Features
■ Negligible switching losses
■ Low thermal resistance
■ Avalanche capability specified
■ AEC Q101 qualified
■ ECOPACK
®
2 compliant component
Description
STPS3L60-Y
Automotive power Schottky rectifier
Schottky rectifier suited for switched mode power
supplies and high frequency DC to DC
converters.
Packaged in SMC this device is intended for use
in DC/DC chargers for automotive applications.
STPS3L60SY
SMC
(JEDEC DO-214AB)
Table 1. Device summary
I
3 A
F(AV)
V
RRM
150 °C
T
j (max)
V
F (max)
60 V
0.65 V
September 2011 Doc ID 17537 Rev 1 1/7
www.st.com
7
Characteristics STPS3L60-Y
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
P
T
Repetitive peak reverse voltage 60 V
RRM
Forward rms current 10 A
= 100 °C δ = 0.5
Average forward current
Surge non repetitive forward
current
Repetitive peak reverse current
Repetitive peak avalanche power
ARM
Storage temperature range -65 to +175 °C
stg
T
Operating junction temperature range
j
T
C
t
= 10 ms Sinusoidal 75 A
p
t
= 2 µs square F=1 kHz
p
= 1 µs Tj = 25 °C
t
p
(1)
1600 W
-40 to +150 °C
3A
1A
dV/dt Critical rate of rise reverse voltage 10000 V/µs
dPtot
---------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 3. Thermal resistances
1
--------------------------
<
Rth j a–()
Symbol Parameter Value Unit
Junction to leads 20 ° C/W
R
th (j-l)
Table 4. Static electrical characteristics
Symbol Parameter Tests conditions Min. Typ. Max. Unit
(1)
I
Reverse leakage current
R
Tj = 25 °C
= 125 °C
T
j
VR = V
RRM
10 15
55
µA
mA
T
= 25 °C
j
T
= 125 °C
(1)
VF
1. Pulse test: tp = 380 µs, δ < 2%
Forward voltage drop
j
T
= 25 °C
j
= 125 °C
T
j
To evaluate the conduction losses use the following equation:
P = 0.54 x I
2/7 Doc ID 17537 Rev 1
F(AV)
+ 0.037x I
F2(RMS)
I
= 3 A 0.7
F
I
= 3 A 0.56 0.65
F
I
= 6 A 0.94
F
= 6 A 0.67 0.76
I
F
V
STPS3L60-Y Characteristics
0
Figure 1. Average forward power dissipation
versus average forward current
PF(av)(W)
2.5
2.0
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
1.5
1.0
T
0.5
=tp/T
0.0
IF(av) (A)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
δ
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
Figure 2. Average forward current versus
ambient temperature (
IF(av)(A)
3.5
3.0
2.5
2.0
1.5
δ
=tp/T
T
tp
1.0
0.5
0.0
0 25 50 75 100 125 15
Rth(j-a)=Rth(j-l)
Rth(j-a)=75°C/W
Tamb (° C)
δ = 0.5)
Figure 4. Normalized avalanche power
derating versus junction
temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
14
12
10
8
6
4
IM
2
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=25°C
Tc=50°C
Tc=100°C
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 6. Relative variation of thermal
impedance junction to lead versus
pulse duration
Zth(j-l)/Rth(j-l)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
δ = 0.2
0.4
0.3
δ = 0.1
0.2
Single pulse
0.1
0.0
1E-3 1E-2 1E-1 1E+0
tp(s)
δ
T
=tp/T
tp
Doc ID 17537 Rev 1 3/7
Characteristics STPS3L60-Y
Figure 7. Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA)
5E+1
1E+1
1E+0
1E-1
1E-2
1E-3
0 5 10 15 20 25 30 35 40 45 50 55 60
Tc=150°C
Tc=125°C
Tc=100°C
Tc=75°C
Tc=50°C
Tc=25°C
VR(V)
Figure 9. Forward voltage drop versus
forward current (low level,
maximum values)
IFM(A)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Tj=150°C
(typical values)
Tj=25°C
Tj=125°C
VFM(V)
Figure 8. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
500
F=1MHz
Tj=25°C
200
100
50
20
VR(V)
10
1 10 100
Figure 10. Forward voltage drop versus
forward current (high level,
maximum values)
IFM(A)
20
Tj=150°C
10
(typical values)
5
2
1
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
VFM(V)
Tj=25°C
Tj=125°C
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead
Rth(j-a) (°C/W)
100
Epoxy printed circuit board FR4,
80
60
40
20
0
012345
4/7 Doc ID 17537 Rev 1
copper thickness = 35 µm
S(Cu) (cm²)
STPS3L60-Y Package information
2 Package information
● Epoxy meets UL94,V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Table 5. SMC Dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Dimensions
Ref.
E1
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
D
E
A2 0.05 0.20 0.002 0.008
(1)
b
c
2.90 3.20 0.114 0.126
(1)
0.15 0.40 0.006 0.016
D 5.55 6.25 0.218 0.246
A1
C
LE2
A2
b
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
L 0.75 1.50 0.030 0.059
1. Dimensions b and c apply to plated leads
Figure 12. Footprint, dimensions in mm (inches)
1.545.111.54
(0.061) (0.201)
8.19
(0.322)
Doc ID 17537 Rev 1 5/7
(0.061)
3.14
(0.124)
Ordering information STPS3L60-Y
3 Ordering information
Table 6. Ordering information
Order code Marking Package Weight Base qty
STPS3L60SY S36Y SMC 0.24 g 2500 Tape and reel
4 Revision history
Table 7. Document revision history
Date Revision Changes
15-Sep-2011 1 Initial release.
Delivery
mode
6/7 Doc ID 17537 Rev 1
STPS3L60-Y
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Doc ID 17537 Rev 1 7/7
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