STPSC6H065
650 V power Schottky silicon carbide diode
Features
■No or negligible reverse recovery
■Switching behavior independent of temperature
■Dedicated to PFC applications
■High forward surge capability
Description
The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide bandgap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature.
Especially suited for use in PFC applications, this ST SiC diode will boost the performance in hard switching conditions. Its high forward surge capability ensures more margin during transient phases.
Datasheet − production data
K
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K |
A |
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NC |
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K |
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TO-220AC |
D2PAK |
STPSC6H065D |
STPSC6H065G |
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K |
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A |
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NC |
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DPAK |
STPSC6H065B
Table 1. |
Device summary |
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Value |
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IF(AV) |
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6 A |
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VRRM |
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650 V |
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Tj (max) |
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175 °C |
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QC (typ) |
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10 nC |
June 2012 |
Doc ID 023247 Rev 1 |
1/9 |
This is information on a product in full production. |
www.st.com |
Characteristics |
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STPSC6H065 |
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1 |
Characteristics |
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Table 2. |
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Absolute ratings (limiting values at 25 °C unless otherwise specified) |
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Value |
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VRRM |
Repetitive peak reverse voltage |
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650 |
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V |
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IF(RMS) |
Forward rms current |
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A |
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DPAK, Tc = TBD °C, δ = 0.5 |
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IF(AV) |
Average forward current |
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TO-220AC, Tc = 122 °C, δ = 0.5 |
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A |
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D2PAK, T = TBD °C, δ = 0.5 |
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c |
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Surge non repetitive forward |
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tp = 10 ms sinusoidal, Tc = 25 °C |
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IFSM |
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tp |
= 10 ms sinusoidal, Tc = 125 °C |
52 |
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A |
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current |
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tp = 10 µs square, Tc = 25 °C |
400 |
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Tstg |
Storage temperature range |
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-55 to +175 |
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°C |
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Tj |
Operating junction temperature |
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-40 to +175 |
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°C |
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Table 3. |
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Thermal resistance (typical values) |
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Value |
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DPAK |
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Rth(j-c) |
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Junction to case |
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TO-220AC |
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1.6 |
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°C/W |
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D2PAK |
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Table 4. |
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Static electrical characteristics |
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Symbol |
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Parameter |
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Tests conditions |
Min. |
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Typ. |
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Max. |
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Unit |
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I |
(1) |
Reverse leakage |
Tj = 25 °C |
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V |
R |
= V |
RRM |
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5 |
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60 |
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µA |
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current |
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R |
Tj = 150 °C |
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- |
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250 |
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V |
(2) |
Forward voltage drop |
Tj = 25 °C |
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I |
= 6 A |
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1.56 |
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1.75 |
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V |
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F |
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Tj = 150 °C |
F |
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- |
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1.98 |
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2.5 |
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1. tp = 10 ms, δ < 2% |
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2. tp = 500 µs, δ < 2% |
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To evaluate the conduction losses use the following equation: |
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P = 1.35 x IF(AV) + 0.192 x IF2(RMS) |
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Table 5. |
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Other parameters |
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Symbol |
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Parameter |
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Test conditions |
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Typ. |
Unit |
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Qc |
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Total capacitive charge |
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Vr = 400 V, IF = 6 A dIF/dt = -500 A/µs |
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10 |
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nC |
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Tj = 150 °C |
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C |
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Total capacitance |
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Vr = 0 V, Tc = 25 °C, F = 1 Mhz |
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300 |
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pF |
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Vr = 400 V, Tc = 25 °C, F = 1 Mhz |
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30 |
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2/9 |
Doc ID 023247 Rev 1 |
STPSC6H065 |
Characteristics |
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I |
(A) |
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I |
(A) |
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FM |
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FM |
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12 |
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60 |
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Puse test : tp=380µs |
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Puse test : tp=380µs |
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10 |
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50 |
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Ta=25 °C |
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8 |
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Ta=150 °C |
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40 |
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Ta=25 °C |
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6 |
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Ta=175 °C |
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4 |
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Ta=150 °C |
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2 |
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VFM(V) |
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VFM(V) |
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Ta=175 °C |
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0 |
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0 |
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0.0 |
0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
0.0 |
1.0 |
2.0 |
3.0 |
4.0 |
5.0 |
6.0 |
7.0 |
8.0 |
Figure 3. Reverse leakage current versus |
Figure 4. Peak forward current versus case |
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reverse voltage applied |
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temperature |
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(typical values) |
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I |
(µA) |
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70 |
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(A) |
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1.E+02 |
R |
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Tj=175 °C |
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T |
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1.E+01 |
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δ = tp/T |
tp |
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Tj=150 °C |
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40 |
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1.E+00 |
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δ = 0.3 |
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δ = 0.5 |
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δ = 0.7 |
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Tj=25 °C |
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VR(V) |
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δ = 1 |
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1.E-02 |
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0 |
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TC(°C) |
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0 |
50 |
100 |
150 |
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250 |
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350 |
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650 |
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0 25 50 75 100 125 150 175
Figure 5. Relative variation of thermal |
Figure 6. Non-repetitive peak surge forward |
impedance junction to case |
current versus pulse duration |
versus pulse duration |
(sinusoidal waveform) |
Z |
/R |
th(j c) |
th(j c) |
1.0 |
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0.9 |
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0.8 |
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0.7 |
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0.6 |
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0.5 |
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0.4 |
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0.3 |
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0.2 |
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0.1 |
Single pulse |
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tp(s) |
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0.0 |
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1.E-05 |
1.E-04 |
1.E-03 |
1.E-02 |
1.E-01 |
1.E+00 |
1.E+03 |
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Ta=25 °C |
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1.E+02 |
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Ta=125 °C |
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tp(s) |
1.E+01 |
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1.E-05 |
1.E-04 |
1.E-03 |
1.E-02 |
Doc ID 023247 Rev 1 |
3/9 |