ST ST10F276E User Manual

832 Kbyte Flash memory and 68 Kbyte RAM
Features
Highly performance 16-bit CPU with DSP
functions – 31.25ns instruction cycle time at 64MHz
max CPU clock
– Multiply/accumulate unit (MAC) 16 x 16-bit
multiplication, 40-bit accumulator – Enhanced boolean bit manipulations – Single-cycle context switching support
On-chip memories
– 512 Kbyte Flash memory (32-bit fetch) – 320 Kbyte extension Flash memory (16-bit
fetch) – Single voltage Flash memories with
erase/program controller and 100K
erasing/programming cycles – Up to 16 Mbyte linear address space for
code and data (5 Mbytes with CAN or I – 2 Kbyte internal RAM (IRAM) – 66 Kbyte extension RAM (XRAM)
External bus
– Programmable external bus configuration &
characteristics for different address ranges – 5 programmable chip-select signals – Hold-acknowledge bus arbitration support
Interrupt
– 8-channel peripheral event controller for
single cycle interrupt driven data transfer – 16-priority-level interrupt system with 56
sources, sampling rate down to 15.6ns
Timers
– 2 multi-functional general purpose timer
units with 5 timers
Two 16-channel capture / compare units
ST10F276E
16-bit MCU with MAC unit,
LQFP144 (20 x 20 x 1.4mm)
PQFP144 (28 x 28 x 3.4mm)
(Plastic quad flat package)
4-channel PWM unit + 4-channel XPWM
A/D converter
– 24-channel 10-bit – 3 µs minimum conversion time
Serial channels
– 2 synch. / asynch. serial channels – 2 high-speed synchronous channels
2
–1 I
C standard interface
2
C)
2 CAN 2.0B interfaces operating on 1 or 2 CAN
busses (64 or 2x32 message, C-CAN version)
Fail-safe protection
– Programmable watchdog timer – Oscillator watchdog
On-chip bootstrap loader
Clock generation
– On-chip PLL with 4 to 12 MHz oscillator – Direct or prescaled clock input
Real-time clock and 32 kHz on-chip oscillator
Up to 111 general purpose I/O lines
– Individually programmable as input, output
or special function
– Programmable threshold (hysteresis)
Idle, power down and stand-by modes
Single voltage supply: 5V ±10% (embedded
regulator for 1.8 V core supply)
(Low profile plastic quad
flat package)
August 2008 Rev 2 1/231
www.st.com
1
Contents ST10F276E
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2 Pin data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4 Internal Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2.1 Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2.2 Modules structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2.3 Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.2.4 Write operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.2.5 Power supply drop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3 Registers description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3.1 Flash control register 0 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3.2 Flash control register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.3.3 Flash control register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.3.4 Flash control register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.3.5 Flash data register 0 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.3.6 Flash data register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.3.7 Flash data register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.3.8 Flash data register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.3.9 Flash address register low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.3.10 Flash address register high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.3.11 Flash error register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.3.12 XFlash interface control register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.4 Protection strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.4.1 Protection registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.4.2 Flash non-volatile write protection X register low . . . . . . . . . . . . . . . . . . 37
4.4.3 Flash non-volatile write protection X register high . . . . . . . . . . . . . . . . . 38
4.4.4 Flash non-volatile write protection I register low . . . . . . . . . . . . . . . . . . 38
4.4.5 Flash non-volatile write protection I register high . . . . . . . . . . . . . . . . . 38
4.4.6 Flash non-volatile access protection register 0 . . . . . . . . . . . . . . . . . . . 39
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4.4.7 Flash non-volatile access protection register 1 low . . . . . . . . . . . . . . . . 39
4.4.8 Flash non-volatile access protection register 1 high . . . . . . . . . . . . . . . 40
4.4.9 Access protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.4.10 Write protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4.4.11 Temporary unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4.5 Write operation examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4.6 Write operation summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5 Bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
5.1 Selection among user-code, standard or alternate bootstrap . . . . . . . . . 46
5.2 Standard bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.2.1 Entering the standard bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.2.2 ST10 configuration in BSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
5.2.3 Booting steps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.2.4 Hardware to activate BSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.2.5 Memory configuration in bootstrap loader mode . . . . . . . . . . . . . . . . . . 51
5.2.6 Loading the start-up code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
5.2.7 Exiting bootstrap loader mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
5.2.8 Hardware requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
5.3 Standard bootstrap with UART (RS232 or K-Line) . . . . . . . . . . . . . . . . . . 53
5.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
5.3.2 Entering bootstrap via UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.3.3 ST10 Configuration in UART BSL (RS232 or K-Line) . . . . . . . . . . . . . . 55
5.3.4 Loading the start-up code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
5.3.5 Choosing the baud rate for the BSL via UART . . . . . . . . . . . . . . . . . . . 56
5.4 Standard bootstrap with CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
5.4.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
5.4.2 Entering the CAN bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
5.4.3 ST10 configuration in CAN BSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
5.4.4 Loading the start-up code via CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
5.4.5 Choosing the baud rate for the BSL via CAN . . . . . . . . . . . . . . . . . . . . 61
5.4.6 Computing the baud rate error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
5.4.7 Bootstrap via CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
5.5 Comparing the old and the new bootstrap loader . . . . . . . . . . . . . . . . . . 65
5.5.1 Software aspects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
5.5.2 Hardware aspects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
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5.6 Alternate boot mode (ABM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.6.1 Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.6.2 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.6.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.6.4 ST10 configuration in alternate boot mode . . . . . . . . . . . . . . . . . . . . . . 66
5.6.5 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.6.6 Exiting alternate boot mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.6.7 Alternate boot user software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.6.8 User/alternate mode signature integrity check . . . . . . . . . . . . . . . . . . . 67
5.6.9 Alternate boot user software aspects . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.6.10 EMUCON register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.6.11 Internal decoding of test modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.6.12 Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
5.7 Selective boot mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
6 Central processing unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
6.1 Multiplier-accumulator unit (MAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
6.2 Instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
6.3 MAC coprocessor specific instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
7 External bus controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
8 Interrupt system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
8.1 X-Peripheral interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
8.2 Exception and error traps list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
9 Capture / compare (CAPCOM) units . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10 General purpose timer unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
10.1 GPT1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
10.2 GPT2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
11 PWM modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
12 Parallel ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
12.2 I/O’s special features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
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12.2.1 Open drain mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
12.2.2 Input threshold control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
12.3 Alternate port functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
13 A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
14 Serial channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
14.1 Asynchronous / synchronous serial interfaces . . . . . . . . . . . . . . . . . . . . . 94
14.2 ASCx in asynchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
14.3 ASCx in synchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
14.4 High speed synchronous serial interfaces . . . . . . . . . . . . . . . . . . . . . . . . 96
15 I2C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
16 CAN modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
16.1 Configuration support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
16.2 CAN bus configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
17 Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
18 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
19 System reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
19.1 Input filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
19.2 Asynchronous reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
19.3 Synchronous reset (warm reset) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
19.4 Software reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
19.5 Watchdog timer reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
19.6 Bidirectional reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
19.7 Reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
19.8 Reset application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
19.9 Reset summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
20 Power reduction modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
20.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
20.2 Power down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
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20.2.1 Protected power down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
20.2.2 Interruptible power down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
20.3 Stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
20.3.1 Entering stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
20.3.2 Exiting stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
20.3.3 Real-time clock and stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
20.3.4 Power reduction modes summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
21 Programmable output clock divider . . . . . . . . . . . . . . . . . . . . . . . . . . 134
22 Register set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
22.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
22.2 Register description format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
22.3 General purpose registers (GPRs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
22.4 Special function registers ordered by name . . . . . . . . . . . . . . . . . . . . . 138
22.5 Special function registers ordered by address . . . . . . . . . . . . . . . . . . . . 145
22.6 X-registers sorted by name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
22.7 X-registers ordered by address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
22.8 Flash registers ordered by name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
22.9 Flash registers ordered by address . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
22.10 Identification registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
22.11 System configuration registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
22.12 XPERCON and XPEREMU registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
22.13 Emulation dedicated registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
23 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
23.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
23.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
23.3 Power considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
23.4 Parameter interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
23.5 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
23.6 Flash characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
23.7 A/D converter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
23.7.1 Conversion timing control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
23.7.2 A/D conversion accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
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23.7.3 Total unadjusted error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
23.7.4 Analog reference pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
23.7.5 Analog input pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
23.7.6 Example of external network sizing . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
23.8 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
23.8.1 Test waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
23.8.2 Definition of internal timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
23.8.3 Clock generation modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
23.8.4 Prescaler operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
23.8.5 Direct drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
23.8.6 Oscillator watchdog (OWD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
23.8.7 Phase locked loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
23.8.8 Voltage controlled oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
23.8.9 PLL Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
23.8.10 Jitter in the input clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
23.8.11 Noise in the PLL loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
23.8.12 PLL lock/unlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
23.8.13 Main oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
23.8.14 32 kHz oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
23.8.15 External clock drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
23.8.16 Memory cycle variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
23.8.17 External memory bus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
23.8.18 Multiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
23.8.19 Demultiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
23.8.20 CLKOUT and READY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
23.8.21 External bus arbitration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
23.8.22 High-speed synchronous serial interface (SSC) timing modes . . . . . . 220
24 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
24.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
25 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
26 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
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List of tables ST10F276E
List of tables
Table 1. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 2. Flash modules absolute mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 3. Flash modules sectorization (read operations). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 4. Flash modules sectorization (write operations or with ROMS1 = ‘1’) . . . . . . . . . . . . . . . . . 26
Table 5. Control register interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 6. Flash control register 0 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 7. Flash control register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 8. Flash control register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 9. Flash control register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 10. Banks (BxS) and sectors (BxFy) status bits meaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 11. Flash data register 0 low. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 12. Flash data register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 13. Flash data register 1 low. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 14. Flash data register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 15. Flash address register low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 16. Flash address register high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 17. Flash error register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 18. XFlash interface control register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 19. Flash non-volatile write protection X register low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 20. Flash non-volatile write protection X register high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 21. Flash non-volatile write protection I register low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 22. Flash non-volatile write protection I register high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 23. Flash non-volatile access protection register 0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 24. Flash non-volatile access protection register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 25. Flash non-volatile access protection register 1 high. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 26. Summary of access protection level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 27. Flash write operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 28. ST10F276E boot mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 29. ST10 configuration in BSL mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 30. ST10 configuration in UART BSL mode (RS232 or K-line). . . . . . . . . . . . . . . . . . . . . . . . . 55
Table 31. ST10 configuration in CAN BSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 32. BRP and PT0 values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 33. Software topics summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 34. Hardware topics summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 35. ST10 configuration in alternate boot mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 36. ABM bit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 37. Selective boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 38. Standard instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 39. MAC instruction set summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Table 40. Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 41. X-Interrupt detailed mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 42. Trap priorities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 43. Compare modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 44. CAPCOM timer input frequencies, resolutions and periods at 40 MHz . . . . . . . . . . . . . . . 83
Table 45. CAPCOM timer input frequencies, resolutions and periods at 64 MHz . . . . . . . . . . . . . . . 83
Table 46. GPT1 timer input frequencies, resolutions and periods at 40 MHz. . . . . . . . . . . . . . . . . . . 84
Table 47. GPT1 timer input frequencies, resolutions and periods at 64 MHz. . . . . . . . . . . . . . . . . . . 85
Table 48. GPT2 timer input frequencies, resolutions and periods at 40 MHz. . . . . . . . . . . . . . . . . . . 86
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Table 49. GPT2 timer input frequencies, resolutions and periods at 64 MHz. . . . . . . . . . . . . . . . . . . 86
Table 50. PWM unit frequencies and resolutions at 40 MHz CPU clock . . . . . . . . . . . . . . . . . . . . . . 88
Table 51. PWM unit frequencies and resolutions at 64 MHz CPU clock . . . . . . . . . . . . . . . . . . . . . . 88
Table 52. ASC asynchronous baud rates by reload value and deviation errors (fCPU = 40 MHz) . . 94 Table 53. ASC asynchronous baud rates by reload value and deviation errors (fCPU = 64 MHz) . . 95 Table 54. ASC synchronous baud rates by reload value and deviation errors (fCPU = 40 MHz) . . . 95 Table 55. ASC synchronous baud rates by reload value and deviation errors (fCPU = 64 MHz) . . . 96
Table 56. Synchronous baud rate and reload values (fCPU = 40 MHz). . . . . . . . . . . . . . . . . . . . . . . 97
Table 57. Synchronous baud rate and reload values (fCPU = 64 MHz). . . . . . . . . . . . . . . . . . . . . . . 97
Table 58. WDTREL reload value (fCPU = 40 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Table 59. WDTREL reload value (fCPU = 64 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Table 60. Reset event definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Table 61. Reset event. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Table 62. PORT0 latched configuration for the different reset events . . . . . . . . . . . . . . . . . . . . . . . 127
Table 63. Power reduction modes summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Table 64. Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Table 65. General purpose registers (GPRs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Table 66. General purpose registers (GPRs) bytewise addressing . . . . . . . . . . . . . . . . . . . . . . . . . 136
Table 67. Special function registers ordered by address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Table 68. Special function registers ordered by address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Table 69. X-Registers ordered by name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Table 70. X-registers ordered by address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Table 71. Flash registers ordered by name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Table 72. Flash registers ordered by address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
Table 73. MANUF description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
Table 74. IDCHIP description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
Table 75. IDMEM description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Table 76. IDPROG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Table 77. SYSCON description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
Table 78. BUSCON4 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
Table 79. RPOH description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
Table 80. EXIxES bit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Table 81. EXISEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Table 82. EXIxSS and port 2 pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Table 83. SFR area description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Table 84. ESFR description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Table 85. Segment 8 address range mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
Table 86. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
Table 87. Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
Table 88. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
Table 89. Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Table 90. DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Table 91. Flash characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Table 92. Data retention characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
Table 93. A/D converter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
Table 94. A/D converter programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Table 95. On-chip clock generator selections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
Table 96. Internal PLL divider mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Table 97. PLL lock/unlock timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Table 98. Main oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Table 99. Negative resistance (absolute min. value @125oC / VDD = 4.5V). . . . . . . . . . . . . . . . . . 201
Table 100. 32 kHz Oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
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Table 101. Minimum values of negative resistance (module). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Table 102. External clock drive timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Table 103. Memory cycle variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Table 104. Multiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
Table 105. Demultiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Table 106. CLKOUT and READY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
Table 107. External bus arbitration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
Table 108. Master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
Table 109. Slave mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Table 110. Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
Table 111. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
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ST10F276E List of figures
List of figures
Figure 1. Logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 2. Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 3. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 4. Flash modules structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 5. ST10F276E new standard bootstrap loader program flow . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 6. Booting steps for ST10F276E. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 7. Hardware provisions to activate the BSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 8. Memory configuration after reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 9. UART bootstrap loader sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 10. Baud rate deviation between host and ST10F276E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 11. CAN bootstrap loader sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 12. Bit rate measurement over a predefined zero-frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 13. Reset boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Figure 14. CPU Block Diagram (MAC Unit not included). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 15. MAC unit architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Figure 16. X-Interrupt basic structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Figure 17. Block diagram of GPT1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 18. Block diagram of GPT2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Figure 19. Block diagram of PWM module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 20. Connection to single CAN bus via separate CAN transceivers . . . . . . . . . . . . . . . . . . . . 100
Figure 21. Connection to single CAN bus via common CAN transceivers. . . . . . . . . . . . . . . . . . . . . 100
Figure 22. Connection to two different CAN buses (e.g. for gateway application). . . . . . . . . . . . . . . 101
Figure 23. Connection to one CAN bus with internal Parallel Mode enabled . . . . . . . . . . . . . . . . . . 101
Figure 24. Asynchronous power-on RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Figure 25. Asynchronous power-on RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Figure 26. Asynchronous hardware RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Figure 27. Asynchronous hardware RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Figure 28. Synchronous short / long hardware RESET (EA = 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Figure 29. Synchronous short / long hardware RESET (EA = 0). . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Figure 30. Synchronous long hardware RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Figure 31. Synchronous long hardware RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Figure 32. SW / WDT unidirectional RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Figure 33. SW / WDT unidirectional RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Figure 34. SW / WDT bidirectional RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Figure 35. SW / WDT bidirectional RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 36. SW / WDT bidirectional RESET (EA = 0) followed by a HW RESET . . . . . . . . . . . . . . . . 121
Figure 37. Minimum external reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Figure 38. System reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Figure 39. Internal (simplified) reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Figure 40. Example of software or watchdog bidirectional reset (EA = 1) . . . . . . . . . . . . . . . . . . . . . 124
Figure 41. Example of software or watchdog bidirectional reset (EA = 0) . . . . . . . . . . . . . . . . . . . . . 125
Figure 42. PORT0 bits latched into the different registers after reset . . . . . . . . . . . . . . . . . . . . . . . . 128
Figure 43. External RC circuitry on RPD pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Figure 44. Port2 test mode structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
Figure 45. Supply current versus the operating frequency (RUN and IDLE modes) . . . . . . . . . . . . . 181
Figure 46. A/D conversion characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Figure 47. A/D converter input pins scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Figure 48. Charge sharing timing diagram during sampling phase . . . . . . . . . . . . . . . . . . . . . . . . . . 189
11/231
List of figures ST10F276E
Figure 49. Anti-aliasing filter and conversion rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
Figure 50. Input/output waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
Figure 51. Float waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
Figure 52. Generation mechanisms for the CPU clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
Figure 53. ST10F276E PLL jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
Figure 54. Crystal oscillator and resonator connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
Figure 55. 32 kHz crystal oscillator connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Figure 56. External clock drive XTAL1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Figure 57. Multiplexed bus with/without R/W delay and normal ALE. . . . . . . . . . . . . . . . . . . . . . . . . 206
Figure 58. Multiplexed bus with/without R/W delay and extended ALE . . . . . . . . . . . . . . . . . . . . . . . 207
Figure 59. Multiplexed bus, with/without R/W delay, normal ALE, R/W CS. . . . . . . . . . . . . . . . . . . . 208
Figure 60. Multiplexed bus, with/without R/ W delay, extended ALE, R/W CS . . . . . . . . . . . . . . . . . 209
Figure 61. Demultiplexed bus, with/without read/write delay and normal ALE . . . . . . . . . . . . . . . . . 212
Figure 62. Demultiplexed bus with/without R/W delay and extended ALE . . . . . . . . . . . . . . . . . . . . 213
Figure 63. Demultiplexed bus with ALE and R/W CS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Figure 64. Demultiplexed bus, no R/W delay, extended ALE, R/W CS . . . . . . . . . . . . . . . . . . . . . . . 215
Figure 65. CLKOUT and READY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Figure 66. External bus arbitration (releasing the bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
Figure 67. External bus arbitration (regaining the bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
Figure 68. SSC master timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Figure 69. SSC slave timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
Figure 70. PQFP144 mechanical data and package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
Figure 71. LQFP144 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
Figure 72. LQFP144 package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
12/231
ST10F276E Introduction

1 Introduction

The ST10F276E is a derivative of the STMicroelectronics ST10 family of 16-bit single-chip CMOS microcontrollers. It combines high CPU performance (up to 32 million instructions per second) with high peripheral functionality and enhanced I/O-capabilities. It also provides on-chip high-speed single voltage Flash memory, on-chip high-speed RAM, and clock generation via PLL.
ST10F276E is processed in 0.18µm CMOS technology. The MCU core and the logic is supplied with a 5V to 1.8V on-chip voltage regulator. The part is supplied with a single 5V supply and I/Os work at 5V.
The device is upward compatible with the ST10F269 device, with the following set of differences:
Flash control interface is now based on STMicroelectronics third generation of stand-
alone Flash memories (M29F400 series), with an embedded Program/Erase Controller. This completely frees up the CPU during programming or erasing the Flash.
Only one supply pin (ex DC1 in ST10F269, renamed into V
is used for decoupling the internally generated 1.8V core logic supply. Do not connect this pin to 5.0V external supply. Instead, this pin should be connected to a decoupling capacitor (ceramic type, typical value 10nF, maximum value 100nF).
The AC and DC parameters are modified due to a difference in the maximum CPU
frequency.
A new V
EA pin assumes a new alternate functionality: it is also used to provide a dedicated
power supply (see V the main Power Supply of the device (V V
) is turned off for low power mode, allowing data retention. V
18
pin replaces DC2 of ST10F269.
DD
) to maintain biased a portion of the XRAM (16 Kbytes) when
STBY
and consequently the internally generated
DD
the range 4.5-5.5 Volt, and a dedicated embedded low power voltage regulator is in charge to provide the 1.8V for the RAM, the low-voltage section of the 32 kHz oscillator and the Real-Time Clock module when not disabled. It is allowed to exceed the upper limit up to 6V for a very short period of time during the global life of the device, and exceed the lower limit down to 4V when RTC and 32kHz on-chip oscillator are not used.
A second SSC mapped on the XBUS is added (SSC of ST10F269 becomes here
SSC0, while the new one is referred as XSSC or simply SSC1). Note that some restrictions and functional differences due to the XBUS peculiarities are present between the classic SSC, and the new XSSC.
A second ASC mapped on the XBUS is added (ASC0 of ST10F269 remains ASC0,
while the new one is referred as XASC or simply as ASC1). Note that some restrictions and functional differences due to the XBUS peculiarities are present between the classic ASC, and the new XASC.
A second PWM mapped on the XBUS is added (PWM of ST10F269 becomes here
PWM0, while the new one is referred as XPWM or simply as PWM1). Note that some restrictions and functional differences due to the XBUS peculiarities are present between the classic PWM, and the new XPWM.
An I
CLKOUT function can output either the CPU clock (like in ST10F269) or a software
2
C interface on the XBUS is added (see X-I2C or simply I2C interface).
programmable prescaled value of the CPU clock.
) on the QFP144 package
18
voltage shall be in
STBY
13/231
Introduction ST10F276E
Embedded memory size has been significantly increased (both Flash and RAM).
PLL multiplication factors have been adapted to new frequency range.
A/D Converter is not fully compatible versus ST10F269 (timing and programming model). Formula for the conversion time is still valid, while the sampling phase programming model is different.
Besides, additional 8 channels are available on P1L pins as alternate function: the accuracy reachable with these extra channels is reduced with respect to the standard Port5 channels.
External Memory bus potential limitations on maximum speed and maximum
capacitance load could be introduced (under evaluation): ST10F276E will probably not be able to address an external memory at 64MHz with 0 wait states (under evaluation).
XPERCON register bit mapping modified according to new peripherals implementation
(not fully compatible with ST10F269).
Bondout chip for emulation (ST10R201) cannot achieve more than 50MHz at room
temperature (so no real-time emulation possible at maximum speed).
Input section characteristics are different. The threshold programmability is extended to
all port pins (additional XPICON register); it is possible to select standard TTL (with up to 500mV of hysteresis) and standard CMOS (with up to 800mV of hysteresis).
Output transition is not programmable.
CAN module is enhanced: ST10F276E implements two C-CAN modules, so the
programming model is slightly different. Besides, the possibility to map in parallel the two CAN modules is added (on P4.5/P4.6).
On-chip main oscillator input frequency range has been reshaped, reducing it from 1-
25MHz down to 4-12MHz. This is a high performance oscillator amplifier, providing a very high negative resistance and wide oscillation amplitude: when this on-chip amplifier is used as reference for Real-Time Clock module, the Power-down consumption is dominated by the consumption of the oscillator amplifier itself. A metal option is added to offer a low power oscillator amplifier working in the range of 4-8MHz: this will allow a power consumption reduction when Real-Time Clock is running in Power Down mode using as reference the on-chip main oscillator clock.
A second on-chip oscillator amplifier circuit (32kHz) is implemented for low power
modes: it can be used to provide the reference to the Real-Time Clock counter (either in Power Down or Stand-by mode). Pin XTAL3 and XTAL4 replace a couple of V
DD/VSS
pins of ST10F269.
Possibility to re-program internal XBUS chip select window characteristics (XRAM2 and
XFLASH address window) is added.
14/231
ST10F276E Introduction

Figure 1. Logic symbol

V
V
DDVSS
18
XTAL1 XTAL2 XTAL3 XTAL4
RSTIN
RSTOUT
V
AREF
V
AGND
NMI
EA / V
STBY
READY
ALE
RD
WR / WRL
Port 5
16-bit
ST10F276E
Port 0 16-bit
Port 1 16-bit
Port 2 16-bit
Port 3 15-bit
Port 4 8-bit
Port 6 8-bit
Port 7 8-bit
Port 8 8-bit
RPD
15/231
Pin data ST10F276E

2 Pin data

Figure 2. Pin configuration (top view)

(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
RSTOUT
RSTIN
VSS
XTAL1
XTAL2
VDD
P1H.7 / A15 / CC27I
P1H.6 / A14 / CC26I
P1H.5 / A13 / CC25I
P1H.4 / A12 / CC24I
P1H.3 / A11
P1H.2 / A10
P1H.1 / A9
P1H.0 / A8
VSS
VDD
P1L.7 / A7 / AN23
P1L.6 / A6 / AN22
P1L.5 / A5 / AN21
P1L.4 / A4 / AN20
P1L.3 / A3 / AN19
P1L.2 / A2 / AN18
P1L.1 / A1 / AN17
P1L.0 / A0 / AN16
P0H.7 / AD15
P0H.6 / AD14
P0H.5 / AD13
P0H.4 / AD12
P0H.3 / AD11
P0H.2 / AD10
P0H.1 / AD9
VSS
P6.0 / CS0 P6.1 / CS1 P6.2 / CS2 P6.3 / CS3 P6.4 / CS4
P6.5 / HOLD / SCLK1
/ MTSR1
P6.6 / HLDA
P6.7 / BREQ P8.0 / XPOUT0 / CC16IO P8.1 / XPOUT1 / CC17IO P8.2 / XPOUT2 / CC18IO P8.3 / XPOUT3 / CC19IO
/ MRST1
P8.4 / CC20IO P8.5 / CC21IO
P8.6 / RxD1 / CC22IO
P8.7 / TxD1 / CC23IO
VDD
VSS P7.0 / POUT0 P7.1 / POUT1 P7.2 / POUT2 P7.3 / POUT3
P7.4 / CC28IO P7.5 / CC29IO P7.6 / CC30IO P7.7 / CC31IO
P5.0 / AN0 P5.1 / AN1 P5.2 / AN2 P5.3 / AN3 P5.4 / AN4 P5.5 / AN5 P5.6 / AN6 P5.7 / AN7 P5.8 / AN8 P5.9 / AN9
XTAL4
XTAL3
NMI
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
3738394041424344454647484950515253545556575859606162636465666768697071
ST10F276E
115
114
113
112
VDD
111
110
109 108
P0H.0 / AD8
107
P0L.7 / AD7
106
P0L.6 / AD6
105
P0L.5 / AD5
104
P0L.4 / AD4
103
P0L.3 / AD3
102
P0L.2 / AD2
101
P0L.1 / AD1
100
P0L.0 / AD0
99
EA
/ VSTBY
98
ALE
97
READY
96
WR/WRL
95
RD
94
VSS
93
VDD
92
P4.7 / A23 / CAN2_TxD / SDA
91
P4.6 / A22 / CAN1_TxD / CAN2_TxD
90
P4.5 / A21 / CAN1_RxD / CAN2_RxD
89
P4.4 / A20 / CAN2_RxD / SCL
88
P4.3 / A19
87
P4.2 / A18
86
P4.1 / A17
85
P4.0 / A16
84
RPD
83
VSS
82
VDD
81
P3.15 / CLKOUT
80
P3.13 / SCLK0
79
P3.12 / BHE
78
P3.11 / RxD0
77
P3.10 / TxD0
76
P3.9 / MTSR0
75
P3.8 / MRST0
74
P3.7 / T2IN
73
P3.6 / T3IN
72
/ WRH
VSS
P5.12 / AN12 / T6IN
P5.13 / AN13 / T5IN
P5.14 / AN14 / T4EUD
VDD
P2.0 / CC0IO
P2.1 / CC1IO
P2.2 / CC2IO
P2.3 / CC3IO
P5.15 / AN15 / T2EUD
VAREF
VAGND
P5.10 / AN10 / T6EUD
P5.11 / AN11 / T5EUD
V18
VSS
P2.11 / CC11IO / EX3IN
P2.12 / CC12IO / EX4IN
P2.13 / CC13IO / EX5IN
P3.0 / T0IN
P2.14 / CC14IO / EX6IN
P2.15 / CC15IO / EX7IN / T7IN
P2.4 / CC4IO
P2.5 / CC5IO
P2.6 / CC6IO
P2.7 / CC7IO
P2.8 / CC8IO / EX0IN
P2.9 / CC9IO / EX1IN
P2.10 / CC10IO / EX2IN
VSS
VDD
P3.5 / T4IN
P3.2 / CAPIN
P3.1 / T6OUT
P3.3 / T3OUT
P3.4 / T3EUD
16/231
ST10F276E Pin data

Table 1. Pin description

Symbol Pin Type Function
8-bit bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to
P6.0 - P6.7
1 - 8 I/O
1OP6.0CS0
... ... ... ... ...
5OP6.4CS4 Chip select 4 output
6
7
high impedance state. Port 6 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 6 is selectable (TTL or CMOS). The following Port 6 pins have alternate functions:
Chip select 0 output
IP6.5HOLD
External master hold request input
I/O SCLK1 SSC1: master clock output / slave clock input
O P6.6 HLDA
Hold acknowledge output
I/O MTSR1 SSC1: master-transmitter / slave-receiver O/I
P8.0 - P8.7
8
OP6.7 BREQ Bus request output
I/O MRST1 SSC1: master-receiver / slave-transmitter I/O
8-bit bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to
9-16 I/O
high impedance state. Port 8 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 8 is selectable (TTL or CMOS). The following Port 8 pins have alternate functions:
I/O P8.0 CC16IO CAPCOM2: CC16 capture input / compare output
9
O XPWM0 PWM1: channel 0 output
... ... ... ... ...
I/O P8.3 CC19IO CAPCOM2: CC19 capture input / compare output
12
O XPWM0 PWM1: channel 3 output
13 I/O P8.4 CC20IO CAPCOM2: CC20 capture input / compare output
14 I/O P8.5 CC21IO CAPCOM2: CC21 capture input / compare output
I/O P8.6 CC22IO CAPCOM2: CC22 capture input / compare output
15
I/O RxD1 ASC1: Data input (Asynchronous) or I/O (Synchronous)
I/O P8.7 CC23IO CAPCOM2: CC23 capture input / compare output
16
O TxD1 ASC1: Clock / Data output (Asynchronous/Synchronous)
17/231
Pin data ST10F276E
Table 1. Pin description (continued)
Symbol Pin Type Function
8-bit bidirectional I/O port, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to
P7.0 - P7.7
P5.0 - P5.9
P5.10 - P5.15
19-26 I/O
19 O P7.0 POUT0 PWM0: channel 0 output
... ... ... ... ...
22 O P7.3 POUT3 PWM0: channel 3 output
23 I/O P7.4 CC28IO CAPCOM2: CC28 capture input / compare output
... ... ... ... ...
26 I/O P7.7 CC31IO CAPCOM2: CC31 capture input / compare output
27-36 39-44
39 I P5.10 T6EUD GPT2: timer T6 external up/down control input
40 I P5.11 T5EUD GPT2: timer T5 external up/down control input
41 I P5.12 T6IN GPT2: timer T6 count input
42 I P5.13 T5IN GPT2: timer T5 count input
43 I P5.14 T4EUD GPT1: timer T4 external up/down control input
high impedance state. Port 7 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 7 is selectable (TTL or CMOS). The following Port 7 pins have alternate functions:
16-bit input-only port with Schmitt-Trigger characteristics. The pins of Port 5 can be the analog input channels (up to 16) for the A/D converter, where P5.x equals
I
ANx (Analog input channel x), or they are timer inputs. The input threshold of
I
Port 5 is selectable (TTL or CMOS). The following Port 5 pins have alternate functions:
P2.0 - P2.7
P2.8 - P2.15
44 I P5.15 T2EUD GPT1: timer T2 external up/down control input
16-bit bidirectional I/O port, bit-wise programmable for input or output via
47-54 57-64
47 I/O P2.0 CC0IO CAPCOM: CC0 capture input/compare output
... ... ... ... ...
54 I/O P2.7 CC7IO CAPCOM: CC7 capture input/compare output
57 I/O P2.8 CC8IO CAPCOM: CC8 capture input/compare output
... ... ... ... ...
64 I/O P2.15 CC15IO CAPCOM: CC15 capture input/compare output
direction bit. Programming an I/O pin as input forces the corresponding output
I/O
driver to high impedance state. Port 2 outputs can be configured as push-pull or open drain drivers. The input threshold of Port 2 is selectable (TTL or CMOS). The following Port 2 pins have alternate functions:
I EX0IN Fast external interrupt 0 input
I EX7IN Fast external interrupt 7 input
I T7IN CAPCOM2: timer T7 count input
18/231
ST10F276E Pin data
Table 1. Pin description (continued)
Symbol Pin Type Function
15-bit (P3.14 is missing) bidirectional I/O port, bit-wise programmable for input or 65-70, 73-80,
81
65 I P3.0 T0IN CAPCOM1: timer T0 count input
66 O P3.1 T6OUT GPT2: timer T6 toggle latch output
67 I P3.2 CAPIN GPT2: register CAPREL capture input
68 O P3.3 T3OUT GPT1: timer T3 toggle latch output
69 I P3.4 T3EUD GPT1: timer T3 external up/down control input
I/O
output via direction bit. Programming an I/O pin as input forces the
I/O
corresponding output driver to high impedance state. Port 3 outputs can be
I/O
configured as push-pull or open drain drivers. The input threshold of Port 3 is
selectable (TTL or CMOS). The following Port 3 pins have alternate functions:
P3.0 - P3.5
P3.6 - P3.13,
P3.15
70 I P3.5 T4IN GPT1; timer T4 input for count/gate/reload/capture
73 I P3.6 T3IN GPT1: timer T3 count/gate input
74 I P3.7 T2IN GPT1: timer T2 input for count/gate/reload / capture
75 I/O P3.8 MRST0 SSC0: master-receiver/slave-transmitter I/O
76 I/O P3.9 MTSR0 SSC0: master-transmitter/slave-receiver O/I
77 O P3.10 TxD0 ASC0: clock / data output (asynchronous/synchronous)
78 I/O P3.11 RxD0 ASC0: data input (asynchronous) or I/O (synchronous)
79 O P3.12 BHE
WRH
80 I/O P3.13 SCLK0 SSC0: master clock output / slave clock input
81 O P3.15 CLKOUT
External memory high byte enable signal
External memory high byte write strobe
System clock output (programmable divider on CPU clock)
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Pin data ST10F276E
Table 1. Pin description (continued)
Symbol Pin Type Function
Port 4 is an 8-bit bidirectional I/O port. It is bit-wise programmable for input or
output via direction bit. Programming an I/O pin as input forces the
corresponding output driver to high impedance state. The input threshold is
85-92 I/O
85 O P4.0 A16 Segment address line
86 O P4.1 A17 Segment address line
87 O P4.2 A18 Segment address line
88 O P4.3 A19 Segment address line
89 O P4.4 A20 Segment address line
P4.0 –P4.7
90 O P4.5 A21 Segment address line
91 O P4.6 A22 Segment address line
selectable (TTL or CMOS). Port 4.4, 4.5, 4.6 and 4.7 outputs can be configured
as push-pull or open drain drivers.
In case of an external bus configuration, Port 4 can be used to output the
segment address lines:
I CAN2_RxD CAN2: receive data input
I/O SCL
I2C Interface: serial clock
I CAN1_RxD CAN1: receive data input
I CAN2_RxD CAN2: receive data input
92 O P4.7 A23 Most significant segment address line
RD 95 O
/WRL 96 O
WR
READY/
READY
97 I
ALE 98 O
O CAN1_TxD CAN1: transmit data output
O CAN2_TxD CAN2: transmit data output
O CAN2_TxD CAN2: transmit data output
I/O SDA
External memory read strobe. RD
I2C Interface: serial data
is activated for every external instruction or
data read access.
External memory write strobe. In WR
external data write access. In WRL
-mode this pin is activated for every
mode this pin is activated for low byte data write accesses on a 16-bit bus, and for every data write access on an 8-bit bus. See WRCFG in the SYSCON register for mode selection.
Ready input. The active level is programmable. When the ready function is enabled, the selected inactive level at this pin, during an external memory access, will force the insertion of waitstate cycles until the pin returns to the selected active level.
Address latch enable output. In case of use of external addressing or of multiplexed mode, this signal is the latch command of the address lines.
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ST10F276E Pin data
Table 1. Pin description (continued)
Symbol Pin Type Function
External access enable pin. A low level applied to this pin during and after Reset forces the ST10F276E to
start the program from the external memory space. A high level forces ST10F276E to start in the internal memory space. This pin is also used (when
DD
DD
turned
EA / V
STBY
P0L.0 -P0L.7,
P0H.0
P0H.1 - P0H.7
99 I
100-107,
108,
111-117
Stand-by mode is entered, that is ST10F276E under reset and main V off) to bias the 32 kHz oscillator amplifier circuit and to provide a reference voltage for the low-power embedded voltage regulator which generates the internal 1.8V supply for the RTC module (when not disabled) and to retain data inside the Stand-by portion of the XRAM (16 Kbyte). It can range from 4.5 to 5.5V (6V for a reduced amount of time during the device life, 4.0V when RTC and 32 kHz on-chip oscillator amplifier are turned off). In running mode, this pin can be tied low during reset without affecting 32 kHz oscillator, RTC and XRAM activities, since the presence of a stable V guarantees the proper biasing of all those modules.
Two 8-bit bidirectional I/O ports P0L and P0H, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. The input threshold of Port 0 is selectable (TTL or CMOS). In case of an external bus configuration, PORT0 serves as the address (A) and as the address / data (AD) bus in multiplexed bus modes and as the data (D) bus in demultiplexed bus modes.
Demultiplexed bus modes
Data path width 8-bit 16-bi
I/O
P0L.0 – P0L.7: D0 – D7 D0 - D7
P0H.0 – P0H.7: I/O D8 - D15
P1L.0 - P1L.7
P1H.0 - P1H.7
Multiplexed bus modes
Data path width 8-bit 16-bi
P0L.0 – P0L.7: AD0 – AD7 AD0 - AD7
P0H.0 – P0H.7: A8 – A15 AD8 - AD15
Two 8-bit bidirectional I/O ports P1L and P1H, bit-wise programmable for input or output via direction bit. Programming an I/O pin as input forces the corresponding output driver to high impedance state. PORT1 is used as the 16­bit address bus (A) in demultiplexed bus modes: if at least BUSCONx is
118-125 128-135
configured such the demultiplexed mode is selected, the pis of PORT1 are not available for general purpose I/O function. The input threshold of Port 1 is
I/O
selectable (TTL or CMOS). The pins of P1L also serve as the additional (up to 8) analog input channels for
the A/D converter, where P1L.x equals ANy (Analog input channel y, where y = x + 16). This additional function have higher priority on demultiplexed bus function. The following PORT1 pins have alternate functions:
132 I P1H.4 CC24IO CAPCOM2: CC24 capture input
133 I P1H.5 CC25IO CAPCOM2: CC25 capture input
134 I P1H.6 CC26IO CAPCOM2: CC26 capture input
135 I P1H.7 CC27IO CAPCOM2: CC27 capture input
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Pin data ST10F276E
Table 1. Pin description (continued)
Symbol Pin Type Function
XTAL1 138 I XTAL1 Main oscillator amplifier circuit and/or external clock input.
XTAL2 137 O XTAL2 Main oscillator amplifier circuit output.
To clock the device from an external source, drive XTAL1 while leaving XTAL2 unconnected. Minimum and maximum high / low and rise / fall times specified in the AC Characteristics must be observed.
XTAL3 143 I XTAL3 32 kHz oscillator amplifier circuit input
XTAL4 144 O XTAL4 32 kHz oscillator amplifier circuit output
When 32 kHz oscillator amplifier is not used, to avoid spurious consumption, XTAL3 shall be tied to ground while XTAL4 shall be left open. Besides, bit OFF32 in RTCCON register shall be set. 32 kHz oscillator can only be driven by an external crystal, and not by a different clock source.
Reset Input with CMOS Schmitt-Trigger characteristics. A low level at this pin for a specified duration while the oscillator is running resets the ST10F276E. An
RSTIN
RSTOUT
NMI
140 I
141 O
142 I
internal pull-up resistor permits power-on reset using only a capacitor connected
. In bidirectional reset mode (enabled by setting bit BDRSTEN in
to V
SS
SYSCON register), the RSTIN
line is pulled low for the duration of the internal
reset sequence.
Internal Reset Indication Output. This pin is driven to a low level during hardware, software or watchdog timer reset.
RSTOUT
remains low until the EINIT
(end of initialization) instruction is executed.
Non-Maskable Interrupt Input. A high to low transition at this pin causes the CPU to vector to the NMI trap routine. If bit PWDCFG = ‘0’ in SYSCON register, when the PWRDN (power down) instruction is executed, the NMI pin must be low in order to force the ST10F276E to go into power down mode. If NMI is high and PWDCFG = ‘0’, when PWRDN is executed, the part will continue to run in normal mode. If not used, pin NMI
should be pulled high externally.
V
AREF
V
AGND
RPD 84 -
V
DD
37 - A/D converter reference voltage and analog supply
38 - A/D converter reference and analog ground
Timing pin for the return from interruptible power down mode and synchronous / asynchronous reset selection.
17, 46, 72,82,93, 109, 126,
136
Digital supply voltage = + 5V during normal operation, idle and power down
-
modes. It can be turned off when Stand-by RAM mode is selected.
18,45, 55,71,
V
SS
83,94,
- Digital ground
110, 127,
139
V
18
56 -
1.8V decoupling pin: a decoupling capacitor (typical value of 10nF, max 100nF) must be connected between this pin and nearest V
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SS
pin.
ST10F276E Functional description

3 Functional description

The architecture of the ST10F276E combines advantages of both RISC and CISC processors and an advanced peripheral subsystem. The block diagram gives an overview of the different on-chip components and the high bandwidth internal bus structure of the ST10F276E.

Figure 3. Block diagram

XFLASH
16
16
8
16
16
16
16 16
16 16
16 16
16
16
IFLASH 512 KB
XPWM
XCAN2
Controller
External Bus
320 KB
XRAM
48 KB
XRAM
16 KB
(STBY)
XRAM
2 KB
(PEC)
XI2C
XCAN1
Por t 0Por t 1Po rt 4
Por t 6
81615 8 8
XRTC
XASC
XSSC
16
16
Por t 5
32
CPU-Core and MAC Unit
Interrupt Controller
10-bit ADC
GPT1 / GPT2
BRG BRG
Port 3 Port 7 Por t 8
ASC0
SSC0
PEC
PWM
16
16
CAPCOM2
IRAM
2 KB
Watchdog
Oscillator
32 kHz
Oscillator
PLL
5V-1.8V
Vol tag e
Regulator
CAPCOM1
16
Por t 2
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Internal Flash memory ST10F276E

4 Internal Flash memory

4.1 Overview

The on-chip Flash is composed of two matrix modules, each one containing one array divided in two banks that can be read and modified independently of one another: one bank can be read while another bank is under modification.

Figure 4. Flash modules structure

IFLASH (Module I)
Bank 1: 128 Kbyte
program memory
Bank 0: 384 Kbyte
program memory
8 Kbyte test-Flash
+
I-BUS interface
The write operations of the four banks are managed by an embedded Flash program/erase controller (FPEC). The high voltages needed for program/erase operations are internally generated.
The data bus is 32-bit wide. Due to ST10 core architecture limitation, only the first 512 Kbytes are accessed at 32-bit (internal Flash bus, see I-BUS), while the remaining 320 Kbytes are accessed at 16-bit (see X-BUS).

4.2 Functional description

Control section
HV and Ref.
generator
Program/erase
controller
XFLASH (Module X)
Bank 3: 128 Kbyte
Bank 2: 192 Kbyte
X-BUS interface
program memory
program memory

4.2.1 Structure

Ta bl e 2 shows the address space reserved to the Flash module.
Table 2. Flash modules absolute mapping
Description Addresses Size
IFLASH sectors 0x00 0000 to 0x08 FFFF 512 Kbyte
XFLASH sectors 0x09 0000 to 0x0D FFFF 320 Kbyte
Registers and Flash internal reserved area 0x0E 0000 to 0x0E FFFF 64 Kbyte

4.2.2 Modules structure

The IFLASH module is composed of two banks. Bank 0 contains 384 Kbyte of program memory divided in 10 sectors. Bank 0 contains also a reserved sector named test-Flash.
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ST10F276E Internal Flash memory
Bank 1 contains 128 Kbyte of program memory or parameter divided in two sectors (64 Kbyte each).
The XFLASH module is composed of two banks as well. Bank 2 contains 192 Kbyte of program memory divided in three sectors. Bank 3 contains 128 Kbyte of program memory or parameter divided in two sectors (64 Kbyte each).
Addresses from 0x0E 0000 to 0x0E FFFF are reserved for the control register interface and other internal service memory space used by the Flash program/erase controller.
The following tables show the memory mapping of the Flash when it is accessed in read mode (Ta bl e 3 ), and when accessed in write or erase mode (Ta bl e 2 ): note that with this second mapping, the first three banks are remapped into code segment 1 (same as obtained when setting bit ROMS1 in SYSCON register).
Table 3. Flash modules sectorization (read operations)
Bank Description Addresses Size
Bank 0 Flash 0 (B0F0) 0x0000 0000 - 0x0000 1FFF 8 KB
Bank 0 Flash 1 (B0F1) 0x0000 2000 - 0x0000 3FFF 8 KB
Bank 0 Flash 2 (B0F2) 0x0000 4000 - 0x0000 5FFF 8 KB
Bank 0 Flash 3 (B0F3) 0x0000 6000 - 0x0000 7FFF 8 KB
B0
B1
B2
B3
Bank 0 Flash 4 (B0F4) 0x0001 8000 - 0x0001 FFFF 32 KB
Bank 0 Flash 5 (B0F5) 0x0002 0000 - 0x0002 FFFF 64 KB
Bank 0 Flash 6 (B0F6) 0x0003 0000 - 0x0003 FFFF 64 KB
Bank 0 Flash 7 (B0F7) 0x0004 0000 - 0x0004 FFFF 64 KB
Bank 0 Flash 8 (B0F8) 0x0005 0000 - 0x0005 FFFF 64 KB
Bank 0 Flash 9 (B0F9) 0x0006 0000 - 0x0006 FFFF 64 KB
Bank 1 Flash 0 (B1F0) 0x0007 0000 - 0x0007 FFFF 64 KB
Bank 1 Flash 1 (B1F1) 0x0008 0000 - 0x0008 FFFF 64 KB
Bank 2 Flash 0 (B2F0) 0x0009 0000 - 0x0009 FFFF 64 KB
Bank 2 Flash 1 (B2F1) 0x000A 0000 - 0x000A FFFF 64 KB
Bank 2 Flash 2 (B2F2) 0x000B 0000 - 0x000B FFFF 64 KB
Bank 3 Flash 0 (B3F0) 0x000C 0000 - 0x000C FFFF 64 KB
Bank 3 Flash 1 (B3F1) 0x000D 0000 - 0x000D FFFF 64 KB
ST10 bus
size
32-bit (I-BUS)
16-bit
(X-BUS)
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Internal Flash memory ST10F276E
Table 4. Flash modules sectorization (write operations or with ROMS1 = ‘1’)
Bank Description Addresses Size
Bank 0 Test-Flash (B0TF) 0x0000 0000 - 0x0000 1FFF 8 KB
Bank 0 Flash 0 (B0F0) 0x0001 0000 - 0x0001 1FFF 8 KB
Bank 0 Flash 1 (B0F1) 0x0001 2000 - 0x0001 3FFF 8 KB
Bank 0 Flash 2 (B0F2) 0x0001 4000 - 0x0001 5FFF 8 KB
Bank 0 Flash 3 (B0F3) 0x0001 6000 - 0x0001 7FFF 8 KB
B0
B1
B2
B3
Bank 0 Flash 4 (B0F4) 0x0001 8000 - 0x0001 FFFF 32 KB
Bank 0 Flash 5 (B0F5) 0x0002 0000 - 0x0002 FFFF 64 KB
Bank 0 Flash 6 (B0F6) 0x0003 0000 - 0x0003 FFFF 64 KB
Bank 0 Flash 7 (B0F7) 0x0004 0000 - 0x0004 FFFF 64 KB
Bank 0 Flash 8 (B0F8) 0x0005 0000 - 0x0005 FFFF 64 KB
Bank 0 Flash 9 (B0F9) 0x0006 0000 - 0x0006 FFFF 64 KB
Bank 1 Flash 0 (B1F0) 0x0007 0000 - 0x0007 FFFF 64 KB
Bank 1 Flash 1 (B1F1) 0x0008 0000 - 0x0008 FFFF 64 KB
Bank 2 Flash 0 (B2F0) 0x0009 0000 - 0x0009 FFFF 64 KB
Bank 2 Flash 1 (B2F1) 0x000A 0000 - 0x000A FFFF 64 KB
Bank 2 Flash 2 (B2F2) 0x000B 0000 - 0x000B FFFF 64 KB
Bank 3 Flash 0 (B3F0) 0x000C 0000 - 0x000C FFFF 64 KB
Bank 3 Flash 1 (B3F1) 0x000D 0000 - 0x000D FFFF 64 KB
ST10 Bus
size
32-bit (I-BUS)
16-bit
(X-BUS)
Ta bl e 4 above refers to the configuration when bit ROMS1 of SYSCON register is set. When
Bootstrap mode is entered:
Test-Flash is seen and available for code fetches (address 00’0000h)
User IFlash is only available for read and write accesses
Write accesses must be made with addresses starting in segment 1 from 01'0000h,
whatever ROMS1 bit in SYSCON value
Read accesses are made in segment 0 or in segment 1 depending of ROMS1 value.
In Bootstrap mode, by default ROMS1 = 0, so the first 32 Kbytes of IFlash are mapped in segment 0.
Example: In default configuration, to program address 0, user must put the value 01'0000h in the FARL and FARH registers, but to verify the content of the address 0 a read to 00'0000h must be performed.
Ta bl e 5 shows the control register interface composition: this set of registers can be
addressed by the CPU.
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ST10F276E Internal Flash memory
Table 5. Control register interface
Bank Description Addresses Size
FCR1-0 Flash control registers 1-0 0x000E 0000 - 0x000E 0007 8 byte
FDR1-0 Flash data registers 1-0 0x000E 0008 - 0x000E 000F 8 byte
FAR Flash address registers 0x000E 0010 - 0x000E 0013 4 byte
FER Flash error register 0x000E 0014 - 0x000E 0015 2 byte
FNVWPXR
FNVWPIR
FNVAPR0
FNVAPR1
XFICR XFlash interface control register 0x000E E000 - 0x000E E001 2 byte
Flash non-volatile protection X register
Flash non-volatile protection I register
Flash non-volatile access protection register 0
Flash non-volatile access protection register 1
0x000E DFB0 - 0x000E DFB3 4 byte
0x000E DFB4 - 0x000E DFB7 4 byte
0x000E DFB8 - 0x000E DFB9 2 byte
0x000E DFBC - 0x000E DFBF 4 byte
ST10
bus size
16-bit
(X-BUS)

4.2.3 Low power mode

The Flash modules are automatically switched off executing PWRDN instruction. The consumption is drastically reduced, but exiting this state can require a long time (t
Note: Recovery time from Power Down mode for the Flash modules is anyway shorter than the
main oscillator start-up time. To avoid any problem in restarting to fetch code from the Flash, it is important to size properly the external circuit on RPD pin.
PD
).
Power-off Flash mode is entered only at the end of the eventually running Flash write operation.

4.2.4 Write operation

The Flash modules have one single register interface mapped in the memory space of the XFlash module (0x0E 0000 to 0x0E 0013). All the operations are enabled through four 16-bit control registers: Flash Control Register 1-0 High/Low (FCR1H/L-FCR0H/L). Eight other 16­bit registers are used to store Flash Address and Data for Program operations (FARH/L and FDR1H/L-FDR0H/L) and Write Operation Error flags (FERH/L). All registers are accessible with 8 and 16-bit instructions (since mapped on ST10 XBUS).
Note: Before accessing the XFlash module (and consequently also the Flash register to be used
for program/erasing operations), bit XFLASHEN in XPERCON register and bit XPEN in SYSCON register shall be set.
The four banks have their own dedicated sense amplifiers, so that any bank can be read while any other bank is written. However simultaneous write operations (“write” means either Program or Erase) on different banks are forbidden: when there is a write operation on going (Program or Erase) anywhere in the Flash, no other write operation can be performed.
During a Flash write operation any attempt to read the bank under modification will output invalid data (software trap 009Bh). This means that the Flash bank is not fetchable when a write operation is active: the write operation commands must be executed from another
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Internal Flash memory ST10F276E
bank, or from the other module or again from another memory (internal RAM or external memory).
Note: During a Write operation, when bit LOCK of FCR0 is set, it is forbidden to write into the
Flash Control Registers.

4.2.5 Power supply drop

If during a write operation the internal low voltage supply drops below a certain internal voltage threshold, any write operation running is suddenly interrupted and the modules are reset to Read mode. At following Power-on, an interrupted Flash write operation must be repeated.

4.3 Registers description

4.3.1 Flash control register 0 low

The Flash control register 0 low (FCR0L) together with the Flash control register 0 high (FCR0H) is used to enable and to monitor all the write operations for both the Flash modules. The user has no access in write mode to the test-Flash (B0TF). Besides, test­Flash block is seen by the user in Bootstrap mode only.
FCR0L (0x0E 0000) FCR Reset value: 0000h
1514131211109876543210
Reserved BSY1 BSY0 LOCK Res. BSY3 BSY2 Res.
RRR RR
Table 6. Flash control register 0 low
Bit Function
Bank 3:2 Busy (XFLASH) These bits indicate that a write operation is running on the corresponding bank of
XFLASH. They are automatically set when bit WMS is set. Setting Protection operation sets bit BSY2 (since protection registers are in the Block B2). When these
BSY(3:2)
bits are set every read access to the corresponding bank will output invalid data (software trap 009Bh), while every write access to the bank will be ignored. At the end of the write operation or during a Program or Erase Suspend these bits are automatically reset and the bank returns to read mode. After a Program or Erase Resume these bits are automatically set again.
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ST10F276E Internal Flash memory
Table 6. Flash control register 0 low (continued)
Bit Function
Flash registers access locked When this bit is set, it means that the access to the Flash Control Registers FCR0H/-
FCR1H/L, FDR0H/L-FDR1H/L, FARH/L and FER is locked by the FPEC: any read access to the registers will output invalid data (software trap 009Bh) and any write
LOCK
BSY(1:0)
access will be ineffective. LOCK bit is automatically set when the Flash bit WMS is set. This is the only bit the user can always access to detect the status of the Flash: once it is found low, the rest of FCR0L and all the other Flash registers are accessible by the user as well. Note that FER content can be read when LOCK is low, but its content is updated only when also BSY bits are reset.
Bank 1:0 Busy (IFLASH) These bits indicate that a write operation is running in the corresponding bank of
IFLASH. They are automatically set when bit WMS is set. When these bits are set every read access to the corresponding bank will output invalid data (software trap 009Bh), while every write access to the bank will be ignored. At the end of the write operation or during a Program or Erase Suspend these bits are automatically reset and the bank returns to read mode. After a Program or Erase Resume these bits are automatically set again.

4.3.2 Flash control register 0 high

The Flash control register 0 high (FCR0H) together with the Flash control register 0 Low (FCR0L) is used to enable and to monitor all the write operations for both the Flash modules. The user has no access in write mode to the Test-Flash (B0TF). Besides, test­Flash block is seen by the user in Bootstrap mode only.
FCR0H (0x0E 0002) FCR Reset value: 0000h
1514131211109876543210
WMS SUSP WPG DWPG SER Reserved SPR SMOD Reserved
RW RW RW RW RW RW RW
Table 7. Flash control register 0 high
Bit Function
Select module
SMOD
SPR
If this bit is reset, the Write Operation is performed on XFLASH Module; if this bit is set, the Write Operation is performed on IFLASH Module. SMOD bit is automatically reset at the end of the Write operation.
Set protection This bit must be set to select the Set Protection operation. The Set Protection
operation allows to program 0s in place of 1s in the Flash Non-volatile Protection Registers. The Flash Address in which to program must be written in the FARH/L registers, while the Flash Data to be programmed must be written in the FDR0H/L before starting the execution by setting bit WMS. A sequence error is flagged by bit SEQER of FER if the address written in FARH/L is not in the range 0x0EDFB0­0x0EDFBF. SPR bit is automatically reset at the end of the Set Protection operation.
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Internal Flash memory ST10F276E
Table 7. Flash control register 0 high (continued)
Bit Function
Sector erase This bit must be set to select the Sector Erase operation in the Flash modules. The
Sector Erase operation allows to erase all the Flash locations to 0xFF. From 1 to all the
SER
DWPG
WPG
SUSP
WMS
sectors of the same bank (excluded Test-Flash for Bank B0) can be selected to be erased through bits BxFy of FCR1H/L registers before starting the execution by setting bit WMS. It is not necessary to pre-program the sectors to 0x00, because this is done automatically. SER bit is automatically reset at the end of the Sector Erase operation.
Double word program This bit must be set to select the Double Word (64 bits) Program operation in the Flash
modules. The Double Word Program operation allows to program 0s in place of 1s. The Flash Address in which to program (aligned with even words) must be written in the FARH/L registers, while the 2 Flash Data to be programmed must be written in the FDR0H/L registers (even word) and FDR1H/L registers (odd word) before starting the execution by setting bit WMS. DWPG bit is automatically reset at the end of the Double Word Program operation.
Word program This bit must be set to select the Word (32 bits) Program operation in the Flash
modules. The Word Program operation allows to program 0s in place of 1s. The Flash Address to be programmed must be written in the FARH/L registers, while the Flash Data to be programmed must be written in the FDR0H/L registers before starting the execution by setting bit WMS. WPG bit is automatically reset at the end of the Word Program operation.
Suspend This bit must be set to suspend the current Program (Word or Double Word) or Sector
Erase operation in order to read data in one of the sectors of the bank under modification or to program data in another bank. The Suspend operation resets the Flash bank to normal read mode (automatically resetting bits BSYx). When in Program Suspend, the two Flash modules accept only the following operations: Read and Program Resume. When in Erase Suspend the modules accept only the following operations: Read, Erase Resume and Program (Word or Double Word; Program operations cannot be suspended during Erase Suspend). To resume the suspended operation, the WMS bit must be set again, together with the selection bit corresponding to the operation to resume (WPG, DWPG, SER). Note: It is forbidden to start a new Write operation with bit SUSP already set.
Write mode start This bit must be set to start every write operation in the Flash modules. At the end of
the write operation or during a Suspend, this bit is automatically reset. To resume a suspended operation, this bit must be set again. It is forbidden to set this bit if bit ERR of FER is high (the operation is not accepted). It is also forbidden to start a new write (program or erase) operation (by setting WMS high) when bit SUSP of FCR0 is high. Resetting this bit by software has no effect.
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