The STOD13AS is a dual DC-DC converter for
AMOLED display panels. It integrates a step-up
and an inverting DC-DC converter making it
particularly suitable for battery operated products,
in which the major concern is overall system
efficiency. It works in pulse skipping mode during
low load conditions and PWM-MODE at 1.5 MHz
frequency for medium/high load conditions. The
high frequency allows the value and size of
external components to be reduced. The Enable
pin allows the device to be turned off, therefore
reducing the current consumption to less than 1
µA. The negative output voltage can be
programmed by an MCU through a dedicated pin
which implements single-wire protocol. Soft-start
with controlled inrush current limit, thermal
shutdown, and short-circuit protection are
integrated functions of the device.
Order codePositive voltageNegative voltagePackagePackaging
STOD13ASTPUR4.6V-2.4V to -6.4VDFN12L (3 x 3mm)3000 parts per reel
1. A 250 mA load can be provided with inductor saturation current as a minimum of 0.9 A.
2. At -6.4 V, a 250 mA load can be provided with inductor saturation current as a minimum of 1.5 A. See
CoilCraft
Murata
CoilCraft
Murata
Murata
Taiyo YudeN
Murata
Taiyo YudeN
Murata
Taiyo YudeN
Murata
Taiyo YudeN
LPS4012-472ML
LQH3NPN4R7MM0
LPS4012-472ML
LQH3NPN4R7MM0
GRM219R61A106KE44
LMK212BJ106KD-T
GRM219R61A106KE44
LMK212BJ106KD-T
GRM219R61A106KE44
LMK212BJ106KD-T
GRM185R60J105KE26
JMK107BJ105KK-T
4.7µH
4.7µH
2 x 10µF0805
10µF
2 x 10µF
1µF
4.0 x 4.0 x 1.2
3.0 x 3.0 x 1.5
4.0 x 4.0 x 1.2
3.0 x 3.0 x 1.5
0805
0805
0805
0805
0603
0603
±20%, I = 1.7A, R = 0.175Ω
±20%, I = 1.25A, R = 0.13Ω
±20%, I = 1.7A, R = 0.175Ω
±20%, I = 1.25A, R = 0.13Ω
±10%, X5R, 10V
±10%, X5R, 10V
±10%, X5R, 10V
±10%, X5R, 10V
±10%, X5R, 10V
±10%, X5R, 10V
±10%, X5R, 6.3V
±10%, X5R, 6.3V
Section 7.1.1
.
Note:All the above components refer to the typical application performance characteristics.
Operation of the device is not limited to the choice of these external components. Inductor
values ranging from 3.3 µH to 6.8 µH can be used together with the STOD13AS.
4/25Doc ID 022733 Rev 1
STOD13ASSchematic
UVLO
LOGIC CONTROL
OTP
S-WIRE
RING
KILLER
VREF
OSC
STEP-UP
CONTROL
FAST
DISCHARGE
DMD
INVERTING
CONTROL
FAST
DISCHARGE
DMD
s
s
s
s
V
INA
EN
S
WIRE
V
REF
AGND
PGND
#
#
VREF
S-WIRE
control
N1
s
V
INP
V
MID
V
O2
L
X1
L
X2
P1A
P1B
P2
N2
FD
SSD
SCP
OLP
VO2
LX
CURRENT
SENSE
VINP
Figure 2.Block schematic
AM10458v1
Doc ID 022733 Rev 15/25
Pin configurationSTOD13AS
2 Pin configuration
Figure 3.Pin configuration (top view)
Table 3.Pin description
Pin namePin n°Description
Lx
1
1Boost converter switching node
PGND 2Power ground pin
V
MID
FD4
3Boost converter output voltage
Fast discharge control pin. When pulled LOW, the fast discharge after
shutdown is active. When pulled HIGH, the fast discharge is OFF
AGND 5Signal ground pin. This pin must be connected to the power ground layer
V
S
REF
WIRE
6
7Negative voltage setting pin
EN 8
V
O2
Lx
2
V
IN A
V
12Power input supply voltage
IN P
9Inverting converter output voltage
10Inverting converter switching node
11Analogic input supply voltage
Exposed
pad
Voltage reference output. 1 µF bypass capacitor must be connected
between this pin and AGND
Enable control pin. High = converter on; Low = converter in shutdown
mode
Internally connected to AGND. Exposed pad must be connected to
ground layers in the PCB layout in order to guarantee proper operation of
the device
Note:Absolute maximum ratings are those values beyond which damage to the device may occur.
Functional operation under these condition is not implied.
The Lx1 and Lx2 have high slew rate and they can be over the absolute maximum rating
during operation due to the parasitic inductance in the PCB and scope probe. An absolute
maximum rating of Lx1 and Lx2 is related to voltage supplied by an external source so the
internally generated Lx1 and Lx2 voltage during normal operation doesn't damage the
chipset.
Table 5.Thermal data
SymbolParameterValueUnit
R
thJA
R
thJC
1. The package is mounted on a 4-layer (2S2P) JEDEC board as per JESD51-7.
Thermal resistance junction-ambient33°C/W
Thermal resistance junction-case (FR-4 PCB)
(1)
2.12°C/W
Doc ID 022733 Rev 17/25
Electrical characteristicsSTOD13AS
4 Electrical characteristics
TJ = 25 °C, V
C
= 2 x 10 µF, C
O2
INA
= V
= 3.7 V, I
INP
= 1 µF, L1 = L2 = 4.7 µH, V
REF
MID,O2
= 30 mA, C
= 2 x 10 µF, C
IN
= 2 V, V
EN
= 4.6 V, V
MID
MID
= 10 µF,
= -4.9 V unless
O2
otherwise specified.
Table 6.Electrical characteristics
SymbolParameterTest conditionsMin.Typ.Max.Unit
General section
V
INA, VINP
UVLO_HUnder voltage lockout HIGHV
UVLO_LUnder voltage lockout LOWV
I_
I
Q_SH
V
EN
V
EN
I
EN
V
FD
V
FD
I
FD
fsSwitching frequencyPWM mode1.351.51.65MHz
D1
D2
V
REF
I
REF
Supply input voltage2.53.74.5V
rising2.222.25V
INA
falling1.92.18V
INA
VI
Input currentNo load condition1.72.1mA
= VSW = GND
V
Shutdown current
HEnable high threshold
EN
T
= -40°C to +85°C
J
=2.5V to 4.5V,
V
INA
= -40°C to +85°C
T
J
1.2V
LEnable low threshold0.4
Enable input current
HFast discharge high threshold
V
EN=VINA
= -40°C to +85°C
T
J
V
INA
= -40°C to +85°C
T
J
=4.5V;
=2.5V to 4.5V,
1.2V
LFast discharge low threshold0.4
=4.5V;
=10 to 30mA,
=4.6V, VO2=-4.9V
=30 to 150mA,
=4.6V, VO2=-4.9V
=150 to 250mA,
=4.6V, VO2=-4.9V
78
85
82
=10µA1.2081.2201.232V
100µA
MAX
MAX
V
Fast discharge input current
FD=VINA
= -40°C to +85°C
T
J
Step-up maximum duty cycleNo load87%
Inverting maximum duty cycle No load87%
I
MID,O2
V
MID
I
Total system efficiency
Reference voltageI
Reference current capability
MID,O2
V
MID
I
MID,O2
V
MID
REF
@ 98.5% of no load
reference voltage
1µA
1µA
50µA
%
Step-up converter section
Positive output voltage4.6V
V
V
MID
Positive output voltage total
variation
INA=VINP
I
MID
load T
=2.9V to 4.5V;
=5mA to 250mA, IO2 no
= -40°C to +85°C
J
8/25Doc ID 022733 Rev 1
-0.80.8%
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