ST STPS340 User Manual

Main product characteristics

I

F(AV)

V

RRM

T

(max) 150° C

j

(max) 0.57 V

V

F

3 A

40 V

STPS340

Power Schottky rectifier

K

A

NC

DPAK

STPS340B

Features and Benefits

■ Very small conduction losses

■ Negligible switching losses

■ Low forward voltage drop

■ Low thermal resistance

■ Extremely fast switching

■ Surface mounted device

■ Avalanche capability specified

Description

Single chip Schottky rectifier suited for switch
mode power supplies and high frequency DC to
DC converters.

Packaged in DPAK, SMC, SMB, and low profile
SMB, this device is intended for use in low and
medium voltage operation, high frequency
inverters, free wheeling and polarity protection
applications where low switching losses are
required.

A

K

SMB

STPS340U

K

SMB flat

STPS340UF

Order codes

Part Number Marking

STPS340U U34

STPS340S S34

STPS340B S340

A

K

SMC

STPS340S

A

STPS340B-TR S340

STPS340UF FU34

February 2007 Rev 9 1/11

www.st.com

11

Characteristics STPS340

1 Characteristics

Table 1. Absolute Ratings (limiting values)

Symbol Parameter Value Unit

V

I

F(RMS)

I

F(AV)

I

P

T

1. condition to avoid thermal runaway for a diode on its own heatsink

Table 2. Thermal resistance

Repetitive peak reverse voltage 40 V

RRM

RMS forward current DPAK 6 A

T

= 135° C δ = 0.5 DPAK

c

Average forward current

Surge non repetitive forward current tp =10 ms sinusoidal 75 A

FSM

Repetitive peak avalanche power tp = 1 µs Tj = 25° C 1300 W

ARM

Storage temperature range -65 to + 150 °C

stg

Operating junction temperature

T

j

dPtot

--------------­dTj

1

--------------------------

<

Rth j a–()

= 105° C δ = 0.5 SMB/SMC

L

T

= 115° C δ = 0.5 SMB flat

L

(1)

3AT

150 °C

Symbol Parameter Value Unit

SMB 25

R

th(j-l)

Junction to lead

°C/WSMB flat 15

SMC 20

th(j-c)

Junction to case DPAK 5.5 °C/W

R

Table 3. Static electrical characteristics

Symbol Parameter Test Conditions Min. Typ. Max. Unit

= 25° C

T

(1)

I

V

1. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

R

(1)

Forward voltage drop

F

j

= 125° C 2 10 mA

T

j

= 25° C

T

j

T

= 125° C 0.52 0.57

j

= 25° C

T

j

T

= 125° C 0.63 0.72

j

To evaluate the conduction losses use the following equation:
P = 0.42 x I

2/11

F(AV)

+ 0.050 I

F2(RMS)

V

R

= 3 A

I

F

= 6 A

I

F

= V

20 µA

RRM

0.63

V

0.84

STPS340 Characteristics

Figure 1. Average forward power dissipation

versus average forward current (per
diode)

P (W)

F(AV)

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3. Average forward current versus

ambient temperature (δ = 0.5, per
diode) (SMB flat)

I (A)

F(AV)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0 25 50 75 100 125 150

δ

=tp/T

T

tp

R=R

th(j-a) th(j-l)

T (°C)

amb

SMB flat

R =40°C/W

th(j-a)

. S =2.5 cm

CU

2

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values) (SMB)

I (A)

M

10

9

8

7

6

5

4

3

2

IM

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB

T =25°C

a

T =75°C

a

T =125°C

a

Figure 2. Average forward current versus

ambient temperature (δ = 0.5, per
diode) (DPAK / SMB / SMC)

I (A)

F(AV)

3.5

3.0

2.5

R =65°C/W

δ

=tp/T

th(j-a)

T

tp

2.0

1.5

1.0

0.5

0.0

0 25 50 75 100 125 150

R=R

th(j-a) th(j-l)

T (°C)

amb

DPAK

SMB / SMC

Figure 4. Non repetitive surge peak forward

current versus overload duration
(maximum values) (DPAK)

I (A)

M

60

50

40

30

20

IM

10

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

DPAK

T =25°C

c

T =75°C

c

T =125°C

c

Figure 6. Non repetitive surge peak forward

current versus overload duration
(maximum values) (SMC)

I (A)

M

12

11

10

9

8

7

6

5

4

3

IM

2

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMC

T =25°C

a

T =75°C

a

T =125°C

a

3/11

Characteristics STPS340

Figure 7. Non repetitive surge peak forward

current versus overload duration
(maximum values) SMB flat

I (A)

M

25

20

15

10

5

IM

t

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t(s)

SMB flat

T =25°C

L

T =75°C

L

T =125°C

L

Figure 9. Normalized avalanche power

derating versus junction
temperature

P(t)

ARM p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 11. Relative variation of thermal

impedance junction to ambient
versus pulse duration (SMB)

Z/R

th(j-a) th(j-a)

1.0

SMB

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

δ

=tp/T

T

tp

Figure 8. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 10. Relative variation of thermal

impedance junction to ambient
versus pulse duration (DPAK)

Z/R

th(j-a) th(j-a)

1.0

DPAK

0.9

0.8

0.7

0.6

0.5

0.4

Single pulse

0.3

0.2

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00

t (s)

p

δ

T

=tp/T

Figure 12. Relative variation of thermal

impedance junction to ambient
versus pulse duration (SMC)

Z/R

th(j-a) th(j-a)

1.0

SMC

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

δ

T

=tp/T

tp

tp

4/11

STPS340 Characteristics

Figure 13. Relative variation of thermal

impedance junction to lead
versus pulse duration - SMB flat

Z/R

th(j-l) th(j-l)

1.0

SMB flat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

t (s)

p

Figure 15. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

1000

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Figure 14. Reverse leakage current versus

reverse voltage applied (typical
values)

I (mA)

R

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

1.E-04

0 5 10 15 20 25 30 35 40

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=25°C

V (V)

R

Figure 16. Forward voltage drop versus

forward current

I (A)

FM

10

Tj=125°C

(Maximum values)

1

100

V (V)

10

1 10 100

R

Figure 17. Thermal resistance junction to

ambient versus copper surface
under each lead (epoxy printed
board FR4, e

R (°C/W)

th(j-a)

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

= 35 µm) (DPAK)

CU

S (cm²)

CU

DPAK

Tj=125°C

Tj=125°C

(Typical values)

(Typical values)

0

0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

Tj=25°C

(Maximum values)

V (V)

FM

Figure 18. Thermal resistance junction to

ambient versus copper surface
under each lead (epoxy printed
board FR4, e

= 35 µm)

CU

(SMB / SMC)

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S (cm²)

CU

SMB / SMC

5/11

Package Information STPS340

Figure 19. Thermal resistance junction to

ambient versus copper surface
under each lead (epoxy printed
board FR4, e

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMB flat

= 35 µm) (SMB flat)

CU

S (cm²)

CU

2 Package Information

● Band indicates cathode on SMB and SMC

● Epoxy meets UL94, V0

Table 4. DPAK dimensions

E

B2

L2

H

L4

B

G

0.60 MIN.

A1

A2

V2

A

C2

D

R

R

C

Dimensions

Ref

Millimeters Inches

Min. Max. Min. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

6/11

STPS340 Package Information

Figure 20. DPAK footprint dimensions (in millimeters)

1.6

2.3

2.3

1.6

Dimensions

6.7

Table 5. SMB dimensions

6.7 3 3

E1

D

E

A1

C

L

A2

b

Ref.

Figure 21. SMB footprint (dimensions in mm)

1.62

2.60

5.84

1.62

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

2.18

7/11

Package Information STPS340

Table 6. SMB Flat dimensions

Dimensions

Ref.

A

D

L

E

E1

c

A 0.90 1.10 0.035 0.043

(1)

b

(1)

c

L2

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.200 0.220

L

b

E1 4.05 4.60 0.189 0.181

L1

L 0.75 1.50 0.029 0.059

L1 0.40 0.016

L2 0.60 0.024

1. Applies to plated leads

Figure 22. SMB Flat footprint (dimensions in mm)

5.84

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

1.95 2.20 0.077 0.087

0.15 0.40 0.006 0.016

2.07

1.20 1.203.44

8/11

STPS340 Package Information

Table 7. SMC package mechanical data

Dimensions

Ref

E1

D

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

E

A1

E 7.75 8.15 0.305 0.321

E1 6.60 7.15 0.260 0.281

C

LE2

A2

b

E2 4.40 4.70 0.173 0.185

D 5.55 6.25 0.218 0.246

Figure 23. Foot print dimensions (in millimeters)

1.54

5.03

Millimeters Inches

Min. Max. Min. Max.

b 2.90 3.2 0.114 0.126

c 0.15 0.41 0.006 0.016

L 0.75 1.40 0.030 0.063

1.54

3.15

8.11

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

9/11

Ordering information STPS340

3 Ordering information

Ordering type Marking Package Weight Base qty Delivery mode

STPS340U U34 SMB 0.107 g 2500

STPS340S S34 SMC 0.243 g 2500

STPS340B

S340 DPAK 0.30 g

STPS340B-TR 2500 Tape and reel

STPS340UF FU34 SMB flat 0.50 g 5000 Tape and reel

4 Revision history

Date Revision Description of Changes

Jul-2003 7B Last update.

Feb-2005 8 Layout update. No content change.

08-Feb-2007 9

Tape and reel

75 Tube

Reformatted to current standard. Added ECOPACK
statement. Added SMB flat package.

10/11

STPS340

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2007 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

11/11