查询STB25NM50N供应商
STP25NM50N - STF25NM50N
STB25N M50N/-1 - STW25NM50N
N-CH A NNEL 500V 0.11 Ω - 22 A TO-220/FP/D²/I²PAK/TO-247
SECOND GENERATION MDmesh™ MOSFET
Table 1: Gener al Featur es
TYPE V
STB25NM50N-1
STF25NM50N
STP25NM50N
STW25NM50N
STB25NM50N
■ HIGH dv/dt AND AVALANCHE CAPABILITIES
■ 100% AVALANCHE TESTED
■ LOW INPUT CAPACITANCE AND GATE
DSS
(@Tj
550V
550V
550V
550V
550V
MAX
) I
22 A(*)
D
22 A
22 A
22 A
22 A
R
DS(on)
0.140 Ω
0.140 Ω
0.140 Ω
0.140 Ω
0.140 Ω
CHARGE
■ LOW GATE INPUT RESISTANCE
DESCRIPTION
The STx25NM50N is realized with the second
generation of MDmesh Techno logy. This revolu
tionary MOSFET associates a new vertical structure to the Comp any's strip layout to yield one of
the world's lowest on-resistance and gate charge.
It is therefore suitable for the most demanding high
efficiency converters
APPLICATIONS
The MDmesh™ II family is very suitable for increasing power density of high voltage converters
allowing system miniaturization and higher effi
ciencies.
Figure 1: Package
2
TO-220
1
I²PAK
D²PAK
2
TO-247
TO-220FP
Figure 2: Internal Schematic Diagram
2
1
2
Table 2: Order Codes
SALES TYPE MARKING PACKAGE PACKAGING
STP25NM50N P25NM50N TO-220 TUBE
STF25NM50N F25NM50N TO-220FP TUBE
STB25NM50N-1 B25NM50N I²PAK TUBE
STW25NM50N W25NM50N TO-247 TUBE
STB25NM50N B25NM50N D²PAK TAPE & REEL
Rev. 9
1/16 October 2005
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
Table 3: Absolute Maximum ratings
Symbol Parameter Value Unit
TO-220/D²PAK/I² PAK/
TO-247
V
DS
V
DGR
V
GS
I
D
I
D
IDM ( )
P
TOT
Drain-source Voltage (VGS = 0) 500 V
Drain-gate Voltage (RGS = 20 kΩ) 500 V
Gate- source Voltage ±25 V
Drain Current (continuous) at TC = 25°C
Drain Current (continuous) at TC = 100°C
22 22(*) A
14 14 (*) A
Drain Current (pulsed) 88 88 (*) A
Total Dissipation at TC = 25°C
160 40 W
Derating Factor 1.28 0.32 W/°C
dv/dt(1) Peak Diode Recovery voltage slope 15 V/ns
T
stg
T
Storage Temperature –55 to 150 °C
Max. Operating Junction Temperature 150 °C
j
( ) Pulse width l i mited by safe operating area
(1) ISD ≤ 22 A, di/dt ≤ 400 A /µs, V DD =80% V
(*) Limited only by maximum temperature allowed
(BR)DSS
.
Table 4: Thermal Data
TO-220/D²PAK/I² PAK/
TO-247
Rthj-case Thermal Resistance Junction-case Max 0.78 3.1 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
Maximum Lead Temperature For Soldering
l
Purpose
300 °C
TO-220FP
TO-220FP
Table 5: Avalanche Characteristics
Symbol Parameter Max Value Unit
I
AS
Avalanche Current, Repetitive or Not-Repetitive
10 A
(pulse width limited by Tj max)
E
AS
Single Pulse Avalanche Energy
350 mJ
(starting Tj = 25 °C, ID = IAS, VDD = 50 V)
2/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
Table 6: On/Off
Symbol Parameter Test Conditions Value Unit
Min. Typ. Max.
V
(BR)DSS
Drain-source
ID = 1mA, VGS = 0 500 V
Breakdown Voltage
dv/dt(2) Drain Source Voltage
Slope
I
DSS
Zero Gate Voltage
Drain Current (VGS = 0)
I
GSS
Gate-body Leaka ge
Vdd=400V, Id=25A,
44 V/ns
Vgs=10V
VDS = Max Rating
VDS = Max Rating,
TC = 125 °C
1
10
VGS = ± 20V 100 nA
Current (VDS = 0)
V
GS(th)
R
DS(on)
Gate Threshold Voltage
Static Drain-source On
VDS = VGS, ID = 250 µA
2 3 4 V
VGS = 10V, ID = 11 A 0.110 0.140 Ω
Resistance
(2) Cha rac teristic val ue at turn off on in ductive load
Table 7: Dynamic
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(1) Forward Transconductance VDS=15 V, ID =11 A
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
(*) Equivalent Outpu t
VDS = 25V, f = 1 MHz, VGS = 0 2565
VGS = 0V, VDS = 0V to 400V 315 pF
Capacitance
t
d(on)
t
d(off)
Q
Q
Q
R
t
r
t
f
g
gs
gd
g
Turn-on Delay Time
Rise Time
Off-voltageRise Time
VDD =250 V, ID = 11A
RG = 4.7Ω VGS = 10 V
(see Figure 19)
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD = 400V, ID =22 A,
VGS = 10V,
(see Figure 23)
Gate Input Resistance f=1MHz Gate DC Bias=0
Test Signal Level=20mV
Open Drain
19 S
511
77
23
23
75
22
84
11
35
1.6 Ω
µA
µA
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
Table 8: Source Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
t
rr
Q
rr
I
RRM
(1) Pulsed: Pulse durati on = 300 µs, duty cycle 1.5 %.
(*) C
oss eq.
Source-drain Current
( )
Source-drain Current (pulsed)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
is defined as a co nstant equivalent capacit ance giving the same charging time as C
ISD = 22 A, VGS = 0
ISD = 22A, di/dt = 100 A/µs
VDD = 100 V, Tj = 25°C
(see Figure 21)
ISD = 22 A, di/dt = 100 A/µs
VDD = 100 V, Tj = 150°C
(see Figure 21)
460
6.9
30
532
8.25
31
when VDS increases from 0 to 80% V
oss
22
88
1.3 V
A
A
ns
µC
A
ns
µC
A
DS
3/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
Figure 3: Safe Operating Area For TO-220/
I²PAK/D²PAK
Figure 4: Safe Operating Area For TO-220FP
Figure 6: Thermal Impedance TO-220/I²PAK/
D²PAK
Figure 7: Thermal Impedance For TO-220FP
Figure 5: Safe Operating Area For TO-247
4/16
Figure 8: Thermal Impedance For TO-247
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
Figure 9: Output Characteristics
Figure 10: Transconductance
Figure 12: Transfer Characteristics
Figure 13: Static Drain-Source On Resistance
Figure 11: Gate Charge vs Gate-source Voltage
Figure 14: Capacitance Variations
5/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
Figure 15: Normalized Gate Threshold Voltage
vs Tem perat ure
Figure 16: S ource-Drain Forward Char acteristics
Figure 17: Normal ized On R esistance vs Temperature
Figure 18: Normalized BV
vs Temperature
DSS
6/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
Figure 19: Unclamped Inductive Load Test Circuit
Figure 20: Switching Times Test Circuit For
Resistive Load
Figure 22: Unclamped Inductive Wafeform
Figure 23: Gate Charge Test Circuit
Figure 21: Test Circuit For Inductive Load
Switching and Diode Recovery Times
7/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, i n compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at:
www.st.com
8/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
T APE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
9/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
10/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
F1
F
G1
H
F2
123
L4
L2
L5
G
11/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
TO-247 MECHANICAL DATA
DIM.
A 4.85 5.15 0.19 0.20
A1 2.20 2.60 0.086 0.102
b 1.0 1.40 0.039 0.055
b1 2.0 2.40 0.079 0.094
b2 3.0 3.40 0.118 0.134
c 0.40 0.80 0.015 0.03
D 19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e5 . 4 5 0 . 2 1 4
L 14.20 14.80 0.560 0.582
L1 3.70 4.30 0.14 0.17
L2 18.50 0.728
øP 3.55 3.65 0.140 0.143
øR 4.50 5.50 0.177 0.216
S5 . 5 0 0 . 2 1 6
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
12/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
TO-262 (I2PAK) MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c 0.49 0.70 0.019 0.027
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
E 10 10.40 0.393 0.410
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L2 1.27 1.40 0.050 0.055
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
13/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
D2PAK MECHANICAL DATA
TO -24 7 M E CHA NICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
M 2.4 3.2 0.094 0.126
R0 . 4 0 . 0 1 5
V2 0º 4º
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
14/16
3
1
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
Table 9: Revision History
Date Revision Description of Change s
30-Nov-2004 1 First Release.
08-Mar-2005 2 Inserted Curves
22-Mar-2005 3 Modified title
13-Apr-2005 4 Modified some values
28-Apr-2005 5 Modified some values in Table 8
16-May-2005 6 Modified values in tab7
17-Jun-2005 7 Inserted new row in table 6
07-Sep-2005 8 Inserted ecopack indication
05-Oct-2005 9 Modified curves 9-12
15/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
16/16
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