ST ST33F1M User Manual

Smartcard MCU with 32-bit ARM® SecurCore® SC300™ CPU

259a.ai

Micromodule Wafer

DFN8 package

and 1.25 Mbytes high-density Flash memory

Features

ST33F1M major applications include:

■ Mobile communications (GSM, 3G and CDMA)

■ Java Card™ applications

■ Multimedia

■ Mobile TV, banking & transportation

Hardware features

■ ARM® SecurCore® SC300™ 32-bit RISC core

■ 30 Kbytes User RAM

■ 1280 Kbytes User Flash memory with OTP

area:
– 10-year data retention
– 100,000 Erase/Write cycles
– Page granularity of 256 Bytes
– Block granularity: 1 Kbyte
– 256 Bytes of OTP for User
– Page Erase time 5 ms
– Block Erase 1 Kbyte in 15 ms
– Programming performance up to 10µs/byte

in Chained mode

– Flash Erase / Write Protection software

programmable on 128 Kbyte Sectors

■ Asynchronous Receiver Transmitter

supporting ISO/IEC 7816-3 T=0 and T=1
protocols

■ Single Wire Protocol (SWP) Interface for

communications with NFC router

■ Optional Serial Peripheral Interface (SPI) Slave

interface

■ Two 16-bit timers with interrupt capability and

one extra 16-bit timer with watchdog capability

■ 1.8V, 3V and 5V supply voltage ranges

■ External clock frequency from 1 up to 10 MHz

■ High performance provided by:

– CPU clock frequency up to 25 MHz
– External clock multiplier (2x, 3x, and 4x)

ST33F1M

Data brief

■ Current consumption compatible with GSM

and ETSI specifications

■ Power-saving Standby state

■ Contact assignment compatible with ISO/IEC

7816-2

■ ESD protection greater than 4 kV (HBM)

■ 8-lead plastic small outline (208 mils body

width) ECOPACK® package

Software features

■ Secure Flash Loader

■ Flash drivers

Security features

■ Active shield

■ Memory Protection Unit (MPU)

■ Monitoring of environmental parameters

■ Protection against faults

■ ISO 3309 CRC calculation block

■ True Random Number Generator

■ Unique serial number on each die

■ Hardware security-enhanced DES accelerator

■ NESCRYPT coprocessor for public key

cryptography algorithm

Development environment

Software development and firmware generation
are supported by a comprehensive set of
development tools dedicated to software design
and validation:

■ C Compiler

■ Simulator

■ Emulator

December 2011 Doc ID 18396 Rev 2 1/5

For further information contact your local STMicroelectronics sales office.

www.st.com

5

Description ST33F1M

1 Description

1.1 Hardware description

The ST33F1M is a serial access microcontroller designed for secure mobile applications
that incorporates the most recent generation of ARM processors for embedded secure
systems. Its SecurCore® SC300™ 32-bit RISC core is built on the Cortex™ M3 core with
additional security features to help to protect against advanced forms of attacks.

Cadenced at 25MHz, the SC300™ core brings great performance and excellent code
density thanks to the Thumb®-2 instruction set.

The high-speed embedded Flash 1280 Kbyte memory introduces more flexibility to the
system.

The ST33F1M also offers a serial communication interface fully compatible with the ISO/IEC
7816-3 standard (T=0, T=1) and a single-wire protocol (SWP) interface for communication
with a near field communication (NFC) router in SIM/NFC applications.

An SPI Slave interface is also available for communication in non-SIM applications.

Three general purpose 16-bit timers are available; one configurable as a watchdog.

The ST33F1M features hardware accelerators for advanced cryptographic functions. The
EDES peripheral provides a secure DES (Data Encryption Standard) algorithm
implementation, while the NESCRYPT crypto-processor efficiently supports the public key
algorithm.

The ST33F family operates in the –25 to +85°C temperature range and 1.8V, 3V and 5V
supply voltage ranges. A comprehensive range of power-saving modes enables the design
of efficient low-power applications.

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

2/5 Doc ID 18396 Rev 2