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ST33TPM12I2C
Trusted Platform Module with I2C interface based on 32-bit ARM®
SecurCore® SC300™ CPU
Data brief − production data
Features
TPM features
■ Single-chip Trusted Platform Module (TPM)
■ Compliant with Trusted Computing Group
(TCG) Trusted Platform Module (TPM) Main
specifications 1.2, Level 2, Revision 116
■ Based on TCG PC Client Specific TPM
Interface Specifications 1.21
2
■ I
C support in Standard mode (100 kHz) and
Fast mode (400 kHz), supporting clock
stretching
■ Provisioned with Endorsement key and
Endorsement Key certificate
■ Support of clock suspension for power saving
mode
■ Support of Field Upgrade and Dictionary Attack
protection
■ Monotonic counter endurance guaranteed for
7 years
■ Support of software and hardware physical
presence
Hardware features
■ ARM® SecurCore® SC300™ 32-bit RISC core
■ Highly reliable CMOS EEPROM submicron
technology
– 30-year data retention at 25° C
– 500,000 Erase/Write cycles endurance
typical at 25° C
■ Temperature range: 0°C to +70°C
■ ESD protection up to 4 kV (HBM)
■ 3.3 V supply voltage range
■ 28-lead thin shrink small outline and 32-lead
very thin fine pitch quad flat pack ECOPACK®
packages
Security features
■ Active shield and environmental sensors
■ Memory protection unit (MPU)
■ Monitoring of environmental parameters
(power and clock)
■ Hardware and software protection against fault
injection
■ AIS-31 Class P2 compliant true random
number generator (TRNG)
■ Cryptographic algorithms:
– RSA key generation from 512 to 2048 with
a 2-byte step
– RSA signature and encryption
– SHA-1 and SHA-256
– AES-128 in CTR mode
Performance and resource features
■ SHA1 computation for 64-byte block: 155 µs
■ Signature with a 2048-bit key: 150 ms
■
Signature with a 1024-bit key: 30 ms
■
NV storage allocated space: 4 Kbytes
(1.2 Kbytes used by EK certificate)
■ Supported 2048-bit key slots:
– up to 10 key slots (without EK and SRK)
– 1 key slot in volatile memory for high-
frequency loading use case
(a)
(a)
(a)
a. Typical value with clock configuration in secure mode
without communication time.
March 2012 Doc ID 022806 Rev 1 1/11
This is information on a product in full production. For further information contact your local STMicroelectronics sales
office.
www.st.com
1
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Description ST33TPM12I2C
1 Description
The ST33TPM12I2C is a cost-effective and high performance Trusted Platform Module
(TPM) targeting embedded system applications.
This device implements the functions defined by the Trusted Computing Group
(www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Specifications
version 1.2 Level 2 Revision 116 ([1][2][3]), and is also based on the TCG PC Client specific
TPM interface specifications 1.21 [5] and the PC Client implementation specification for
conventional BIOS [6] for what concerns the TPM internal register list and bit definitions.
The ST33TPM12I2C is based on a secure MCU hardware platform.
The ST33TPM12I2C is built on a 32-bit ARM® reduced instruction set computing (RISC)
processor which provides high cryptographic and general performances. A crypto-processor
NESCRYPT is also present to support efficiently all public key cryptographic algorithms.
1.1 Hardware features
The ST33TPM12I2C is based on a smartcard-class secure MCU that incorporates the most
recent generation of ARM processors for embedded secure systems. Its SecurCore®
SC300™ 32-bit RISC core is built on the Cortex™ M3 core with additional security features
to help to protect against advanced forms of attacks.
Cadenced at 30 MHz, the SC300™ core brings great performance and excellent code
density thanks to the Thumb®-2 instruction set.
The ST33TPM12I2C offers a fast slave I²C interface supported by an embedded hardware
communication engine.
The ST33TPM12I2C features hardware accelerators for advanced cryptographic functions.
The EDES peripheral provides a secure DES (Data Encryption Standard) algorithm
implementation, while the NESCRYPT crypto-processor efficiently supports the public key
algorithm.
The ST33TPM12I2C operates in the 0 to +70°C temperature and 3.3V supply voltage
ranges.
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and device status are available at: www.st.com.
ECOPACK® is an ST trademark.
2/11 Doc ID 022806 Rev 1
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Pin and signal description ST33TPM12I2C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NC
NC
NC
GND
NC
NC
PP
SDA
SCL
VPS
GND
NC
NC
NC
TPMSTB
TPMIRQ
NC
NC
VPS
NC
NC
NC
NC
NC
NC
RESET
GND
NC
TSSOP28
1
2
3
4
5
6
7
8
9 1011121314
28 27 26 25
24
23
22
21
20
19
18
17
1615
GND
NC
NC
NC
NC
PP
SDA
SCL
VPS
GND
NCNCNC
TPMSTB
TPMIRQ
NC
NC
VPS
NC
NC
NC
NC
NC
NC
RESET
GND
NC
QFN32
29303132
NC
NC
NC
NC
NC
2 Pin and signal description
2.1 Pinout descriptions
Figure 2. TSSOP28 pinout
Figure 3. VQFN32 pinout
4/11 Doc ID 022806 Rev 1