The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established stripbased PowerME SH™ layout. In addition to pushing
on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the
most demanding applications. Such series complements ST full range of high voltage MOSFETs i ncluding revolutionary MDmesh™ products.
STP10NK60Z-STP10NK60ZFP, STB10NK60Z, ST B10NK60Z -1, S TW10NK 60Z
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
TO-220/
2
PAK/I2PAK
D
Drain-source Voltage (VGS=0)
Drain-gate Voltage (RGS=20kΩ)600V
Gate- source Voltage± 30V
Drain Current (continuous) at TC= 25°C1010 (*)10A
Drain Current (continuous) at TC= 100°C5.75.7 (*)5.7A
()
Drain Current (pulsed)3636 (*)36A
Total Dissipation at TC= 25°C
11535156W
I
V
DM
P
V
DGR
V
I
I
TOT
DS
GS
D
D
Derating Factor0.920.281.25W/°C
V
ESD(G-S)
Gate source ESD
(HBM-C=100pF, R=1.5KΩ)
dv/dt (1)Peak Diode Recovery voltage slope4.5V/ns
V
ISO
T
j
T
stg
() Pulse width limited by safe operating area
(1) I
≤10A, di/dt ≤200A/µs,VDD≤ V
SD
Insulation Withstand Voltage (DC)
Operating Junction Temperature
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
E
AS
E
AR
Single Pulse Avalanche Energy
(starting T
= 25 °C, ID=IAR,VDD=50V)
j
Repetitive Avalanche Energy
(Pulse with limited by T
max)
j
max.)
j
9A
300mJ
3.5mJ
GATE-SOURCE ZENER DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain)30V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIOD ES
The built-in back -to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb pos sible voltage trans ients that may occas ionally be
applied from gate to source. In this respect the Zener v olt age is appropriate to achieve an efficient and
cost-effective intervention toprotectthedevice’sintegrity.These integrated Zener diodes thus avoid
the usage of external components.
2/14
STP10NK60Z-STP10NK60ZFP, STB10N K60 Z, STB10N K60Z-1, ST W 10N K60Z
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SP ECIFIED)
CASE
ON/OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=1mA,VGS= 0600V
Breakdown Voltage
I
I
GSS
V
GS(th)
R
DS(on)
DSS
Zero Gate Voltage
Drain Current (V
GS
=0)
Gate-body Leakage
Current (V
DS
=0)
Gate Threshold Voltage
Static Drain-source On
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C
V
= ± 20V±10µA
GS
V
DS=VGS,ID
= 100µA
33.754.5V
1
50
VGS=10V,ID= 4.5 A0.650.75Ω
Resistance
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
(1)Forward TransconductanceVDS=15V,ID= 4.5 A7.8S
g
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
(3)Equivalent Output
=25V,f=1MHz,VGS= 01370
V
DS
156
37
VGS=0V,VDS= 0V to 480V90pF
Capacitance
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Q
Q
Q
Turn-on Delay Time
t
r
g
gs
gd
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD=300V,ID=4A
RG= 4.7Ω VGS=10V
(Resistive Load see, Figure 3)
STP10NK60Z-STP10NK60ZFP, STB10NK60Z, ST B10NK60Z -1, S TW10NK 60Z
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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