ST STE110NA20 User Manual

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N - CHANNEL ENHANCEMENT MODE
TYPE V
DSS
STE11 0NA 20 200 V < 0.019 110 A
R
DS(on)
STE110NA20
FAST POWER MOS TRANSISTOR
PRELIMINARY DATA
I
D
TYPICALR
HIGH CURRENTPOWER MODULE
VERYLARGE SOA - LARGE PEAK POWER
DS(on)
=0.015
CAPABILITY
EASY TO MOUNT
SAMECURRENT CAPABILITYFOR THE
TWOSOURCE TERMINALS
EXTREMELYLOW Rth (Junction to case)
VERYLOW INTERNALPARASITIC
INDUCTANCE
ISOLATEDPACKAGE UL RECOGNIZED
APPLICATIONS
SMPS& UPS
MOTORCONTROL
WELDINGEQUIPMENT
OUTPUTSTAGE FOR PWM, ULTRASONIC
CIRCUITS
ISOTOP
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
DM
P
T
V
() Pulse width limited bysafe operatingarea
March 1996
Drain-source Voltage ( VGS= 0 ) 200 V
DS
Drain- gate Volt age (RGS=20kΩ) 200 V
DGR
Gat e- source Voltage ± 30 V
GS
I
Drain Curren t (co nt inu ous ) at Tc=25oC 110 A
D
I
Drain Curren t (co nt inu ous ) at Tc=100oC73A
D
() Drain Current (pulsed) 440 A
Tot al Dissipation at Tc=25oC 450 W
tot
Derating Factor 3.6 W/ St orage Temperatur e -55 to 150
stg
T
Max. Operating Junction Temperatur e 150
j
Ins ulation Withhstand V o lt age (A C- R M S) 2500 V
ISO
o
C
o
C
o
C
1/8
STE110NA20
THERMAL DATA
R
thj-case
R
thc-h
AVALANCHE CHARACTERISTICS
Symb o l Para met er M ax Value Uni t
I
AR
E
E
I
AR
Ther mal Resistance Junct ion-case Max Ther mal Resistance Case-heatsink Wit h Conduct ive Gr ease Appli ed Max
Avalanche Current , Repet it iv e or Not-Repe t it ive (pulse width limi t ed by T
Single Pu lse Avalanc he E nerg y
AS
(starti ng T Repetitive Avalanche Energy
AR
=25oC, ID=IAR,VDD=50V)
j
(pulse width limi t ed by T
max, δ <1%)
j
max, δ <1%)
j
Avalanche Current , Repet it iv e or Not-Repe t it ive
=100oC, p ulse wid t h limited by Tjmax, δ <1%)
(T
c
0.27
0.05
55 A
500 mJ
175 mJ
32.5 A
o
C/W
o
C/W
ELECTRICAL CHARACTERISTICS (T
=25oC unlessotherwise specified)
case
OFF
Symbol Parameter Test Condition s Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=1mA VGS= 0 200 V
Break dow n Voltage
I
I
DSS
GSS
Zero Gate Voltage Drain Current (V
GS
Gat e- bod y Leaka ge Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingx0.8 Tc= 125oC
V
DS
V
= ± 30 V ± 400 nA
GS
400 200
ON ()
Symbol Parameter Test Condition s Min. Typ. Max. Unit
V
GS(th )
R
DS(on)
I
D(on)
Gat e Thre shold Volt age VDS=VGSID=1mA 2.25 3 3.75 V St at ic Drain-source On
Resistance
VGS= 10V ID=55A
= 10V ID=55A Tc=100oC
V
GS
On State Drain Current VDS>I
D(on)xRDS(on)max
110 A
0.015 0.019
VGS=10V
DYNAMIC
Symbol Parameter Test Condition s Min. Typ. Max. Unit
g
()Forward
fs
Tr ansc on ductance
C
C
C
Input Capac it an ce
iss
Out put Capac itance
oss
Reverse Transfer
rss
Capacit a nc e
VDS=15 V ID=55A 38 S
VDS=25V f=1MHz VGS= 0 12.9
2870
980
µA
mA
nF pF pF
2/8
STE110NA20
ELECTRICAL CHARACTERISTICS (continued)
SWITCHINGON
Symbol Parameter Test Condition s Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Time Rise Time
VDD=100V ID=55A
=4.7 VGS=10V
R
G
(see test cir cuit, figure 3)
(di/dt)
Tur n-on C urr ent Slope VDD=160V ID= 110 A
on
R
=47 VGS=10V
G
(see tes t circuit, f igure 5)
Q
Q
Q
Tot al Gat e Charge
g
Gate-Source Charge
gs
Gat e- Drain Charge
gd
VDD=160V ID= 110 A VGS= 10 V 470
SWITCHINGOFF
Symbol Parameter Test Condition s Min. Typ. Max. Unit
t
r(Voff)
t
Off -voltage Rise Time
t
Fall T ime
f
Cross-over Time
c
VDD=160V ID= 110 A
=4.7 VGS=10V
R
G
(see test cir cuit, figure 5)
SOURCE DRAIN DIODE
70 95
100 125
290 A/ µs
600 nC
43
226
115
68
160
150 100 210
ns ns
nC nC
ns ns ns
Symbol Parameter Test Condition s Min. Typ. Max. Unit
I
I
SDM
SD
Source-drain Current
()
Source-drain Current
110 440
(pulsed)
()ForwardOnVoltage ISD=110A VGS=0 1.6 V
V
SD
t
Q
Reverse Recovery
rr
Time Reverse Recovery
rr
ISD= 110 A di/dt = 100 A/µs
=50V Tj=150oC
V
R
(see test cir cuit, figure 5)
625
11
Charge
I
RRM
Reverse Recovery
35
Current
() Pulsed: Pulse duration =300 µs,duty cycle 1.5 % () Pulse width limited by safe operating area
Safe Operating Area ThermalImpedance
A A
ns
µC
A
3/8
STE110NA20
Derating Curve
TransferCharacteristics
OutputCharacteristics
Transconductance
StaticDrain-source On Resistance
4/8
Gate Charge vs Gate-source Voltage
STE110NA20
CapacitanceVariations
Normalized OnResistance vs Temperature
Normalized GateThreshold Voltage vs Temperature
Turn-onCurrent Slope
Turn-offDrain-source VoltageSlope
Cross-overTime
5/8
STE110NA20
SwitchingSafe Operating Area
Source-drainDiode Forward Characteristics
AccidentalOverload Area
Fig. 1: UnclampedInductive Load Test Circuit
6/8
Fig. 2: UnclampedInductive Waveform
STE110NA20
Fig. 3: SwitchingTimes Test Circuits For
ResistiveLoad
Fig. 5: Test CircuitFor Inductive Load Switching And DIodeRecovery Times
Fig. 4: GateCharge test Circuit
7/8
STE110NA20
Information furnished is believedto be accurateand reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequencesof use ofsuch informationnor for any infringement of patents or otherrights of third parties which may resultsfrom its use. No licenseis grantedby implicationor otherwise underany patentor patentrights ofSGS-THOMSONMicroelectronics. Specificationsmentioned in this publicationare subject to change without notice.This publication supersedes andreplaces all informationpreviously supplied. SGS-THOMSONMicroelectronics products are notauthorized for useas criticalcomponents in lifesupportdevicesor systems withoutexpress writtenapproval of SGS-THOMSONMicroelectonics.
1995 SGS-THOMSONMicroelectronics - All Rights Reserved
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