Features
■ Very low forward voltage drop for less power
dissipation and reduced heatsink
■ Optimized conduction/reverse losses trade-off
which means the highest efficiency in the
applications
■ High power surface mount miniature package
■ Avalanche capability specified
Description
Single Schottky rectifier suited to switched mode
power supplies and high frequency DC to DC
converters.
This device is especially intended for use as a
rectifier at the secondary of 3.3 V SMPS units.
STPS5L25
Low drop power Schottky rectifier
2
1
NC
DPAK
4(TAB)
2
3
3
4
Table 1. Device summary
I
F(AV)
V
RRM
(max) 150 °C
T
j
(max) 0.35 V
V
F
5 A
25 V
April 2008 Rev 6 1/7
www.st.com
7
Characteristics STPS5L25
d
-
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
P
ARM
T
stg
T
Repetitive peak reverse voltage 25 V
RMS forward current 7 A
Average forward current TC = 145 °C δ = 0.5 5 A
Surge non repetitive forward current tp = 10 ms sinusoidal 75 A
Repetitive peak reverse current tp = 2 µs square F = 1 kHz 1 A
Non repetitive peak reverse current tp = 100 µs square 2 A
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 3000 W
Storage temperature range -65 to + 150 °C
Maximum operating junction temperature
j
(1)
150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Ptot
--------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 3. Thermal resistance
1
--------------------------
<
Rth j a–()
Symbol Parameter Value Unit
R
th(j-c)
Table 4. Static electrical characteristics
Junction to case 2.5 °C/W
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1)
I
R
V
F
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
(
1.)Forward voltage drop
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = V
RRM
55 115 mA
IF = 5 A 0.47
IF = 5 A 0.31 0.35
IF = 10 A 0.59
IF = 10 A 0.41 0.50
350 µA
V
2/7
STPS5L25 Characteristics
Figure 1. Average forward power dissipation
versus average forward current
PF(av)(W)
2.5
2.0
1.5
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
1.0
T
0.5
tp
=tp/T
0.0
IF(av) (A)
0123456
δ
Figure 3. Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
IF(av)(A)
6
5
Rth(j-a)=Rth(j-c)
4
3
2
Rth(j-a)=70°C/W
T
1
tp
=tp/T
δ
0
0 25 50 75 100 125 150
Tamb(°C)
Figure 4. Normalized avalanche power
derating versus junction
temperature
P(t)
ARM p
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
0 25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
100
80
60
40
IM
20
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=25°C
Tc=75°C
Tc=100°C
Figure 6. Relative variation of thermal
impedance junction to case
versus pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.1
δ = 0.5
δ = 0.2
Single pulse
tp(s)
δ
=tp/T
T
tp
0.6
0.4
0.2
0.0
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+0
3/7
Characteristics STPS5L25
Figure 7. Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA)
3E+2
1E+2
1E+1
Tj=150°C
Tj=125°C
1E+0
1E-1
Tj=25°C
1E-2
1E-3
0 5 10 15 20 25
VR(V)
Figure 9. Forward voltage drop versus
forward current (maximum values)
IFM(A)
100.0
Typical values
Tj=150°C
10.0
1.0
Tj=125°C
Tj=25°C
Figure 8. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
2000
F=1MHz
Tj=25°C
1000
500
200
VR(V)
100
12 5102030
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, copper thickness:
35 µm)
Rth(j-a) (°C/W)
100
80
60
40
20
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
4/7
VFM(V)
0
0 2 4 6 8 101214161820
S(Cu) (cm²)
STPS5L25 Package Information
2 Package Information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 11. DPAK dimensions
Dimensions
®
Ref
A 2.20 2.40 0.086 0.094
E
B2
L2
A
C2
A1 0.90 1.10 0.035 0.043
A2 0.003 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
H
L4
B
G
R
A1
D
R
C
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
0.60 MIN.
A2
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
V2
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
Figure 12. Foot print dimensions (in millimeters)
6.7 3 3
Millimeters Inches
Min. Max. Min. Max.
1.6
6.7
2.3
2.3
1.6
5/7
Ordering information STPS5L25
3 Ordering information
Table 5. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS5L25B-TR STPS5L25B DPAK 0.30 g 2500 Tape and reel
4 Revision history
Table 6. Document revision history
Date Revision Changes
Jul-2003 5A Previous release.
15-Apr-2008 6 Reformatted to current standards. Corrected order code in Ta b l e 5.
6/7
STPS5L25
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