ST STTH3L06 User Manual

®

TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER

Table 1: Main Product Characteristics

I

F(AV)

V

I

(max)

R

V

F

(typ)

t

rr

RRM

T

j

(typ)

3 A

600 V

100 µA

175°C

0.85 V

60 ns

STTH3L06

KA

K

A

NC

FEATURES AND BENEFITS

■ Ultrafast switching

■ Low forward voltage drop

■ Low thermal resistance

■ Low leakage current (platinium doping)

DESCRIPTION

The STTH3L06, which is using ST Turbo 2 600V
technology, is specially suited as boost diode in
discontinuous or critical mode power factor correc­tions.
This device is intended for use as a free wheeling
diode in power supplies and other power switching
applications.

Table 2: Order Codes

Part Number Marking

STTH3L06 STTH3L06

STTH3L06RL STTH3L06

STTH3L06B STTH3L06B

STTH3L06B-TR STTH3L06B

STTH3L06U 3L6U
STTH3L06S S06

DO-201AD
STTH3L06

SMB

STTH3L06U

DPAK

STTH3L06B

SMC

STTH3L06S

September 2005 REV. 3

1/10

STTH3L06

Table 3: Absolute Ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

T

T

Table 4: Thermal Parameters

Symbol Parameter Maximum Unit

R

th(j-l)

R

th(j-a)

Repetitive peak reverse voltage 600 V

RMS forward current DO-201AD / SMB / SMC 10 A

DPAK 6

Average forward current
δ = 0.5

DO-201AD Tl = 100°C 3 A

DPAK Tl = 155°C

SMB Tl = 80°C

SMC Tl = 100°C

Surge non repetitive forward current DO-201AD tp = 10ms

SMB / SMC 60

sinusoidal

70 A

DPAK 40

Storage temperature range -65 to + 175 °C

stg

Maximum operating junction temperature 175 °C

j

Junction to lead DO-201AD L = 10 mm 20 °C/W

DPAK 5.5

SMB 25

SMC 20

Junction to ambient (see fig. 13) DO-201AD L = 10 mm 75 °C/W

Table 5: Static Electrical Characteristics

Symbol Parameter Test conditions Min. Typ Max. Unit

I

V

To evaluate the conduction losses use the following equation: P = 0.89 x I

Reverse leakage current Tj = 25°C VR = V

R

T

= 150°C 15 100

j

Forward voltage drop Tj = 25°C IF = 3A 1.3 V

F

= 150°C 0.85 1.05

T

j

F(AV)

RRM

+ 0.055 I

F2(RMS)

3µA

Table 6: Dynamic Characteristics

Symbol Parameter Test conditions Min. Typ Max. Unit

t

Reverse recovery

rr

Tj = 25°C IF = 1A dIF/dt = -50 A/µs VR =30V 60 85 ns

time

t

V

Forward recovery

fr

time

Forward recovery

FP

Tj = 25°C IF = 3A dIF/dt = 100 A/µs

= 1.1 x V

V

FR

Fmax

IF = 3A dIF/dt = 100 A/µs 7.5 V

100 ns

voltage

2/10

STTH3L06

Figure 1: Conduction losses versus average
current

P(W)

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
printed circuit FR4, L

Z/R

th(j-a) th(j-a)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

Single pulse

0.2

0.1

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

SMB

S = 1cm

Cu

SMC

S = 1cm

Cu

2

2

= 10mm, SCU=1cm2)

leads

DPAK

2

S = 1cm

Cu

DO-201AD

L = 10mm

leads

t (s)

p

Figure 2: Forward voltage drop versus forward
current

I (A)

FM

100.0

10.0

1.0

0.1

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

(maximum values)

T =150°C

j

(typical values)

T =150°C

j

V (V)

FM

T =25°C

j

(maximum values)

Figure 4: Peak reverse recovery current
versus dI

I (A)

RM

20

V =400V

R

T =125°C

j

18

16

14

12

10

8

6

4

2

0

0 50 100 150 200 250 300 350 400 450 500

/dt (typical values)

F

I=I

FF(AV)

I =0.5 x I

F F(AV)

I =0.25 x I

FF(AV)

dI /dt(A/µs)

F

I =2 x I

F F(AV)

Figure 5: Reverse recovery time versus dI
(typical values)

t (ns)

rr

700

600

500

400

300

200

100

0

0 20 40 60 80 100 120 140 160 180 200

I =2 x I

F F(AV)

I=I

F F(AV)

dI /dt(A/µs)

F

I =0.5 x I

F F(AV)

V =400V

R

T =125°C

j

/dt

F

Figure 6: Reverse recovery charges versus dIF/
dt (typical values)

Q (nC)

rr

500

V =400V

R

T =125°C

j

450

400

350

300

250

200

150

100

50

0

0 20 40 60 80 100 120 140 160 180 200

I =2 x I

FF(AV)

I=I

FF(AV)

I =0.5 x I

FF(AV)

dI /dt(A/µs)

F

3/10

STTH3L06

Figure 7: Softness factor versus dIF/dt (typical
values)

S factor

2.0

I=I

F F(AV)

1.8

V =400V

R

T =125°C

j

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 20 40 60 80 100 120 140 160 180 200

dI /dt(A/µs)

F

Figure 9: Transient peak forward voltage
versus dI

V (V)

FP

10

I=I

9

T =125°C

8

7

6

5

4

3

2

1

0

0 20 40 60 80 100 120 140 160 180 200

/dt (typical values)

F

F F(AV)

j

dI /dt(A/µs)

F

Figure 8: Relative variations of dynamic
parameters versus junction temperature

1.25

1.00

0.75

0.50

0.25

0.00

25 50 75 100 125

Figure 10: Forward recovery time versus dI

I

RM

Q

RR

T (°C)

S factor

I=I

FF(AV)

V =400V

R

Reference:T =125°C

j

j

/dt

F

(typical values)

t (ns)

fr

200

180

160

140

120

100

80

60

40

20

0

0 20 40 60 80 100 120 140 160 180 200

dI /dt(A/µs)

F

I=I

F F(AV)

V =1.1 x V max.

FR F

T =125°C

j

Figure 11: Junction capacitance versus
reverse voltage applied (typical values)

C(pF)

100

10

V (V)

1

1 10 100 1000

R

4/10

F=1MHz

V =30mV

OSC RMS

T =25°C

j

Figure 12: Thermal resistance junction to
ambient versus copper surface under lead
(epoxy FR4, e

R (°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

=35µm) (DO-201AD)

CU

DO-201AD

S (cm²)

CU

STTH3L06

Figure 13: Thermal resistance junction to
ambient versus copper surface under lead
(epoxy FR4, e

R (°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

=35µm) (SMB / SMC)

CU

SMB

SMC

S (cm²)

CU

Figure 15: Thermal resistance versus lead length

R (°C/W)

th

100

90

80

70

60

50

40

30

20

10

0

5 10152025

R

th(j-a)

R

th(j-l)

L (mm)

lead

DO-201AD

Figure 14: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, eCU=35µm) (DPAK)

R (°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

DPAK

S (cm²)

CU

5/10

STTH3L06

Figure 16: DPAK Package Mechanical Data

DIMENSIONS

REF.

Millimeters Inches

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°

Figure 17: DPAK Foot Print Dimensions

(in millimeters)

6.7

6.7

3

3

1.61.6

2.32.3

6/10

Figure 18: SMB Package Mechanical Data

STTH3L06

DIMENSIONS

E1

D

E

A1

C

L

A2

Figure 19: SMB Foot Print Dimensions

(in millimeters)

REF.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.41 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

b

D 3.30 3.95 0.130 0.156

L 0.75 1.60 0.030 0.063

1.52 2.75

2.3

1.52

7/10

STTH3L06

Figure 20: SMC Package Mechanical Data

DIMENSIONS

E1

D

E

A1

C

L

A2

Figure 21: SMC Foot Print Dimensions

(in millimeters)

REF.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 2.90 3.2 0.114 0.126

c 0.15 0.41 0.006 0.016

E 7.75 8.15 0.305 0.321

E1 6.60 7.15 0.260 0.281

b

E2 4.40 4.70 0.173 0.185

D 5.55 6.25 0.218 0.246

L 0.75 1.60 0.030 0.063

2.0 4.2 2.0

3.3

8/10

Figure 22: DO-201AD Package Mechanical Data

BA

B

ØC

REF.

STTH3L06

DIMENSIONS

Millimeters Inches

note 1

E

note 1

E

Min. Max. Min. Max.

A9.500.374
B 25.40 1.000
C5.300.209
D1.300.051

ØD ØD

note 2

E 1.25 0.049

1 - The lead diameter ø D is not controlled over zone E

NOTES

2 - The minimum axial length within which the device
may be placed with its leads bent at right angles is

0.59"(15 mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com

.

Table 7: Ordering Information

Ordering type Marking Package Weight Base qty

Delivery

mode

STTH3L06 STTH3L06 DO-201AD 1.12 g 600 Ammopack

STTH3L06-RL STTH3L06 DO-201AD 1.12 g 1900 Tape & reel

STTH3L06B STTH3L06B DPAK 0.3 g 75 Tubel

STTH3L06B-TR STTH3L06B DPAK 0.3 g 2500 Tape & reel

STTH3L06U 3L6U SMB 0.11 g 2500 Tape & reel
STTH3L06S S06 SMC 0.243 g 2500 Tape & reel

■ Epoxy meets UL94, V0

■ Band indicated cathode (DO-201AD)

■ Bending method: see application note AN1471 (DO-201AD)

Table 8: Revision History

Date Revision Description of Changes

October-2001 1 First issue

07-Sep-2004 2 SMB, SMC and DPAK packages added

14-Oct-2005 3 Changed marking of STTH3L06U from 3L06U to 3L6U.

Added ECOPACK statement

9/10

STTH3L06

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics.

All other names are the property of their respective owners

© 2005 STMicroelectronics - All rights reserved

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

STMicroelectronics group of companies

www.st.com

10/10