with exposed pad up
STA516B is a monolithic quad half-bridge stage in
Multipower BCD Technology. The device can be
used as dual bridge or reconfigured, by
connecting pin CONFIG to pins VDD, as a single
bridge with double-current capability or as a half
bridge (binary mode) with half-current capability.
The device is intended for the output stage of a
stereo all-digital high-efficiency amplifier. It is
capable of delivering 200 W + 200 W into 6-Ω
loads with THD = 10% at V
= 51 V or, in single
CC
The input pins have a threshold proportional to
the voltage on pin VL.
The STA516B is aimed at audio amplifiers in Hi-Fi
applications, such as home theatre systems,
active speakers and docking stations.
It comes in a 36-pin PowerSO package with
exposed pad up (EPU).
BTL configuration, 400 W into a 3-Ω load with
THD = 10% at V
Table 1.Device summary
Order codeTemperature rangePackagePackaging
STA516B0 to 90 °CPowerSO36 EPUTube
STA516B13TR0 to 90 °CPowerSO36 EPUTape and reel
= 52 V.
CC
November 2010Doc ID 13183 Rev 41/17
www.st.com
17
IntroductionSTA516B
1 Introduction
The STA516B is a high performance quad half-bridge amplifier with the capability to drive up
to 220 W
(a)
stereo into 3- to 8-ohm speakers from a single 50 V supply.
It offers the highest flexibility since it can be configured as a stereo-BTL, as a mono-BTL or
as four channels of single-ended outputs to fit different application requirements.
It provides remarkably high levels of efficiency when driven by the FFX-patented 3-state
pulse-width modulator embedded in STMs digital audio processors .
The device is self-protected by design. Overcurrent, overtemperature, under- and
overvoltage protection are provided with an automatic recovery feature to safeguard the
device and speakers against fault conditions that could damage the overall system.
a. The achievable output power depends on the thermal configuration of the final application.
A high performance thermal interface material between the package exposed pad and the heat sink should be
used in order to maximize output power levels
0: temperature of the IC >130 °C
1: normal operation
31IN2AIInput of half bridge 2A
32IN2BIInput of half bridge 2B
33, 34VSSPWR5-V regulator referred to +V
35, 36VCC_SIGNPWRSignal positive supply
CC
4/17Doc ID 13183 Rev 4
STA516BElectrical specifications
3 Electrical specifications
Table 3.Absolute maximum ratings
SymbolParameterValueUnit
V
CC_MAX
V
max
T
j_MAX
T
stg
DC supply voltage (pins 4, 7, 12, 15)65V
Maximum voltage on pins 23 to 325.5V
Operating junction temperature 0 to 150°C
Storage temperature-40 to 150°C
Warning:Stresses beyond those listed under “Absolute maximum
ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device
at these or any other conditions beyond those indicated
under “Recommended operating condition” are not implied.
Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability. In the real
application, power supplies with nominal values rated within
the recommended operating conditions, may experience
some rising beyond the maximum operating conditions for a
short time when no or very low current is being drawn
(amplifier in mute state, for instance). In this case the
reliability of the device is guaranteed, provided that the
absolute maximum rating is not exceeded.
Table 4.Thermal data
SymbolParameterMinTypMaxUnit
T
j-case
T
warn
T
jSD
t
hSD
Table 5.Recommended operating conditions
Thermal resistance junction to case (thermal pad)-12.5°C/W
Thermal warning temperature-130-°C
Thermal shut-down junction temperature-150-°C
Thermal shut-down hysteresis-25-°C
SymbolParameterMinTypMaxUnit
V
T
CC
amb
Supply voltage for pins PVCCA, PVCCB10-58V
Ambient operating temperature0-90°C
Doc ID 13183 Rev 45/17
Electrical specificationsSTA516B
Unless otherwise stated, the test conditions for Ta bl e 6 below are VL = 3.3 V, VCC = 50 V
and T
Table 6.Electrical characteristics
SymbolParameterTest conditionsMinTypMaxUnit
amb
= 25 °C
R
I
g
g
dsON
dss
N
P
Power P-channel/N-channel
MOSFET R
dsON
Power P-channel/N-channel
leakage Idss
Power P-channel R
dsON
matching
Power N-channel R
dsON
matching
= 1 A-200240mΩ
I
dd
---50µA
= 1 A95--%
I
dd
= 1 A95--%
I
dd
Dt_sLow current dead time (static)see Figure 2- 1020ns
L = 22 µH, C = 470 nF
= 8 Ω, Idd = 4.5 A
R
L
--50ns
see Figure 3
Resistive load
see Figure 2
Resistive load
see Figure 2
--25ns
--25ns
V
/ 2 +
L
300 mV
/ 2
-
V
L
300 mV
L
= 3.3 V-35-µA
V
L
-1-µA
--V
V
Dt_d
t
d ON
t
d OFF
t
r
t
f
V
IN-High
V
IN-Low
I
IN-H
I
IN-L
I
PWRDN-H
High current dead time
(dynamic)
Turn-on delay timeResistive load--100ns
Turn-off delay timeResistive load--100ns
Rise time
Fall time
High level input voltage---
Low level input voltage-
High level input currentVIN = V
Low level input currentVIN = 0.3V-1 -µA
High level PWRDN pin input
current
Low logical state voltage
V
Low
(pins PWRDN, TRISTATE)
= 3.3 V0.8-V
V
L
(seeTa bl e 7 )
High logical state voltage
V
High
(pins PWRDN, TRISTATE)
= 3.3 V-1.7V
V
L
(seeTa bl e 7 )
I
VCC-
PWRDN
Supply current from VCC in
power down
V
PWRDN
= 0 V --2.4mA
Output current on pins
I
FAULT
FAULT, TH_WARN with fault
V
= 3.3V-1-mA
pin
condition
I
VCC-HiZ
Supply current from VCC in
3-state
V
TRISTATE
= 0 V-22-mA
6/17Doc ID 13183 Rev 4
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