ST STG5223 User Manual

Low voltage 0.5 Ω dual SPDT switch

Features

■ Ultra low power dissipation:

I

= 0.2 μA (max.) at TA= 85 °C

CC

■ Low ON resistance:

–R

–R

–R

■ Wide operating voltage range:

V

■ 5 V tolerant and 1.8 V compatible threshold on

digital control input at V

■ Latch-up performance exceeds 300 mA

(JESD 17)

■ ESD performance:

HBM > 2 kV (MIL STD 883 method 3015)

Description

The STG5223 is a high-speed CMOS dual analog
SPDT (single pole dual throw) switch or dual 2:1
multiplexer/demultiplexer bus switch fabricated in
silicon gate C
operate from 1.65 to 4.3 V, making this device
ideal for portable applications.

=0.50 Ω (max. TA=25°C) at

ON

V

=4.3V

CC

=0.55Ω (max. TA=25°C) at

ON

V

=3.6V

CC

=0.55Ω (max. TA=25°C) at

ON

V

=3.0V

CC

(opr) = 1.65 V to 4.3 V single supply

CC

= 1.65 to 4.3 V

CC

2

MOS technology. It is designed to

STG5223

with break-before-make

QFN10

(1.8x1.4mm)

exists between the two ports) when nIN is held
low. The switches nS2 are ON (connected to
common ports Dn) when the nIN input is held low
and OFF (high impedance state exists between
the two ports) when IN is held high. Additional key
features are fast switching speed, break-before­make delay time and ultra low power
consumption. All inputs and outputs are equipped
with protection circuits against static discharge,
giving them ESD immunity and transient excess
voltage immunity.

It offers very low ON resistance (<0.5 Ω) at
V

= 3.0 V. The nIN inputs are provided to

CC

control the switches. The switches nS1 are ON
(connected to common ports Dn) when the nIN
input is held high and OFF (high impedance state

Table 1. Device summary

Order code Package Packaging

STG5223QTR QFN10 (1.8 x 1.4 mm) Tape and reel

May 2009 Doc ID 14312 Rev 3 1/19

\

www.st.com

19

Contents STG5223

Contents

1 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Input equivalent circuit and truth table . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2/19 Doc ID 14312 Rev 3

STG5223 Pin settings

1 Pin settings

1.1 Pin connection

Figure 1. Pin connection (top through view)

GND

2S2

10

SEL2

10

8

1

6

9

9

7

1S2

5

81

8

1.2 Pin description

Table 2. Pin description

Pin number Symbol Name and function

1V

2 1S1 Independent channel

3 D1 Common channel

4 SEL1 Control

5 1S2 Independent channel

2S1

CC

D2

9

2

2

10

3

3

1

4

4

VCC

Positive supply voltage

SEL1

4

7

7

D1

3

6

6

2

5

5

1S1

6 GND Ground (0V)

7 2S2 Independent channel

8 SEL2 Control

9 D2 Common channel

10 2S1 Independent channel

Warning: Exposed pad must be soldered to a floating plane. Do NOT

connect to power or ground.

Doc ID 14312 Rev 3 3/19

Input equivalent circuit and truth table STG5223

2 Input equivalent circuit and truth table

Figure 2. Input equivalent circuit

Table 3. Truth table

IN Switch S1 Switch S2

HON

L

OFF

(1)

OFF

ON

(1)

1. High impedance

4/19 Doc ID 14312 Rev 3

STG5223 Maximum rating

3 Maximum rating

Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.

Table 4. Absolute maximum ratings

Symbol Parameter Value Unit

Supply voltage -0.5 to 5.5 V

CC

V

DC input voltage -0.5 to VCC + 0.5 V

I

DC control input voltage -0.5 to 5.5 V

IC

DC output voltage -0.5 to VCC + 0.5 V

O

DC input diode current on control pin (V

IKC

I

DC input diode current (VIN < 0 V) ± 50 mA

IK

DC output diode current ± 20 mA

OK

DC output current ± 300 mA

I

O

DC output current peak (pulse at 1 ms, 10% duty cycle) ± 500 mA

OP

or

DC VCC or ground current ± 100 mA

D

Power dissipation at TA=70 °C

(1)

< 0 V) − 50 mA

SEL

1120 mW

I

CC

I

V

V

V

I

I

I

GND

P

T

Storage temperature -65 to 150 °C

STG

Lead temperature (10 sec) 300 °C

T

L

1. Derate above 70 °C by 18.5 mW/ °C

Doc ID 14312 Rev 3 5/19

Maximum rating STG5223

3.1 Recommended operating conditions

Table 5. Recommended operating conditions

Symbol Parameter Value Unit

V

V

V

T

dt/dv Input rise and fall time control input

Supply voltage 1.65 to 4.3 V

CC

Input voltage 0 to V

V

I

Control input voltage 0 to 4.3 V

IC

Output voltage 0 to V

O

Operating temperature -40 to 85 °C

op

V

= 1.65 V to

CC

2.7 V

V

CC

4.3 V

= 3.0V to

0 to 20

0 to 10

CC

CC

V

V

ns/V

6/19 Doc ID 14312 Rev 3