– Shutdown mode
– Shutdown + NTC
– Ready mode + auxiliary red LED
– Flash mode: up to 800 mA
– Torch mode: up to 200 mA
■ Soft and hard triggering of flash
■ Flash and torch dimming with 16 exponential
values
■ Dimmable red LED indicator auxiliary output
■ Internally or externally timed flash operation
■ Digitally programmable safety time-out in flash
mode
■ LED overtemperature detection and protection
with external NTC resistor
■ Opened and shorted LED failure detection and
protection
■ Chip over temperature detection and protection
■ < 1 µA shutdown current
STCF03
QFN20 (4 x 4)
■ Packages:
–QFN20 (4 x 4)
– TFBGA25 (3 x 3)
Applications
■ Cell phone and smart phone
■ Camera flashes/strobe
■ PDAs and digital still cameras
Description
The STCF03 is a high efficiency power supply
solution to drive a single flash LED in camera
phone, PDAs and other hand-held devices. It is a
buck - boost converter to guarantee a proper LED
current control over all possible conditions of
battery voltage and output voltage; the output
current control ensure a good current regulation
over the forward voltage spread characteristics of
the flash LED. Thanks to the high efficiency of the
converter allows having the input current taken
from the battery remain under 1.5 A.
All the functions of the device are controlled through the I²C which helps bus that allows to
reduce logic pins on the package and to save PCB tracks on the board. Hard and softtriggering of flash are both supported. The device includes many functions to protect the
chip and the power LED such as: a soft start control, chip over temperature detection and
protection as well as opened and shorted LED detection and protection. Besides, a digital
programmable time out function protects the LED in case of a wrong command from the
microprocessor. An optional external NTC resistor is supported to protect the LED against
over heating.
In mobile phone applications it is possible to reduce immediately the flash LED current
during the signal transmission using the TMSK pin. This saves battery life and gives more
priority to supply RF transmission instead of flash function.
It is possible by I²C to separately program the current intensity in flash and torch mode using
exponential steps. An auxiliary output can control an optional red LED to be used as a
recording indicator.
The device is packaged in QFN (4 x 4 mm) 20L with a height less than 1 mm and in
TFBGA25 (3 x 3 mm).
6/35Doc ID 13169 Rev 7
STCF03Diagram
2 Diagram
Figure 1.Block diagram
Doc ID 13169 Rev 77/35
Pin configurationSTCF03
3 Pin configuration
Figure 2.Pin connections (bottom view)
QFN20 (4x4)
Table 2.Pin description
Pin n° for
QFN20
Pin n° for
TFBGA25
SymbolName and function
1E1, D2VLX2Inductor connection
2B3RXR
resistor connection
X
3A4NTCNTC resistor connection
4D1, C2VOUTOutput voltage
5B5FB1Feedback pin [I
6A5FB2R
bypass
TR
7B4FB2SFeedback sensing pin [I
8E2GNDSignal ground
9D4ADDI²C address selection
10D5AUXLAuxiliary LED output
11C5TMSKTX mask input.
12B1, C1PVBATPower supply voltage
13A3VBATSupply voltage
*(RFL+RTR)]
LED
LED*RFL
TFBGA25 (3x3)
]
14A2VLX1AInductor connection
15A1, B2VLX1BInductor connection
16E5SCLI²C clock signal
17E3SDAI²C data
18C3, D3PGNDPower ground
19E4ATNAttention (open drain output, active LOW)
20C4TRIGFlash trigger input
Exposed padPGND
To be connected to the PCB ground plane for optimal electrical and
thermal performance
8/35Doc ID 13169 Rev 7
STCF03Maximum ratings
4 Maximum ratings
Table 3.Absolute maximum ratings
(1)
SymbolParameterValueUnit
VBAT Signal supply voltage-0.3 to 6V
PVBATPower supply voltage-0.3 to 6V
VLX1A, VLX1BInductor connection 1–0.3 to V
VLX2Inductor connection 2–0.3 to V
+0.3V
I
+0.3V
O
VOUTOutput voltage-0.3 to 6V
AUXLAuxiliary LED–0.3 to VI+0.3V
FB1, FB2, FB2SFeedback and sense voltage-0.3 to 3V
SCL, SDA, TRIG,
ATN, ADD TMSK
R
X
Logic pin-0.3 to V
Connection for reference resistor-0.3 to 3V
+0.3V
I
NTCConnection for LED temperature sensing-0.3 to 3V
ESDHuman body model±2kV
(2)
(BGA)
P
TOT
T
OP
T
J
T
STG
1. Absolute maximum ratings are those values beyond which damage to the device may occur. Functional operation under
these condition is not implied.
2. Power dissipation is related parameter to used PCB. The recommended PCB design is included in the application note.
Continuous power dissipation (at TA=70°C)800mW
Operating junction temperature range-40 to 85°C
Junction temperature-40 to 150°C
Storage temperature range-65 to 150°C
Table 4.Thermal data
SymbolParameterQFN20TFBGA25Unit
R
thJA
Thermal resistance junction-ambient59150°C/W
Doc ID 13169 Rev 79/35
ApplicationSTCF03
5 Application
Figure 3.Application schematic
**: Connect to VI, or GND or SDA or SCL to choose one of the 4 different I²C Slave Addresses.
***: Optional components to support auxiliary functions.
Table 5.List of external components
ComponentManufacturerPart numberValueSize
L (I
L (I
C
I
C
O
= 0.5A)TDK VLF3012ST-4R7MR914.7 µH2.6 x 2.8 x 1.2 mm
FLASH
= 0.8A)TDK VLF4012AT-4R7M1R14.7 µH3.7 x 3.5 x 1.2 mm
FLASH
TDKX5R0J106M10 µF0603
TDKX5R0J105M1 µF0603
NTCMurataNCP21WF104J03RA100 kΩ0805
R
FL
R
TR
R
X
0.27 Ω0603
1.8 Ω0402
15 kΩ0402
Note:All of the above listed components refer to typical application. Operation of the STCF03 is
not limited to the choice of these external components.
10/35Doc ID 13169 Rev 7
STCF03Electrical characteristics
6 Electrical characteristics
TJ = 25 °C, VI = 3.6 V, 2 x CI = 10 µF, CO = 1 µF, L = 4.7 µH, RFL = 0.27 Ω, R
R