ST STTH2002C User Manual

STTH2002C
High efficiency ultrafast diode
Features
Suited for SMPS
Low losses
Low forward and reverse recovery times
High junction temperature
Insulated package: TO-220FPAB
Description
Dual center tap rectifier suited for switch mode power supplies and high frequency DC to DC converters.
Packaged in TO-220AB, D
2
and I
PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications.
2
PAK, TO-220FPAB
A1
A2
A2
K
A1
TO-220AB
STTH2002CT
A2
K
A1
TO-220FPAB
STTH2002CFP

Table 1. Device summary

K
I2PA K
STTH2002CR
K
K
A1
2
PA K
D
STTH2002CG
A2
K
A1
A2
Symbol Value
I
F(AV)
V
RRM
(max) 175 °C
T
j
(typ) 0.78 V
V
F
t
(typ) 22 ns
rr
Up to 2 x 10 A
200 V
June 2010 Doc ID 10176 Rev 2 1/11
www.st.com
11
Characteristics STTH2002C

1 Characteristics

Table 2. Absolute ratings (limiting values, per diode)

Symbol Parameter Value Unit
V
I
F(RMS)
Repetitive peak reverse voltage 200 V
RRM
Forward rms current 30 A
Tc = 150 °C Per diode 10 A
I
F(peak)
I
T

Table 3. Thermal parameters

Avarage forward current δ = 0.5
Surge non repetitive forward current tp = 10 ms sinusoidal 90 A
FSM
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature 175 °C
T
j
2
PAK, D2PA K,
I TO-220AB
TO-220FPAB
= 140 °C Per device 20 A
T
c
T
= 130 °C Per diode 15 A
c
= 115 °C Per device 30 A
T
c
T
= 120 °C Per diode 10 A
c
T
= 85 °C Per device 20 A
c
Symbol Parameter Value (max) Unit
Per diode 2.5
Per device 1.6
Per diode 5
°C/W
R
th(j-c)
I2PAK , D2PAK, TO-220AB
Junction to case
TO-220FPAB
Per device 3.8
2
I
R
th(c)
Coupling
PAK , D2PAK, TO-220AB 0.7
TO-220FPAB 2.5
When the diodes 1 and 2 are used simultaneously: Δ T
j (diode1)
2/11 Doc ID 10176 Rev 2
= P
(diode1)
x R
th(j-c) (per diode
) + P
(diode2)
x R
th(c)
STTH2002C Characteristics

Table 4. Static electrical characteristics (per diode)

Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
I
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: t
Reverse leakage current
R
(2)
Forward voltage drop
F
= 380 µs, δ < 2 %
p
Tj = 25 °C
VR = V
= 125 °C 6 100
T
j
= 25 °C IF = 10 A 1.1
T
j
T
= 25 °C IF = 20 A 1.25
j
= 150 °C IF = 10 A 0.78 0.89
T
j
= 150 °C IF = 20 A 1.05
T
j
RRM
10
To evaluate the conduction losses use the following equation: P = 0.73 x I

Table 5. Dynamic electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit
t
rr
t
fr
V
FP
I
RM
Reverse recovery time Tj = 25 °C
Forward recovery time Tj = 25 °C
Forward recovery voltage Tj = 25 °C
Reverse recovery current Tj = 125 °C
F(AV)
+ 0.020 I
F2(RMS)
= 1 A, VR = 30 V
I
F
/dt = 100 A/µs
dI
F
I
= 10 A,
F
/dt = 100 A/µs
dI
F
VFR = 1.1 x V
= 10 A,
I
F
/dt = 100 A/µs
dI
F
Fmax
IF = 10 A, VR = 160 V
/dt = 200 A/µs
dI
F
22 27 ns
200 ns
2.4 V
7.0 9.0 A
µA
V
Doc ID 10176 Rev 2 3/11
Characteristics STTH2002C
Figure 1. Peak current versus duty cycle
(per diode)
I (A)
M
80
70
60
50
40
30
P = 5W
20
10
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
P = 20W
P = 10W
δ
I
δ
M
=tp/T
T
tp
Figure 3. Forward voltage drop versus
forward current (maximum values, per diode)
I (A)
FM
100
90
80
70
60
50
40
30
20
10
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
T =150°C
j
V (V)
FM
T =25°C
j
Figure 5. Relative variation of thermal
impedance junction to case versus pulse duration (TO-220FPAB)
Z/R
th(j-c) th(j-c)
1.0
Figure 2. Forward voltage drop versus
forward current (typical values, per diode)
I (A)
FM
100
90
80
70
60
50
40
30
20
10
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
T =150°C
j
V (V)
FM
T =25°C
j
Figure 4. Relative variation of thermal
impedance junction to case versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
Single pulse
0.1
1.E-03 1.E-02 1.E-01 1.E+00
TO-220AB, D PAK, I PAK
t (s)
p
22
Figure 6. Junction capacitance versus
reverse voltage applied (typical values, per diode)
C(pF)
100
F=1MHz
V =30mV
OSC RMS
T =25°C
j
Single pulse
0.1
t (s)
0.0
p
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
10
0 50 100 150 200
4/11 Doc ID 10176 Rev 2
V (V)
R
STTH2002C Characteristics
I =10A
F
V =160V
R
dI
/dt (typical values, per diode)
F
T =125°C
j
dI /dt(A/µs)
F
versus dI
/dt
F
T =25°C
j
Figure 8. Reverse recovery time versus dI
(typical values, per diode)
t (ns)
rr
80
I =10A
F
V =160V
R
70
60
50
40
30
20
10
0
10 100 1000
T =125°C
j
dI /dt(A/µs)
F
T =25°C
j
Figure 10. Dynamic parameters versus
junction temperature
Figure 7. Reverse recovery charges versus
Q (nC)
rr
300
250
200
150
100
50
0
10 100 1000
Figure 9. Peak reverse recovery current
(typical values, per diode)
I (A)
RM
16
I =10A
F
V =160V
R
14
12
10
8
6
4
2
0
10 100 1000
T =125°C
j
dI /dt(A/µs)
F
T =25°C
j
Q;rrI [T ]/Q ;I [T =125°C]
RM j rr RM j
1.4
I =10A
F
V =160V
R
1.2
1.0
I
0.8
0.6
0.4
0.2
0.0
25 50 75 100 125 150
RM
Q
rr
T (°C)
j
Figure 11. Thermal resistance junction to ambient versus copper surface under tab (Epoxy
printed circuit board FR4, copper thickness: 35 µm) for D
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
02468101214161820
S(Cu)(cm²)
2
PAK
F
/dt
Doc ID 10176 Rev 2 5/11
Package information STTH2002C

2 Package information

Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value : 0.4 to 0.6 N·n
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. I2PAK dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
L2
A
E
c2
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.044 0.067
D
c 0.49 0.70 0.019 0.028
c2 1.23 1.32 0.048 0.052
L1
L
b1
A1
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
E 10 10.40 0.394 0.409
b
e
e1
c
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
6/11 Doc ID 10176 Rev 2
STTH2002C Package information
Table 7. D
L2
L
L3
2
PAK dimensions
E
A1
B2
B
G
2mm min. FLAT ZONE
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A
C2
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
D
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
A2
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
V2
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016

Figure 12. Footprint (dimensions in mm)

16.90
10.30
8.90
V2
5.08
1.30
3.70
Doc ID 10176 Rev 2 7/11
Package information STTH2002C

Table 8. TO-220AB dimensions

Dimensions
L2
F2
F1
F
G1
H2
Dia
G
L9
L5
L6
L4
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
A
C
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
L7
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
M
E
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
8/11 Doc ID 10176 Rev 2
Diam. 3.75 3.85 0.147 0.151
STTH2002C Package information

Table 9. TO-220FPAB dimensions

Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
L6
L2
L3
L5
F1
L4
F2
F
G1
G
D
L7
E
F 0.75 1 0.030 0.039
F1 1.15 1.5 0.045 0.059
F2 1.15 1.5 0.045 0.059
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
Doc ID 10176 Rev 2 9/11
Ordering information STTH2002C

3 Ordering information

Table 10. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STTH2002CT STTH2002CT TO-220AB 2.23 g 50 Tube
STTH2002CG STTH2002CG D2PAK 1.48 g 50 Tube
2
STTH2002CG-TR STTH2002CG D
STTH2002CR STTH2002CR I
PAK 1.48 g 1000 Tape and reel
2
PAK 1.49 g 50 Tube
STTH2002CFP STTH2002CFP TO-220AB 1.70 g 50 Tube

4 Revision history

Table 11. Document revision history

Date Revision Changes
Feb-2004 1 First issue.
23-Jun-2010 2 Updated Ta b l e 1 . Updated ECOPACK statement.
10/11 Doc ID 10176 Rev 2
STTH2002C
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Doc ID 10176 Rev 2 11/11
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