STTH3012
Ultrafast recovery - 1200 V diode
Main product characteristics
I
F(AV)
V
RRM
T
j
(typ) 1.30 V
V
F
(typ) 57 ns
t
rr
30 A
1200 V
175° C
Features and benefits
■ Ultrafast, soft recovery
■ Very low conduction and switching losses
■ High frequency and/or high pulsed current
operation
■ High reverse voltage capability
■ High junction temperature
Description
The high quality design of this diode has
produced a device with low leakage current,
regularly reproducible characteristics and intrinsic
ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term
reliability.
Such demanding applications include industrial
power supplies, motor control, and similar
mission-critical systems that require rectification
and freewheeling. These diodes also fit into
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.
KA
A
K
DO-247
STTH3012W
A
K
TO-220AC
STTH3012D
Order codes
Part Number Marking
STTH3012D STTH3012D
STTH3012W STTH3012W
The improved performance in low leakage
current, and therefore thermal runaway guard
band, is an immediate competitive advantage for
this device.
March 2006 Rev 1 1/9
www.st.com
9
Characteristics STTH3012
1 Characteristics
Table 1. Absolute ratings (limiting values at 25° C, unless otherwise specified)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FRM
I
FSM
T
Table 2. Thermal parameters
Repetitive peak reverse voltage 1200 V
RMS forward current 50 A
Average forward current, δ = 0.5 Tc = 105° C 30 A
Repetitive peak forward current tp = 5 µs, F = 5 kHz square 300 A
Surge non repetitive forward current tp = 10 ms Sinusoidal 210 A
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature 175 °C
T
j
Symbol Parameter Value Unit
R
th(j-c)
Table 3. Static electrical characteristics
Junction to case 0.95 °C/W
Symbol Parameter Test conditions Min. Typ Max. Unit
T
(1)
I
R
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: t
Reverse leakage current
(2)
Forward voltage drop
F
= 380 µs, δ < 2 %
p
= 25° C
j
= 125° C 15 150
T
j
= V
V
R
RRM
Tj = 25° C
Tj = 125° C 1.25 1.9
= 150° C 1.20 1.8
T
j
T
= 25° C
j
Tj = 125° C 1.35 2.05
= 150° C 1.30 1.95
T
j
= 25 A
I
F
= 30 A
I
F
20
2.1
2.25
µA
V
To evaluate the conduction losses use the following equation:
P = 1.60 x I
2/9
F(AV)
+ 0.012 I
F2(RMS)
STTH3012 Characteristics
Table 4. Dynamic characteristics
Symbol Parameter
t
Reverse recovery time
rr
I
Reverse recovery current
RM
S Softness factor
t
Forward recovery time
fr
V
Forward recovery voltage
FP
Figure 1. Conduction losses versus
average current
P(W)
80
δ = 0.5
δ
I (A)
F(AV)
δ = 0.2
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35
δ = 0.05
δ = 0.1
Test conditions
I
= 1 A, dIF/dt = -50 A/µs,
F
VR = 30 V, Tj = 25° C
= 1 A, dIF/dt = -100 A/µs,
I
F
= 30 V, Tj = 25° C
V
R
= 30 A, dIF/dt = -200 A/µs,
I
F
VR = 600 V, Tj = 125° C
I
= 30 A, dIF/dt = -200 A/µs,
F
VR = 600 V, Tj = 125° C
= 30 A dIF/dt = 100 A/µs
I
F
= 1.5 x V
V
FR
= 30 A, dIF/dt = 100 A/µs,
I
F
= 25° C
T
j
, Tj = 25° C
Fmax
Figure 2. Forward voltage drop versus
I (A)
120
110
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
=tp/T
δ = 1
T
tp
forward current
FM
T=150°C
j
(maximum values)
T=150°C
j
(typical values)
Min. Typ Max. Unit
115
ns
57 80
25 35 A
1.5
550 ns
6V
T= 25°C
j
(maximum values)
V (V)
FM
3/9
Characteristics STTH3012
Figure 3. Relative variation of thermal
impedance junction to case
versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
Single pulse
0.3
0.2
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
Figure 5. Reverse recovery time versus
dI
/dt (typical values)
F
t (ns)
rr
800
700
I =2 x I
600
500
400
300
200
0 50 100 150 200 250 300 350 400 450 500
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
V =600V
R
T=125°C
j
Figure 7. Softness factor versus dIF/dt
(typical values)
S factor
3.0
2.5
2.0
1.5
1.0
dI /dt(A/µs)
0.5
0 50 100 150 200 250 300 350 400 450 500
F
I 2xI
≤
F F(AV)
V =600V
R
T=125°C
j
Figure 4. Peak reverse recovery current
versus dI
I (A)
RM
60
V =600V
R
55
T=125°C
j
50
45
40
35
30
25
20
15
10
5
0
I =0.5 x I
F F(AV)
0 50 100 150 200 250 300 350 400 450 500
/dt (typical values)
F
I =2 x I
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
Figure 6. Reverse recovery charges versus
dIF/dt (typical values)
Q (µC)
rr
8
V =600V
R
T=125°C
j
7
6
5
4
3
2
1
0
0 50 100 150 200 250 300 350 400 450 500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
Figure 8. Relative variations of dynamic
parameters versus junction
temperature
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
25 50 75 100 125
S factor
t
rr
I
RM
Q
RR
T (°C)
j
I=I
F F(AV)
V =600V
R
Reference:T =125°C
j
4/9
STTH3012 Characteristics
Figure 9. Transient peak forward voltage
versus dI
V (V)
FP
30
I=I
F F(AV)
T=125°C
j
25
20
15
10
5
0
0 100 200 300 400 500
/dt (typical values)
F
dI /dt(A/µs)
F
Figure 11. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
F=1MHz
V =30mV
OSC RMS
T=25°C
j
Figure 10. Forward recovery time versus dI
(typical values)
t (ns)
fr
1100
1000
900
800
700
600
500
400
300
200
0 100 200 300 400 500
dI /dt(A/µs)
F
I=I
F F(AV)
V =1.5 x V max.
FR F
T=125°C
j
F
/dt
100
V (V)
10
1 10 100 1000
R
5/9
Package information STTH3012
2 Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 Nm (TO-220AC)
Recommended torque value: 0.80 Nm (DO-247)
Maximum torque value: 0.7 Nm (TO-220AC)
Maximum torque value: 1.0 Nm (DO-247)
Table 5. DO-247 dimensions
DIMENSIONS
REF.
Millimeters Inches
Min. Max Min. Max.
A 4.85 5.15 0.191 0.203
V
D 2.20 2.60 0.086 0.102
E 0.40 0.80 0.015 0.031
V
Dia
F 1.00 1.40 0.039 0.055
F2 2.00 0.078
H
A
F3 2.00 2.40 0.078 0.094
G 10.90 0.429
L5
L
L2
L4
F2
L1
L3
V2
F3
F
G
D
ME
H 15.45 15.75 0.608 0.620
L 19.85 20.15 0.781 0.793
L1 3.70 4.30 0.145 0.169
L2 18.50 0.728
L3 14.20 14.80 0.559 0.582
L4 34.60 1.362
L5 5.50 0.216
M 2.00 3.00 0.078 0.118
V5° 5°
6/9
V2 60° 60°
Dia. 3.55 3.65 0.139 0.143
STTH3012 Package information
Table 6. T0-220AC dimensions
DIMENSIONS
L2
F1
REF.
Millimeters Inches
Min. Max. Min. Max.
H2
Ø I
L5
A
C
L7
L6
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
L9
L4
F
G
D
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
M
E
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering information STTH3012
3 Ordering information
Part Number Marking Package Weight Base qty Delivery mode
STTH3012D STTH3012D TO-220AC 1.86 g 50 Tube
STTH3012W STTH3012W DO-247
4.4 g
30 Tube
4 Revision history
Date Revision Description of Changes
02-Mar-2006 1 First issue.
8/9
STTH3012
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