ST STDS75 User Manual

Digital temperature sensor and thermal watchdog
Features
Measures temperatures from
±0.5 °C (typ) accuracy
±2 °C (max) accuracy from 25 °C to +100 °C
Low operating current: 125 µA (typ)
No external components required
2-wire I
– Selectable serial bus address allows
Thermometer resolution is user-configurable
from 9 (default) to 12 bits (0.5 °C to 0.0625 °C)
9-bit conversion time is 150 ms (max)
Programmable temperature threshold and
hysteresis set points
Wide power supply range - operating voltage
range: 2.7 V to 5.5 V
Pin- and software-compatible with DS75 (drop-
in replacement)
Power-up defaults permit standalone operation
as thermostat
Shutdown mode to minimize power
consumption
Separate open drain output pin operates as an
interrupt or comparator/thermostat output (dual purpose event pin)
MSOP8 (TSSOP8) package
2
C/SMBus-compatible serial interface
connection of up to eight devices on the same bus
STDS75
Datasheet production data
MSOP8
(TSSOP8)
March 2012 Doc ID 13297 Rev 9 1/38
This is information on a product in full production.
www.st.com
1
Contents STDS75
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Serial communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Temperature sensor output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.3 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3.1 SDA (open drain) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3.2 SCL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3.3 OS
1.3.4 GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3.5 A2, A1, A0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3.6 V
2 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
/INT (open drain) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Thermal alarm function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3 Comparator mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4 Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5 Fault tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6 Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.7 Temperature data format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 Registers and register set formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1.1 Command/pointer register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1.2 Configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1.3 Temperature register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1.4 Overlimit temperature register (T
3.1.5 Hysteresis temperature register (T
3.2 Power-up default conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3 Serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4 2-wire bus characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
) . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
OS
) . . . . . . . . . . . . . . . . . . . . . . . . . 19
HYS
3.4.1 Bus not busy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4.2 Start data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4.3 Stop data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2/38 Doc ID 13297 Rev 9
STDS75 Contents
3.4.4 Data valid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4.5 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.5 READ mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.6 WRITE mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4 Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Doc ID 13297 Rev 9 3/38
List of tables STDS75
List of tables
Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. Fault tolerance setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3. Relationship between temperature and digital output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4. Command/pointer register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5. Register pointers selection summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 6. Configuration register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 7. Programmable resolution configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 8. Temperature register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 9. T
Table 10. STDS75 serial bus slave addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 11. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 12. Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 13. DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 14. AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 15. MSOP8 (TSSOP8) – 8-lead, thin shrink small outline (3 mm x 3 mm) package
Table 16. Carrier tape dimensions for MSOP8 (TSSOP8) package. . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 17. Reel dimensions for 12 mm carrier tape - MSOP8 (TSSOP8) package . . . . . . . . . . . . . . . 35
Table 18. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 19. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
and T
OS
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
HYS
4/38 Doc ID 13297 Rev 9
STDS75 List of figures
List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 2. Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3. Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Typical 2-wire interface connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. OS
Figure 6. Serial bus data transfer sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 7. Acknowledgement sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 8. Slave address location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 9. Typical 2-byte READ from preset pointer location (e.g. temp - T
Figure 10. Typical pointer set followed by an immediate READ for 2-byte register (e.g. temp). . . . . . 24
Figure 11. Typical 1-byte READ from the configuration register with preset pointer . . . . . . . . . . . . . . 24
Figure 12. Typical pointer set followed by an Immediate READ from the configuration register . . . . . 25
Figure 13. Configuration register WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 14. T
Figure 15. Temperature variation vs. voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 16. Bus timing requirements sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 17. MSOP8 (TSSOP8) – 8-lead, thin shrink small outline (3 mm x 3 mm) package
Figure 18. Carrier tape for MSOP8 (TSSOP8) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 19. Reel schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
output temperature response diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
, T
) . . . . . . . . . . . . 24
HYS
OS
and T
OS
WRITE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
HYS
mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Doc ID 13297 Rev 9 5/38
Description STDS75

1 Description

The STDS75 is a high-precision CMOS (digital) temperature sensor IC with a delta-sigma analog-to-digital (ADC) converter and an I for general applications such as personal computers, system thermal management, electronics equipment, and industrial controllers, and is packaged in the industry-standard 8-lead TSSOP package.
The device contains a bandgap temperature sensor and programmable 9- to 12-bit ADC which monitor and digitize the temperature to a resolution up to 0.0625 °C. The STDS75 is typically accurate to (±3 °C - max) over the full temperature measurement range of –55 °C to 125 °C with ±2 °C accuracy in the –25 °C to +100 °C range. At power-up, the STDS75 defaults to 9-bit resolution for software compatibility with the STLM75.
The STDS75 is specified for operating at supply voltages from 2.7 V to 5.5 V. Operating at
3.3 V, the supply current is typically (125 µA).
The onboard delta-sigma analog-to-digital converter (ADC) converts the measured temperature to a digital value that is calibrated in °C; for Fahrenheit applications a lookup table or conversion routine is required.
The STDS75 is factory-calibrated and requires no external components to measure temperature.

1.1 Serial communications

The STDS75 has a simple 2-wire I2C-compatible digital serial interface which allows the user to access the data in the temperature register at any time. It communicates via the serial interface with a master controller which operates at speeds up to 400kHz. Three pins (A0, A1, and A2) are available for address selection, and enable the user to connect up to 8 devices on the same bus without address conflict.
2
C-compatible serial digital interface. It is targeted
In addition, the serial interface gives the user easy access to all STDS75 registers to customize operation of the device.

1.2 Temperature sensor output

The STDS75 temperature sensor has a dedicated open drain overlimit signal/alert (OS
/INT/Alert) output which features a thermal alarm function. This function provides a user-programmable trip and turn-off temperature. It can operate in either of two selectable modes:
Comparator mode, and
Interrupt mode.
At power-up the STDS75 comes up in 9-bit mode and immediately begins measuring the temperature and converting the temperature to a digital value. The resolution of the digital output data is user-configurable to 9, 10, 11, or 12 bits which correspond to temperature increments of 0.5 °C, 0.25 °C, 0.125 °C, and 0.0625 °C, respectively.
6/38 Doc ID 13297 Rev 9
STDS75 Description
The measured temperature value is compared with a temperature limit (which is stored in the 16-bit (T the 16-bit (T OS
/INT pin is activated (see Figure 3 on page 8).
) READ/WRITE register), and the hysteresis temperature (which is stored in
OS
) READ/WRITE register). If the measured value exceeds these limits, the
HYS

Figure 1. Logic diagram

V
DD
(1)
SDA
SCL
O.S./INT
1. SDA and OS/INT are open drain.
(1)
Note: See Pin descriptions on page 9 for details.

Table 1. Signal names

Pin Symbol/name Type/direction Description
1SDA
(1)
2 SCL Input Serial clock input
3OS/INT
(1)
4 GND Supply ground Ground
5A2Input Address2 input
6A
7A
8V
1. SDA and OS/INT are open drain.
1
0
DD
Input/ output Serial data input/output
Output Overlimit signal/interrupt alert output
Input Address1 input
Input Address0 input
Supply power Supply voltage (2.7 V to 5.5 V)
STDS75
GND
A
0
A
1
A
2
AI11840
Note: See Pin descriptions on page 9 for details.
Doc ID 13297 Rev 9 7/38
Description STDS75

Figure 2. Connections

(1)
SDA
SCL
O.S./INT
(1)
GND
1. SDA and OS/INT are open drain.
Note: See Pin descriptions on page 9 for details.

Figure 3. Functional block diagram

Temperature
Sensor and Analog-to-Digital Converter (ADC)
Σ-Δ
V
DD
A
0
Configuration Register
Temperature Register
THYS Set Point Register
TOS Set Point Register
1 2 3 4
8
V
DD
7
A
0
6
A
1
5
A
2
Pointer Register
Control and Logic
Comparator
AI11841
O.S.
SDA
A
1
A
2
2-wire I2C Interface
GND
SCL
AI11833a
8/38 Doc ID 13297 Rev 9
STDS75 Description

1.3 Pin descriptions

See Figure 1 on page 7 and Table 1 on page 7 for a brief overview of the signals connected to this device.

1.3.1 SDA (open drain)

This is the serial data input/output pin for the 2-wire serial communication port.

1.3.2 SCL

This is the serial clock input pin for the 2-wire serial communication port.

1.3.3 OS/INT (open drain)

This is the overlimit signal/interrupt alert output pin. It is open drain, so it needs a pull-up resistor.
Note: The open drain thermostat output that indicates if the temperature has exceeded user-
programmable limits (over/under temperature indicator).

1.3.4 GND

Ground; it is the reference for the power supply. It must be connected to system ground.

1.3.5 A2, A1, A0

A2, A1, and A0 are selectable address pins for the 3 LSBs of the I2C interface address. They can be set to V
1.3.6 V
DD
This is the supply voltage pin, and ranges from +2.7 V to +5.5 V.
or GND to provide 8 unique address selections.
DD
Doc ID 13297 Rev 9 9/38
Operation STDS75

2 Operation

After each temperature measurement and analog-to-digital conversion, the STDS75 stores the temperature as a 16-bit two’s complement number in the 2-byte temperature register (see Table 8: Temperature register format). The most significant bit (S, bit 15) indicates if the temperature is positive or negative:
for positive numbers S = 0, and
for negative numbers S = 1.
The most recently converted digital measurement can be read from the temperature register at any time. Since temperature conversions are performed in the background, reading the temperature register does not affect the operation in progress.
Bits 3 through 0 of the temperature register are hardwired to logic '0.' When the STDS75 is configured for 12-bit resolution, the 12 MSBs (bits 15 through 4) of the temperature register will contain temperature data. For 11-bit resolution, the 11 MSBs (bits 15 through 5) of the temperature register will contain data, and bit 4 will read out as logic '0.' For 10-bit resolution, the 10 MSBs (bits 15 through 6) will contain data, and for 9-bit resolution the 9 MSBs (bits 15 through 7) will contain data and all unused LSBs will contain '0's.
Table 3 on page 15 gives examples of 12-bit resolution digital output data and the
corresponding temperatures. The data is compared to the values in the T registers, and then the OS operating mode. The number of T
/INT is updated based on the result of the comparison and the
OS
and T
bits used during the thermostat comparison
HYS
is equal to the conversion resolution set by the FT1 and FT0 bits in the configuration register. For example, if the resolution is 9 bits, only the 9 MSBs of T
OS
used by the thermostat comparator. The alarm fault tolerance is controlled by the FTI and FTO bits in the configuration register. They are used to set up a fault queue. This prevents false tripping of the OS
/INT pin when the STDS75 is used in a noisy environment (see
Table 2 on page 14).
OS
and T
and T
HYS
HYS
will be
The active state of the OS
/INT output can be changed via the polarity (POL) bit in the
configuration register. The power-up default is active-low.
If the user does not wish to use the thermostat capabilities of the STDS75, the OS output should be left floating.
Note: If the thermostat is not used, the T
OS
and T
HYS
system data.
10/38 Doc ID 13297 Rev 9
/INT
registers can be used for general storage of
STDS75 Operation

2.1 Applications information

STDS75 digital temperature sensors are optimal for thermal management and thermal protection applications. They require no external components for operations except for pull­up resistors on SCL, SDA, and OS The sensing device of STDS75 is the chip itself. The typical interface connection for this type of digital sensor is shown in Figure 4 on page 11.
Intended applications include:
System thermal management
Computers/disk drivers
Electronics/test equipment
Power supply modules
Consumer products
Battery management
Fax/printers management
Automotive

Figure 4. Typical 2-wire interface connection diagram

/INT outputs. A 0.1 µF bypass capacitor is recommended.
Pull-up
V
DD
10kΩ
1. SDA and OS/INT are open drain.
STDS75
O.S./INT
A
0
A
1
A
2
(1)
SDA
GND
V
DD
SCL
(1)
0.1μF
V
DD
Pull-up
V
10kΩ 10kΩ
I2C Address = 1001000 (1001A2A1A0)
DD
Master Device
AI11832
Doc ID 13297 Rev 9 11/38
Operation STDS75

2.2 Thermal alarm function

The STDS75 thermal alarm function provides user-programmable thermostat capability and allows the STDS75 to function as a standalone thermostat without using the serial interface. The OS
/INT output is the alarm output. This signal is an open drain output, and at power-up,
this pin is configured with active-low polarity by default.

2.3 Comparator mode

In comparator mode, each time a temperature-to-digital (T-to-D) temperature conversion occurs, the new digital temperature is compared to the value stored in the T registers. If a fault tolerance number of consecutive temperature measurements are greater than the value stored in the T
register, the OS/INT output will be activated.
OS
For example, if the FT1 and FT0 bits are equal to “10” (fault tolerance = 4), four consecutive temperature measurements must exceed T OS
/INT output is active, it will remain active until the first time the measured temperature
drops below the temperature stored in the T
When the thermostat is in comparator mode, the OS with any amount of hysteresis. The OS temperature exceeds the T
value a consecutive number of times as defined by the FT1
OS
/INT output becomes active when the measured
and FT0 fault tolerance (FT) bits in the configuration register. The OS until the first time the temperature falls below the value stored in T into shutdown mode does not clear OS
to activate the OS/INT output. Once the
OS
register.
HYS
/INT can be programmed to operate
/INT then stays active
. Putting the device
HYS
/INT in comparator mode.
OS
and T
HYS
12/38 Doc ID 13297 Rev 9
STDS75 Operation

2.4 Interrupt mode

In Interrupt mode, the OS/INT output first becomes active when the measured temperature exceeds the T configuration register. Once activated, the OS STDS75 into shutdown mode or by reading from any register (temperature, configuration, T
, or T
OS
HYS
reactivated when the measured temperature falls below the T number of times equal to the FT value. Figure 5 illustrates typical OS response for STDS75 configured to have a fault tolerance of 2. The interrupt/clear process is cyclical between T
value a consecutive number of times equal to the FT value in the
OS
/INT can only be cleared by either putting the
) on the device. Once the OS/INT has been deactivated, it will only be
value a consecutive
HYS
output temperature
OS
and T
HYS
.
Figure 5. OS
output temperature response diagram
T
OS
Temperature
T
HYS
Inactive
OS Output - Comparator mode
Active
Inactive
OS Output - Interrupt mode
Active
(1)(1)
(1)
Conversions
1. This assumes that a READ has occurred.
Note: The STDS75 is configured to have a fault tolerance of 2 in this example.
AI12224b
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Operation STDS75

2.5 Fault tolerance

For both comparator and interrupt modes, the alarm “fault tolerance” setting plays a role in determining when the OS of consecutive times an error condition must be detected before the user is notified. Higher fault tolerance settings can help eliminate false alarms caused by noise in the system. The alarm fault tolerance is controlled by the bits (bits 4 and 3) in the configuration register. These bits can be used to set the fault tolerance to 1, 2, 4, or 6 as shown in Tab le 2 . At power-up, these bits both default to logic '0.'

Table 2. Fault tolerance setting

FT1 FT0 STDS75 (consecutive faults) Comments
0 0 1 Power-up default
01 2
10 4
11 6
/INT output will be activated. Fault tolerance refers to the number
Note: OS output will be asserted one t
condition remains.

2.6 Shutdown mode

For power-sensitive applications, the STDS75 offers a low-power shutdown mode. The SD bit in the configuration register controls shutdown mode. When SD is changed to login '1,' the conversion in progress will be completed and the result stored in the temperature register, after which the STDS75 will go into a low-power standby state. The OS will be cleared if the thermostat is operating in interrupt mode and the OS unchanged in comparator mode. The 2-wire interface remains operational in shutdown mode, and writing a '0' to the SD bit returns the STDS75 to normal operation.
after fault tolerance is met, provided that the error
CONV
/INT will remain
/INT output
14/38 Doc ID 13297 Rev 9
STDS75 Operation

2.7 Temperature data format

Ta bl e 3 shows the relationship between the output digital data and the external temperature
for 12-bit resolution.
Temperature data for temperature, T
OS
and T
registers is represented by 9-bit, 10-bit,
HYS
11-bit, and 12-bit depending upon the resolution bits RC1, RC0 (bits 6 and 5) in the configuration register (see Table 7 on page 17). The default resolution is 9-bits.
The left-most hot in the output data stream controls temperature polarity information for each conversion. If the sign bit is '0', the temperature is positive and of the sign bit is '1', the temperature is negative.

Table 3. Relationship between temperature and digital output

Digital
Temperature
+125 °C 0 111 1101 0 0 0 0 0000 7D00
+25.0625 °C 0 001 1001 0 0 0 1 0000 1910
+10.125 °C 0 000 1010 0 0 1 0 0000 0A20
+0.5 °C 0 000 0000 1 0 0 0 0000 0080
0 °C 0 000 0000 0 0 0 0 0000 0000
–0.5 °C 1 111 1111 1 0 0 0 0000 FF80
Number of bits used by
Sign
conversion resolution
10-bit resolution 0 0 0000
9-bit resolution 0 0 0 0000
9 101112
12-bit resolution 0000
11- bit resolution 0 0000
Always
zero
output
(HEX)
–10.25 °C 1 111 0101 1 1 1 0 0000 F5E0
–25.0625 °C 1 110 0110 1 1 1 1 0000 E6F0
–55 °C 1 100 1001 0 0 0 0 0000 C900
Doc ID 13297 Rev 9 15/38
Functional description STDS75

3 Functional description

The STDS75 registers have unique pointer designations which are defined in Tab le 5 o n
page 16. Whenever any READ/WRITE operation to the STDS75 register is desired, the user
must “point” to the device register to be accessed.
All of these user-accessible registers can be accessed via the digital serial interface at anytime (see Serial interface on page 20), and they include:
Command register/address pointer register
Configuration register
Temperature register
Overlimit signal temperature register (T
Hysteresis temperature register (T
HYS

3.1 Registers and register set formats

3.1.1 Command/pointer register

The most significant bits (MSBs) of the command register must always be zero. Writing a '1' into any of these bits will cause the current operation to be terminated (see Ta b le 4 ).
)
OS
)
The command register retains pointer information between operations. Therefore, this register only needs to be updated once for consecutive READ operations from the same register. All bits in the command register default to '0' at power-up.
Table 4. Command/pointer register format
MSB LSB
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
000000P1P0
Table 5. Register pointers selection summary
Pointer
Val ue
(H)
00 0 0 TEMP
01 0 1 CONF
02 1 0 T
P1 P0 Name Description
Temperature
register
Configuration
register
HYS
Hysteresis
register
Width
(Bits)
Typ e
Power-on
(R/W)
Read
16
only
8R/W 00
16 R/W 4800 Default = 75 °C
default
N/A To store measured temperature data
Pointer
Comments
03 1 1 T
16/38 Doc ID 13297 Rev 9
Overtemperature
OS
shutdown
16 R/W 5000
Set point for overtemperature shutdown (T
) limit default = 80 °C
OS
STDS75 Functional description

3.1.2 Configuration register

The configuration register is used to store the device settings such as device operation mode, OS
The configuration register allows the user to program various options such as conversion resolution (see Ta b le 7 ), thermostat fault tolerance, thermostat polarity, thermostat operating mode, and shutdown mode. The user has READ/WRITE access to all of the bits in the configuration register except the MSB (bit7), which is reserved as a “Read only” bit (see
Ta bl e 6 ). The entire register is volatile and thus powers-up in its default state only.
Table 6. Configuration register format
Byte
STDS75 Reserved RC1 RC0 FT1 FT0 POL M SD
Default00000000
Keys: SD = shutdown control bit FT1 = fault tolerance1 bit
1. Indicates operation mode; 0 = comparator mode, and 1 = interrupt mode (see Comparator mode on
page 12 and Interrupt mode on page 13).
2. The OS/INT is active-low ('0').
Table 7. Programmable resolution configurations
/INT operation mode, OS/INT polarity, and OS/INT fault queue.
MSB LSB
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
(2)
(1)
RC0 = resolution conversion0 bit
RC1 = resolution conversion1 bit
M = thermostat mode
POL = output polarity
FT0 = fault tolerance0 bit Bit7 = must be set to '0.' Reserved
RC1 RC0 Resolution Conversion time Remarks
0 0 9-bit 0.5 °C 150 ms Default resolution
0 1 10-bit 0.25 °C 300 ms
1 0 11-bit 0.125 °C 600 ms
1 1 12-bit 0.0625 °C 1200 ms
Doc ID 13297 Rev 9 17/38
Functional description STDS75

3.1.3 Temperature register

The temperature register is a two-byte (16-bit) “Read only” register (see Table 8 on
page 18). Digital temperatures from the ADC are stored in the temperature register in two’s
complement format, and the contents of this register are updated each time the A/D conversion is finished.
The user can read data from the temperature register at any time. When a T-to-D conversion is completed, the new data is loaded into a comparator buffer to evaluate fault conditions and will update the temperature register if a read cycle is not ongoing. If a READ is ongoing, the previous temperature will be read. Accessing the STDS75 continuously without waiting at least one conversion time between communications will prevent the device from updating the temperature register with a new temperature conversion result. Consequently, the STDS75 should not be accessed continuously with a wait time of less than t
Depending on the A/D conversion resolution, the 9-, 10-, 11- or 12-bit MSBs of the register will contain temperature data. All unused bits following the digital temperature will be zero. The MSB (Bit 15) of the Temperature Register denotes whether the temperature data is positive or negative. A '0' in Bit 15 is positive and a '1' is negative.
Table 8. Temperature register format
Bytes MS byte LS byte
CONV
(max).
MSB THSB TLSB LSB
Bits
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
STDS75 SB TMSB TD TD TD TD TD TD
Keys: SB = two’s complement sign bit
TMSB = temperature MSB
TLSB = temperature LSB
TD = temperature data
9-bit LSB
Note: These are comparable formats to the DS75 and LM75.

3.1.4 Overlimit temperature register (TOS)

The TOS register is a two-byte (16-bit) READ/WRITE register that stores the user­programmable upper trip-point temperature for the thermal alarm in two’s complement format (see Table 9 on page 19). This register defaults to 80 °C at power-up (i.e., 0101 0000 0000 0000).
The format of the T the T
register are hardwired to zero, so data written to these register bits will be ignored.
OS
The MSB position contains the sign bit for the digital temperature and bit 14 contains the temperature MSB.
register is identical to that of the temperature register. The 4 LSBs of
OS
10-bit
LSB
11-bit
LSB
12-bit
LSB
000 0
The resolution setting for the A/D conversion determines how many bits of the T are used by the thermal alarm. For example, for 9-bit conversions, the trip-point temperature is defined by the 9 MSBs of the T
18/38 Doc ID 13297 Rev 9
register, and all remaining bits are “Don’t cares.”
OS
register
OS
STDS75 Functional description
3.1.5 Hysteresis temperature register (T
T
register is a two-byte (16-bit) READ/WRITE register that stores the user-
HYS
programmable lower trip-point temperature for the thermal alarm in two’s complement format (see Ta bl e 9 ). This register defaults to 75 °C at power-up (i.e., 0100 1011 0000
0000).
The format of this register is the same as that of the temperature register. The 4 LSBs of the T
register are hardwired to zero, so data written to these bits is ignored. The MSB
HYS
position contains the sign bit for the digital temperature and bit 14 contains the temperature MSB.
The resolution setting for the A/D conversion determines how many bits of the T are used by the thermal alarm. For example, for 9-bit conversions, the hysteresis temperature is defined by the 9 MSBs of the T cares.”
Table 9. T
Bytes MS byte LS byte
Bits
STDS75 SB TMSB TD TD TD TD TD TD
and T
OS
MSB THSB TLSB LSB
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
register format
HYS
)
HYS
register, and all remaining bits are “Don’t
HYS
9-bit
10-bit
11-bit
12-bit
LSB
LSB
LSB
LSB
000 0
HYS
register
Keys: SB = two’s complement sign bit
TMSB = temperature MSB
TLSB = temperature LSB
TD = temperature data
Note: These are comparable formats to the DS75 and LM75.

3.2 Power-up default conditions

The STDS75 always powers up in the following default states:
Thermostat mode = comparator mode
Polarity = active-low
Fault tolerance = 1 fault (i.e., relevant bits set to '0' in the configuration register)
T
T
Register pointer = 00 (temperature register)
Conversion resolution = 9-bit (i.e., RC0 = 0 and RC1 = 0 in the configuration register;
Note: After power-up these conditions can be reprogrammed via the serial interface.
= 80 °C
OS
= 75 °C
HYS
see Table 7 on page 17)
Doc ID 13297 Rev 9 19/38
Functional description STDS75

3.3 Serial interface

Writing to and reading from the STDS75 registers is accomplished via the two-wire serial interface protocol which requires that one device on the bus initiates and controls all READ and WRITE operations. This device is called the “master” device. The master device also generates the SCL signal which provides the clock signal for all other devices on the bus. These other devices on the bus are called “slave” devices. The STDS75 is a slave device (see Ta bl e 1 0). Both the master and slave devices can send and receive data on the bus.
During operations, one data bit is transmitted per clock cycle. All operations follow a repeating, nine-clock-cycle pattern that consists of eight bits (one byte) of transmitted data followed by an acknowledge (ACK) or not acknowledge (NACK) from the receiving device.
Note: There are no unused clock cycles during any operation, so there must not be any breaks in
the data stream and ACKs/NACKs during data transfers. Conversely, having too few clock cycles can lead to incorrect operation if an inadvertent 8-bit READ from a 16-bit register occurs.

Table 10. STDS75 serial bus slave addresses

MSB LSB
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
1 0 0 1 A2 A1 A0 R/W

3.4 2-wire bus characteristics

The bus is intended for communication between different ICs. It consists of two lines: a bi­directional data signal (SDA) and a clock signal (SCL). Both the SDA and SCL lines must be connected to a positive supply voltage via a pull-up resistor.
The following protocol has been defined:
Data transfer may be initiated only when the bus is not busy.
During data transfer, the data line must remain stable whenever the clock line is high.
Changes in the data line, while the clock line is high, will be interpreted as control
signals.
Accordingly, the following bus conditions have been defined (see Figure 6 on page 21):

3.4.1 Bus not busy

Both data and clock lines remain high.

3.4.2 Start data transfer

A change in the state of the data line, from high to low, while the clock is high, defines the START condition.

3.4.3 Stop data transfer

A change in the state of the data line, from low to high, while the clock is high, defines the STOP condition.
20/38 Doc ID 13297 Rev 9
STDS75 Functional description

3.4.4 Data valid

The state of the data line represents valid data when after a start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line may be changed during the low period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a start condition and terminated with a stop condition. The number of data bytes transferred between the start and stop conditions is not limited. The information is transmitted byte-wide and each receiver acknowledges with a ninth bit.
By definition a device that gives out a message is called “transmitter,” the receiving device that gets the message is called “receiver.” The device that controls the message is called “master.” The devices that are controlled by the master are called “slaves.”
Figure 6. Serial bus data transfer sequence
DATA LINE
STABLE
DATA VALID
CLOCK
DATA
STA RT
CONDITION
CHANGE OF
DATA ALLOWED
STOP
CONDITION
AI00587
Doc ID 13297 Rev 9 21/38
Functional description STDS75

3.4.5 Acknowledge

Each byte of eight bits is followed by one acknowledge bit. This acknowledge bit is a low level put on the bus by the receiver whereas the master generates an extra acknowledge related clock pulse (see Figure 7). A slave receiver which is addressed is obliged to generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter.
The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is a stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. A master receiver must signal an end of data to the slave transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this case the transmitter must leave the data line high to enable the master to generate the STOP condition.
Figure 7. Acknowledgement sequence
CLOCK PULSE FOR
ACKNOWLEDGEMENT
SCL FROM MASTER
START
12 89
DATA OUTPUT BY TRANSMITTER
DATA OUTPUT BY RECEIVER
MSB LSB
AI00601
22/38 Doc ID 13297 Rev 9
STDS75 Functional description

3.5 READ mode

In this mode the master reads the STDS75 slave after setting the slave address (see
Figure 8). Following the WRITE mode control bit (R/W
address 'An' is written to the on-chip address pointer.
There are two READ modes:
Preset pointer locations (e.g. temperature, T
Pointer setting (the pointer has to be set for the register that is to be read)
Note: The temperature register pointer is usually the default pointer.
These modes are shown in the READ mode typical timing diagrams (see Figure 9,
Figure 10, and Figure 11 on page 24).

Figure 8. Slave address location

=0) and the acknowledge bit, the word
OS
and T
registers), and
HYS
R/W
START A
SLAVE ADDRESS
MSB
0 1 A2 A1 A010
LSB
AI12226
Doc ID 13297 Rev 9 23/38
Functional description STDS75
Figure 9. Typical 2-byte READ from preset pointer location (e.g. temp - TOS, T
119199
1
0 0 1 A2 A1 A0 R D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Start
by
Master
Address Byte
Most Significant Data Byte Least Significant Data Byte
ACK
by
STDS75
ACK
by
Master
HYS
No ACK
by
Master
)
Stop
Cond.
by
Master
AI12281b

Figure 10. Typical pointer set followed by an immediate READ for 2-byte register (e.g. temp)

1199
0 0 1 A2 A1 A0 W 0 0 0 0 0 0 D1 D0
1
Start
by
Master
Address Byte
ACK
by
STDS75
Pointer Byte
ACK
by
STDS75
119199
1
0 0 1 A2 A1 A0 R D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Repeat
Start
by
Master
Address Byte
Most Significant Data Byte Least Significant Data Byte
ACK
by
STDS75
ACK
by
Master
No ACK
Master

Figure 11. Typical 1-byte READ from the configuration register with preset pointer

1199
1
0 0 1 A2 A1 A0 R D7 D6 D5 D4 D3 D2 D1 D0
Stop
Start
by
Master
Address Byte
ACK
by
STDS75
Data Byte
No ACK
Master
Cond.
by
Master
by
Stop
Cond.
by
Master
by
AI12282b
AI12283b
24/38 Doc ID 13297 Rev 9
STDS75 Functional description

3.6 WRITE mode

In this mode the master transmitter transmits to the STDS75 slave receiver. Bus protocol is shown in Figure 12. Following the START condition and slave address, a logic '0' (R/W is placed on the bus and indicates to the addressed device that word address will follow and is to be written to the on-chip address pointer.
These modes are shown in the WRITE mode typical timing diagrams (see Figure 12, and
Figure 13, and Figure 14 on page 26).
Figure 12. Typical pointer set followed by an Immediate READ from the
configuration register
1199
1
001A2A1A0W 000000D1D0
= 0)
Start
by
Master
Repeat
Start
by
Master
Address Byte
1919
1 0 0 1 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
Address Byte Data Byte
ACK
by
STDS75
R/W
ACK
by
STDS75
Pointer Byte
ACK
by
STDS75
No ACK
by
STDS75
Stop
Cond.
by
Master
AI12279b

Figure 13. Configuration register WRITE

119919
1
001A2A1A0W 000000 000D4D3D2D1D0D1 D0
Start
by
Master
Address Byte
ACK
by
STDS75
Pointer Byte
ACK
by
STDS75
Configuration Byte
STDS75
ACK
by
Stop
Cond.
by
Master
AI12280b
Doc ID 13297 Rev 9 25/38
Functional description STDS75
Figure 14. TOS and T
1199
1
0 0 1 A2 A1 A0 W 0 0 0 0 0 0 D1 D0
Start
by
Master
Address Byte
1919
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Most Significant Data Byte Least Significant Data Byte
HYS
WRITE
ACK
by
STDS75
ACK
by
STDS75
Pointer Byte
ACK
by
STDS75
ACK
by
STDS75
Stop
Cond.
by
Master
AI12284b
26/38 Doc ID 13297 Rev 9
STDS75 Typical operating characteristics

4 Typical operating characteristics

Figure 15. Temperature variation vs. voltage

140
120
100
80
60
40
20
0
Temperature (°C)
–20
–40
–60
23456
Voltage (V)
–20
0.5
85
110
125
AI12258
Doc ID 13297 Rev 9 27/38
Maximum ratings STDS75

5 Maximum ratings

Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 11. Absolute maximum ratings

Symbol Parameter Value Unit
T
STG
(1)
T
SLD
V
IO
V
DD
V
OUT
I
O
P
D
θ
JA
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Storage temperature (VCC off, V
off) –60 to 150 °C
BAT
Lead solder temperature for 10 seconds 260 °C
Input or output voltage VCC +0.5 V
Supply voltage 7.0 V
Output voltage VDD + 0.5 V
Output current 10 mA
Power dissipation 320 mW
Thermal resistance 216.3 °C/W
28/38 Doc ID 13297 Rev 9
STDS75 DC and AC parameters

6 DC and AC parameters

This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics tables that follow, are derived from tests performed under the measurement conditions summarized in
Ta bl e 1 2 . Designers should check that the operating conditions in their circuit match the
operating conditions when relying on the quoted parameters.

Table 12. Operating and AC measurement conditions

Parameter STDS75 Unit
V
DD/VBAT
Ambient operating temperature (T
supply voltage 2.7 to 5.5 V
) –55 to 125 °C
A
Input rise and fall times 5ns
Input pulse voltages 0.2 to 0.8V
Input and output timing reference voltages 0.3 to 0.7V
CC
CC
V
V
Doc ID 13297 Rev 9 29/38
DC and AC parameters STDS75

Table 13. DC and AC characteristics

Sym Description Test condition
V
DD
I
DD
I
DD1
(1)
Min Typ
(2)
Supply voltage TA = –55 to +125 °C 2.7 5.5 V
VDD supply current, active temperature conversions
VDD supply current, communication only
Standby supply current, serial port inactive
Accuracy for corresponding range 2.7 V ≤ V
5.5 V
DD
V
= 3.3 V 125 150 µA
DD
= 25 °C 70 100 µA
T
A
= 25 °C 1.0 µA
T
A
–25 °C < T
–55 °C < T
< 100 °C ±0.5 ±2.0 °C
A
< 125 °C ±0.5 ±3.0 °C
A
Resolution 12-bit temperature data
912bits
9150ms
10 300 ms
t
CONV
Conversion time
11 600 ms
12 1200 ms
T
Overtemperature shutdown Default value 80 °C
OS
T
V
V
1. Valid for ambient operating temperature: TA = –55 to 125 °C; VDD = 2.7 V to 5.5 V (except where noted).
2. Typical number taken at
Hysteresis Default value 75 °C
HYS
OS/INT saturation voltage (VDD
OL1
= 5V)
V
Input logic high
IH
V
Input logic low Digital pins –0.45 0.3 x V
IL
Output logic (SDA) I
OL2
C
Capacitance 5 pF
IN
V
= 3.0 V, TA = 25 °
DD
4 mA sink current 0.5 V
Digital pins
(SCL, SDA, A2-A0)
= 3 mA 0.4 V
OL2
0.7 x V
DD
VDD + 0.5 V
Max Unit
0.0625 °C
DD
V
30/38 Doc ID 13297 Rev 9
STDS75 DC and AC parameters

Figure 16. Bus timing requirements sequence

SDA
tHD:STAtBUF
tR
SCL
tHIGH
SP

Table 14. AC characteristics

tLOW
Sym Parameter
f
SCL
t
BUF
t
HD:DAT
t
HD:STA
t
HIGH
t
LOW
t
SU:DAT
t
SU:STA
SCL clock frequency 0 400 kHz
Time the bus must be free before a new transmission can start 1.3 µs
SDA and SCL fall time 300 ns
t
F
(3)
Data hold time 0 µs
START condition hold time (after this period the first clock pulse is generated)
Clock high period 600 ns
Clock low period 1.3 µs
SDA and SCL rise time 300 ns
t
R
Data setup time 100 ns
START condition setup time (only relevant for a repeated start condition)
tHD:STA
tF
(1)(2)
tSU:DAT
tHD:DAT
SR
Min Max Unit
tSU:STOtSU:STA
P
AI00589
600 ns
600 ns
t
SU:STO
1. Valid for ambient operating temperature: TA = –55 to 125 °C; VDD = 2.7 V to 5.5 V (except where noted).
2. Devices are tested at maximum clock frequency of 400 kHz.
3. Transmitter must internally provide a hold time to bridge the undefined region (300 ns max) of the falling edge of SCL.
STOP condition setup time 600 ns
Doc ID 13297 Rev 9 31/38
Package mechanical data STDS75

7 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
32/38 Doc ID 13297 Rev 9
STDS75 Package mechanical data
Figure 17. MSOP8 (TSSOP8) – 8-lead, thin shrink small outline (3 mm x 3 mm)
package mechanical drawing
D
ccc
Note: Drawing is not to scale.
Table 15. MSOP8 (TSSOP8) – 8-lead, thin shrink small outline (3 mm x 3 mm) package
mechanical data
Sym
Typ Min Max Typ Min Max
A1.100.043
A1 0.00 0.15 0.000 0.006
A2 0.85 0.75 0.95 0.034 0.030 0.037
b 0.22 0.40 0.009 0.016
8
1
5
EE1
4
A2A
A1
eb
L
L1
c
k
L2
E3_ME
mm inches
c 0.08 0.23 0.003 0.009
D 3.00 2.80 3.20 0.118 0.110 0.126
E 4.90 4.65 5.15 0.193 0.183 0.203
E1 3.00 2.80 3.10 0.118 0.110 0.122
e0.65 0.026
L 0.60 0.40 0.80 0.024 0.016 0.032
L1 0.95 0.037
L2 0.25 0.010
k 0°8° 0°8°
ccc 0.10 0.004
Doc ID 13297 Rev 9 33/38
Package mechanical data STDS75

Figure 18. Carrier tape for MSOP8 (TSSOP8) package

P
D
T
A
TOP COVER
TAPE
K
0
0
CENTER LINES OF CAVITY
P
2
B
0
0
P
1
E
F
W
USER DIRECTION OF FEED

Table 16. Carrier tape dimensions for MSOP8 (TSSOP8) package

Package W D E P
MSOP8
(TSSOP8)
12.00 ±0.30
1.50
+0.10/
–0.00
1.75
±0.10
4.00
±0.10
P
0
2.00
±0.10
FA0B
2
5.50
±0.05
5.30
±0.10
0
3.40
±0.10
K
0
1.40
±0.10
P
1
8.00
±0.10
AM03073v1
TUnit
0.30
±0.05
mm 4000
Bulk
Qty
34/38 Doc ID 13297 Rev 9
STDS75 Package mechanical data

Figure 19. Reel schematic

T
40mm min.
Access hole
At slot location
B
D
C
A
Tape slot
Full ra dius
In core for
Tape s tart
2.5mm min.width
N
G measured
At hub
AM04928v1

Table 17. Reel dimensions for 12 mm carrier tape - MSOP8 (TSSOP8) package

A
(max)
330 mm
(13-inch)
B
(min)
1.5 mm
C
13 mm
± 0.2 mm
D
(min)
N
(min)
20.2 mm 60 mm
G
12.4 mm
+ 2/–0 mm
T
(max)
18.4 mm
Note: The dimensions given in Tab le 1 7 incorporate tolerances that cover all variations on critical
parameters.
Doc ID 13297 Rev 9 35/38
Part numbering STDS75

8 Part numbering

Table 18. Ordering information scheme

Example: STDS75 DS 2 F
Device type
STDS75
Package
M = SO8
DS = MSOP8 (TSSOP8)
Temperature range
2 = –55 to 125 °C
(1)
Shipping method
F = ECOPACK
E = ECOPACK
1. Not recommended for new design, contact local ST sales office for availability. Refer to the STTS75M2F replacement part.
2. Not recommended for new design, contact local ST sales office for availability.
®
package, tape & reel
®
package, tube
(2)
For other options, or for more information on any aspect of this device, please contact the ST sales office nearest you.
36/38 Doc ID 13297 Rev 9
STDS75 Revision history

9 Revision history

Table 19. Document revision history

Date Revision Changes
28-Nov-2005 1 Initial release.
08-May-06 2
22-Jan-2007 3
01-Mar-2007 4
06-Jun-2007 5
17-Jul-2008 6
09-Apr-2009 7
15-Jun-2010 8
07-Mar-2012 9
Update characteristics, diagrams (Figure 3, 4, 9, 10, 11,
12, 13, 14, 15; Table 1, 2, 6, 9, 12, 13, 14)
Updates to parameters, package mechanical information (Figure 17, Ta bl e 1 5) and part numbering (Ta b l e 1 8 ).
Updated cover page (package information); Section 2:
Operation; Ta b le 1 3 ; package mechanical data (Figure 17
and Ta b le 1 5 ); and part numbering (Ta b le 1 8).
Updated cover page, document status upgraded to full datasheet.
Minor text changes; updated Section 3.1.3: Temperature
register; cover page and Tab l e 1 8 .
Updated Features, Tab l e 1 1 , 13, 14, text in Section 7:
Package mechanical data; added tape and reel information Figure 18, Ta bl e 1 5; minor reformatting.
Updated Section 2.5, Section 5; added Figure 19,
Ta bl e 1 7 ; minor textual changes; reformatted document.
Removed SO8 package and references from document; indicated that shipping method in tubes is not recommended for new design (Tab le 1 8 ).
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