The STPS50U100C is a dual power Schottky
diode rectifier, suited for high frequency switch
mode power supplies.
Featuring an ultralow forward voltage (ULVF)
drop, this device, packaged in TO-220AB and
2
I
PAK, is intended to be used in notebook, game
station and desktop adaptors as well as server
SMPS. It has been especially designed to help
power supply manufacturers meet the recently
introduced worldwide efficiency standards.
A1
A2
A2
K
A1
K
TO-220AB
STPS50U100CT
Table 1.Device summary
STPS50U100CR
SymbolValue
I
F(AV)
V
RRM
(typ) (25 A @ 125 °C)0.64 V
V
F
T
(max)150 °C
j
2
PAK
I
2 x 25 A
A1
100 V
A2
K
TM: ULVF is a trademark of STMicroelectronics
November 2010Doc ID 16603 Rev 21/8
www.st.com
8
CharacteristicsSTPS50U100C
1 Characteristics
Table 2.Absolute ratings (limiting values per diode at 25 °C, unless otherwise specified)
SymbolParameterValueUnit
V
I
F(RMS)
I
F(AV)
I
T
1. condition to avoid thermal runaway for a diode on its own heatsink
Table 3.Thermal resistance
Repetitive peak reverse voltage100 V
RRM
Forward rms current50 A
Average forward current, δ = 0.5
Surge non repetitive forward currenttp = 10 ms, half sine-wave250 A
FSM
Storage temperature range-65 to + 150 °C
stg
T
Maximum operating junction temperature
j
<
Rth(j-a)
1
dPtot
dTj
(1)
TC = 120 °C
= 105 °C
T
C
Per diode
Per device
25
50
150 °C
SymbolParameterValueUnit
R
R
th (j-c)
th (c)
Junction to case
Per diode
Per device
Coupling0.45°C/W
1.3
0.9
°C/W
When the diodes 1 and 2 are used simultaneously:
ΔT
(diode 1) = P(diode1) x R
j
Table 4.Static electrical characteristics
(Per diode) + P(diode2) x R
th(j-c)
th(c)
A
SymbolParameterTests conditionsMin.Typ.Max.Unit
= 25 °C
T
Reverse leakage current
I
R
V
Forward voltage drop
F
j
= 125 °C -10-mA
T
j
= 25 °C
T
j
T
= 125 °C -1540mA
j
T
= 25 °C
j
T
= 125 °C -0.38-
j
T
= 25 °C
j
Tj = 125 °C -0.54-
T
= 25 °C
j
= 125 °C -0.640.7
T
j
VR = 70 V
= V
V
R
RRM
= 5 A
I
F
= 15 A
I
F
IF = 25 A
To evaluate the conduction losses use the following equation: P = 0.475 x I
-15-µA
-30200µA
-0.48-
-0.58-
-0.670.73
+ 0.009 I
F(AV)
F2(RMS)
2/8Doc ID 16603 Rev 2
V
STPS50U100CCharacteristics
Figure 1.Average forward power dissipation
versus average forward current
(per diode)
P
(W)
F(AV)
28
δ = 0.1
24
20
16
12
8
4
0
05101520253035
δ = 0.05
δ = 0.2
δ= tp/T
δ = tp/T
δ = 0.5
T
T
t
t
p
p
δ = 1
I
F(AV)
(A)
Figure 3.Reverse leakage current versus
reverse voltage applied (typical
values, per diode)
IR(mA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0 102030405060708090100
Tj= 150 °C
Tj= 125 °C
Tj= 100 °C
Tj= 75 °C
Tj= 50 °C
Tj= 25 °C
VR(V)
Figure 5.Relative variation of thermal
impedance junction to case versus
pulse duration
Z
th(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-041.E-031.E-021.E-011.E+00
tp(s)
Figure 2.Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
IM(A)
250
225
200
175
150
125
100
75
50
I
M
25
0
1.E-031.E-021.E-011.E+00
δ = 0.5
t
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
t(s)
Figure 4.Average forward current versus
ambient temperature
(δ = 0.5, per diode)
I
(A)
F(AV)
30
R
= R
th(j-a)
25
20
15
10
5
0
T
δ = tp/T
0255075100125150
t
p
th(j-c)
T
amb
(°C)
Figure 6.Junction capacitance versus
reverse voltage applied
(typical values, per diode)
C(pF)
10000
1000
100
110100
V
osc
F = 1 MHz
= 30 mV
Tj= 25 °C
RMS
VR(V)
Doc ID 16603 Rev 23/8
Application informationSTPS50U100C
Figure 7.Forward voltage drop versus forward current (per diode)
IFM(A)
50
45
40
35
30
25
20
15
10
5
0
0.00.10.20.30.40.50.60.70.80.91.0
Tj= 125 °C
(Maximum value)
Tj= 125 °C
(Typical value)
Tj= 25 °C
(Maximum value)
VFM(V)
2 Application information
It is mandatory to ensure a peak reverse voltage below the V
absolute rating. ST
RRM
recommends the use of an RC clamping snubber circuit in parallel with the STPS50U100C
device.
Figure 8.Application schematic
R
DC/DC input
STPS50U100C
C
DC/DC output
4/8Doc ID 16603 Rev 2
STPS50U100CPackage information
3 Package information
●Epoxy meets UL94,V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 5.TO-220AB dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
C1.231.320.0480.051
H2
Dia
A
C
D2.402.720.0940.107
E0.490.700.0190.027
L2
F2
F1
L5
L6
L9
L4
F
G1
L7
F0.610.880.0240.034
F11.141.700.0440.066
F21.141.700.0440.066
G4.955.150.1940.202
D
G12.402.700.0940.106
H21010.400.3930.409
L216.4 typ.0.645 typ.
M
E
L413140.5110.551
L52.652.950.1040.116
G
L615.2515.750.6000.620
L76.206.600.2440.259
L93.503.930.1370.154
M2.6 typ.0.102 typ.
Dia.3.753.850.1470.151
Doc ID 16603 Rev 25/8
Package informationSTPS50U100C
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device,
IS NOT PERMITTED. A standard through-hole mounting is mandatory.
Table 6.I2PAK dimensions
Dimensions
L2
Ref.
MillimetersInches
Min.Max.Min.Max.
A
E
c2
A4.404.600.1730.181
A12.402.720.0940.107
b0.610.880.0240.035
b11.141.700.0440.067
D
c0.490.700.0190.028
c21.231.320.0480.052
L1
L
b1
A1
D8.959.350.3520.368
e2.402.700.0940.106
e14.955.150.1950.203
E1010.400.3940.409
b
e
e1
c
L13140.5120.551
L13.503.930.1380.155
L21.271.400.0500.055
6/8Doc ID 16603 Rev 2
STPS50U100COrdering information
4 Ordering information
Table 7.Ordering information
Order codeMarkingPackageWeightBase qtyDelivery mode
STPS50U100CTSTPS50U100CTO-220AB2.23 g50Tube
STPS50U100CRSTPS50U100CI2PAK1.49 g50Tube
For the latest information on available order codes see the product pages on www.st.com.
5 Revision history
Table 8.Document revision history
DateRevisionChanges
17-Nov-20091First release.
04-Nov-20102Added trademark statement for UVLF.
Doc ID 16603 Rev 27/8
STPS50U100C
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