO-201AD package

Rth(°C/W)

100

90

80

70

60

50

40

30

20

10

0

5 10152025

R

th(j-a)

R

th(j-l)

L

leads

DO-201AD

(mm)

2 Ordering information scheme

STTH 3 R 02 XXX

Ultrafast switching diode

Average forward current

3 = 3 A

Model R

Repetitive peak reverse voltage

02 = 200 V

Packag e

Blank = DO-201 in Ammopack
RL = DO-201 in Tape and reel
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
S= SMC in Tape and reel

5/9

Package information STTH3R02

3 Package information

● Epoxy meets UL94, V0

● Cooling method: by conduction (C)

Table 5. DO-201AD Dimensions

Dimensions

BB

Note 1 Note 1

ØD

Table 6. DO-15 dimensions

CC

D

A

EE

Note 2

ØC

A

B

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 9.50 0.374

B 25.40 1.000

C 5.30 0.209

D 1.30 0.051

E 1.25 0.049

Notes 1 - The lead diameter ø D is not

controlled over zone E
2 - The minimum length which must stay
straight between the right angles after
bending is 0.59"(15mm)

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 6.05 6.75 0.238 0.266

B 2.95 3.53 0.116 0.139

C 26 31 1.024 1.220

6/9

D 0.71 0.88 0.028 0.035

STTH3R02 Package information

Table 7. SMC dimensions

Dimensions

Ref.

E1

D

E

A1

C

LE2

A2

b

Figure 15. SMC footprint (dimensions in mm)

2.20

4.25

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 2.90 3.2 0.114 0.126

c 0.15 0.41 0.006 0.016

E 7.75 8.15 0.305 0.321

E1 6.60 7.15 0.260 0.281

E2 4.40 4.70 0.173 0.185

D 5.55 6.25 0.218 0.246

L 0.75 1.60 0.030 0.063

2.20

3.30

8.65

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

7/9

Ordering information STTH3R02

4 Ordering information

Part Number Marking Package Weight Base qty Delivery mode

STTH3R02 STTH3R02 DO-201AD 1.16 g 600 Ammopack

STTH3R02RL STTH3R02 DO-201AD 1.16 g 1900 Tape and reel

STTH3R02Q STTH3R02 DO-15 0.4 g 1000 Ammopack

STTH3R02QRL STTH3R02 DO-15 0.4 g 6000 Tape and reel

STTH3R02S 3R2S SMC 0.243 g 2500 Tape and reel

5 Revision history

Date Revision Description of Changes

03-May-2006 1 First issue

10-Oct-2006 2 Added SMC package

8/9

STTH3R02

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2006 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

9/9