The STM32L073Z-EVAL evaluation board is designed as a complete demonstration and
development platform for the STMicroelectronics Arm
STM32L073VZT6 microcontroller with three I
interfaces, one UART interface, 12-bit ADC and DAC, LCD driver, up to 192-Kbyte Flash
memory, 20-Kbyte RAM, 6-Kbyte EEPROM, touch sensing, USB OTG FS, LCD controller,
SWD debugging support. This evaluation board can be used as reference design for user
application development but is not considered as a final application.
The full range of hardware features on the board help the user to evaluate all peripherals
(USB OTG FS, USART, 12-bit ADC and DAC, color TFT LCD, LCD glass, low-power UART,
IrDA, microSD™ card, touch sensing slider, pressure measurement, temperature
measurement, LC sensor metering) and develop his applications. The extension headers
offer the possibility to connect a daughterboard or a wrapping board for a specific
application.
An embedded ST-LINK/V2-1 debugger facilitates the software development and the
programming of the STM32L073VZT6 microcontroller.
featuring 192 Kbytes of Flash memory and 20 Kbytes of RAM in LQFP100 package
•Four 5 V power supply options: power jack, ST-LINK USB connector, user USB FS
connector, or daughterboard
•Selectable MCU voltage: 3.3 V or adjustable from 1.7 V to 3.6 V
•2.8-inch color TFT LCD with resistive touchscreen
•LCD glass 40 x 8 segments
•On-board current measurement
•IrDA transceiver
•Pressure sensor
•LC sensor metering
•Touch-sensing linear sensor
•User and reset push-buttons
•4-direction joystick with selection button
•Board connectors:
–2 RS-232 with DB9
–USB with Micro-B
–microSD™ card interface
•Board expansion connectors:
–RF-EEPROM daughterboard
–Extension connector for daughterboard or wrapping board
•On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability:
mass storage, virtual COM port and debug port
•Comprehensive free software libraries and examples available with the STM32Cube
package
•Support of a wide choice of integrated development environments (IDEs), including
IAR™, Keil
®
and GCC-based IDEs
a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
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Product markingUM1878
2 Product marking
Evaluation tools marked as “ES” or “E” are not yet qualified and are therefore not ready to
be used as reference design or in production. Any consequences arising from such usage
will not be at STMicroelectronics’ charge. In no event will STMicroelectronics be liable for
any customer usage of these engineering sample tools as reference designs or in
production.
‘E’ or ‘ES’ marking examples of location:
•on the targeted STM32 that is soldered on the board (for illustration of STM32 marking,
refer to the section Package information in the STM32 datasheet at www.st.com).
•next to the evaluation tool ordering part number, that is stuck or silkscreen printed on
the board
This board features a specific STM32 device version, which allows the operation of any
bundled commercial stack/library available. This STM32 device shows a "U" marking option
at the end of the standard part number and is not available for sales.
In order to use the same commercial stack in his application, a developer may need to
purchase a part number specific to this stack/library. The price of those part numbers
includes the stack/library royalties.
3 System requirements
•Windows® OS (7, 8 and 10), Linux® 64-bit or macOS
•USB Type-A to Micro-B cable
4 Development toolchains
•Keil® MDK-ARM
•IAR™ EWARM
•GCC-based IDEs including free SW4STM32 from AC6
(b)
(b)
®(a)
a. macOS® is a trademark of Apple Inc., registered in the U.S. and other countries.
b. On Windows only
8/64UM1878 Rev 2
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UM1878Demonstration software
5 Demonstration software
The demonstration software, included in the STM32Cube MCU Package corresponding to
the on-board MCU, is preloaded in the STM32 Flash memory for easy demonstration of the
device peripherals in standalone mode. The latest versions of the demonstration source
code and associated documentation can be downloaded from www.st.com.
6 Ordering information
To order the STM32L073Z-EVAL Evaluation board, refer to Tab le 1.
Order codeTarget STM32
STM32L073Z-EVALSTM32L073VZT6
Table 1. Ordering information
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Hardware layout and configurationUM1878
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7 Hardware layout and configuration
STM32L073Z-EVAL evaluation board is designed around the STM32L073VZT6 (LQFP 100
package). The hardware block
between the STM32L073VZT6 and peripherals while Figure 3: STM32L073Z-EVAL
evaluation board (top view) helps the user to locate these features on the actual evaluation
board.
Figure 2. Hardware block diagram
Figure 2: Hardware block diagram illustrates the connections
The ST-LINK/V2-1 programming and debugging tool is integrated on the
STM32L073Z-EVAL evaluation board. Compared to ST-LINK/V2 the changes are listed
below.
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Hardware layout and configurationUM1878
The new features supported on ST-LINK/V2-1 are:
•USB software re-enumeration
•Virtual com port interface on USB
•Mass storage interface on USB
•USB power management request for more than 100 mA power on USB
This feature is no more supported on ST-LINK/V2-1:
•SWIM interface
For all general information concerning debugging and programming features common
between V2 and V2-1 refer to ST-LINK/V2 User Manual UM1075.
Known limitation:
Activating the readout protection on ST-LINK/V2-1 target, prevents the target application
from running afterwards. The target readout protection must be kept disabled on STLINK/V2-1 boards.
Note:It is possible to power the board via CN17 (Embedded ST-LINK/V2-1 USB connector) even
if an external tool is connected to connectors CN11 or CN12.
7.1.1 Drivers
The ST-LINK/V2-1 requires a dedicated USB driver, which can be found on www.st.com for
Windows
In case the STM32L073Z-EVAL evaluation board is connected to the PC before the driver is
installed, some STM32L073Z-EVAL interfaces may be declared as “Unknown” in the PC
device manager. In this case the user must install the driver files, and update the driver of
the connected device from the device manager.
Note:Prefer using the “USB Composite Device” handle for a full recovery.
®
XP, 7, 8.
Figure 4. USB Composite device
7.1.2 ST-LINK/V2-1 firmware upgrade
The ST-LINK/V2-1 embeds a firmware upgrade mechanism for in-situ upgrade through the
USB port. As the firmware may evolve during the life time of the ST-LINK/V2-1 product (for
example new functionality, bug fixes, support for new microcontroller families), it is
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UM1878Hardware layout and configuration
recommended to visit www.st.com before starting to use the STM32L073Z-EVAL evaluation
board and periodically, in order to stay up-to-date with the latest firmware version.
7.2 SWD connectors
Only Serial Wire Debug interface can be used on trace connectors CN11 and CN12.
SWDIO, SWCLK and RESET of the microcontroller STM32L073VZT6 are available. The
parallel trace and JTAG are not available on the STM32L073VZT6 microcontroller.
7.3 Power supply
STM32L073Z-EVAL evaluation board is designed to be powered by a 5 V DC power supply
and to be protected from wrong power plug-in event by PolyZen. It is possible to configure
the evaluation board to use any of the following four power supply sources:
•a 5 V DC power adapter connected on the board to the power jack CN18, called
PSU_E5V on silkscreen. It is selected by a jumper placed in E5V location of JP11. The
external power supply does not come with the board but can be ordered separately.
•a 5 V DC power with 300 mA limitation from the USB type B connector of
ST-LINK/V2-1 CN17 (silkscreen marking (ST-LINK/V2)).Note that only the ST-LINK
part is power supplied before the USB enumeration, as the host PC only provides 100
mA to the board at that time. During the USB enumeration, the STM32L073Z-EVAL
evaluation board requires 300 mA of current to the host PC. If the host is able to
provide the required power, the enumeration ends by a “SetConfiguration” command
and then, the power switch ST890 U29 is switched ON, the red LED LD5 is turned ON,
thus the evaluation board can consume a maximum of 300 mA current, not more. If the
host is not able to provide the required current, the enumeration fails, therefore the
power switch U29 remains OFF and the STM32 including its peripherals will not be
powered. As a consequence the red LED LD5 remains turned OFF. In such case it is
mandatory to use one external power supply connected to power jack CN18. This
power switch features also a current limitation to protect the PC in case of short-circuit
on board. If overcurrent (more than 600 mA) happens on board, the LED LD10 is
lighted on.
•5 V DC power with 500 mA limitation from the USB FS connector CN9. This connector
is a micro B receptacle with a silkscreen marking on the PCB: USB. This 5 V input is
called U5V.
•5 V DC power from a customer daughterboard plugged in pin 24 of extension
connector CN4. This 5 V input is called D5V.
Note:The 5 V DC power adapter should have the positive polarity at center pin, as shown in
Figure 5: Pin-out of 5 V DC adapter.
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Hardware layout and configurationUM1878
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Figure 5. Pin-out of 5 V DC adapter
The power supply selection is done by the jumpers JP11, JP12, JP7, JP4, JP5 and JP13
as described in
JumperDescription
Tabl e 2: Power related jumpers.
Table 2. Power related jumpers
JP11 is used to select one of the four possible power supply sources.
To supply STM32L073Z-EVAL only from a 5 V power adapter connected to CN18
(PSU_E5V), set the jumper to E5V location, as following (Default setting):
JP11
To supply STM32L073Z-EVAL only from the USB connector CN9 set the jumper to
U5V location, as following:
To supply STM32L073Z-EVAL only from the USB connector CN17 of ST-LINK/V2,
set the jumper JP11 to STlk location, as showed in the below figure. In this case, the
jumper of ST-LINK JP13 should be opened.
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Table 2. Power related jumpers (continued)
JumperDescription
To supply both STM32L073Z-EVAL and a daughterboard connected to extension
connectors CN4 and CN5, (daughterboard should have its own power supply not connected), set jumpers to E5V and D5V locations, as following:
JP11
JP12
V
DD_MCU
(pins VDD of STM32L073Z) is connected to fixed +3.3 V DC power when
JP12 is set as shown (Default setting):
V
DD_MCU
is connected to the adjustable DC power from 1.65 V to 3.6 V when JP12
is set as shown:
V
DD_MCU
power pin of STM32L073Z is connected to VDD_MCU when JP7 is set as
shown (Default setting):
JP7
V
DD_MCU
power pin of STM32L073Z is powered by the USB connector CN9 when
JP7 is set as shown here:
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Table 2. Power related jumpers (continued)
JumperDescription
JP7
JP4
V
DD_MCU
power pin of STM32L073Z can be powered externally by an external
power supply, providing no jumper is connected to JP7. The external supply can be
connected to pin2 of JP7, as shown here:
power pin of STM32L073Z is connected to V
V
DDA
DD_MCU
when JP4 is closed as
shown (default setting):
To measure the current drawn by V
pin of STM32L073Z, remove the jumper of
DDA
JP4 and connect an ampere-meter to JP4, positive terminal to pin 1, negative to pin
2.
V
pin of STM32L073Z is connected to V
REF+
DD_MCU
when JP5 is closed as shown
(default setting):
JP5
To measure the current drawn by V
JP5 and connect an ampere-meter to JP5, positive terminal to pin 1, negative to pin
2.
By default JP13 is not connected to let ST-LINK detect automatically if it should
JP13
provide the supply of the board from ST-LINK USB V
If JP13 is connected, ST-LINK will never supply the evaluation board from ST-LINK
USB.
The red LED LD5 is on when the board STM32L073Z-EVAL is powered correctly by the 5 V.
7.3.1 Adjustable power supply
As detailed above the STM32L073VZT6 microcontroller can be supplied by a variable
voltage when pins 2 and 3 of JP12 are connected by a jumper. Use the potentiometer RV1
16/64UM1878 Rev 2
pin of STM32L073Z, remove the jumper of
REF+
(default setting).
BUS
Page 17
UM1878Hardware layout and configuration
to adjust the voltage from 1.65 V to 3.6 V. The three LEDs LD7, LD8, LD9 warn the user that
voltage is below 1.7
V or above 1.8 V.
7.4 Clock source
Two clock sources are available for the microcontroller STM32L073VZT6 on the evaluation
board STM32L073Z-EVAL:
•The 32.768 KHz crystal X2 for embedded RTC
•The 8 MHz crystal X1 8 MHz with a socket. It can be removed when the internal RC
clock is used.
Solder bridgeDescription
Open (default setting) PC14 is connected to the crystal X2.
SB27
closed
Open (default setting) PC15 is connected to 32 KHz crystal.
Table 3. 32.768 KHz crystal X2 solder bridges
PC14 is connected to pin11 of extension connector CN5. In such
case R49 must be removed to avoid disturbance due to the 32Khz
quartz X2.
SB26
closed
Solder bridgeDescription
Open (default setting) PH0 is connected to 8 MHz crystal X1.
SB25
closed
Open (default setting) PH1 is connected to 8 MHz crystal X1.
SB23
closed
7.5 Reset sources
The RESET signal of STM32L073Z-EVAL evaluation board is active low.
PC15 is connected to pin 12 of extension connector CN5. In such
case R48 must be removed to avoid disturbance due to the 32Khz
quartz X2.
Table 4. 8 MHz crystal X1 solder bridges
PH0 is connected to pin 8 of extension connector CN5. In such
case X1 and C27 must be removed to avoid disturbance due to the
crystal.
PH1 is connected to pin 7 of extension connector CN5. In such
case R342 must be removed to avoid disturbance due to the
crystal.
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Sources of reset are:
•Reset button B1
•Debugging tools from SWD connectors CN12 and CN11.
•From a daughterboard connected to extension connectors, RESET is pin 24 of
connector CN5.
•Embedded ST-LINK/V2-1
•RS-232 connector CN6 for ISP. Jumper JP6 should be closed for RESET to be handled
by pin 8 of RS-232 connector CN6 (CTS signal).
7.6 Boot option
After reset, the STM32L073VZT6 MCU can boot from the following embedded memory
locations:
•User Flash memory
•System Flash memory
•Embedded RAM (for debugging)
The microcontroller is configured to one of the listed boot options by setting the
STM32L073VZT6 port BOOT0 level by the switch SW1 and by setting nBOOT1 bit of
FLASH_OPTR option bytes register, as shown in
can be forced to high and, SW1 action overruled, by DSR line of RS-232 connector CN6, as
shown in
Tabl e 6: Boot related jumper. This can be used to force the execution of the
bootloader and start user Flash memory flashing process (ISP) from RS-232 interface. The
option bytes of STM32L073VZT6 and their modification procedure are described in the
reference manual RM0367. STM32 microcontroller system memory boot mode Application
Note (AN2606) details the bootloader mechanism and configurations.
Table 5. Boot related switch
Tab le 5. Depending on JP3, BOOT0 level
SwitchDescription
STM32L073Z-EVAL evaluation board boots from User Flash. BOOT0 pin
is tied to “Low”.
(default setting)
SW1
STM32L073VZT6 boots from system Flash memory (nBOOT1 bit of
FLASH_OPTR register is set high) or from RAM (nBOOT1 is set low).
BOOT0 pin is tied to "high".
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UM1878Hardware layout and configuration
JumperDescription
jumper not
fitted (default
JP3
setting)
Jumper fitted
7.7 USB FS
STM32L073Z-EVAL evaluation board supports USB2.0 FS communication. The USB
connector is the micro-B type connector CN9.
The USB functionality is independent of LCD glass connectors.
STM32L073VZT6 ports PA11 and PA12 are used for the USB DM and DP signals
respectively. In case PA11 and PA12 are not used for USB, it can be accessed for another
usage by the extension connector CN4, providing resistors R69 and R70 are removed.
Table 6. Boot related jumper
By default, BOOT0 is only controlled by switch SW1.
BOOT0 can be forced high with terminal 6 of CN6 connector (RS-232 DSR
line). This configuration is used to allow the device connected via RS-232 to
initiate STM32L073VZT6 flashing process.
USB section of the micro-controller STM32L073VZT6 V
3.6
V internally or externally through jumper JP7. Refer to Section 7.3: Power supply for
more details regarding JP7 use.
7.7.1 Operating voltage
•If V
DD_USB
and 2 should be connected, please refer to Section 7.3: Power supply for more details.
•If V
DD_USB
the voltage range: 1.65 V to 3.6 V.
is supplied from VDD: USB is working typically with V
is supplied from USB (U5V voltage), STM32L073Z-EVAL is functional in all
7.8 SMBus temperature sensor
A temperature sensor STLM75M2F is connected to I2C1 bus and to the SMBus of the
microcontroller STM32L073VZT6.
The I2C address of temperature sensor is by default 0x92 with address pin A0 set to 1 by
the closed solder bridge SB4.
By opening SB4 it is possible to change the temperature sensor address into 0x90.
DD_USB
must be supplied with 3.0 to
> 3.0 V. JP7 pins 1
DD
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Solder bridgeDescription
Closed
(default setting)
SB4
OpenTemperature sensor
Table 7. Temperature sensor related solder bridge
To enable SMBus functionality, the LCD glass module has to be mounted on “IO” position.
However, if the LCD glass is used and then mounted on “LCD” position, it is still possible to
use the temperature sensor through the I
used for SMBus is used for LCD glass.
Refer to Section 7.19: LCD glass display module for more details.
7.8.1 Limitations
The temperature sensor INT signal of SMBus is exclusive with LCD glass.
7.8.2 Operating voltage
The operating voltage of temperature sensor STLM75M2F is 2.7 to 3.6 V.
Temperature sensor
I2C address set to 0x92.
I2C address set to 0x90.
2
C bus without SMBus because PB5 previously
7.9 RS-232 USART2 and IrDA
7.9.1 RS-232
The evaluation board STM32L073Z-EVAL offers an RS-232 communication port at the DB9
male connector CN6. The signals RX, TX, RTS and CTS from USART2 of
STM32L073VZT6 are available.
Signals Bootloader_RESET and Bootloader_BOOT0 can be added on RS-232 connector
CN6 for ISP support. To use Bootloader_RESET, resistor R63 must be removed and jumper
JP6 must be closed. If Bootloader_BOOT0 is used, the jumper JP3 must be closed.
For jumpers settings refer to the Table 8: RS-232 and IrDA jumper settings.
7.9.2 IrDA
The evaluation board STM32L073Z-EVAL is offering an IrDA communication thanks to the
IrDA transceiver U14 located in the middle of left side of the board. Jumpers settings are
described inside the below table.
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Jumpers and resistorsDescription
2 and 3 connected
JP9
(default setting)
1 and 2 connected
Table 8. RS-232 and IrDA jumper settings
RS-232 use:
DB9 connector CN9 RXD signal is connected to PD6 of STM32L073VZT6
used as USART2 RX.
IrDA use:
RxD pin of IrDA transceiver U14 is connected to PD6 of STM32L073VZT6
used as IrDA Rx.
7.9.3 Limitations
RS-232 from USART2 and IrDA are exclusive.
7.9.4 Operating voltage
RS-232 from USART2 and IrDA are operating on the whole VDD voltage range: 1.65 V to
3.6
V.
7.10 RS-232 LPUART
LPUART signals RX, TX, RTS, CTS are available at DB9 connector CN7 located on the
right side of the board. The LPUART can be used on the whole voltage range of V
because level shifters are used.
7.10.1 Limitations
LPUART is exclusive with LCD glass. LCD glass module should be mounted in I/O position.
7.10.2 Operating voltage
LPUART is operating over the whole VDD range (1.65 V to 3.6 V).
7.11 Virtual Com Port
RX and TX of USART4 are available in a USB Virtual Com Port managed by the STLINK/V2-1. The USB connector of ST-LINK/V2-1 is CN17. Virtual Com Port can be used
over the whole operating voltage range of the microcontroller because level shifters are
used.
DD
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By default, the serial communication settings are: 115200b/s, 8bits, no parity, 1 stop bit, no
flow control.
7.11.1 Limitations
No limitation.
7.11.2 Operating voltage
The Virtual Com Port is operating over the whole VDD range: 1.65 V to 3.6 V.
7.12 MicroSD card
A 4-Gbyte microSD card can be plugged into the connector CN13, located at the left side of
the board. It communicates with the microcontroller STM32L073VZT6 using the SPI1 port.
The card detection switch is connected to the GPIO expander MFX, part U25.
Level shifters insure functionality of microSD card over the whole voltage range.
Table 9. MicroSD connector CN13
Pin
number
1NC6 GND
2MicroSD_CS (PD0)7SPI_MISO (PE14)
3SPI_MOSI (PE15)8NC
4+3V39 GND
5SPI_CLK (PE13)10
Description
7.12.1 Limitations
With V
If V
> 2.7 V the SPI clock can be at maximum speed: 16 MHz.
DD
< 2.7 V the SPI clock should be 8 MHz maximum.
DD
7.12.2 Operating voltage
STM32L073Z-EVAL evaluation board Micro SD card is operating over whole range of VDD:
1.65
V to 3.6 V.
7.13 Analog input ADC
Pin
number
Description
MicroSDcard_detect (to expander
MFX)
The analog input ADC_IN5 (port PA5) of the microcontroller STM32L073VZT6 is available
at connector CN2. It is located below right to the touch sensing slider LS1. The 2-pin
connector CN2 allows connection of a GND reference to the left pin of CN2, and the voltage
to be converted is connected to the right pin of CN2.
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Figure 6. Location of ADC input connector CN2
A low pass filter can be implemented for the ADC input by replacing R7 and C2 by
appropriate values depending on the application.
Figure 7. Provision for filter implementation
As the port PA5 can be used also a DAC output, the STM32L073Z-EVAL evaluation board
gives also provision to build an output filter structure by replacing R8 and C2 by appropriate
values.
Note that V
by the ADC. In general case, V
pin must be connected to a reference voltage to allow a proper conversion
REF+
is connected to V
REF
DD_MCU
, then jumper JP5 should be
closed.
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7.13.1 Operating voltage
ADC input is operational with VDD >1.8 V.
7.14 Analog output DAC
The analog output DAC_OUT1 (port PA4) of microcontroller STM32L073VZT6 is available
at connector CN3 located below the touch sensing slider as shown below. The left pin of
CN3 is the connection of GND reference, and right pin is DAC output voltage. As PA4 is also
used by LC sensor metering, pins 1 and 2 of the selection jumper JP2 should be closed.
Figure 8. Location of DAC output CN3 and JP2
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Jumpers and resistorsDescription
2 and 3 connected
JP2
(default setting)
1 and 2 connected
Table 10. Analog input related jumper JP2 settings
LC sensor metering use:
PA4 is connected to the capacitor C59 to filter the DAC_OUT1 voltage for
LC sensor metering. DAC_OUT1 is connected internally to the inverting
input of the internal comparator Comp2 (refer to Section 7.20.1: LC sensor
metering principle for more details).
DAC output DAC_OUT1 use:
PA4 is connected to CN3 connector to be used as a DAC Output.
A low pass filter can be implemented for the DAC output by replacing R29 and C15 by
appropriate values depending on the application.
Figure 9. Provision for filter implementation
As the port PA4 can be used also as ADC input IN4, the STM32L073Z-EVAL evaluation
board gives also provision to build an input filter structure by replacing R28 and C15 by
appropriate values.
Please note that V
conversion by the ADC and the DAC. In general case, V
pin must be connected to a reference voltage to allow a proper
REF+
is connected to V
REF+
DD_MCU
, then
jumper JP5 should be closed.
7.14.1 Limitations
DAC Output is exclusive with LC sensor metering.
7.14.2 Operating voltage
DAC output is operational with VDD >1.8 V.
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7.15 TFT LCD display
The 2.4” color TFT LCD is connected to SPI1 port of STM32L073VZT6. The LCD TFT
module is the MB895/S.
Voltage translators are implemented on SPI bus between the microcontroller
STM32L073VZT6 and LCD module to allow the LCD to be functional over the whole voltage
range of the microcontroller. A bidirectional voltage translator is used on SPI_MOSI PE15
because the LCD module has a specific mode in which it may send back information on this
line. The direction of this voltage translator is controlled by SPI_MOSI_DIR PH9. PE15 is
working as MOSI when PH9 is high or as MISO when PH9 is LOW.
7.15.1 Limitations
No exclusivity.
7.15.2 Operating voltage
V
DD
3.3V
The whole operating range of STM32L073VZT6 is: 1.65 V to 3.6 V.
7.16 User LEDs
Four general purpose color LEDs (LD 1, 2, 3, 4) are available as display devices.
User LEDsPin usedcomment
LED LD1 (Green)PE4“low” = LED lighted
LED LD2 (Orange)PE5“low” = LED lighted
LED LD3 (Red)PD1“low” = LED lighted
LED LD4 (Blue)PE7“low” = LED lighted
26/64UM1878 Rev 2
Table 12. User LEDs
Page 27
UM1878Hardware layout and configuration
7.17 Input devices
The 4-direction joystick B3 with selection, Wake-up/ Tamper button B2, Reset button B1 are
available as input devices.
Input devicesPin usedCircuit
Joystick SEL GPIO0MFX U25
Joystick DOWN GPIO1MFX U25
Joystick LEFT GPIO2MFX U25
Joystick RIGHTGPIO3MFX U25
Joystick UPGPIO4MFX U25
Wake-up/ Tamper button B2PC13STM32L073VZT6 U5
RESET B1NRSTSTM32L073VZT6 U5
Table 13. Input devices
7.18 RF-EEPROM
An RF-EEPROM daughterboard MB1020 A02 can be plugged into connector CN1 of the
STM32L073Z-EVAL evaluation board. The connector CN1 is located at the top left corner of
the board. The RF-EEPROM can be accessed by the microcontroller via the I2C1 bus.
The I2C address of the RF-EEPROM module MB1020 A02 is 0xA6.
CN1 can be used also as an I2C extension connector offering SDA and SCL from I2C1 bus,
GND at pins 1, 3, 7 respectively.
7.19 LCD glass display module
A LCD glass module daughterboard (MB979) is mounted in the connectors CN10 and CN14
of the STM32L073Z-EVAL evaluation board. It can be connected to the LCD driver pins of
the STM32L073VZT6 or work as a set of jumpers to route the microcontroller pins for
another usage, depending on the position:
•When LCD glass module is mounted in LCD position, the LCD glass display is
connected to the LCD driver pins of the STM32L073VZT6 and all peripherals shared
with LCD glass are disconnected. See Figure 10: LCD glass board in LCD position
•When LCD glass module is mounted in IO position, all peripherals shared with the LCD
glass are connected to the STM32L073VZT6 and the LCD glass is disconnected. See
Figure 11: LCD glass board in IO position.
•When LCD glass module is not plugged in, the connectors CN10 and CN14 give
access to ports of the microcontroller. Refer to Figure 3: STM32L073Z-EVAL
evaluation board (top view) for more details.
UM1878 Rev 227/64
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Hardware layout and configurationUM1878
Figure 10. LCD glass board in LCD position
Figure 11. LCD glass board in IO position
The custom LCD glass module used on MB979 daughterboard is XHO5002B. The signal
mapping of each LCD segment is detailed in following table (rows are LCD_COMx, columns
LCD_SEGy, with x comprised between 0 and 7, y from 0 to 39):
SEG2122232425262728
COM71g2g3g4g5g6g7g8g
COM61h2h3h4h5h6h7h8h
COM51i2i3i4i5i6i7i8i
COM41j2j3j4j5j6j7j8j
COM31d2d3d4d5d6d7d8d
COM21c2c3c4c5c6c7c8c
COM01e2e3e4e5e6e7e8e
COM11f2f3f4f5f6f7f8f
28/64UM1878 Rev 2
Table 14. LCD glass segments 21 to 28 mapping table
Page 29
UM1878Hardware layout and configuration
Table 15. LCD glass segments 0 and 29 to 39 mapping table
SEG29303132333435363738390
COM7 9g10g11g12g13g 14g 15g 16g 17g18g19g5J
COM6 9h10h11h12h13h 14h 15h 16h 17h18h19h5C
COM5 9i10i11i12i13i14i15i16i17i18i19i5B
COM4 9j10j11j12j13j14j15j16j17j18j19j5I
COM3 9d10d11d12d13d 14d 15d 16d 17d18d19d13a
COM2 9c10c11c12c13c 14c 15c 16c 17c18c19c13b
COM0 9e10e11e12e13e 14e 15e 16e 17e18e19eO1
COM1 9f10f11f12f13f14f15f16f17f18f19fO2
Table 16. LCD glass segments 1 to 8, 15, 18 to 20 mapping table
Table 18. LCD glass related jumpers and solder bridges
Description
The LC network (L2 or L3, and C40) on STM32L073Z-EVAL is used for LC sensor
metering. Nothing is connected to connector CN8.
An external LC network on STM32L073Z-EVAL can be connected to connector CN8 for
LC sensor metering.
V
The operational amplifier U9 TSV611ILT is used to generate the
The operational amplifier U9 TSV611ILT is used to generate the
DD
V
DD
/2 voltage.
/2 voltage.
30/64UM1878 Rev 2
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UM1878Hardware layout and configuration
06Y9
06Y9
Table 18. LCD glass related jumpers and solder bridges (continued)
Jumpers, solder
bridges, resistors
JP1, JP15, JP17,
JP2: 2,3 closed
JP14, JP16,
JP18: opened
JP1,
JP2,
JP14,
JP15,
JP16,
JP17,
JP18
JP1, JP15, JP17,
JP2: 1,2 closed
JP14, JP16,
JP18: opened
Description
LC sensor metering is used, exclusive with LCD glass and DAC output.
JP1, JP15, JP17 with pins 2 and 3 closed: ports PA7, PB4, PC0 are used for LC sensor
JP2 with pins 2 and 3 closed: port PA4 is used for LC sensor metering signal
DET_DAC_OUT1
JP14, JP16, JP18 opened: reserved use.
LCD glass is used, DAC output on CN3 is used, both are exclusive with LCD glass
JP1, JP15, JP17 with pins 1 and 2 closed: ports PA7, PB4, PC0 are used for LCD
glass: LCDSEG4, LCDSEG8 and LCDSEG18 respectively.
JP2 with pins 1 and 2 closed: port PA4 is used for DAC output connector CN3, signal
DAC_OUT1.
JP14, JP16, JP18 opened: reserved use.
7.19.1 Limitations
LCD glass is exclusive with LPUART, LC sensor metering, temperature sensor INT, EXT
RESET.
7.20 LC sensor metering
The LC sensor metering is a metal detector based on a resonating LC network connected to
the microcontroller STM32L073VZT6. The STM32L073VZT6 trigs periodically the LC
network to initiate self-oscillations. If a non-ferrous metal plate is placed in the magnetic field
of the inductor L, the higher loss reduces the number of self-oscillations. Using the
comparator and the low-power timer LPTIM embedded inside the microcontroller, it is
possible for the software to detect the presence of non-ferrous metal by a lower count of the
timer LPTIM.
A small board called Detection Accessory MB1199 is proposed with the evaluation board
STM32L073Z-EVAL, to test the LC sensor metering quickly. The copper area to detect is
12
mm by 12 mm wide.
UM1878 Rev 231/64
63
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Hardware layout and configurationUM1878
06Y9
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7.20.1 LC sensor metering principle
Figure 13. Functional block diagram of LC sensor metering
The port PD7 of the microcontroller STM32L073VZT6 is configured in GPIO output to
deliver a high state. PD7 is in fact the signal called POWER_CONTROL. It is in charge to
provide power supply to the resistor divider Ra, Rb and the follower amplifier based on an
operational amplifier. The DC voltage at the output the operational amplifier is approximately
VDD/2 as Ra = Rb.
In a second phase, the port PB4 is used in GPIO output to cause a DC current flowing inside
the inductor of the LC sensor.
In steady state, the DC current is VDD/2 Re. The inductor stores the electrical energy in his
magnetic core.
PB4 is internally disconnected from the GPIO and connected to the positive input of the
comparator Comp2 of the microcontroller STM32L073VZT6. The current disruption causes
high frequency voltage self-oscillations of the LC resonator circuit. The lower connection of
the LC resonator is considered grounded from an AC point of view thanks to the capacitor
and the low output impedance of the follower amplifier. Then, the voltage oscillations are
32/64UM1878 Rev 2
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UM1878Hardware layout and configuration
C40
1nF
DET_COMP2_INP
1 2
External LC network
CN8
DET_COMP2_OUT
-
Comp2
STM32L
PB4
PA7
+
R67
0
C57
[N/A]
R59
120
VDD/2 generation
AC ground
LC sensor
Internal comparator 2
CompOut
TP18
VDD/2
TP14
JP8
C46
100pF
C63
1nF
R73
330K
R76
330K
POWER_CONTROL
3
1
2
4
5
Vcc-
Vcc+
U9
TSV631ILT
4
3
2
1
5
Vcc-
Vcc+
U11
TSV911ILT
SB29
Closed by default
SB30
Closed by default
LC_H
LC_L
L3
[N/A)
LC_H
LC_L
L
1
NC
2
NC
3
L
4
NC
8
NC
7
NC
6
NC
5
N
C
N
C
N
C
N
C
N
C
N
C
L2
100uH
Parts placed close to STM32L073
SB33
Open by default
SB32
Open by default
DET_DAC_OUT1
C59
1nF
C47
[N/A]
R64
330K
R54
330K
PA4
PD7
SB31
Closed by defa ult
close to MCU
TP18 located close to MCU pin PA7
DET_LPTIM_CH1
LPTIM input
PC0
C58
100nF
Note *: Sensor inductors L2 or L3 are exclusive.
Using a double PCB footprint.
see note *
see note *
available at port PB4 with a superimposition of a DC voltage of VDD/2 respectively to the
ground. After the comparator threshold controlled by the DAC_OUT1 voltage is set properly
by a calibration, the comparator will deliver pulses to the Low Power timer LPTIM. LPTIM is
in charge to count the number of oscillations.
The value in the counter LPTIM depends directly on the decay time of the oscillations, and
therefore to the quality factor of the inductor L.
Finally if a piece of non-ferrous metal is placed in the magnetic field of the inductor, losses
increase, reducing the decay time and then it reduces the number of counts in LPTIM. The
software can thus detect the presence of a piece of non-ferrous metal by comparing the
value of LPTIM timer that is lower with metal presence than without.
7.20.2 LC sensor metering description
The LC sensor metering of STM32L073Z-EVAL evaluation board follows closely the
principle described above (see
Figure 14. LC sensor metering schematic
Figure 14).
Comp2 INM inp ut ca n be connected to DAC OUT1 using an intern al switch of the MCU
The LC network used for LC sensor metering is based on the inductor L2 or L3 and the
capacitor C40. A double footprint allows to solder inductor L2 or L3 exclusively, the location
is called detection on the PCB. The inductor L2 or L3 is called L for sake of simplicity in this
description. The POWER_CONTROL PD7 supplies the voltage divider R73, R76 and the
low-power operational amplifier TSV631ILT U9 to generate a V
of the LC network (refer to
Figure 14: LC sensor metering schematic). From AC voltage
/2 voltage at the LC_L net
DD
point of view, LC_L net is grounded, thanks to the capacitor C46 and the low-output
impedance of the operational amplifier.
Another operational amplifier TSV911ILT U11 is available in back-up of U9 with improved
output impedance performances over frequency but with a higher operating current.
To store magnetic energy inside the inductor L, the ports PB7 and PB4 should be set in
GPIO output mode, with PD7 high, PB4 low. The DC current flowing inside L is V
/2*R59.
DD
After the energy is stored in the inductor L, the port PB4 called DET_COMP2_INP is
switched from GPIO output into a positive input of the comparator Comp2. This current
disruption inside the inductor L, trigs the self-oscillations of the LC network. The oscillation
frequency is typically in the range of 500
UM1878 Rev 233/64
KHz to 700 KHz.
63
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Hardware layout and configurationUM1878
06Y9
06Y9
The threshold of the comparator is the voltage on the negative input of Comp2. It is
generated by the DAC_OUT1 connected internally inside the microcontroller. The
DAC_OUT1 voltage should be set to a voltage a bit higher to V
over V
/2. The port PA4 called DET_DAC_OUT1 connected to internal voltage
DD
/2, typically a few 10 mV
DD
DAC_OUT1 allows the connection to the external capacitor C59 for a more stable threshold
voltage.
The port PA7 DET_COMP2_OUT delivers calibrated pulses to the low-power timer input
DET_LPTIM_CH1, port PC0.
An external LC network can be used by removing the solder bridges SB29, SB30 and by
connecting an external parallel LC network to the connector CN8.
Some solder bridges and jumpers should be set properly to enable the LC sensor metering,
refer to
Tab le 19: Solder bridges and jumpers for LC sensor metering:
Table 19. Solder bridges and jumpers for LC sensor metering
The LC network (L2 or L3, and C40) on STM32L073Z-EVAL is used for LC sensor
metering. Nothing is connected to connector CN8.
An external LC network on STM32L073Z-EVAL can be connected to connector
CN8 for LC sensor metering.
V
The operational amplifier U9 TSV611ILT is used to generate the
The operational amplifier U9 TSV611ILT is used to generate the
DD
V
DD
/2 voltage.
/2 voltage.
34/64UM1878 Rev 2
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UM1878Hardware layout and configuration
06Y9
06Y9
Table 19. Solder bridges and jumpers for LC sensor metering (continued)
Jumpers, solder bridges,
resistors
JP1, JP15, JP17,
JP2: 2,3 closed
JP14, JP16, JP18:
opened
JP1,
JP2,
JP14,
JP15,
JP16,
JP17,
JP18
(default setting)
JP1, JP15, JP17,
JP2: 1,2 closed
JP14, JP16, JP18:
opened
Description
LC sensor metering is used, and is exclusive with LCD glass and DAC output.
JP1, JP15, JP17 with pins 2 and 3 closed: ports PA7, PB4, PC0 are used for LC
JP2 with pins 2 and 3 closed: port PA4 is used for LC sensor metering signal
DET_DAC_OUT1
JP14, JP16, JP18 opened: reserved use.
LCD glass (without LCDSEG4, LCDSEG8, LCDSEG18) is used, DAC output on
CN3 is used, both are exclusive with LCD glass.
JP1, JP15, JP17 with pins 1 and 2 closed: ports PA7, PB4, PC0 are used for LCD
glass: LCDSEG4, LCDSEG8, LCDSEG18 respectively.
JP2 with pins 1 and 2 closed: port PA4 is used for DAC output connector CN3,
signal DAC_OUT1.
JP14, JP16, JP18 opened: reserved use.
7.20.3 Limitations
LC sensor metering is exclusive with LCD glass and DAC output.
But it is possible to use LCD glass without segments SEG4, SEG8, SEG18 with LC sensor
metering with JP1, JP15, JP17, JP2: 1,2 closed.
However, if LCD segments SEG4, SEG8, SEG18 are not used, the LCD glass can be used
in such limited manner with LC sensor metering. In that case jumpers JP1, JP15, JP17 and
JP2 should have pins 1 and 2 closed.
7.21 Pressure sensor
An absolute pressure sensor with 0 to 1000 HPa measurement range is used.
7.21.1 Calculations
The equivalent schematic of the sensor is a Wheastone bridge with a following differential
voltage output considering it is supplied with +3.3
V:
UM1878 Rev 235/64
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Hardware layout and configurationUM1878
PressureSensor differential voltage
0 HPa0 mV
800 HPa10.56 mV
1000 HPa13.2mV
1200 HPa15.84 mV
Table 20. Sensor differential voltage
As the proposed pressure measurement targets only barometric use, the sensor is used
only in the range from 800
range. Then it leads to use a differential amplifier with offset voltage (see
HPa to 1000 HPa, then the amplification is centered on this
Tabl e 15):
Figure 15. Differential amplifier with offset correction
Following the formula, the differential output voltage (Vo+ - Vo-) versus differential input
voltage (V
Using R1 = 220, R2 = 47Kohm, R3=27.4Kohm the output differential voltage is:
(V
- V
o+
) = 430* (Vi+ - Vi-) - 1.71*V
o-
DD
It gives the following differential voltages referring to a virtual ground equal to VDD/2 (see
Tab le 21: Differential voltage):
36/64UM1878 Rev 2
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UM1878Hardware layout and configuration
28801650–()200⁄
6.15mV
HPa
---------------------=
Pressure
0 HPa0 mVSaturated at -V
800 HPa10.56 mV-1.3V
1000 HPa13.2mV0V
1200 HPa15.84 mV+1.23V
Table 21. Differential voltage
Sensor differential voltage
- Vi-)
(V
i+
Differential V
(Vo+ - Vo-)
out
DD
Finally, in STM32L073Z-EVAL evaluation board, the differential voltage is shifted by a VDD/2
offset and changed in a single voltage by the last unity gain operational amplifier. The output
of this amplifier, delivers the single output voltage to the ADC input PA0:
Pressure
0 HPa0 mV0V
800 HPa10.56 mV0.163V
1000 HPa13.2mV1.65V
1200 HPa15.84 mV+
Table 22. Single output voltage to the ADC
Sensor differential voltage
- Vi-)
(V
i+
Single output voltage
2.88V
ADC input PA0
7.21.2 Errors
Offset error: with 0.1% tolerance resistors, the error is 22.6 mV, then equivalent to 0.4 HPa.
Gain error: with 0.1% tolerance resistors, the gain error is roughly 0.2%, at 1000 HPa is
quivalent to 2 HPa. So, errors due to electronic circuitry is around 2.4 HPa at 1000 HPa
e
nd error due to the sensor himself is 6 HPa. Finally the total absolute error is 0.4+2+6 =
a
4 HPa.
8.
7.21.3 Pressure computation
The relation between the atmospheric pressure and the measured voltage is linear. To
overcome gain and offset errors, the software of the user may use a calibration. It allows to
determine the linear equation between the measured voltage and the atmospheric pressure.
The slope of the linear equation is typically:
7.21.4 Filtering
Low pass filtering is mandatory to reduce unwanted noise and also to avoid aliasing,
because the ADC will oversample the value to simulate a 16-bit ADC.
UM1878 Rev 237/64
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Hardware layout and configurationUM1878
A 1st order low pass with 3 Hz cut-off frequency, is composed of 47 K resistors combined
with 1
uF capacitors to feedback the first amplifiers U3A and U3B.
7.21.5 Limitations
No exclusivity.
7.21.6 Operating voltage
Operating voltage is fixed at: +3.3 V
7.22 Touch sensing slider
The STM32L073Z-EVAL evaluation board supports a touch sensing slider based on either
RC charging or charge transfer technology. The charge transfer technology is enabled by
the default assembly.
The touch sensing slider is connected to PB12, PB0, PA1 and the related charge capacitors
are respectively connected to PB13, PB1 and PA2. PC6 and PC7 manage an active shield
reducing sensitivity to other signals. The active shield is placed on the internal layer 2,
immediately under the slider to eliminate influence from other circuits.
Some rework on solder bridges and resistors is necessary to use touch sensing and it is
described in the below
Settings to
Solder
bridges
SB6ClosePB12Connects the 1st touch sensing zone to PB12.
SB5OpenPB12Disconnects PB12 from track to LCD glass to avoid disturbances.
SB8ClosePB0Connects the 2nd touch sensing zone to PB0.
SB14OpenPB0Disconnects PB0 from track to LCD glass to avoid disturbances.
SB11ClosePA1Connects the 3rd touch sensing zone to PA1.
SB12OpenPA1Disconnects PA1 from track to LCD glass to avoid disturbances.
SB17ClosePC6Connects the shield to PC6.
SB18OpenPC6Disconnects PC6 from track to LCD glass to avoid disturbances.
SB24ClosePC7Connects the charge capacitor of shield to PC7.
SB22OpenPC7Disconnects PC7 from track to LCD glass to avoid disturbances.
SB15ClosePB13Connects the charge capacitor to PB13.
SB16OpenPB13Disconnects PB13 from track to LCD glass to avoid disturbances.
enable
touch
sensing
Tabl e 23:
Table 23. Touch sensing related solder bridges
STM32
port
Description
SB7ClosePB1Connects the charge capacitor to PB1.
SB13OpenPB1Disconnects PB1 from track to LCD glass to avoid disturbances.
38/64UM1878 Rev 2
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UM1878Hardware layout and configuration
06Y9
Table 23. Touch sensing related solder bridges (continued)
Settings to
Solder
bridges
SB10ClosePA2Connects the charge capacitor to PA2.
SB9OpenPA2Disconnects PA2 from track to LCD glass to avoid disturbances.
enable
touch
sensing
STM32
port
Description
Figure 16. Solder bridges settings to enable the touch slider (red = closed, green = opened)
7.22.1 Limitations
Touch sensing slider is exclusive with LCD glass.
7.23 Extension connectors
Two 2.54 mm pitch headers CN4 and CN5 called “extension connectors” are intended to
connect an external board to the STM32L073Z-EVAL evaluation board.
Both connectors CN4 and CN5 give access to the GPIOs that are not accessible by the LCD
glass connectors.
In addition to GPIOs, CN4 and CN5 have the following supplies and signals:
For more details regarding clock pins, refer to Section 7.4: Clock source.
UM1878 Rev 239/64
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Hardware layout and configurationUM1878
CN4 (left side)CN5 (right side)
PinSignalPinSignal
1GND1GND
2+3V32GND
3PE73PA5
4PE84PB2
5PE95PA0
6PE106PA4
7PE117PH1
8PE128PH0
9PE139PH10
10PE1410PH9
11GN D11P C 1 4
12GND12PC15
13PE1513PC13
14PA1114GND
Table 24. Extension connectors pin-out
15PA1315GND
16PA1216NC
17PD017VLCD
18PA1418PE6
19PD319PE5
20PD120PE4
21PD621BOOT0
22PD522PB7
23PD723PB6
24D5V24RESET#
25GND25GND
26GND26
7.24 IDD auto-measurement
In addition to the jumpers allowing to measure separately each power domain or the whole
microcontroller consumption, the STM32L073Z-EVAL evaluation board offers also an
automatic consumption measurement. The current of the microcontroller STM32L073VZT6
can be autonomously measured while it is in Run or Low power saving modes.
V
DD
40/64UM1878 Rev 2
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UM1878Hardware layout and configuration
VDD
R133
10K [1%]
VDD_MCU
GND
VDD
C104
100nF
GND
GND
R170
22K
to MCU
R132
1K [1%]
R130
100 [1%]
R131
10 [1%]
R134
1 [1%]
C100
100nF
GND
GND
GNDGNDGND
GND
CAL
SH0SH1SH2SH3
3
4
5
G
SD
6
2
1
T10
STT7P2UH7
3
4
5
G
SD
6
2
1
T4
STT7P2UH7
3
4
5
G
SD
6
2
1
T2
STT7P2UH7
3
4
5
G
SD
6
2
1
T6
STT7P2UH7
3
4
5
G
SD
621
T8
STT7P2UH7
C102
100nF
+3V3
V+
V-
3
2
1
48
U21A
TSZ122IST
V+
V-
3
2
1
48
U23A
TSZ122IST
GND
+5V
C88
100nF
GND
5
6
7
U21B
TSZ122IST
IDD_MEAS
SH1_DSH2_DSH3_DSH0_D
CAL_D
5
6
7
U23B
TSZ122IST
321
JP10
R151
100
C87
10uF
R164
100
C101
1uF
GND
R159
1K [0.1%]
R162
1K [0.1%]
R163
49K9 [0.1%]
R165
49K9 [0.1%]
R167
1K
R127
100K
R124
100K
R126
100K
R123
100K
R125
100K
Table 25. IDD auto-measurement related jumper settings
JumperDescription
JP10 2 and 3 closed (jumper in IDD position):
STM32L073VZT6 is powered through IDD measurement circuit.
(default setting)
JP10 1 and 2 closed (jumper in
JP10
IDD measurement circuit is bypassed, STM32L073VZT6 is powered directly.
JP10: no jumper to pins 1, 2, 3.
STM32L073VZT6 total current consumption can be measured by connecting an
ampere-meter between pins 1 and 2 of JP10.
7.24.1 Analog section description
V
DD
position):
The analog part of the IDD auto-measurement circuit is based on five shunts resistors:
R134, R131, R130, R132 and R133, switched by PMOS transistors to get enough resolution
and precision over a wide range of currents. The possibility to use shunts from 1
10
Kohm allows to measure currents from 100 mA to few 10 mA typically. This covers all
functional modes of the STM32L073VZT6 microcontroller.
Figure 17. Figure: analog section schematic
see note *
see note *see note *
see note *
bypass
Current
direction
decoupling capacitor
close to TS Z122
decoupling capacitors
close to TS Z122
see note *
differential
amplifier
Shunts
UM1878 Rev 241/64
ohm to
63
Page 42
Hardware layout and configurationUM1878
R133
10K [1%]
GND
VDD
C104
100nF
GND
GND
R170
22K
R132
1K [1%]
R130
100 [1%]
C100
100nF
GND
GNDGND
SH2SH3
3
4
5
G
SD
6
2
1
T2
STT7P2UH7
3
4
5
G
SD
6
2
1
T6
STT7P2UH7
C102
100nF
+3V3
V+
V-
3
2
1
48
U21A
TSZ122IST
V+
V-
3
2
1
48
U23A
TSZ122IST
GND
+5V
C88
100nF
GND
5
6
7
U21B
TSZ122IST
IDD_MEAS
5
6
7
U23B
TSZ122IST
R151
100
C87
10uF
R164
100
C101
1uF
GND
R159
1K [0.1%]
R162
1K [0.1%]
R163
49K9 [0.1%]
R165
49K9 [0.1%]
R167
1K
R127
100K
R124
100K
The voltage drop across the selected shunt is amplified by a very high accuracy and
zero-drift operational amplifier TSZ122.
The voltage drop is connected to pins 3 and 5 of the operational amplifier TSZ122 U21.
The digital section switches or not to a higher resistance shunt for a better measurement,
depending on the measurement result obtained with one shunt. The transistor T8 is used to
set to zero the voltage difference for the calibration of the analog amplifier.
7.24.2 Difference amplifier
Figure 18. Difference amplifier
decoupling capacitor
close to TSZ122
decoupling capacitors
close to TSZ122
see note *see note *
Shunts
The voltage measured over the shunt is amplified by a difference amplifier based on high
performances operational amplifiers TSZ122. The DC gain is 49.9. Finally the output
voltage I
DD_MEAS
is available for conversion and treatment by the digital section.
7.24.3 Digital section description
The multifunction expander MFX U25 is, among other functions, in charge of sequencing
and acquiring the IDD auto-measurement feature.
It controls the switches of the analog section to measure the current sequentially from the
lowest resistance shunt to the highest one, to maximize the precision of the current
measurement. It works as an auto-range ampere-meter. It has internally some
functionalities to avoid a too big voltage drop on the supply voltage of the microcontroller
under test.
From SW point of view, it is up to the host STM32L073VZT6 to send the commands to the
MFX to measure the current via the I
to request a measurement and have enough time to go in low-power mode. After the given
delay the MFX will measure the current. At the end, the measured value can be read by the
host STM32L073VZT6 inside the MFX registers through the I
42/64UM1878 Rev 2
2
C bus. A delay can be used to allow the host STM32,
differential
amplifier
2
C bus.
Page 43
UM1878Hardware layout and configuration
MFX_IRQOUT
MFX_SWCLK
CAL
SH2
SH1
MFX_SWDIO
SH3
R166 0
PE6
VDD
C116
100nF
C94
100nF
C91
100nF
C106
100nF
VDD
one capa citor close to each MFX pins:
VDD, VDD_1, VDD_2, VDD_3
C99
100nF
SH0
VDD_MCU
JOY_SEL
JOY_DOWN
JOY_LEFT
JOY_RIGHT
JOY_UP
R177 0
R179 0
PB6
PB7
MFX_WKUP
VDD
R174
510
L7
BEAD
C90
1uF
C93
100nF
VDD
R176 [N/A]
R171 10K
R189 10K
R190 10K
R191 10K
R188 10K
PE6 can also be used to wak e-up the MCU
MFX_I2C_SDA
MFX_I2C_SCL
MFX_MicroSD_detect
RESET#
R158
0
XPTP27 [N/A]
XNTP 26 [N/A]
YPTP29 [N/A]
TP31
[N/A]
R180 0
R169
10K
C95
[N/A]
R155
[N/A]
MFX
MFX
MFX
MFX
MFX
MFX
R157
100K
D8
BAT60JFILM
IDD_MEAS
MFX_V3
WAKEUP
2
NRST
7
TSC_XP/GPO0
10
TSC_XN/GPO1
11
TSC_YP/GPO2
12
TSC_YN/GPO3
13
USART_T X
21
USART_R X
22
SPARE
14
SWDIO
34
SWCLK
37
I2C_SCL
42
I2C_SDA
43
BOOT0
44
I2C_ADDR
45
IRQOUT
46
IDD_CAL/GPO4
3
IDD_SH0
4
IDD_SH1/GPO5
5
IDD_SH2/GPO6
6
IDD_MEAS
25
GPIO0
18
GPIO1
19
GPIO2
20
GPIO3
39
GPIO4
40
GPIO5
15
GPIO6
16
GPIO7
17
GPIO8
29
GPIO9
30
GPIO10
31
GPIO11
32
GPIO12
33
GPIO13
26
IDD_SH3/GPO7
38
GPIO14
27
GPIO15
28
IDD_VDD_MCU
41
VDD
1
VDDA
9
VDD_124VDD_236VDD_3
48
VSSA
8
VSS_123VSS_235VSS_3
47
U25
STM32L152CCT6
Figure 19. Digital section schematic
MFX
Multi Function eXpander
Warning:To avoid current injection from STM32 to components on the
board during IDD measurement it is strongly recommended
to keep V
DD_MCU
powered by 3.3 V so that, if V
≤ 3.3 V. Some components on the board are
DD_MCU
is higher than 3.3 V, a
current can be injected.
UM1878 Rev 243/64
63
Page 44
ConnectorsUM1878
-36
-36
'&9
*1'
8 Connectors
8.1 RS-232 connector CN6
Figure 20. RS-232 connector CN6 (front view)
Pin numberDescription
1NC6Bootloader_BOOT0
2RX (PD6)7RTS (PD4)
3TX (PD5)8CTS/ Bootloader_RESET
4NC9NC
5GND--
Table 26. RS-232 connector CN6
8.2 Power connector CN18
STM32L073Z-EVAL evaluation board can be powered from a DC 5 V power supply via the
external power supply jack (CN18) shown in
central pin must be positive.
Figure 21. Power supply connector CN18
Pin
number
Description
Figure 21: Power supply connector CN18. The
44/64UM1878 Rev 2
Page 45
UM1878Connectors
8.3 LCD glass daughterboard connectors CN10 and CN14
Two 48-pins male headers CN10 and CN14 are used to connect with the LCD glass
daughterboard (MB979). The space between these two connectors and the position of
every LCD glass signals are defined as a standard, which allows to develop common
daughterboards for several evaluations boards. The standard width between CN10 pin 1
and CN14 pin 1 is 700
GPIO signals on these two connectors can be tested on odd pins when LCD glass board is
not plugged in. For signals assignment details refer to
connectors.
Odd pinGPIO signalOdd pinGPIO signal
1PA91PD2
3PA83PC12
5PA105PC11
7PB97PC10
9PB119PC3
11PB1011PC4
13PB513PC5
mils (17.78 mm).
Tabl e 27: LCD glass daughterboard
Table 27. LCD glass daughterboard connectors
CN10CN14
15PB1415PC6
17PB1317PC7
19PB1219PC8
21PA1521PC9
23PB823PD8
25PB1525PD9
27PC227PD10
29PC129PD11
31PC031PD12
33PA333PD13
35PA235PD14
37PB037PD15
39PA739PE0
41PA641PE1
43PB443PE2
45PB345PE3
47PB147PA1
UM1878 Rev 245/64
63
Page 46
ConnectorsUM1878
If CN10 and CN14 are used as GPI/O extension connectors on a daughterboard, odd pins
and even pins must not be connected directly on the daughterboard.
8.4 ST-LINK/V2-1 programming connector CN15
The connector CN16 is used only for embedded ST-LINK/V2-1 programming during board
manufacture. It is not populated by default and not for end user.
8.5 ST-LINK/V2-1 USB Type B connector CN17
The USB connector CN17 is used to connect embedded ST-LINK/V2-1 to PC for debugging
of board.
SB3
Closed by default
SB20
Closed by default
SB1
Closed by default
SB21
Closed by default
SB2
Closed by default
SB19
Closed by default
C89
[N/A]
L5
82μH 10%
SB38
Open by default
Figure 30. Power
UM1878 Rev 253/64
Recommendation:
100nF decoupling capacitor close to each supply pin
connected by the shunt of
IDD_measurement ci rcuitry
UM1878Electrical schematics
AGND is the local ground plane of pressure sensor circuitry
(refer to ADC16b_Pressure schematic sheet)
Page 54
54/64UM1878 Rev 2
512
Peripherals
MB1168C-01
10/14/2015
Title:
Size:Referen ce:
Date:Sheet: of
A3
Revision:
STM32L073Z-EVAL
Project:
SDA
1
SCL
2
OS/INT
3
GND4A2
5
A1
6
A0
7
VDD
8
U2
STLM75M2F
VDD
C3
100nF
VDD
VDD
I2C1_SCL
I2C1_SDA
R9 0
R10 0
R4 0
Temperature sensor
TempSensor_INT
PB7
R2 0
R1 0
RF EEPROM MB1020 A-02 I2C address= 0xA6
PB6
PB5
SDA
SCL
1 2
3 4
5 6
7 8
CN1
SSM-104-L-DH
RFEEPROM & Extension Connector
EXT_RESET
PE2
R3
[N/A]
VDD
SB4
Closed by default
VDD
By default SB4 closed: I2C address = 0x92
Operating voltage: 2.7V to 3.6V
R203
100
COMMON
5
Selection
2
DWON
3
LEFT
1
RIGHT
4
UP
6
B3
MT008-A
JOY_SEL
JOY_DOWN
JOY_LEFT
JOY_RIGHT
JOY_UP
MFX
MFX
MFX
MFX
MFX
DAC_OUT1
C15
[N/A]
R28
0
Close to MCU
PA4
1 2
DAC_OUT1
CN3
R29
0
ADC_IN5
C2
[N/A]
R7
0
Close to MCU
PA5
1 2
ADC_IN5
CN2
R8
0
WKUP/TAMPER Button
R215
220K
1
43
2
B2
WKUP
VDD
R214
330
KEY
PC13
1 2
LD1
Green
1 2
LD3
Red
1 2
LD2
Orange
+3V3
R202
510
R201
680
R200
680
R199
680
LED4
LED3
LED1
LED2
PE4
1 2
LD4
Blue
PE5
PD1
PE7
VDD
+3V3
R198
1K [1%]
R196
1.15K [1%]
+5V
12
LD7
Red
R210
1K
6
5
7
U28B
TS3702IPT
2
3
1
48
U28A
TS3702IPT
12
LD8
Orange
R211
1K
12
LD9
Green
R212
1K
VDD
R197
49.9 [1%]
VDD<1.71V
1.71V<VDD<1.8V
VDD>1.8V
+5V
C117
100nF
R5
10K
R6
10K
(If SB4 opened: I2C address = 0x90)
Figure 31. Peripherals
Electrical schematicsUM1878
RFEEPROM module MB102 0 A-0 2
is plugged in CN1 pins 1, 3, 5, 7
Page 55
UM1878 Rev 255/64
612
TFT_MicroSD
MB1168C-01
10/14/2015
Title:
Size:Referen ce:
Date:Sheet: of
A3
Revision:
STM32L073Z-EVAL
Project:
+3V3
MFX_MicroSD_detect
CS
1
SCL
2
SDI
3
RS
4
WR
5
RD
6
RESET
8
VDD
9
VCI
10
SDO
7
GND
11
GND
12
BL_VDD
13
BL_Control
14
BL_GND
15
BL_GND
16
CN16
2.4" LCD connector (MB895/S)
+3V3
TFT LCD
MFX
+5V
C110
10uF
L9
BEAD
C111
100nF
L10
BEAD
+3V3
R128
[N/A]
+3V3
R110
[N/A]
+3V3
RVS
1
CS
2
DI
3
Vdd
4
SCLK
5
Vss
6
DO
7
RVS
8
SW2
9
SW1
10
CN13
PJS008-2000 (SMS064FF or SMS128FF)
PE10
PD0
R116
0
RESET#
+3V3
VDD
R145
4K7
R144 270
R112
10K
R135 270
R114 0
SPI LCD
SPI MICRO SD
SPI1_MISO_3V3
PE14
Input pin with pull-up
SPI1_MOSI
PE15
R138 0
VCCA
1
A1
2
A2
3
GND4DIR
5
B2
6
B1
7
VCCB
8
U18
SN74LVC2T45DCUT
+3V3VDD
VDD
C77
100nF
C71
100nF
SPI1_MOSI_3V3
SPI1_MOSI_DIR
R117 10K
R118 0
SPI1_SCK
VCCA
1
A1
2
A2
3
GND4DIR
5
B2
6
B1
7
VCCB
8
U17
SN74LVC2T45DCUT
+3V3VDD
VDD
C76
100nF
C70
100nF
SPI1_SCK_3V3
PE13
R136
100K
VDD
R137 0
VCCA
1
A1
2
A2
3
GND4DIR
5
B2
6
B1
7
VCCB
8
U19
SN74LVC2T45DCUT
+3V3VDD
VDD
C78
100nF
C72
100nF
PD0
R122
100K
R121 0
PE10
MicroSD_CS
TFT_CS
R140 0
R139
100K
VDD
R120 [N/A]
R141 [N/A]
R119 0
R142 0
PE13
PE15
PH9
TST_MOSI_DIR
SB40
Closed by default
SB41
Open by default
3
4
5
G
SD
621
T11
STT5N2VH5
p
reserved use
ZZ1
micro SD card
L11
BEAD
L4
BEAD
L12
BEAD
C61
N/A
R720
R750
C84
N/A
C62
N/A
close to U1 7
close to U1 8
close to U1 9
R72, R75 close to CN16
Figure 32. TFT microSD
UM1878Electrical schematics
MB895/S LCD TFT 2.4 inches module is
lugged in CN16
Page 56
56/64UM1878 Rev 2
712
USART_LPUART
MB1168C-01
10/14/2015
Title:
Size:Reference:
Date:Sheet: of
A3
Revision:
STM32L073Z-EVAL
Project:
SD
5
TxD
3
GND
8
Anode (VCC2)
1
Cathode
2
RxD
4
VCC1
6
Vlogic
7
U14
TFDU6300
+3V3
C68
4.7uF
C65
4.7uF
1
6
2
7
3
8
4
9
5
CN6
DB9-male
USART2/I rDA_RX_ 3V3
USART2
Bootloader_BOOT0_3V3
Bootloader_RESET_3V3
C2+
1
C2-2V-
3
R1IN
4
R2IN
5
R3IN
6
R4IN
7
R5IN
8
T1OUT
9
T2OUT
10
T3OUT
11
T3IN
12
T2IN
13
T1IN
14
R5OUT
15
R4OUT
16
R3OUT
17
R2OUT
18
R1OUT
19
R2OUTB
20
R1OUTB
21
nSHDN
22
nEN
23
C1-24GND
25
VCC
26
V+
27
C1+
28
U7
ST3241EBPR
C45
100nF
C38
100nF
C43
100nF
C39
100nF
C42
100nF
+3V3
+3V3
RXD
RTS
TXD
CTS
DSR
R91
0
USART2_ CTS_3V 3
PD3
R90 5.1
R92 47
PD6
USART2_RTS_3V3
PD4
VCCA
1
A1
2
A2
3
GND4DIR
5
B2
6
B1
7
VCCB
8
U13
SN74LVC2T45DCUT
+3V3
VDD
VDD
C67
100nF
C64
100nF
R95
100K
R94
100K
VDD
USART2_RTS_3V3
R63 0
R93 0
R96 0
C69
100nF
C66
100nF
USART2_ TX
IRDA
USART2_RTS
PD5
IRDA_RX
GND
GND
1
6
2
7
3
8
4
9
5
CN7
DB9-male
LPUART_RX_3V3
LPUART
C2+
1
C2-2V-
3
R1IN
4
R2IN
5
R3IN
6
R4IN
7
R5IN
8
T1OUT
9
T2OUT
10
T3OUT
11
T3IN
12
T2IN
13
T1IN
14
R5OUT
15
R4OUT
16
R3OUT
17
R2OUT
18
R1OUT
19
R2OUTB
20
R1OUTB
21
nSHDN
22
nEN
23
C1-24GND
25
VCC
26
V+
27
C1+
28
U8
ST3241EBPR
C50
100nF
C53
100nF
C52
100nF
C55
100nF
C51
100nF
+3V3
+3V3
RXD
RTS
TXD
CTS
DSR
LPUART_CTS_3V3
PD11
PD9
LPUART_RTS_3V3
PD12
VCCA
1
A1
2
A2
3
GND4DIR
5
B2
6
B1
7
VCCB
8
U12
SN74LVC2T45DCUT
+3V3VDD
VDD
C56
100nF
C60
100nF
R89
100K
R83
100K
VDD
LPUART_RTS_3V3
LPUART_TX
LPUART_RTS
PD8
GND
GND
R62
0
R88
0
R61
0
R87
0
3
2
1
JP9
Electrical schematicsUM1878
Figure 33. USART_LPUART
Page 57
UM1878 Rev 257/64
812
ADC16b_Pressure
MB1168C-01
10/14/2015
Title:
Size:Reference:
Date:Sheet: of
A3
Revision:
STM32L073Z-EVAL
Project:
PRESSURE
PA0
Pressure Sensor
R11
220 0.1%
R15
27400 0.1%
R14
47K 0.1%
R17
47K 0.1%
R32
10K 0.1%
R33
10K 0.1%
R20
10K 0.1%
R22
20K 0.1%
V+
V-
3
2
1
48
U3A
TSZ122IST
V+
V-
3
2
1
48
U4A
TSZ122IST
5
6
7
U3B
TSZ122IST
R21
20K 0.1%
AGND
C61uF
AGND
C71uF
AGND
R34
100
C19
10uF
AGND
Vs
3
GND
1
Vout+
2
Vout-
4
U1
MPXM2102AS
C1
100nF
AGND
C8
100nF
C9
1uF
AGND
AGND
C17
100nF
C18
1uF
AGNDAGND
R16
27400 0.1%
3Hz low-pass filter
Differential amplifier
Operating voltage: 3.3V
VDD_ANA
5
6
7
U4B
TSZ122IST
Spare operational amplifier
R30
[N/A]
R24 0
R31
0
R23
0
R38
0
C16
[N/A]
AGND
Figure 34. Pressure sensor
- AGND is the local ground plane of this section
- AGND local ground plane is connected to GND by default using solder bridges SB1, SB2, SB3, SB19, SB20, SB21 or by a ferrite bead L1. (refer to Power sheet)
- VDD_ANA is distributed in star sche me
UM1878Electrical schematics
Page 58
58/64UM1878 Rev 2
912
LC Detection
MB1168C-01
10/14/2015
Title:
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STM32L073Z-EVAL
Project:
C40
1nF
DET_COMP2_INP
1 2
External LC network
CN8
DET_COMP2_OUT
-
Comp2
STM32L
PB4
PA7
+
R67
0
C57
[N/A]
R59
120
VDD/2 generation
AC ground
LC sensor
Internal comparator 2
CompOut
TP18
VDD/2
TP14
JP8
C46
100pF
C63
1nF
R73
330K
R76
330K
POWER_CONTROL
3
1
2
4
5
Vcc-
Vcc+
U9
TSV631ILT
4
3
2
1
5
Vcc-
Vcc+
U11
TSV911ILT
SB29
Closed by default
SB30
Closed by default
LC_H
LC_L
L3
[N/A)
LC_H
LC_L
L
1
NC
2
NC
3
L
4
NC
8
NC
7
NC
6
NC
5
N
N
N
N
N
N
L2
100uH
Parts placed close to STM32L073
SB33
Open by default
SB32
Open by default
DET_DAC_OUT1
C59
1nF
C47
[N/A]
R64
330K
R54
330K
PA4
PD7
SB31
Closed by defau lt
close to MCU
TP18 located close to MCU pin PA7
DET_LPTIM_CH1
LPTIM input
PC0
C58
100nF
Note *: Sensor inductors L2 or L3 are exclusive.
Using a double PCB footprint.
see note *
see note *
Figure 35. LC sensor metering
Comp2 INM input can be conn ected to DAC OUT1 using an in ternal switch of the MCU
Electrical schematicsUM1878
Page 59
10 12
IDD_measurement
MB1168C-01
10/14/2015
Title:
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STM32L073Z-EVAL
Project:
VDD
R133
10K [1%]
VDD_MCU
GND
VDD
C104
100nF
GND
GND
R170
22K
R132
1K [1%]
R130
100 [1%]
R131
10 [1%]
R134
1 [1%]
C100
100nF
GND
GND
GNDGNDGND
GND
CAL
SH0SH1SH2SH3
3
4
5
G
SD
6
2
1
T10
STT7P2UH7
3
4
5
G
SD
6
2
1
T4
STT7P2UH7
3
4
5
G
SD
6
2
1
T2
STT7P2UH7
3
4
5
G
SD
6
2
1
T6
STT7P2UH7
3
4
5
G
SD
621
T8
STT7P2UH7
C102
100nF
+3V3
V+
V-
3
2
1
48
U21A
TSZ122IST
V+
V-
3
2
1
48
U23A
TSZ122IST
GND
+5V
C88
100nF
GND
5
6
7
U21B
TSZ122IST
MFX_IRQOUT
MFX_SWCLK
CAL
SH2
SH1
MFX_SWDIO
IDD_MEAS
SH3
N
p
SH1_DSH2_DSH3_DSH0_D
CAL_D
435
G
SD
6
7
8
2
1
T9
STS9P2UH7
VDD
SH0_D
SH0
435
G
SD
6
7
8
2
1
T7
STS9P2UH7
VDD
CAL_D
CAL
435
G
SD
6
7
8
2
1
T3
STS9P2UH7
SH1_D
SH1
435
G
SD
6
7
8
2
1
T1
STS9P2UH7
SH2_D
SH2
435
G
SD
6
7
8
2
1
T5
STS9P2UH7
SH3_D
SH3
CAL_D
CAL_D
CAL_D
R166 0
PE6
MFX_SWDIO
MFX_SWCLK
VDD
1 2
3 4
5
CN19
[N/A]
VDD
C116
100nF
C94
100nF
C91
100nF
C106
100nF
VDD
C99
100nF
SH0
VDD_MCU
JOY_SEL
JOY_DOWN
JOY_LEFT
JOY_RIGHT
JOY_UP
R177 0
R179 0
PB6
PB7
MFX_WKUP
VDD
R174
510
L7
BEAD
C90
1uF
C93
100nF
VDD
R176[N /A]
R171 10K
R189 10K
R190 10K
R191 10K
R188 10K
PE6 can also be used to wake-up the MCU
MFX_I2C_SDA
MFX_I2C_SCL
MFX_MicroSD_detect
RESET#
R158
0
XPTP27 [N/A]
XNTP26 [N/A ]
YPTP29 [N/A]
TP31
[N/A]
5
6
7
U23B
TSZ122IST
321
JP10
R151
100
C87
10uF
R164
100
C101
1uF
GND
R192
0
R180 0
R159
1K [0.1%]
R162
1K [0.1%]
R163
49K9 [0.1%]
R165
49K9 [0.1%]
R169
10K
C95
[N/A]
R155
[N/A]
R167
1K
R127
100K
R124
100K
R126
100K
R123
100K
R125
100K
MFX
MFX
MFX
MFX
MFX
MFX
R157
100K
D8
BAT60JFILM
IDD_MEAS
MFX_V3
WAKEUP
2
NRST
7
TSC_XP/GPO0
10
TSC_XN/GPO1
11
TSC_YP/GPO2
12
TSC_YN/GPO3
13
USART_TX
21
USART_RX
22
SPARE
14
SWDIO
34
SWCLK
37
I2C_SCL
42
I2C_SDA
43
BOOT0
44
I2C_ADDR
45
IRQOUT
46
IDD_CAL/GPO4
3
IDD_SH0
4
IDD_SH1/GPO5
5
IDD_SH2/GPO6
6
IDD_MEAS
25
GPIO0
18
GPIO1
19
GPIO2
20
GPIO3
39
GPIO4
40
GPIO5
15
GPIO6
16
GPIO7
17
GPIO8
29
GPIO9
30
GPIO10
31
GPIO11
32
GPIO12
33
GPIO13
26
IDD_SH3/GPO7
38
GPIO14
27
GPIO15
28
IDD_VDD_MCU
41
VDD
1
VDDA
9
VDD_124VDD_236VDD_3
48
VSSA
8
VSS_123VSS_235VSS_3
47
U25
STM32L152CCT6
bypass
see note *
to MCU
UM1878 Rev 259/64
see note *
Current
direction
see note *see note *
Shunts
MFX
Multi Function eXpander
Figure 36. IDD measurement
one capacitor close to each MFX pins:
VDD, VDD_1, VDD_2, VDD_3
Chapter 5: Demonstration software, and Chapter 6: Ordering
information.
UM1878 Rev 263/64
63
Page 64
UM1878
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