This power Schottky rectifier is designed and
packaged to comply with the ESCC5000
specification for aerospace products. Housed in
hermetically sealed packages both surface mount
and through hole, it is ideal for use in applications
for aerospace and other harsh environments.
The STPS40100HR is intended for use in medium
voltage application and particularly, in high
frequency circuits where low switching losses and
low noise are required.
Table 1.Device summary
Order code
STPS40100C2FSY1-
STPS40100C2FSYHR5106/019/01ESCC flightY
ESCC detailed
specification
Quality levelConfigurationPackageMassEPPL
Engineering
model
Double die,
common cathode
pin 2
T0-25410.0 g
-
March 2010Doc ID 17306 Rev 11/9
www.st.com
9
CharacteristicsSTPS40100HR
1 Characteristics
Table 2.Absolute maximum ratings
SymbolCharacteristicValueUnit
(6)
(6)
(3)
(2)
(1)
300A
100V
1A
(4), (5)
20
40
-65 to +175 °C
-65 to +175°C
+260
> +125 °C are carried out in a 100%
amb
A
°C
V
I
FSM
I
RRM
RRM
Forward surge current (per diode)
Repetitive peak reverse voltage
Repetitive peak reverse current
Average output rectified current (50% duty cycle):
I
O
per diode
per device
I
F(RMS)
T
OP
T
T
STG
T
SOL
Forward rms current (per diode)30 A
Operating temperature range
(case temperature)
Junction temperature+175 °C
J
Storage temperature range
Soldering temperature:
For TO-254
(7)
dV/dtCritical rate of rise of reverse voltage10000 V/µs
1. Sinusoidal pulse of 10 ms duration
2. Pulsed, duration 5 ms, F = 50 Hz
3. Pulsed, duration 2 µs, F = 1 kHz
4. For T
5. The “per device” ratings apply only when both anode terminals are tied together.
6. For devices with hot solder dip lead finish all testing performed at T
inert atmosphere.
7. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same
lead shall not be resoldered until 3 minutes have elapsed.
≥ +132°C per device and T
case
≥ +148°C per diode, derate linearly to 0 A at +175°C.
case
Table 3.Thermal resistance
SymbolCharacteristicValueUnit
Thermal resistance, junction to case
(1)
R
th(j-c)
per diode
per device
1. Package mounted on infinite heatsink
2/9Doc ID 17306 Rev 1
1.5
1.2
°C/W
STPS40100HRCharacteristics
Table 4.Electrical measurements at ambiant temperature (per diode), T
SymbolCharacteristic
I
R1
I
R2
(1)
V
F1
(1)
V
F2
(1)
V
F3
CCapacitance4001V
Z
th(j-c)
1. Pulse width ≤ 300µs, duty cycle ≤ 2%
2. Performed only during screening tests parameter drift values (initial measurements for HTRB), go-no-go.
3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and
shall guarantee the R
Table 5.Electrical measurements at high and low temperatures (per diode)
SymbolCharacteristic
s
Reverse current4016
Forward voltage4011
Relative thermal impedance,
(2)
junction to case
limits specified in maximum ratings.
th(j-c)
MIL-STD-750
test method
3101
MIL-STD-750
test method
= 22 ±3 °C
amb
Values
Test conditions
Min.Max.
DC method, VR = 100 V-30µA
DC method, VR = 50 V-5µA
Pulse method, I
= 5 A-610mV
F
Pulse method, IF = 10 A-730mV
Pulse method, IF = 20 A-900mV
= 10 V, F = 1 MHz-1nF
R
= 15 to 40 A, tH = 50 ms
I
H
IM = 50 mA, tmd = 100 µs
Test conditions
(1)
Calculate ΔV
Values
(3)
F
Min.Max.
Units
°C/W
Units
T
= +125 (+0, -5) °C
I
R1
case
DC method, VR = 100 V
-20mA
Reverse current4016
T
= +125 (+0, -5) °C
I
R2
(2)
V
F2
Forward voltage4011
(2)
V
F3
1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a
100% inspection may be performed.
2. Pulse width ≤ 300µs, duty cycle ≤ 2%
case
DC method, VR = 50 V
= +125 (+0, -5) °C
T
case
pulse method, IF = 10 A
T
= +125 (+0, -5) °C
case
pulse method, IF = 20 A
T
= -55 (+5, -0) °C
case
pulse method, IF = 20 A
-7.5mA
-660mV
-850mV
-950mV
Doc ID 17306 Rev 13/9
ConfigurationsSTPS40100HR
2 Configurations
Figure 1.Available device configuration
STPS40100C2FSY1
STPS40100C2FSYHR
1
Terminal 1:
Terminal 2:
Terminal 3:
Anode a
Common cathode
Anode b
2
3
4/9Doc ID 17306 Rev 1
STPS40100HRPackage Information
3 Package Information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 2.Metal flange mount package (TO-254
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
(a)
), 3 lead dimension definitions
R1
G
R2
B
H
ØF
C
3
2
1
N
L
D
E
A
ØM
K
K
a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections
ØI
J
Doc ID 17306 Rev 15/9
Package InformationSTPS40100HR
Table 6.Metal flange mount package (TO-254), 3-lead dimension values
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