ST STB25NM50N-1, STF25NM50N, STP25NM50N, STW25NM50N, STB25NM50N User Manual

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查询STB25NM50N供应商
STP25NM50N - STF25NM50N
STB25N M50N/-1 - STW25NM50N
N-CH A NNEL 500V 0.11 - 22 A TO-220/FP/D²/I²PAK/TO-247
SECOND GENERATION MDmesh™ MOSFET
Table 1: Gener al Featur es
TYPE V
STB25NM50N-1 STF25NM50N STP25NM50N STW25NM50N STB25NM50N
HIGH dv/dt AND AVALANCHE CAPABILITIES
100% AVALANCHE TESTED
DSS
(@Tj
550V 550V 550V 550V 550V
MAX
) I
22 A(*)
D
22 A 22 A
22 A 22 A
R
DS(on)
0.140
0.140
0.140
0.140
0.140
CHARGE
LOW GATE INPUT RESISTANCE
DESCRIPTION
The STx25NM50N is realized with the second generation of MDmesh Techno logy. This revolu
­tionary MOSFET associates a new vertical struc­ture to the Comp any's strip layout to yield one of the world's lowest on-resistance and gate charge. It is therefore suitable for the most demanding high efficiency converters
APPLICATIONS
The MDmesh™ II family is very suitable for in­creasing power density of high voltage converters allowing system miniaturization and higher effi
­ciencies.
Figure 1: Package
2
TO-220
1
I²PAK
D²PAK
2
TO-247
TO-220FP
Figure 2: Internal Schematic Diagram
2
1
2
Table 2: Order Codes
SALES TYPE MARKING PACKAGE PACKAGING
STP25NM50N P25NM50N TO-220 TUBE STF25NM50N F25NM50N TO-220FP TUBE
STB25NM50N-1 B25NM50N I²PAK TUBE
STW25NM50N W25NM50N TO-247 TUBE
STB25NM50N B25NM50N D²PAK TAPE & REEL
Rev. 9
1/16October 2005
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
Table 3: Absolute Maximum ratings
Symbol Parameter Value Unit
TO-220/D²PAK/I²PAK/
TO-247
V
DS
V
DGR
V
GS
I
D
I
D
IDM ()
P
TOT
Drain-source Voltage (VGS = 0) 500 V Drain-gate Voltage (RGS = 20 kΩ) 500 V Gate- source Voltage ±25 V Drain Current (continuous) at TC = 25°C Drain Current (continuous) at TC = 100°C
22 22(*) A
14 14 (*) A Drain Current (pulsed) 88 88 (*) A Total Dissipation at TC = 25°C
160 40 W
Derating Factor 1.28 0.32 W/°C
dv/dt(1) Peak Diode Recovery voltage slope 15 V/ns
T
stg
T
Storage Temperature –55 to 150 °C Max. Operating Junction Temperature 150 °C
j
() Pulse width l i mited by safe operating area
(1) ISD 22 A, di/dt ≤ 400 A /µs, VDD =80% V (*) Limited only by maximum temperature allowed
(BR)DSS
.
Table 4: Thermal Data
TO-220/D²PAK/I²PAK/
TO-247
Rthj-case Thermal Resistance Junction-case Max 0.78 3.1 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
Maximum Lead Temperature For Soldering
l
Purpose
300 °C
TO-220FP
TO-220FP
Table 5: Avalanche Characteristics
Symbol Parameter Max Value Unit
I
AS
Avalanche Current, Repetitive or Not-Repetitive
10 A
(pulse width limited by Tj max)
E
AS
Single Pulse Avalanche Energy
350 mJ
(starting Tj = 25 °C, ID = IAS, VDD = 50 V)
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STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
Table 6: On/Off
Symbol Parameter Test Conditions Value Unit
Min. Typ. Max.
V
(BR)DSS
Drain-source
ID = 1mA, VGS = 0 500 V
Breakdown Voltage
dv/dt(2) Drain Source Voltage
Slope
I
DSS
Zero Gate Voltage Drain Current (VGS = 0)
I
GSS
Gate-body Leaka ge
Vdd=400V, Id=25A,
44 V/ns
Vgs=10V VDS = Max Rating
VDS = Max Rating, TC = 125 °C
1
10
VGS = ± 20V 100 nA
Current (VDS = 0)
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
VDS = VGS, ID = 250 µA
2 3 4 V
VGS = 10V, ID = 11 A 0.110 0.140
Resistance
(2) Cha rac teristic val ue at turn off on in ductive load
Table 7: Dynamic
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(1) Forward Transconductance VDS=15 V, ID =11 A
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
(*) Equivalent Outpu t
VDS = 25V, f = 1 MHz, VGS = 0 2565
VGS = 0V, VDS = 0V to 400V 315 pF
Capacitance
t
d(on)
t
d(off)
Q Q Q
R
t
r
t
f
g
gs
gd
g
Turn-on Delay Time Rise Time Off-voltageRise Time
VDD =250 V, ID = 11A RG = 4.7 VGS = 10 V (see Figure 19)
Fall Time Total Gate Charge
Gate-Source Charge Gate-Drain Charge
VDD = 400V, ID =22 A, VGS = 10V, (see Figure 23)
Gate Input Resistance f=1MHz Gate DC Bias=0
Test Signal Level=20mV Open Drain
19 S
511
77
23 23 75 22
84 11 35
1.6
µA µA
pF pF pF
ns ns ns ns
nC nC nC
Table 8: Source Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
t
rr
Q
rr
I
RRM
(1) Pulsed: Pulse durati on = 300 µs, duty cycle 1.5 %. (*) C
oss eq.
Source-drain Current
()
Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
is defined as a co nstant equivalent capacit ance giving the same charging time as C
ISD = 22 A, VGS = 0 ISD = 22A, di/dt = 100 A/µs
VDD = 100 V, Tj = 25°C (see Figure 21)
ISD = 22 A, di/dt = 100 A/µs VDD = 100 V, Tj = 150°C (see Figure 21)
460
6.9 30
532
8.25 31
when VDS increases from 0 to 80% V
oss
22 88
1.3 V
A A
ns
µC
A
ns
µC
A
DS
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STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
Figure 3: Safe Operating Area For TO-220/ I²PAK/D²PAK
Figure 4: Safe Operating Area For TO-220FP
Figure 6: Thermal Impedance TO-220/I²PAK/ D²PAK
Figure 7: Thermal Impedance For TO-220FP
Figure 5: Safe Operating Area For TO-247
4/16
Figure 8: Thermal Impedance For TO-247
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
Figure 9: Output Characteristics
Figure 10: Transconductance
Figure 12: Transfer Characteristics
Figure 13: Static Drain-Source On Resistance
Figure 11: Gate Charge vs Gate-source Voltage
Figure 14: Capacitance Variations
5/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
Figure 15: Normalized Gate Threshold Voltage vs Tem perat ure
Figure 16: S ource-Drain Forward Char acteris­tics
Figure 17: Normal ized On R esistance vs Tem­perature
Figure 18: Normalized BV
vs Temperature
DSS
6/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
Figure 19: Unclamped Inductive Load Test Cir­cuit
Figure 20: Switching Times Test Circuit For Resistive Load
Figure 22: Unclamped Inductive Wafeform
Figure 23: Gate Charge Test Circuit
Figure 21: Test Circuit For Inductive Load Switching and Diode Recovery Times
7/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, i n compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com
8/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
T APE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
9/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154
L20 16.40 0.645 L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
10/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
F1
F
G1
H
F2
123
L4
L2
L5
G
11/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
TO-247 MECHANICAL DATA
DIM.
A 4.85 5.15 0.19 0.20
A1 2.20 2.60 0.086 0.102
b 1.0 1.40 0.039 0.055 b1 2.0 2.40 0.079 0.094 b2 3.0 3.40 0.118 0.134
c 0.40 0.80 0.015 0.03
D 19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e5.45 0.214
L 14.20 14.80 0.560 0.582 L1 3.70 4.30 0.14 0.17 L2 18.50 0.728
øP 3.55 3.65 0.140 0.143 øR 4.50 5.50 0.177 0.216
S5.50 0.216
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
12/16
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
TO-262 (I2PAK) MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c 0.49 0.70 0.019 0.027
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
E 10 10.40 0.393 0.410
L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
13/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
D2PAK MECHANICAL DATA
TO-247 MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368 D1 8 0.315
E 10 10.4 0.393 E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068
M 2.4 3.2 0.094 0.126 R0.4 0.015
V2
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
14/16
3
1
STB25NM50N/-1 - STW25NM50N - STP25NM50N - STF25NM50N
Table 9: Revision History
Date Revision Description of Change s
30-Nov-2004 1 First Release.
08-Mar-2005 2 Inserted Curves 22-Mar-2005 3 Modified title 13-Apr-2005 4 Modified some values 28-Apr-2005 5 Modified some values in Table 8
16-May-2005 6 Modified values in tab7
17-Jun-2005 7 Inserted new row in table 6
07-Sep-2005 8 Inserted ecopack indication
05-Oct-2005 9 Modified curves 9-12
15/16
STP25NM50N - STF25NM50N - STB25NM 50N/-1 - STW25NM50N
16/16
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