The STA559BW is an integrated solution of digital audio processing, digital amplifier
controls and power output stage to create a high-power single-chip FFX digital amplifier with
high-quality and high-efficiency. Three channels of FFX processing are provided. The FFX
processor implements the ternary, binary and binary differential processing capabilities of
the full FFX processor.
The STA559BW is part of the Sound Terminal
streaming to the speakers and offers cost effectiveness, low power dissipation and sound
enrichment.
The power section consists of four independent half-bridges. These can be configured via
digital control to operate in different modes.
For example, 2.1 channels can be provided by two half bridges and a single full bridge,
supplying up to 2 x 1.4 W + 1 x 6 W of output power or two channels can be provided by two
full-bridges, supplying up to 2 x 3 W of output power.
The IC can also be configured as 2.1 channels with 2 x 20 W supplied by the device plus a
drive for an external FFX power amplifier, such as STA533WF or STA515W.
Also provided in the STA559BW are a full assortment of digital processing features. This
includes up to four programmable biquads (EQ) per channel. Available presets enable a
time-to-market advantage by substantially reducing the amount of software development
needed for functions such as audio preset volume loudness, preset volume curves and
preset EQ settings. There are also new advanced AM radio interference reduction modes.
®
family that provides full digital audio
Figure 1.Block diagram
I2C
I2S
interface
Power
Volume
control
PLL
FFX
control
Protection
current/thermal
Logic
Regulators
Bias
Channel
1A
Channel
1B
Channel
2A
Channel
2B
PowerDigital DSP
8/67Doc ID 18190 Rev 1
STA559BWPin connections
2 Pin connections
2.1 Connection diagram
Figure 2.Pin connection PowerSSO-36 (top view)
GND_SUB
SA
TEST_MODE
VSS
VCC_REG
OUT2B
GND2
VCC2
OUT2A
OUT1B
VCC1
GND1
OUT1A
GND_REG
VDD
CONFIG
OUT3B / FFX3B
OUT3A / FFX3A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
EP, exposed pad
(device ground)
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
D05AU1638
VDD_DIG
GND_DIG
SCL
SDA
INT_LINE
RESET
SDI
LRCKI
BICKI
XTI
GND_PLL
FILTER_PLL
VDD_PLL
PWRDN
GND_DIG
VDD_DIG
TWARN / OUT4A
EAPD / OUT4B
2.2 Pin description
Table 2.Pin description
PinTypeNameDescription
1GNDGND_SUBSubstrate ground
2I SAI
3ITEST_MODEThis pin must be connected to ground (pull-down)
4I/OVSSInternal reference at V
5I/OVCC_REGInternal V
6OOUT2BOutput half-bridge channel 2B
7GNDGND2Power negative supply
8PowerVCC2Power positive supply
9OOUT2AOutput half-bridge channel 2A
10OOUT1BOutput half-bridge channel 1B
2
C select address (pull-down)
- 3.3 V
CC
reference
CC
Doc ID 18190 Rev 19/67
Pin connectionsSTA559BW
Table 2.Pin description (continued)
PinTypeNameDescription
11PowerVCC1Power positive supply
12GNDGND1Power negative supply
13OOUT1AOutput half-bridge channel 1A
14GNDGND_REGInternal ground reference
15PowerVDDInternal 3.3 V reference voltage
16ICONFIGParallel mode command
17OOUT3B / FFX3BPWM out channel 3B / external bridge driver
18OOUT3A / FFX3APWM out channel 3A / external bridge driver
19OEAPD / OUT4BPower down for external bridge / PWM out channel 4B
20I/OTWARN / OUT4A
21PowerVDD_DIGDigital supply voltage
22GNDGND_DIGDigital ground
23IPWRDNPower down (pull-up)
24PowerVDD_PLLPositive supply for PLL
Thermal warning from external bridge (pull-up when input)
/ PWM out channel 4A
25IFILTER_PLLConnection to PLL filter
26GNDGND_PLLNegative supply for PLL
27IXTIPLL input clock
2
28IBICKII
29ILRCKII
30ISDII
S serial clock
2
S left/right clock
2
S serial data channels 1 and 2
31IRESETReset (pull-up)
32OINT_LINEFault interrupt
2
33I/OSDAI
34ISCLI
C serial data
2
C serial clock
35GNDGND_DIGDigital ground
36PowerVDD_DIGDigital supply voltage
--EP Exposed pad for PCB heatsink, to be connected to GND
10/67Doc ID 18190 Rev 1
STA559BWElectrical specifications
3 Electrical specifications
3.1 Absolute maximum ratings
Table 3.Absolute maximum ratings
Symbol Parameter MinTypMaxUnit
V
CC
V
DD
V
DD
T
Operating junction temperature -20-150 °C
op
Storage temperature -40 -150 °C
T
stg
Power supply voltage (pins VCCx) -0.3-24 V
Digital supply voltage (pins VDD_DIG)-0.3 -4.0V
PLL supply voltage (pin VDD_PLL)-0.3-4.0V
Warning:Stresses beyond those listed in Table 3 above may cause
permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any
other conditions beyond those indicated under
“Recommended operating conditions” are not implied.
Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability. In the real
application, power supplies with nominal values rated within
the recommended operating conditions, may experience
some rising beyond the maximum operating conditions for a
short time when no or very low current is sinked (amplifier in
mute state). In this case the reliability of the device is
guaranteed, provided that the absolute maximum ratings are
not exceeded.
3.2 Thermal data
Table 4.Thermal data
R
th j-case
T
th-sdj
T
th-w
T
th-sdh
R
th j-amb
1. See Chapter 8: Package thermal characteristics on page 63 for details.
3.4 Electrical specifications for the digital section
The specifications given in this section are valid for T
Table 6.Electrical specifications - digital section
Symbol Parameter ConditionsMinTypMaxUnit
I
il
I
ih
V
il
V
ih
V
ol
V
oh
Low level input current without
pull-up/down device
High level input current without
pull-up/down device
Vi = 0 V --1 µA
Vi = VDD_DIG
= 3.6 V
Low level input voltage---
High level input voltage-
Low level output voltageIol = 2 mA-
High level output voltageIoh = 2 mA
= 25 °C unless otherwise specified.
amb
--1µA
0.8 *
VDD_DIG
0.8 *
VDD_DIG
--V
--V
0.2 *
VDD_DIG
0.4 *
VDD_DIG
V
V
R
pu
Equivalent pull-up/down
resistance
--50-kΩ
12/67Doc ID 18190 Rev 1
STA559BWElectrical specifications
3.5 Electrical specifications for the power section
The specifications given in this section are valid for the operating conditions: VCC=5V,
f=1kHz, f
Table 7.Electrical specifications - power section
SymbolParameter ConditionsMin Typ Max Unit
= 384 kHz, T
sw
= 25 °C and RL = 4 Ω, unless otherwise specified.
amb
Output power BTL
Po
Output power SE
R
dsON
Power P-channel or N-channel MOSFETld = 0.75 A --250 mΩ
gPPower P-channel RdsON matchingl
gNPower N-channel RdsON matchingl
THD = 1%R
THD = 10%R
THD = 1%,R
THD = 10%,R
= 0.75 A-100-%
d
= 0.75 A-100-%
d
= 2 Ω-4.2-
L
= 2 Ω-5.3-
L
= 2 Ω-1-
L
= 2 Ω -1.3-
L
W
W
IdssPower P-channel/N-channel leakageVcc=9V--1µA
t
r
t
f
Rise time
Fall time --10 ns
Resistive load,
see Figure 3 below
--10 ns
Supply current from VCC in power down PWRDN = 0 -0.3-µA
I
VCC
I
VDD
I
LIM
I
SCP
V
t
min
UVP
Supply current from V
Supply current FFX processing
Overcurrent limit
in operation PWRDN = 1-15-mA
CC
Internal clock =
49.152 MHz
(1)
-55-mA
2.23.0-A
Short -circuit protectionRL = 0 Ω2.7 3.6 -A
Undervoltage protection ---4.3 V
Output minimum pulse width No load 20 40 60 ns
DRDynamic range--100-dB
Signal to noise ratio, ternary modeA-Weighted-100-dB
SNR
Signal to noise ratio binary mode--90-dB
FFX stereo mode,
THD+NTotal harmonic distortion + noise
Po = 1 W
-0.2-%
f=1kHz
FFX stereo mode,
<5 kHz
X
TA LK
Crosstalk
One channel driven
-80-dB
at 1 W, other channel
measured
Peak efficiency, FFX mode
η
Peak efficiency, binary modes
Po = 2 x 2 0 W
into 8 Ω
Po = 2 x 9 W into 4 Ω
+ 1 x 20 W into 8 Ω
-90-
%
-87-
1. Limit the current if overcurrent warning detect adjustment bypass is enabled (register bit CONFC.OCRB on
page 28). When disabled refer to I
SCP
.
Doc ID 18190 Rev 113/67
Electrical specificationsSTA559BW
Figure 3.Test circuit
Low current dead time = MAX(DTr, DTf)
Duty cycle = 50%
INxY
gnd
+Vcc
OUTxY
OUTxY
DTrDTf
Rload = 8
Ω
vdc = Vcc/2
+
-
Vcc
(3/4)Vcc
(1/2)Vcc
(1/4)Vcc
t
14/67Doc ID 18190 Rev 1
STA559BWElectrical specifications
3.6 Power on/off sequence
Figure 4.Power-on sequence
VCC
VCC
VCC
VCC
VCC
VDD_Dig
VDD_Dig
VDD_Dig
VDD_Dig
VDD_Dig
XTI
XTI
XTI
XTI
XTI
Reset
Reset
Reset
Reset
Reset
2
2
2
2
2
C
C
C
C
C
I
I
I
I
I
PWDN
PWDN
PWDN
PWDN
PWDN
Note: no specific VCC and
VDD_DIG turn
is required
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
−
on sequence
TR
TR
TR
TR
TR
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
TC
TC
TC
TC
TC
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0 CMD1 CMD2
TR = minimum time between XTI master clock stable and Reset removal: 1 ms
TC = minimum time between Reset removal and I
Note:The definition of a stable clock is when f
Section : Serial data interface on page 25 gives information on setting up the I
Figure 5.Power-off sequence for pop-free turn-off
VCC
VCC
VDD_Dig
VDD_Dig
XTI
XTI
Soft Mute
Soft Mute
Reg. 0x07
Reg. 0x07
Data 0xFE
Data 0xFE
Soft EAPD
Soft EAPD
Reg. 0x05
Reg. 0x05
Bit 7 = 0
Bit 7 = 0
Don’t care
Don’t care
2
C program, sequence start: 1ms
- f
max
< 1 MHz.
min
FE
FE
2
S interface.
Note: no specific VCC and
VDD_DIG turn
is required
Don’t care
Don’t care
Don’t care
Don’t care
−
off sequence
Don’t care
Don’t care
Don’t care
Don’t care
Doc ID 18190 Rev 115/67
Processing data pathsSTA559BW
4 Processing data paths
Figure 6 below shows the data processing paths inside STA559BW. The whole processing
chain can be considered as two consecutive sections. In the first one, dual-channel
processing is implemented and in the second section each channel is fed into the post
mixing block, either to generate a third channel (typically used in 2.1 output configuration
and with crossover filters enabled) or to have the channels processed by the dual-band DRC
block (2.0 output configuration with crossover filters used to define the cut-off frequency of
the two bands).
The first section contains a 2x oversampling FIR filter providing 2 * f
a selectable high-pass filter to remove the DC level (enabled if HPB = 0).
If the coefficient sets for the two channels are linked (BQL = 1) it is possible to use the
de-emphasis, bass and treble filters in a user defined configuration (provided the relevant
BQx bits are set). In this case both channels use the same processing coefficients and can
have up to seven filters each. If BQL = 0 the BQx bits are ignored and the fifth, sixth and
seventh filters are configured as de-emphasis, bass and treble controls, respectively.
audio processing and
S
16/67Doc ID 18190 Rev 1
STA559BWProcessing data paths
Figure 6.Left and right processing
Sampling
Sampling
frequency=Fs
frequency=Fs
From
From
I2S input
I2S input
interface
interface
L
L
R
R
x2
x2
FIR
FIR
over
over
sampling
sampling
x2
x2
FIR
FIR
over
over
sampling
sampling
Sampling
Sampling
frequency= 2xFs
frequency= 2xFs
Hi-Pass
Hi-Pass
PreScale
PreScale
If DEMP=0
If DEMP=0
PreScale
PreScale
If DEMP=0
If DEMP=0
Filter
Filter
If HPB=0 User-Defined Filters
If HPB=0 User-Defined Filters
Hi-Pass
Hi-Pass
Filter
Filter
If HPB=0 User-Defined Filters
If HPB=0 User-Defined Filters
C1Mx1
C1Mx1
+
+
C1Mx2
C1Mx2
C2Mx1
C2Mx1
+
+
C2Mx2
C2Mx2
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
If DSPB=0 and C1EQBP=0
If DSPB=0 and C1EQBP=0
Biquad#1Biquad#2Biquad#3Biquad
Biquad#1Biquad#2Biquad#3Biquad
If DSPB=0 and C2EQBP=0
If DSPB=0 and C2EQBP=0
Hi-Pass XO
Hi-Pass XO
Filter
Filter
Hi-Pass XO
Hi-Pass XO
Filter
Filter
De-
De-
BassTreble
De-
De-
BassTreble
If C1TCB=0
If C1TCB=0
BTC: Bass Boost/Cut
BTC: Bass Boost/Cut
TTC: Treble Boost/Cut
TTC: Treble Boost/Cut
BassTreble
BassTreble
If C2TCB=0
If C2TCB=0
BTC: Bass Boost/Cut
BTC: Bass Boost/Cut
TTC: Treble Boost/Cut
TTC: Treble Boost/Cut
Post scale
Post scale
Post scale
Post scale
R
R
L
L
Emphasis
Vol
Vol
And
And
Limiter
Limiter
Vol
Vol
And
And
Limiter
Limiter
Emphasis
Emphasis
Emphasis
#4
#4
#4
#4
C3Mx1
C3Mx1
+
+
C3Mx2
C3Mx2
User-Defined Mix Coefficients
User-Defined Mix Coefficients
Doc ID 18190 Rev 117/67
Lo-PassXO
Lo-Pass XO
Filter
Filter
Crossover Frequency deter mined by XO Setting
Crossover Frequency deter mined by XO Setting
User Defined If XO=0000
User Defined If XO=0000
Vol
Vol
And
And
Limiter
Limiter
Post scale
Post scale
I2C bus specificationSTA559BW
5 I2C bus specification
The STA559BW supports the I2C protocol via the input ports SCL and SDA_IN (master to
slave) and the output port SDA_OUT (slave to master). This protocol defines any device that
sends data on to the bus as a transmitter and any device that reads the data as a receiver.
The device that controls the data transfer is known as the master and the other as the slave.
The master always starts the transfer and provides the serial clock for synchronization. The
STA559BW is always a slave device in all of its communications. It supports up to 400 kb/s
(fast-mode bit rate).
For correct operation of the I
has a frequency at least 10 times higher than the frequency of the applied SCL clock.
5.1 Communication protocol
5.1.1 Data transition or change
Data changes on the SDA line must only occur when the clock SCL is low. A SDA transition
while the clock is high is used to identify a START or STOP condition.
2
C interface ensure that the master clock generated by the PLL
5.1.2 Start condition
START is identified by a high to low transition of the data bus, SDA, while the clock, SCL, is
stable in the high state. A START condition must precede any command for data transfer.
5.1.3 Stop condition
STOP is identified by low to high transition of SDA while SCL is stable in the high state. A
STOP condition terminates communication between STA559BW and the bus master.
5.1.4 Data input
During the data input the STA559BW samples the SDA signal on the rising edge of SCL. For
correct device operation the SDA signal must be stable during the rising edge of the clock
and the data can change only when the SCL line is low.
5.2 Device addressing
To start communication between the master and the STA559BW, the master must initiate
with a start condition. Following this, the master sends onto the SDA line 8-bits (MSB first)
corresponding to the device select address and read or write mode bit.
The seven most significant bits are the device address identifiers, corresponding to the I
bus definition. In the STA559BW the I
the SA pin configuration, 0x38 when SA = 0, and 0x3A when SA = 1.
2
C interface has two device addresses depending on
2
C
The eighth bit (LSB) identifies a read or write operation (R/W); this is set to 1 for read and to
0 for write. After a START condition the STA559BW identifies the device address on the SDA
bus and if a match is found, acknowledges the identification during the 9th bit time frame.
The byte following the device identification is the address of a device register.
18/67Doc ID 18190 Rev 1
STA559BWI2C bus specification
5.3 Write operation
Following the START condition the master sends a device select code with the RW bit set
to 0. The STA559BW acknowledges this and then waits for the byte of internal address.
After receiving the internal byte address the STA559BW again responds with an
acknowledgement.
5.3.1 Byte write
In the byte write mode the master sends one data byte, this is acknowledged by the
STA559BW. The master then terminates the transfer by generating a STOP condition.
5.3.2 Multi-byte write
The multi-byte write modes can start from any internal address. The master generating a
STOP condition terminates the transfer.
Figure 7.Write mode sequence
BYTE
WRITE
MULTIBYTE
WRITE
DEV-ADDR
STARTRW
DEV-ADDR
STARTRW
ACK
ACK
SUB-ADDR
SUB-ADDR
5.4 Read operation
5.4.1 Current address byte read
Following the START condition the master sends a device select code with the RW bit set
to 1. The STA559BW acknowledges this and then responds by sending one byte of data.
The master then terminates the transfer by generating a STOP condition.
5.4.2 Current address multi-byte read
The multi-byte read modes can start from any internal address. Sequential data bytes are
read from sequential addresses within the STA559BW. The master acknowledges each
data byte read and then generates a STOP condition terminating the transfer.
ACK
ACK
DATA IN
DATA IN
ACK
ACK
STOP
DATA IN
ACK
STOP
5.4.3 Random address byte read
Following the START condition the master sends a device select code with the RW bit set
to 0. The STA559BW acknowledges this and then the master writes the internal address
byte. After receiving, the internal byte address the STA559BW again responds with an
acknowledgement. The master then initiates another START condition and sends the device
select code with the RW bit set to 1. The STA559BW acknowledges this and then responds
by sending one byte of data. The master then terminates the transfer by generating a STOP
condition.
Doc ID 18190 Rev 119/67
I2C bus specificationSTA559BW
5.4.4 Random address multi-byte read
The multi-byte read modes could start from any internal address. Sequential data bytes are
read from sequential addresses within the STA559BW. The master acknowledges each
data byte read and then generates a STOP condition terminating the transfer.
Figure 8.Read mode sequence
CURRENT
ADDRESS
READ
RANDOM
ADDRESS
READ
SEQUENTIAL
CURRENT
READ
SEQUENTIAL
RANDOM
READ
DEV-ADDR
STARTRW
DEV-ADDR
STARTRW
START
STARTRW
DEV-ADDR
DEV-ADDR
RW=
HIGH
ACK
ACK
ACK
ACK
DATA
SUB-ADDR
DATA
SUB-ADDR
NO ACK
STOP
ACK
DEV-ADDR
STARTRW
ACK
DATA
ACK
DEV-ADDR
STARTRW
ACK
ACK
ACK
DATA
DATA
DATA
NO ACK
NO ACK
ACK
STOP
STOP
ACKNO ACK
DATA
DATA
STOP
20/67Doc ID 18190 Rev 1
STA559BWRegister description
6 Register description
Note:Addresses exceeding the maximum address number must not be written.