Features
■ High junction temperature capability
■ Low leakage current
■ Good trade off between leakage current and
forward voltage drop
■ Low thermal resistance
■ High frequency operation
Description
STPS61H100C
High voltage power Schottky rectifier
Datasheet − production data
A1
A2
K
Dual center tap Schottky rectifier suited for high
frequency switch mode power supply.
Packaged in TO-247, this device is intended for
use to enhance the reliability of the application.
A1
TO-247
j
Table 1. Device summary
I
F(AV)
V
RRM
(max) 175 °C
T
j
V
(max) 0.67 V
F
A2
K1
2 x 30 A
100 V
March 2012 Doc ID 10029 Rev 3 1/7
This is information on a product in full production.
www.st.com
7
Characteristics STPS61H100C
1 Characteristics
Table 2. Absolute ratings (limiting values, per diode)
Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
FSM
P
T
Repetitive peak reverse voltage 100 V
RRM
Forward rms current 80 A
Average forward current
Tc = 150 °C
δ = 0.5
Per diode
Per device
Surge non repetitive forward current tp = 10 ms sinusoidal 450 A
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 26400 W
ARM
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature
T
j
(1)
30
60
175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
<
Rth(j-a)
1
dPtot
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 3. Thermal resistance
Symbol Parameter Value Unit
R
R
Junction to case
th(j-c)
Junction to case Coupling 0.3 °C/W
th(c)
Per diode
To t al
0.9
0.6
°C/W
When the diodes 1 and 2 are used simultaneously:
ΔTj(diode 1) = P(diode1) x R
Table 4. Static electrical characteristics (per diode)
(Per diode) + P(diode 2) x R
th(j-c)
th(c)
A
Symbol Parameter Test conditions Min. Typ. Max. Unit
= 25 °C
T
(1)
I
V
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
R
(1)
Forward voltage drop
F
j
= 125 °C 4 16 mA
T
j
= 25 °C IF = 30 A 0.79
T
j
T
= 125 °C IF = 30 A 0.63 0.67
j
= 25 °C IF = 60 A 0.93
T
j
T
= 125 °C IF = 60 A 0.72 0.78
j
To evaluate the conduction losses use the following equation:
P = 0.56 x I
2/7 Doc ID 10029 Rev 3
F(AV)
+ 0.0036 I
F2(RMS)
V
= V
R
RRM
V
316µA
STPS61H100C Characteristics
Figure 1. Conduction losses versus average
current (per diode)
P (W)
F(AV)
30
25
20
15
10
5
0
0 5 10 15 20 25 30 35 40
δ = 0.05
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3. Normalized avalanche power
derating versus junction
temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
I (A)
M
400
350
300
250
200
150
100
IM
50
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
T =25°C
c
T =75°C
c
T =125°C
c
Figure 2. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 4. Average forward current versus
ambient temperature (δ = 0.5, per
diode)
I (A)
F(AV)
35
30
25
20
15
10
5
0
0 25 50 75 100 125 150 175
δ
=tp/T
T
tp
R=R
th(j-a) th(j-c)
R =15°C/W
th(j-a)
T (°C)
amb
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
δ = 0.1
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
δ
=tp/T
T
tp
Doc ID 10029 Rev 3 3/7