ST STTH200L06TV User Manual

Features
Ultrafast switching
Low reverse current
Low thermal resistance
STTH200L06TV
Turbo 2 ultrafast high voltage rectifier
A1 K1
A2 K2
K1
Description
The STTH200L06TV, which is using ST Turbo 2 600 V technology, is specially suited for use in switching power supplies, and industrial applications (such as welding), as rectification diode.
K2
A2
ISOTOP
STTH200L06TV1

Table 1. Device summary

Symbol Value
I
F(AV)
V
RRM
T
j
(typ) 0.95 V
V
F
t
(max) 80 ns
rr
A1
Up to 2 x 120 A
600 V
150 °C
TM: ISOTOP is a trademark of STMicroelectronics
September 2011 Doc ID 10767 Rev 2 1/8
www.st.com
8
Characteristics STTH200L06TV

1 Characteristics

Table 2. Absolute ratings (limiting values, per diode)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
T

Table 3. Thermal parameter

Repetitive peak reverse voltage 600 V
RRM
Forward rms current 180 A
T
= 65 °C Per diode 100 A
Average forward current, δ = 0.5
Surge non repetitive forward current tp = 10 ms Sinusoidal 800 A
FSM
Storage temperature range -55 to + 150 °C
stg
Maximum operating junction temperature 150 °C
T
j
c
= 35 °C Per diode 120 A
T
c
Symbol Parameter Maximum Unit
Per diode 0.60
R
R
Junction to case
th(j-c)
Coupling 0.1
th(c)
°C/WTo ta l 0 .3 5
When the diodes 1 and 2 are used simultaneously:
Δ T
j (diode1)
Table 4. Static electrical characteristics (per diode)
Symbol Parameter Test conditions Min. Typ. Max. Unit
= P
(diode1)
x R
th(j-c) (per diode)
+ P
(diode2)
x R
th(c)
T
= 25 °C
(1)
I
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Reverse leakage current
R
(2)
Forward voltage drop Tj = 25 °C IF = 100 A 1.55
F
j
= 125 °C 100 1000
T
j
= 150 °C 0.95 1.20
T
j
To evaluate the maximum conduction losses use the following equation: P = 0.93 x I
2/8 Doc ID 10767 Rev 2
F(AV)
+ 0.0027 I
F2(RMS)
= V
V
R
RRM
µA
V
100
STTH200L06TV Characteristics

Table 5. Dynamic characteristics (per diode)

Symbol Parameter
t
rr
I
RM
t
fr
V
FP
Reverse recovery time
Reverse recovery current
Forward recovery time
Forward recovery voltage
= 25 °C
T
j
= 125 °C
T
j
= 25 °C
T
j
T
= 25 °C
j
Test conditions
I
= 0.5 A, Irr = 0.25 A,
F
= 1 A
I
R
= 1 A, dIF/dt = 50 A/µs,
I
F
= 30 V
V
R
I
= 100 A, dIF/dt = 400 A/µs,
F
dIF/dt = 100 A/µs
= 100 A, dIF/dt = 200 A/µs
I
F
= 1.1 x V
V
FR
= 100 A, dIF/dt = 200 A/µs
I
F
= 1.1 x V
V
FR
Figure 1. Conduction losses versus average
forward current (per diode)
P(W)
200
180
160
140
120
100
δ = 0.05
80
60
40
20
0
0 20 40 60 80 100 120 140 160
δ = 0.2
δ = 0.1
I (A)
F(AV)
δ = 0.5
δ = 1
δ
=tp/T
T
tp
Figure 3. Relative variation of thermal
impedance junction to case versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t (s)
p
Min. Typ. Max. Unit
80
85 120
15 20 A
Fmax
Fmax
3.4 V
700 ns
Figure 2. Forward voltage drop versus
forward current (per diode)
I (A)
FM
200
180
160
140
120
100
80
60
40
20
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
(maximum values)
T =150°C
j
(typical values)
T =150°C
j
V (V)
FM
T =25°C
j
(maximum values)
Figure 4. Peak reverse recovery current
versus dI
F
/dt
(typical values, per diode)
I (A)
RM
60
V =400V
R
T =125°C
j
50
40
30
20
10
0
0 50 100 150 200 250 300 350 400 450 500
I =0.5 x I
F F(AV)
I=I
dI /dt(A/µs)
F
F F(AV)
I =2 x I
F F(AV)
ns
Doc ID 10767 Rev 2 3/8
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