■ Fully Integrated Oscillator requires no external
components
■ CMOS Compatible Inputs
■ Programmable ID-Number
■ Programmable Bias Ratio
■ Programmable Columns Organization
■ Fully Integrated Configurable LCD bias voltage
generator with:
– Selectable multiplication factor (3x, 4X and
5X)
– Effective sensing for High Precision Output
– Eight selectable temperature compensation
coefficients
■ Designed for chip-on-glass (COG) applications
■ Low Power Consumption, suitable for battery
operated systems
■ Interfaces Supply Voltage range from 1.6 to
3.6V
■ High Voltage Generator Supply Voltage range
from 2.4 to 3.6V
■ Display Supply Voltage range from 3 to 13.2V
= 25°C)
(T
amb
Description
The STE2007 is a low power LCD driver, capable
to drive 96 columns and up to 68 lines, designed
for monochrome displays.
The STE2007 includes fully integrated bias
voltage generator (up to 5x multiplication factor),
and internal oscillator, thus reducing to minimum
the number of external components required and
the current consumption.
The STE2007 features the three standard serial
interfaces (3 and 4 lines serial, I
STE2007 3-lines 9 bits serial interface is a bidirectional link between the display driver and the
host processor.
It consists of three lines:
–SDAIN/SDAOUT Serial Data
–SCLK Serial Clock
–!CS Peripheral enable: - Active Low- Enables and Disables the serial interface
The serial interface is active only if the !CS line is low. If !CS is low after the positive edge of
!RES, the serial interface is ready to receive data after the internal reset time. Serial data must
be input to SDA in the sequence D/!C, D7 to D0. STE2007 read data on SCLK rising edge. The
first bit of serial data D/!C is data/command flag. When D/!C =”1” D7 to D0 bits are display RAM
data or Command Parameters. When D/!C=”0” D7 to D0 bits identify a command
4.1.1 MCU TxData Mode (Write Mode)
STE2007 is always a slave device on the communication bus and receive the communication
clock on the SCLK pin from the master. Information are exchanged word-wide. Every word is
composed by 9 bit. The first bit is named D/!C and indicates whether the following byte is a
command (D/!C =0) or a Display Data Byte (D/!C =1).
During data transfer, the data line is sampled by the receiver unit on the SCLK rising edge.
The data/command received is transferred to DDRAM or Executed on the first falling edge after
the latching rising edge or on the !CS rising edge.
If !CS stays low after the last bit of a command/data byte, the serial interface expects the D/!C
bit of the next data byte on the next SCLK positive edge.
A reset pulse on !RES pin interrupts any transmission.
Figure 5.
!CS
SDA
SCLK
D/C D7 D6 D5 D4 D3 D2 D1 D0 D/C
123456789
4.1.1.1 Data/Command Transfer break
If the Host processor generates an break condition (!CS Line HIGH before having received Bit
D0) while transferring a Data byte to the Frame Memory or a Command identifier or a command
parameter, the not complete received byte is discarded, the communication is interrupted and
the interface is forced in reset state.
D7 D6 D5 D4
111012 1314
When !CS line becomes low again to start a new communication session STE2007 is ready to
receive the same byte interrupted re-transmitted or a new command identifier.
16/62
STE20074 INTERFACE
3
Figure 6.3-lines SPI Data Transfer break condition
Break
!CS
SCL
SDA
D7D6D5D4D3D7D6D5D4
COMMAND/PARAMETERCOMMAND/PARAMETER
4.1.1.2 Data/Command Transfer pause
It is possible while transferring Frame Memory Data, Commands or Command Parameters to
insert a pause in the data transmission (!CS Line HIGH after 8 Bits Received). When !CS is
forced high after a whole byte received, the received byte is processed. Then STE2007 is
forced in a wait state ready to restart processing incoming data from the point where the
communication has been paused
If a new command identifier is transferred after a pause condition the previous communication
session is definitively closed.
Four are the possible conditions:
–Command-Pause-Command
–Command-Pause-Parameter
–Parameter-Pause-Command
–Parameter-Pause-Parameter
D/!C
LR0204
Figure 7.3-lines SPI Data Transfer Pause
Pause
!CS
SCL
SDA
D3D2D1D0D7D6D5D4D3
COMMAND/PARAMETERCOMMAND/PARAMETER
4.1.2 Driver TxData Mode (Read Mode)
The Driver TxData–mode is a method to check the electrical interconnection between LCD
driver and baseband, to identify the driver and for VDD Intercfonnection electrical self testing.
D/!C
D2D1D0
LR020
17/62
4 INTERFACESTE2007
Self Testing of the electrical contacts is based on the monitoring of VLCD. The improper
electrical contact on VDD can be noted from a too low level of VLCD.
The serial interface Driver TxData–mode is controlled by three input signals.
The serial data output (SDAOUT/Driver TxData) and serial clock input (SCLK) are enabled
when !CS is low after having received one Reading Command.
To access Driver TxData–mode a Reading command must be sent to STE2007 driver. The first
bit (D/C) is low to indicates next 8–bits are for command. The data is read to the driver on the
rising edge of SCLK (see section ”MCU TxData–mode”). After last command bit (bit 0) is read
SDAOUT becomes active (Low impedance) and MCU is able to read data from driver.
SDAOUT is forced in high impedence when !CS line is forced high or after the eight SCLK rising
edges from the last SCLK rising edge of teh reading command transfer (Figure 8).
After sending out all 8 bits the driver release automatically the bus and go back to the MCU
TxData–mode. MCU Txdata line changes from high–z to active low or high in the falling edge of
8th SCLK pulse. !CS must be set high and low again before !D/C writing can continue.
If !CS is forced high during the Driver TxDAta-mode, the Driver Tx data session is aborted and
SDAOUT is forced in high impedance Mode.
SDAOUT and SDAIN line can be short circuited in normal working conditions.
Figure 8.AC timing characteristics
Timing BTiming A
SCLK
MCU TxData
MCU Data direction
Driver TxData
Command
TxTxRx
Hi±Z
Hi±ZStatus
Hi±Z
Command
Hi±Z
Timing A
SCLK
MCU TxData
Driver TxData
Driver SDA direction
!CS
Timing B
SCLK
MCU TxData
Driver TxData
!CS
T1T2
inout
T3T4
outinDriver SDA direction
1/2 SCLK
D/C
T5
1/2 SCLK
18/62
STE20074 INTERFACE
Figure 9.Timing chart for start and stop of data reading from driver
Self Test command writingReading of statusD/C writing
SCLK
MCU TxData
0
Driver TxData
!CS
MCU TxData begins
1
D/C='0'7
4.2 4-Line SPI
STE2007 4-lines serial interface is a bidirectional link between the display driver and the host
processor.
It consists of four lines:
–SDA Serial Data
–SCL Serial Clock
–!CS Peripheral enable: - Active Low- Enables and Disables the serial interface
–Mode selection (D/!C).
28912
...
...
High Z
...
1
0
Driver TxData begins
7
...
High Z
...
...
6
...
8
7
0
1
MCU TxData begins
1
2
D/C
7
The serial interface is active only if the !CS line is low. If !CS is low after the positive edge of
!RES, the serial interface is ready to receive data after the internal reset time.
4.2.1 MCU TxData Mode (Write Mode)
STE2007 is always a slave device on the communication bus and receive the communication
clock on the SCL pin from the master. Information are exchanged byte-wide. During data
transfer, the data line is sampled by the receiver unit on the SCL rising edge.
D/!C line status set whether the byte is a command (D/!C =0) or a data (D/!C =1); D/!C line is
read on the eighth SCL clock pulse during every byte transfer.
If !CS stays low after the last bit of a command/data byte, the serial interface expects the MSB
of the next data byte on the next SCL positive edge.
If !CS line is forced high in the middle of a data transfer, not complete Data bytes and
Commands bytes are discarded.
A reset pulse on !RES pin interrupts any transmission.
If the Host processor generates an break condition (!CS Line HIGH before having received Bit
D0) while transferring a Data byte to the Frame Memory or a Command identifier or a command
parameter, the not complete received byte is discarded, the communication is interrupted and
the interface is forced in reset state.
When !CS line becomes low again to start a new communication session STE2007 is ready to
receive the same byte interrupted re-transmitted or a new command identifier.
Figure 12. 4-lines SPI Data Transfer break condition
!CS
D/!C
SCL
SDA
D7D6D5D4D3D7D6D5D4D3
COMMAND/PARAMETERCOMMAND/PARAMETER
4.2.1.2 Data/Command Transfer pause
Break
LR0192
It is possible while transferring Frame Memory Data, Commands or Command Parameters to
insert a pause in the data transmission (!CS Line HIGH after 8 Bits Received). When !CS is
forced high after a whole byte received, the received byte is processed. Then STE2007 is
forced in a wait state ready to restart processing incoming data from the point where the
communication has been paused
20/62
STE20074 INTERFACE
5
If a new command identifier is transferred after a pause condition the previous communication
session is definitively closed.
Four are the possible conditions:
–Command-Pause-Command
–Command-Pause-Parameter
–Parameter-Pause-Command
–Parameter-Pause-Parameter
Figure 13. 4-lines SPI Data Transfer Pause
Pause
!CS
D/!C
SCL
SDA
D3D2D1D0D7D6D5D4D3
COMMAND/PARAMETERCOMMAND/PARAMETER
4.2.2 Driver TxData Mode (Read Mode)
Throughout SDA line is possible to read some registers value (ID Numbers, Status byte,
temperature).
SDA (output Driver) is in High impedance in steady state and during data write.
Figure 14. 4-lines SPI 8Bit Read Cycle
DATA
High Z
!CS
D!C
SCL
SDA
(Input)
SDA
(Output)
MCU Data Tx Start
Read Command
D7 D6 D5 D4 D3 D2 D1 D0
High Z
LCD Driver Data Tx Start
D7 D6 D5 D4 D3 D2 D1
D2D1D0
LR0191
Next Command
D7 D6 D5 D4 D3 D2 D1 D0
D0
LR025
MCU Data Tx Start
4.3 I2C Bus
The I2C interface is a fully complying I2C bus specification, selectable to work in both Fast
(400kHz Clock) and High Speed Mode (3.4MHz).
This bus is intended for communication between different ICs. It consists of two lines: one bidirectional for data signals (SDA) and one for clock signals (SCL). Both the SDA and SCL lines
must be connected to a positive supply voltage via an active or passive pull-up.
The following protocol has been defined:
21/62
4 INTERFACESTE2007
–Data transfer may be initiated only when the bus is not busy.
–During data transfer, the data line must remain stable whenever the clock line is high.
Changes in the data line while the clock line is high will be interpreted as a Start or
Stop Data Transfer condition (see below).
Accordingly, the following bus conditions have been defined:
BUS not busy: Both data and clock lines remain High.
Start Data Transfer: A change in the state of the data line, from High to Low, while the clock is
High, define the START condition.
Stop Data Transfer: A Change in the state of the data line, from low to High, while the clock
signal is High, defines the STOP condition.
Data Valid: The state of the data line represents valid data when after a start condition, the
data line is stable for the duration of the High period of the clock signal. The data on the line
may be changed during the Low period of the clock signal. There is one clock pulse per bit of
data.
Each data transfer starts with a start condition and terminated with a stop condition. The
number of data bytes transferred between the start and the stop conditions is not limited. The
information is transmitted byte-wide and each receiver acknowledges with the ninth bit.
By definition, a device that gives out a message is called "transmitter", the receiving device that
gets the signals is called "receiver". The device that controls the message is called "master".
The devices that are controlled by the master are called "slaves"
Acknowledge. Each byte of eight bits is followed by one acknowledge bit. This acknowledge
bit is a low level put on the bus by the receiver, whereas the master generates an extra
acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of each
byte. Also, a master receiver must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to pull
down the SDA_IN line during the acknowledge clock pulse. Of course, setup and hold time
must be taken into account. A master receiver must signal an end-of-data to the slave
transmitter by not generating an acknowledge on the last byte that has been clocked out of the
slave. In this case, the transmitter must leave the data line High to enable the master to
generate the STOP condition.
Connecting SDA_IN and SDA_OUT together the SDA line become the standard data line.
Having the acknowledge output (SDAOUT) separated from the serial data line is advantageous
in Chip-On-Glass (COG) applications. In COG applications where the track resistance from the
SDAOUT pad to the system SDA line can be significant, a potential divider is generated by the
bus pull-up resistor and the Indium Tin Oxide (ITO) track resistance. It is possible that during
the acknowledge cycle the STE2007 will not be able to create a valid logic 0 level. By splitting
the SDA input from the output the device could be used in a mode that ignores the
acknowledge bit. In COG applications where the acknowledge cycle is required, it is necessary
to minimize the track resistance from the SDACK pad to the system SDA line to guarantee a
valid LOW level.
2
To be compliant with the I
C-bus Hs-mode specification the STE2007 is able to detect the
special sequence "S00001xxx". After this sequence no acknowledge pulse is generated.
Since no internal modification are applied to work in Hs-mode, the device is able to work in Hsmode without detecting the master code.
22/62
STE20074 INTERFACE
Figure 15. Bit transfer and START,STOP conditions definition
DATA LINE
STABLE
DATA VALID
CLOCK
DATA
START
CONDITION
Figure 16. Acknowledgment on the I
START
SCLK FROM
MASTER
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
1
MSBLSB
4.3.1 Communication Protocol
The STE2007 is an I2C slave. The access to the device is bi-directional since data write and
status read are allowed.
Four are the device addresses available for the device. All have in common the first 5 bits
(01111). The two least significant bit of the slave address are set by connecting the SA0 and
SA1 inputs to a logic 0 or to a logic 1.
CHANGE OF
DATA ALLOWED
2
C-bus
289
D00IN1151
D00IN1152
STOP
CONDITION
CLOCK PULSE FOR
ACKNOWLEDGEMENT
4.3.2 Starting the Communication
To start the communication between the bus master and the slave LCD driver, the master must
initiate a START condition. Following this, the master sends an 8-bit byte, on the SDA bus line
(Most significant bit first). This consists of the 7-bit Device Address Code, and the 1-bit Read/
Write Designator (R/W
communication (read or write).
All slaves with the corresponding address acknowledge in parallel, all the others will ignore the
2
I
C-bus transfer.
). The R/W bit has to be set to logic 1 to logic 0 according to the type of
ADDRESS BYTE
STE2007
SLAVE ADDRESS
S
011110AR/
S
A
W
1
READ or WRITE
DESIGNATOR
23/62
4 INTERFACESTE2007
4.3.3 MCU TxData Mode (Write Mode)
If the R/W bit is set to logic 0 the STE2007 is set to be a receiver and the master can send
commands or data.
After the communication has started and slaves have acknowledged, the master sends a
control byte defined as follows and waits for its acknowledgement:
CONTROL BYTE
Co
DC
000
000
The Co bit is the control byte MSB and defines if after this control byte will follow a single byte
sequence (Co = 1) or a multiple bytes sequence (Co = 0). The D/C
following byte (if Co = 1) or the following stream of bytes (if Co = 0) are command (D/C
DDRAM data (D/C
= 1).
bit defines whether the
= 0) or
Depending on state of flags Co and D/C, four writing sequences are possible:
SINGLE COMMAND BYTE SEQUENCE (Co = 1, D/C
= 0): a single byte interpreted as a
command will follow the control byte;
SINGLE DATA BYTE SEQUENCE (Co = 1, D/C
= 1): a single byte interpreted as a data to be
written in DDRAM will follow the control byte;
MULTIPLE COMMAND BYTES SEQUENCE (Co = 0, D/C
= 0): a stream of bytes will follow the
control byte, with each single byte interpreted as a command;
MULTIPLE DATA BYTES SEQUENCE (Co = 0, D/C
= 1): a stream of bytes will follow the
control byte, with each byte interpreted as a data byte to be written in DDRAM.
Every single byte of a sequence must be acknowledged by all addressed units.
A multiple data sequence is terminated only by sending a STOP condition on the I
When a sequence is terminated, another sequence of any type can follow or a I
2
C bus.
2
C STOP
condition can be sent to close the communication.
In a single or multiple data bytes sequence, every data byte received is stored in the DDRAM at
the location specified by the current values of data pointers. Data pointers are automatically
updated after each single data byte written.
24/62
STE20074 INTERFACE
4.3.4 Driver TxData Mode (Read Mode)
If the R/W bit is set to logic 1 the chip will output data immediately after the slave address. If the
D/C bit during the last write access, is set to a logic 0, the byte read is the status byte.
Figure 17. Communication Protocol
WRITE MODE
COMMUNICATION
START
SINGLE COMMAND
SEQUENCE
MULTIPLE COMMAND
SEQUENCE
SINGLE DATA
SEQUENCE
I2C START
COND
Co
D/C
Control Byte
Co
D/C
Control Byte
Co
D/C
Control Byte
111
0
SLAVE ADDRESS
STE2007 ACK
00010
000
STE2007 ACKSTE2007 ACK
000
00000
STE2007 ACK
00011
000
1
A
COMMAND Byte
Command Byte
A
COMMAND Byte
First Command Byte
DATA ByteA
A
Data Byte
STE2007 ACK
SA1
SA2
STE2007 ACK
STE2007 ACK
R/W
0
A
A
STE2007 ACK
COMMAND Byte A
A
Last Command Byte
MULTIPLE DATA
SEQUENCE
COMMUNICATION
STOP
READ MODE
STATUS BYTE READ
SEQUENCE
Co
D/C
Control Byte
I2C STOP
COND
I2C START
COND
STE2007 ACKSTE2007 ACK
000
A
00001
011110A
DATA Byte
First Data Byte
SA1
SLAVE ADDRESS
25/62
A
STE2007 ACK
SA2
R/W
Last Data Byte
STATUS Byte
STE2007 ACK
DATA ByteA
MASTER ACK
I2C START
A
COND
LR0008d
4 INTERFACESTE2007
4.4 Reading Mode
STE2007 features a reading Command to transmitt data from the LCD driver to Host
Processor. After the reading command STE2007 transfers 8 bits to the Host controller:
–Identification Byte (Command Code DB
4.4.1 IIdentification byte
Identification byte is an 8 Bit code that identify the module revision Number.
Table 15.ID byte format
Bit nrD7(MSB) D6D5D4D3D2D1D0(LSB)
00I DB PADI DA PA D0000
Figure 18.
ASIC(MCU)
8 bit register
Power IC
VDD
VDDI
GND
MCU TxData
Driver TxData
VDDCP
VDD
VDDI
VSS
VSSCP
RESET
SDA
XCS
SCLK
test
Auto
return
)
hex
STE2007
Command decoder
Multi
plexer
ID
VLCD
Voltage booster
BaseBand side
Driver side
Figure 19.
Identification Information
Send rading command (DBh)
Read status(ID data)
Send reset command
26/62
LCD Power
Supply circuit
Command:E2H
STE20075 Display Data RAM (DDRAM)
5 Display Data RAM (DDRAM)
5.1 DDRAM and Page/column address circuit
The DDRAM stores pixel data for LCD. It is a 68–row (8 page by 8 bits +4) by 96–column
addressable array. D7 to D0 display data from MCU corresponds to the LCD common direction.
”0” bit in DDRAM is a OFF–dot on display and ”1” bit in DDRAM is displayed as ON–dot on
display.
Figure 20. DDRAM vs. display on LCD
011 11D0
100 00D1
000 01D2
001 10D3
110 01D4
±±±±
DDRAMDisplay on LCD
COM0
COM1
COM2
COM3
COM4
Each pixel can be selected when page address and column address are specified. The MCU
issues Page address set command to change the page and access to another page. In
DDRAM page address 8 (D3,D2,D1,D0=1,0,0,0) only display data D0,D1,D2 & D3 are valid.
The DDRAM column address is specified by Column address set command.
The specified column address is automatically incremented by +1 when a Display data write
command is entered. After the last column address (5Fh), column address returns to 00h and
page address incremented by +1. After the very last address (column=5Fh, page=8h), both
column address and page address return to 00h (column address=00h, page address=0h).
Data can be written to the DDRAM at the same time as data is being displayed, without causing
the LCD to flicker.
Segment driver direction command can be used to reverse the relationship between the
DDRAM column address and segment output. This function is achieved writing data into
DDRAM in reverse order (from Right to left).
Table 16.Column address direction
Column
address
Normal
Direction
Reverse
Direction
00H01H02H5DH5EH5FH5DH
SEG0SEG1SEG2_ _ _ _ _ _SEG93SEG94SEG95
SEG95SEG94SEG93_ _ _ _ _ _SEG2SEG1SEG0
5.2 Line address circuit
The line address circuit specifies the line address relating to the COM output when the contents
of the DDRAM are displayed. The display start line that is normally the top line of the display,
can be specified by Display start line address set command.
STE2007 features Four different Multiplexing Mode to fine tune the duty ratio on the display
size:
STE2007 feature four configuration for Partial Display function:
–33 Line Partial Display
–25 Line Partial display
–16 Line Partial Display
–9 Line Partial Display
Partial display Area location on the screen is defined by Image Location Parameter.
Image Location + Partial display area > Multiplexing rate.
32/62
STE20075 Display Data RAM (DDRAM)
Figure 27.
Display
Image Location + Partial display area width <= Multiplexing rateImage Location + Partial display area width > Multiplexing rate
When Partial Display Mode is enabled the user has to Update the Operative Voltage, Bias Ratio
and Charge Pump Setting to match the new working conditions.
5.3.1 33 Line Partial Display Mode
Partial Display Area is composed of 33 Lines. Memory vs. Row Drivers Mapping is defined
according to the following parameters:
Image Location (1L[2:0]) + Partial display Area Width (11
S
S
S
S
S
S
SEG
Output
Normal
Direction
Reverse
Direction
E
E
E
G
G
G
0
1
2
S
S
S
E
E
E
G
G
G
95
94
93
S
E
E
E
E
G
G
G
G
3
4
5
6
S
S
S
S
E
E
E
E
G
G
G
G
92
91
90
89
S
S
S
E
E
E
G
G
G
91
90
89
S
S
S
E
E
E
G
G
G
4
5
6
) <= Multiplexing Rate (40
hex
S
S
S
S
E
E
E
E
G
G
G
G
95
94
93
92
S
S
S
S
E
E
E
E
G
G
G
G
0
1
2
3
)
hex
37/62
5 Display Data RAM (DDRAM)STE2007
5.4 Command Parameters Default Configuration
Table 17.
STATUSAfter Power OnAfter HW ResetAfter SW ResetDescription
Driver Status
Power Saver Mode
DISPLAY MODEAll Pixel OnAll Pixel OnAll Pixel On
INVERSIONOFFOFFOFF
DisplayOFFOFFOFF
Frame MemoryRandomNo ChangeNo Change
Page Address0hex0hex0hex
Columns Address0hex0hex0hex
Display Start line0hex0hex0hex
Segment drivers DirectionNormalNormalNormal
Common Drivers DirectionNormalNormalNormal
VOR - Voltage Range4hex4hex4hex
Electronic Volume90hex90hex90hex
Power Control RegisterBooster OFFBooster OFFBooster OFF
ID byte0hex0hex0hexIDA/IDB Pads
Charge Pump5x5x5x
MCU TxData–
mode
Power Saver
Mode
MCU TxData–
mode
Power Saver
Mode
MCU TxData–
mode
Power Saver
Mode
Bias Ratio1/101/101/10
VLCD Temeprature Comp.0ppm0ppm0ppm
N-Line InversionFrame Inv.Frame Inv.Frame Inv.
Multiplexing Rate1/681/681/68
Refresh Rate80Hz80Hz80Hz
Image Location0hex0hex0hex
Icon ModeDisabledDisabledDisabled
38/62
STE20076 Instruction Setups
6 Instruction Setups
6.1 Initialization (Power ON Sequence)
Power ON
Reset status
V0-Voltage Range (**H)
Electronic volume (**H)
Power saver OFF (Display all points OFF (A4H))
Power control set (2FH)
6.2 Display Data Writing Sequence
Column address set Upper 3-bit address (1*H)
Column address set Lower 4-bit address (0*H)
6.3 Power OFF
Page address set (B*H)
Display data write
Display ON (AFH)
Optional Status
!RES Pin="Low Level"
VDD - GND Power OFF
VDDI - GND Power OFF
Power Saver Status or Booster OFF Status
This command is needed only at 1st time after
initialization.
min.20ms
!RES Pin="Low Level"
VDD - GND Power OFF
VDDI - GND Power OFF
39/62
min. 0ms
7 Power ON/Power OFF timing SequenceSTE2007
7 Power ON/Power OFF timing Sequence
In
Figure 33
Figure 33. Timing for phone’s power on sequence when VDD,VDDCP Up before VDDI
is the timing diagram for power on/power down sequences.
tp1
> 0
tpi >0µs
VDDI
VDD
Inputs
tp1
> 0
tpi >0µs
Outputs
!CS
!RES
INTERNAL
RESET
High-Z
Reset State
tcs >0µs
tp2 >0µs
trs = max. 5µs
tcs >0µs
t
PWROFF1
t
PWROFF2
Trs = max. 5µs
>0 ms
>20ms
High-Z
Reset State
XCS,SDAIN,XRES can become ”High” simultaneously with VDDI (tcs>0,tpi>0;tp2>0).
trs= max 5000ns (Internal Reset Time- see AC Characteristics Paragraph)
t
PWROFF1
t
PWROFF2
>0ms must be considered when driver is in Power Saver or Booster OFF status
>20ms must be considered when driver is in Normal Working Condition
VDDI, VDD and VDD_CP can come up/go down in any sequence
VDDI can be Up with VDD, VDDCP down and viceversa. If only one supply rail is up, the driver
is forced in reset state.
If VDD is high after VDDI all timing referred to VDDI must be referred to VDD (Fig. 24)
Figure 34. Timing for phone’s power on sequence when VDDI Up before VDD
tp1
< 0
tpi >0µs
High-Z
Reset State
VDDI
VDD
SDAIN
SDAOUT
!CS
!RES
INTERNAL
RESET
tp1
< 0
tpi >0µs
High-Z
Reset State
tcs >0µs
tp2 >0µs
trs = max. 5µs
tcs >0µs
t
PWROFF1
t
PWROFF2
Trs = max. 5µs
>0 ms
>20ms
40/62
STE20077 Power ON/Power OFF timing Sequence
Table 18.Instruction Set
Code
Command
(D/C)D7D6D5D4D3D2D1D0Hex
Function
Display ON/OFF0 1010111
Display normal/
reverse
Display all points ON/
OFF
Page address set01011addressSets the DDRAM page address
Column address set
upper 3–bit address
Column address set
lower 4–bit address
Display start line
address set
Segment driver
direction
Common driver
direction select
0 1010011
0 1010010
0 0001 * address
00000address
001address
0 1010000
0 1100
0
***
1
01AEAFLCD display
0: OFF, 1: ON
01A6A7LCD display
0: normal, 1: reverse
01A4A5LCD display
0: normal display, 1: all points ON
Sets the DDRAM column address
Sets the DDRAM display start line
address
Sets the correspondence between
01A0
the DDRAM column address and
the SEG driver output.
A1
0:Normal, 1: reverse
Sets the correspondence between
the DDRAM line address and the
COM driver output.
0: normal, 1: reverse
Display data write1Write dataWrites to the DDRAM
Self Test/Identification
data reading
Power control set0 00101
VO-Range0 00100 VO-RangeSets the electronic volume value
Electronic volume0100Electronic volume valueSets the electronic volume value
Power saver– ––––––––
Reset0 11100010E2Internal reset
NOP0 11100011E3Non–operation
VOP
Termal Compensation
0 11011011DBIdentification byte
Operating
mode
0 11100001E1
0VOP[7:0]
0 0011100038
0 *****
Thermal
Comp
Sets the on–chip power supply
circuit operating mode
Compound command of Display
OFF and Display-all-points-ON
Sets the VLCD
SET VLCD Slope in temperature
41/62
7 Power ON/Power OFF timing SequenceSTE2007
Table 18.Instruction Set (continued)
Code
Command
(D/C)D7D6D5D4D3D2D1D0Hex
Function
0 001111013D
Charge Pump
0 ******
0 11101111EF
Refresh Rate
0 ******
Bias ratio0 00110 Bias RatioSets the VLCD
0 10101101AD
N-line Inversion
0**F1N-Line Inversion
Number of Lines0 11010 Mux Rate
0 10101100AC
Image Location
0*****IL[2:0]
Icon Mode0 1111100
0 10101001A9
STM TEST MODE1
0 ********
STM TEST MODE20 10101010AA
STM TEST MODE30 10101011AB
Charge
Pump
Refersh
Rate
Ico
n
Sets the Charge Pump Mux Factor
Sets the Display Refresh
Frequency
SET Initial Row on Display
Reserved for STM (STM Test
Mode)
Reserved for STM (STM Test
Mode)
Reserved for STM (STM Test
Mode)
STM TEST MODE40 10101000A8
STM TEST MODE50 11111111FF
STM TEST MODE60 11111100FC
STM TEST MODE70 11111110FE
STM TEST MODE80 11111101FD
* = Disabled bits.
42/62
Reserved for STM (STM Test
Mode)
Reserved for STM (STM Test
Mode)
Reserved for STM (STM Test
Mode)
Reserved for STM (STM Test
Mode)
Reserved for STM (STM Test
Mode)
STE20078 Commands
8 Commands
8.1 Display ON/OFF
This command turns the display ON and OFF
Table 19.Display ON/OFF
(D/C)D7D6D5D4D3D2D1D0HEXSetting
0 10101110AEDisplay OFF
01AFDisplay ON
When the Display OFF command is executed in the Display all points ON mode, Power saver
mode is entered. See the section on the Power saver for details.
8.2 Display normal/reverse
This command can reverse the lit and unlit without overwriting the contents of
the DDRAM.
Table 20.Display normal/reverse
(D/C)D7D6D5D4D3D2D1D0HEXSetting
0 10100110A6
01A7
Normal:DDRAM Data ”H”=LCD ON
voltage
Reverse:DDRAM Data ”L”=LCD ON
voltage
8.3 Display all points ON/OFF
This command makes it possible to force all display points ON regardless of the content of the
DDRAM. Even when this is done, the DDRAM contents are maintained. This command takes
priority over the Display normal/reverse command.
Table 21.Display all points ON/OFF
(D/C)D7D6D5D4D3D2D1D0HEXSetting
0 10100100A4Normal Display Mode
01A5Display All Points ON
When the Display all points ON command is executed when in the Display OFF mode, Power
saver mode is entered. See the section on the Power Saver for details.
43/62
8 CommandsSTE2007
8.4 Page address set
This command specifies the page address of the DDRAM.
Specifying the page address and column address enables to access a desired bit of the
DDRAM. After the last column address (5FH), page address is incremented by +1. After the
very last address (column = 5FH, page = 8H), page address return to 0H.
Table 22.Page address set
(D/C)D7D6D5D4D3D2D1D0HEXSetting
0 10110000B00H
00001B11H
00010B22H
0:::
01000B88H
8.5 Column address set
This command specifies the column address of the DDRAM. The column address is split into
two sections (the upper 3–bits and lower 4–bits) when it is set.
Each time the DDRAM is accessed, the column address automatically increments by +1,
imaging it possible for the MCU to continuously access to the display data. After the last column
address (5FH), column address returns to 00H.
Table 23.Column address set
(D/C)D7D6D5D4D3D2D1D0Setting
00001*A6A5A4Upper bit address
0A3A2A1A0Lower bit address
* Disabled bit
(D/C)A6A5A4A3A2A1A0Column address
0 000000000H
0 000000101H
0 000001002H
..
..
0 10111105EH
0 10111115FH
44/62
STE20078 Commands
8.6 Display start line address set
This command is used to specify the display start line address of the DDRAM.
If the display start line address is changed dynamically using this command, then screen
scrolling, page swapping can be performed.
Table 24.Display start line address set
(D/C)D7D6D5D4D3D2D1D0HEXSetting
001000000400H
001000001411H
001000010422H
:::
0011111107E3EH
0011111117F3FH
Display start line assress con be used in partial dispaly mode to relocate the partial display
window on the screen.
Display start line + Partial Display area with must be smaller or equal to the number of line
selected.
8.7 Segment driver direction select
This command can reverse the correspondence between the DDRAM column address and the
segment driver output.
Table 25.Segment driver direction select
(D/C)D7D6D5D4D3D2D1D0HEXSetting
0 10100000A0Normal
01A1Reverse
8.8 Common driver direction select
This command can reverse the correspondence between the DDRAM line address and the
common driver output.
Table 26.Common driver direction select
(D/C)D7D6D5D4D3D2D1D0Setting
0 11000* * *Normal
1***Reverse
* Disabled bit
45/62
8 CommandsSTE2007
8.9 Display data write
This command writes 8–bit data to the specified DDRAM address. Since the column address is
automatically incremented by +1 after each write, the MCU can continuously write multiple–
word data.
Table 27.Display data write
(D/C) D7D6D5D4D3D2D1D0
1Write Data
8.10 Data reading from driver (Driver TxData–mode)
These commands set SDAOUT to Driver TxData–mode and enable to read the identification
byte.
Table 28.ID Byte
(D/C)D7D6D5D4D3D2D1D0HEXSetting
0 11011011DBReads ID byte
000IDBIDA0000Pad Default
8.11 Power Control Set
This command sets the on–chip power supply function ON/OFF.
Table 29.Power Control Set
(D/C)D7D6D5D4D3D2D1D0HEXSetting
00010100028
000129
00102A
00112B
01002C
01012D
01102E
01112F
Booster : OFF
Voltage Regulator:OFF
Voltage Follower : OFF
Booster : ON
Voltage regulator : ON
Voltage follower : ON
46/62
STE20078 Commands
8.12 VLCD set
The LCD Voltage VLCD at reference temperature (TA = 25°C) can be set using the Voltage
Range V0R, Electronic Volume EV and VOP registers content according to the following
formula:
For information on VLCD thermal compensation see PAR. 8.18 .
Figure 35.
Vout
13.20V
3V
EV[3:0]
12h
11h
B
00h
00h
10h
VOP[7:0]*B+V-OR
1Fh
Figure 36.
EV[4:0]V0R[2:0]
DAC
Step: 40mV
Range 3V-13.20V
Thermal
Compensation
FFh
VOUT
8.12.1 V0R - Voltage Range Set
This command sets a value of the Voltage Range.
Table 30.V0R – Voltage Range
(D/C)D7D6D5D4D3D2D1D0Setting
0 00100V0R - Voltage RangeCommand Identifier + Data Field
47/62
8 CommandsSTE2007
Table 31.V0R
(D/C)D7D6D5D4D3D2D1D0HEX
0 0010000020 03.00 V
00012114.28 V
00102225.56 V
00112336.84 V
01002448.12 V (Default)
01012559.40 V
011026610.68 V
011127711.96 V
V0R
Value
32 · V0R · B + VLCD
MIN
8.12.2 VOP Set
Contrast Setting Adjustment .
Table 32.VOP Set
(D/C)D7D6D5D4D3D2D1D0HEXFunction
011100001E1Command Identifier
0VOP7 VOP6 VOP5 VOP4 VOP3 VOP2 VOP1 VOP0Data Field
Table 33.VOP
VOP7 VOP 6 VOP 5 VOP 4 VOP3 VOP2 VOP1 VOP0HEXVOP Ad just ment
00000000000 Step (Default)
0000000101+1 Step
0000001002+2 Step
::::::::::
011111117F+127 Step
10000000800 Step
1000000181-1 Step
::::::::::
11111101FD-125 Step
11111110FE-126 Step
11111111FF-127 Step
48/62
STE20078 Commands
8.12.3 Electronic volume
This command sets a value of electronic volume EV for the VLCD voltage regulator, to adjust
the contrast of LCD panel display (End User).
Table 34.Electronic volume
(D/C)D7D6D5D4D3D2D1D0Setting
0100Electronic Volume ValueCommand Identifier + Data Field
Table 35.EV
(D/C)D7D6D5D4D3D2D1D0HexEV ValueVLCD voltage
010000000800 Steplow
000001811 Step
000010822 Step
:::::
0100009016 Step (Default)
:::::
0111109E30 Step
0111119F31 Stephigh
8.13 Power saver mode
If the display all points ON command is executed when the display is in display OFF mode,
power saver mode is entered. This mode stops every operation of the LCD display system.
Figure 37. Power saver mode
Power saver (Display OFF & Display all points ON
Power saver mode
Powersaver OFF (Display all points OFF)
Power saver mode canceled
The internal states in power saver mode are as follows:
–The oscillation circuit is stopped
–The LCD power supply circuit is stopped
–The LCD driver circuit is stopped and segment/common driver outputs to the Vss
level
Command
Effect
49/62
8 CommandsSTE2007
–The display data and operation mode before execution of the Power saver are held,
and the MCU can access to the DDRAM and internal registers.
8.14 Reset
When this command is issued, the driver is initialized.This command doesn’t change DDRAM
content.
Table 36.Reset
(D/C)D7D6D5D4D3D2D1D0HEXFunction
011100010E2Command Identifier
8.15 NOP
Non–operation command.
Table 37.NOP
(D/C)D7D6D5D4D3D2D1D0HEXFunction
011100011E3Command Identifier
8.16 Image Location
Image Location Command
Table 38.Image Location
(D/C)D7D6D5D4D3D2D1D0HEXFunction
010101100ACCommand Identifier
0*****IL2IL1IL0Data Field
Table 39.Image Location
IL2IL1IL0Function
0000 Lines
0018 Lines
01016 Lines
01124 Lines
10032 Lines
10148 Lines
11056 Lines
11164 Lines
50/62
STE20078 Commands
8.17 Bias Ratio
It is possible to select different Bias Ratio.
Table 40.
Bias Ratio
(D/C)D7D6D5D4D3D2D1D0Function
000110BR2BR1BR0Command Identifier + Data Field
Table 41.BIAS Ratio
BR2BR1BR0Function
000Bias Ratio =1/10 - 81 Lines
001Bias Ratio = 1/9 - 65 Lines
010Bias Ratio =1/8 - 49 Lines
011Bias Ratio = 1/7 - 33 Lines
100Bias Ratio =1/6 - 25 Lines
101Bias Ratio = 1/5 - 17 Lines
110Bias Ratio =1/4 - 9 Lines
111Not Used
Table 42.Bias levels Generator
BR=000
V
LCD
R
R
6 R
R
R
BR=001
V
LCD
9
10
8
10
2
10
1
10
R
·V
LCD
R
·V
LCD
5 R
·V
LCD
R
·V
LCD
R
BR=010
V
LCD
R
8
·V
LCD
9
R
7
·V
LCD
9
4 R
2
·V
LCD
9
R
1
·V
LCD
9
R
7
8
6
8
2
8
1
8
BR=011
V
LCD
R
·V
LCD
R
·V
LCD
3 R
·V
LCD
R
·V
LCD
R
6
·V
LCD
7
5
·V
LCD
7
2
·V
LCD
7
1
·V
LCD
7
V
SS
BR=100
V
LCD
R
R
2 R
R
R
V
SS
V
SS
BR=101
V
LCD
5
6
4
6
2
6
1
6
R
·V
LCD
R
·V
LCD
1 R
·V
LCD
R
·V
LCD
R
V
SS
4
5
3
5
2
5
1
5
·V
·V
·V
·V
LCD
LCD
LCD
LCD
V
SS
BR=110
V
LCD
R
R
4 R
R
R
V
SS
3
·V
4
2
·V
4
2
·V
4
1
·V
4
V
SS
LCD
LCD
LCD
LCD
51/62
8 CommandsSTE2007
8.18 Temperature Compensation
Its is possible to select different VLCD temperature compensation Coefficients.
Table 43.VLCD Temperature Compensation
(D/C)D7D6D5D4D3D2D1D0HEXFunction
00011100038Command Identifier
Thermal
0 *****
Temperature Compensation Formula:
Compensation
TC
Data Field
VLCD(T) = VLCD(T
) · [1 + (T(°C) - TA) · TC]
A
TC = Temperature Compensation Coefficients
T(°C) = Temperature
VLCD(T
) = LCD Voltage at TA Temperature (Room Temperature)
A
Table 44.TC
TC2TC1TC0TC Value
000TC= 0 PPM
001TC= -300 PPM
010TC= -600 PPM
011TC= -900 PPM
100TC= -1070 PPM
101TC= -1200 PPM
110TC= -1500 PPM
111TC= -1800 PPM
8.19 Charge Pump Multiplication Factor
It is possible to select different Charge Pump Multiplication Factors.
Table 45.Charge Pump Setting
(D/C)D7D6D5D4D3D2D1D0HEXFunction
0001111013DCommand Identifier
0 ******CP1CP0Data Field
52/62
STE20078 Commands
Table 46.Charge Pump Multiplication Factor
CP1CP0Function
005 x
014 x
103 x
11Not Used
8.20 Refresh Rate
It is possible to select different Refresh Rate.
Table 47.Refresh Rate
(D/C)D7D6D5D4D3D2D1D0HEXFunction
011101111EFCommand Identifier
0******RR1 RR0Data Field
Table 48.Refresh Rate
RR1RR0Function
0080 Hz
0175 Hz
1070 Hz
1165 hz
8.21 Icon Mode
Icon Mode
–0: Icon Mode Disabled
–1: Icon Mode Enabled
Table 49.Icon Mode
(D/C)D7D6D5D4D3D2D1D0Function
01111100ICONCommand Identifier
8.22 N- Line Inversion
N-line Inversion Function.
Table 50.N-Line Inversion
(D/C)D7D6D5D4D3D2D1D0HEXFunction
010101101ADCommand Identifier
0**F1NL4NL3NL2NL1NL0Data Field
53/62
8 CommandsSTE2007
Table 51.N-Line
F1NL4NL3NL2NL1NL0FunctionN row
*00000N-line inversion disabled (default)
0*****XOR function disabled
1*****XOR function enabled
*00001N-line inversion enabled2
*00010N-line inversion enabled3
::::::::
*11111N-line inversion enabled32
The XOR function defines the polarity
8.23 Number of Lines
as the result of the logical XOR
between the N-Line and the frame
Multiplexing Rate setting command.
polarity.
Table 52.Number of Lines
(D/C)D7D6D5D4D3D2D1D0Function
011010M2M1M0Command Identifier + Data Field
Table 53.Multiplexing Rate
M2M1M0Function
00068 Lines (Default)
00165 Lines
01049 Lines
01133 Lines
10033 Lines Partial Display
10125 Lines Partial Display
11017 Lines Partial Display
1119 Lines Partial Display
54/62
STE20079 Chip Mechanical Drawing
9 Chip Mechanical Drawing
Table 54.Mechanical Dimensions
ParameterDimensions
Wafer Thickness500µm
Die Size (X x Y)5.92 mm x 1.29 mm
Bumps Size on Columns and Segments Side28µm X 89 µm X 15
Pad Size on Columns and Segments Side35µm X 96µm
Bumps Pitch on Columns and Segments Side45µm
Bumps Size on Interfaces Side55µm X 73µm X 15
Pad Size on Interfaces Side64 µm X 82 µm
Bumps Pitch on Interfaces Side72µm
Spacing between Bumps17µm
55/62
9 Chip Mechanical DrawingSTE2007
Table 55.Pad Coordinates
NAMEPADX (µm)Y(µm)
R161-2632.5-514.35
R142-2587.5-514.35
R123-2542.5-514.35
R104-2497.5-514.35
R85-2452.5-514.35
R66-2407.5-514.35
R47-2362.5-514.35
R28-2317.5-514.35
R09-2272.5-514.35
C010-2227.5-514.35
C111-2182.5-514.35
C212-2137.5-514.35
Table 55.Pad Coordinates (continued)
NAMEPADX(µm)Y(µm)
C1929-1372.5-514.35
C2030-1327.5-514.35
C2131-1282.5-514.35
C2232-1237.5-514.35
C2333-1192.5-514.35
C2434-1147.5-514.35
C2535-1102.5-514.35
C2636-1057.5-514.35
C2737-1012.5-514.35
C2838-967.5-514.35
C2939-922.5-514.35
C3040-877.5-514.35
C313-2092.5-514.35
C414-2047.5-514.35
C515-2002.5-514.35
C616-1957.5-514.35
C717-1912.5-514.35
C818-1867.5-514.35
C919-1822.5-514.35
C1020-1777.5-514.35
C1121-1732.5-514.35
C1222-1687.5-514.35
C1323-1642.5-514.35
C1424-1597.5-514.35
C1525-1552.5-514.35
C1626-1507.5-514.35
C3141-832.5-514.35
C3242-787.5-514.35
C3343-742.5-514.35
C3444-697.5-514.35
C3545-652.5-514.35
C3646-607.5-514.35
C3747-562.5-514.35
C3848-517.5-514.35
C3949-472.5-514.35
C4050-427.5-514.35
C4151-382.5-514.35
C4252-337.5-514.35
C4353-292.5-514.35
C4454-247.5-514.35
C1727-1462.5-514.35
C1828-1417.5-514.35
56/62
C4555-202.5-514.35
C4656-157.5-514.35
STE20079 Chip Mechanical Drawing
Table 55.Pad Coordinates (continued)
NAMEPADX(µm)Y(µm)
C4757-112.5-514.35
C4858112.5-514.35
C4959157.5-514.35
C5060202.5-514.35
C5161247.5-514.35
C5262292.5-514.35
C5363337.5-514.35
C5464382.5-514.35
C5565427.5-514.35
C5666472.5-514.35
C5767517.5-514.35
C5868562.5-514.35
Table 55.Pad Coordinates (continued)
NAMEPADX(µm)Y(µm)
C75851327.5-514.35
C76861372.5-514.35
C77871417.5-514.35
C78881462.5-514.35
C79891507.5-514.35
C80901552.5-514.35
C81911597.5-514.35
C82921642.5-514.35
C83931687.5-514.35
C84941732.5-514.35
C85951777.5-514.35
C86961822.5-514.35
C5969607.5-514.35
C6070652.5-514.35
C6171697.5-514.35
C6272742.5-514.35
C6373787.5-514.35
C6474832.5-514.35
C6575877.5-514.35
C6676922.5-514.35
C6777967.5-514.35
C68781012.5-514.35
C69791057.5-514.35
C70801102.5-514.35
C71811147.5-514.35
C72821192.5-514.35
C87971867.5-514.35
C88981912.5-514.35
C89991957.5-514.35
C901002002.5-514.35
C911012047.5-514.35
C921022092.5-514.35
C931032137.5-514.35
C941042182.5-514.35
C951052227.5-514.35
R11062272.5-514.35
R31072317.5-514.35
R51082362.5-514.35
R71092407.5-514.35
R91102452.4-514.35
C73831237.5-514.35
C74841282.5-514.35
R111112497.5-514.35
R131122542.5-514.35
57/62
9 Chip Mechanical DrawingSTE2007
Table 55.Pad Coordinates (continued)
NAMEPADX(µm)Y(µm)
R151132587.5-514.35
R171142632.5-514.35
R191152831.85-450.0
R211162831.85-405.0
R231172831.85-360.0
R251182831.85-315.0
R271192831.85-270.0
R291202831.85-225.0
R311212831.85-180.0
R331222831.85-135.0
R351232831.85-90.0
R371242831.85-45.0
Table 55.Pad Coordinates (continued)
NAMEPADX(µm)Y(µm)
TEST41412304.0517.5
VSS_AUX1421944.0517.5
VSS_AUX1431872.0517.5
VSS_AUX1441800.0517.5
VSS_AUX1451728.0517.5
N_RES1461584.0517.5
N_CS1471512.0517.5
T21481368.0517.5
T11491296.0517.5
T01501224.0517.5
VSS1511152.0517.5
VSS1521080.0517.5
R391252831.850.0
R411262831.8545.0
R431272831.8590.0
R451282831.85135.0
R471292831.85180.0
R491302831.85225.0
R511312831.85270.0
R531322831.85315.0
R551332831.85360.0
R571342831.85405.0
R591352831.85450.0
R611362632.5514.35
R631372587.5514.35
R651382542.0514.35
VSS1531008.0517.5
VSS_LCD154936.0517.5
VSS_LCD155864.0517.5
VSS_LCD156792.0517.5
VSS_CP157720.0517.5
VSS_CP158648.0517.5
VSS_CP159576.0517.5
DC160432.0517.5
SDAOUT161360.0517.5
SDIN162288.0517.5
SDOUT163216.0517.5
SCLK164144.0517.5
VREF_BUFF16572.0517.5
VSS_AUX166-72.0517.5
R671392497.5514.35
TEST31402376.0517.5
58/62
SEL1167-144.0517.5
SEL0168-216.0517.5
STE20079 Chip Mechanical Drawing
Table 55.Pad Coordinates (continued)
NAMEPADX(µm)Y(µm)
SA1169-288.0517.5
SA0170-360.0517.5
IDB171-432.0517.5
IDA172-504.0517.5
OSC_IN173-576.0517.5
VDDI174-720.0517.5
VDDI175-792.0517.5
VDDI176-864.0517.5
VDDI177-936.0517.5
VDDI178-1008.0517.5
VDDI179-1080.0517.5
VDD180-1224.0517.5
Table 55.Pad Coordinates (continued)
NAMEPADX(µm)Y(µm)
R62197-2587.5514.35
R60198-2632.5514.35
R58199-2831.85450.0
R56200-2831.85405.0
R54201-2831.85360.0
R52202-2831.85315.0
R50203-2831.85270.0
R48204-2831.85225.0
R46205-2831.85180.0
R44206-2831.85135.0
R42207-2831.8590.0
R40208-2831.8545.0
VDD181-1296.0517.5
VDD182-1368.0517.5
VDD183-1440.0517.5
VDD184-1512.0517.5
VDD185-1584.0517.5
VDD_CP186-1656.0517.5
VDD_CP187-1728.0517.5
VLCD_SNS188-1872.0517.5
VLCD189-1944.0517.5
VLCD190-2016.0517.5
VLCD191-2088.0517.5
VLCD192-2160.0517.5
TEST4193-2304.0517.5
TEST5194-2376.0517.5
R38209-2831.850.0
R36210-2831.85-45.0
R34211-2831.85-90.0
R32212-2831.85-135.0
R30213-2831.85-180.0
R28214-2831.85-225.0
R26215-2831.85-270.0
R24216-2831.85-315.0
R22217-2831.85-360.0
R20218-2831.85-405.0
R18219-2831.85-450.0
R66195-2497.5514.35
R64196-2542.5514.35
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9 Chip Mechanical DrawingSTE2007
Table 56.Alignment marks coordinates
MARKSXY
Mark1-2834.55517.05
Mark22834.55517.05
Mark3-2834.55-517.05
Mark42834.55-517.05
Mark5 2205.0517.05
Figure 38. Alignment marks dimensions
35 µm
85 µm
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STE200710 Revision history
10 Revision history
DateRevisionChanges
9-Nov-20051Initial release.
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STE2007
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