The RHF1401 is a 14-bit analog-to-digital
converter that uses pure (ELDRS-free) CMOS
0.25 µm technology combining high performance,
radiation robustness and very low power
consumption.
Table 1.Device summary
Ceramic SO-48 package
The upper metallic lid is not electrically connected to any
pins, nor to the IC die inside the package.
The RHF1401 is based on a pipeline structure
and digital error correction to provide excellent
static linearity. Specifically designed to optimize
power consumption, the device only dissipates
85 mW at 20 Msps, while maintaining a high level
of performance. The device also integrates a
proprietary track-and-hold structure to ensure a
large effective resolution bandwidth.
Voltage references are integrated in the circuit to
simplify the design and minimize external
components. A tri-state capability is available on
the outputs to allow common bus sharing. A dataready signal, which is raised when the data is
valid on the output, can be used for
synchronization purposes.
The RHF1401 has an operating temperature
range of -55° C to +125° C and is available in a
small 48-pin ceramic SO-48 package.
Order codeSMD pin
RHF1401KSO1-
RHF1401KSO-01V 5962F0626001VXC QMLV-Flight
April 2012Doc ID 13317 Rev 71/39
This is information on a product in full production.
23GNDBEDigital buffer ground0 V47DGNDDigital ground0 V
24VCCBI
Digital buffer power
supply
Most significant bit
output
Digital buffer power
supply
Digital buffer power
supply
2.5 V/3.3 V27DFSBData format select input
Not connected to the
dice
Not connected to the
dice
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5V /3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(2.5 V/3.3 V)
CMOS output
(1)
(2.5 V/3.3 V)
2.5 V/3.3 V46CLKClock input
2.5 V48DGNDDigital ground0 V
28AVCCAnalog power supply2.5 V
29AVCCAnalog power supply2.5 V
30AGNDAnalog ground0 V
31IPOLAnalog bias current input
32VREFPTop voltage reference
33VREFMBottom voltage reference 0 V
34AGNDAnalog ground0 V
35VINAnalog input1 V
36AGNDAnalog ground0 V
37VINBInverted analog input1 V
38AGNDAnalog ground0 V
39INCMInput common mode
40AGNDAnalog ground0 V
41AVCCAnalog power supply2.5 V
42AVCCAnalog power supply2.5 V
43DVCCDigital power supply2.5 V
44DVCCDigital power supply2.5 V
45DGNDDigital ground0 V
1. See load considerations in Chapter 2.2: Timing characteristics.
2.5 V/3.3 V CMOS
input
2.5 V/3.3 V CMOS
input
2.5 V/3.3 V CMOS
input
Can be external or
internal
pp
pp
Can be external or
internal
2.5 V compatible
CMOS input
6/39Doc ID 13317 Rev 7
RHF1401Description
1.4 Equivalent circuits
Figure 3.Analog inputsFigure 4.Output buffers
AVCC
VIN or VINB
7 pF
(pad)
OEB
AGND
Data
AVCC
AGND
AM04557
Figure 5.Clock inputFigure 6.Data format input
VCCBE
CLK
DVCC
DFSB
VCCBE
GNDBE
D0 …D13
7 pF
(pad)
AM04558
7 pF
(pad)
DGND
AM04559
7 pF
(pad)
GNDBE
Figure 7.Reference mode control inputFigure 8.Output enable input
REFMODE
7 pF
(pad)
VCCBE
GNDBE
AM04561
OEB
7 pF
(pad)
VCCBE
GNDBE
AM04560
AM04562
Doc ID 13317 Rev 77/39
DescriptionRHF1401
Figure 9.VREFP and INCM input
AVCC
AVCC
VREFP
7 pF
(pad)
AGND
Figure 10. VREFM input
INCM
7 pF
REFMODEREFMODE
High input impedance
VREFM
7 pF
(pad)
(pad)
AGND
AVCC
AGND
AM04564
AM04563
8/39Doc ID 13317 Rev 7
RHF1401Electrical characteristics
2 Electrical characteristics
2.1 Absolute maximum ratings and operating conditions
Table 3.Absolute maximum ratings
SymbolParameterValuesUnit
AV
CC
DV
CC
V
CCBI
V
CCBE
V
IN
V
INB
V
REFP
V
INCM
I
Dout
T
stg
R
thjc
R
thja
ESDHBM (human body model)
1. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a
1.5 kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations
while the other pins are floating.
Analog supply voltage3.3V
Digital supply voltage3.3V
Digital buffer supply voltage3.3V
Digital buffer supply voltage3.6V
Analog inputs: bottom limit −> top limit-0.6 V −> AVCC+0.6 VV
External references: bottom limit −> top limit-0.6 V −> AVCC+0.6 VV
Digital output current-100 to 100mA
Storage temperature-65 to +150°C
Thermal resistance junction to case22°C/W
Thermal resistance junction to ambient125°C/W
(1)
2kV
Table 4.Operating conditions
SymbolParameterMinTypMaxUnit
AV
CC
DV
CC
V
CCBI
V
CCBE
V
REFP
V
REFM
V
INCM
V
IN
V
INB
DFSB
OEB
1. See Figure 25. for differential input andFigure 42.toFigure 49.for single-ended.
Analog supply voltage2.32.52.7V
Digital supply voltage2.32.52.7V
Digital internal buffer supply2.32.52.7V
Digital output buffer supply2.32.53.4V
Forced top voltage reference0.811.4V
Bottom external reference voltage000.5V
Forced common mode voltage0.20.51.1V
Max. voltage versus GND11.6
(1)
Min. voltage versus GND-0.2GNDV
Digital inputs 0V
CCBE
V
VREFMODE
Doc ID 13317 Rev 79/39
Electrical characteristicsRHF1401
2.2 Timing characteristics
Table 5.Timing characteristics
SymbolParameterTest conditionsMinTypMaxUnit
DCClock duty cycle
T
T
T
T
T
T
Data output delay (fall of
od
clock to data valid)
Data pipeline delay
pd
Falling edge of OEB to
on
digital output valid data
Rising edge of OEB to
off
digital output tri-state
Data rising time10 pF load capacitance6ns
rD
Data falling time10 pF load capacitance3ns
fD
(1)
(2)
F
= 20 Msps455065%
s
10 pF load capacitance57.513ns
Duty cycle = 50%7.57.57.5cycles
1. As per Figure 11.
2. If the duty cycle does not equal 50%: Tpd = 7 cycles + CLK pulse width.
Figure 11. Timing diagram
N+6
N+5
N+4
Analog
input
N-2
N-1
N
N+1
N+3
N+2
1ns
1ns
N+7
N+8
CLK
Tpd+ Tod
Tod
OEB
Data
output
DR
OR
Tod
N-8 N-7 N-6NN-5 N -4N+1N-3N-1
The input signal is sampled on the rising edge of the clock while the digital outputs are
synchronized on the falling edge of the clock. The duty cycles on DR and CLK are the same.
The rising and falling edges of the OR pin are synchronized with the falling edge of the DR
pin.
10/39Doc ID 13317 Rev 7
ToffTon
HZ state
AM06120
RHF1401Electrical characteristics
2.3 Electrical characteristics (after 300 kRad)
Unless otherwise specified, the test conditions in the following tables are:
AVCC = DVCC = VCCBI =VCCBE = 2.5 V, F
VREFP = 1V, INCM = 0.5V, VREFM = 0 V, T
Table 6.Analog inputs
SymbolParameterTest conditionsMinTypMaxUnit
=20 Msps, FIN= 15 MHz, V
s
= 25°C.
amb
at -1 dBFS,
IN
V
IN-VINB
C
Z
Full-scale reference voltage
(1)
(FS)
Input capacitance7pF
IN
Input impedanceFs = 20 Msps3.3kΩ
IN
ERBEffective resolution bandwidth
1. See Chapter 4: Definitions of specified parameters on page 33 for more information.
Table 7.Internal reference voltage
VREFP = 1 V
(forced)
VREFM = 0 V
(1)
2V
70MHz
SymbolParameterTest conditionsMinTypMaxUnit
REFMODE = 0
internal reference
R
Output resistance of internal
out
reference
on
REFMODE = 1
internal reference
30Ω
7.5kΩ
off
V
REFP
V
INCM
1. V
REFM
Table 8.External reference voltage
Top internal reference voltage
Input common mode voltageREFMODE = 00.400.440.50V
connected to GND.
(1)
REFMODE = 00.760.840.95V
(1)
pp
SymbolParameterTest conditionsMinTypMaxUnit
V
REFP
V
REFM
V
INCM
1. See Figure 59.& Figure 60
Table 9.Static accuracy
Forced top reference voltageREFMODE = 10.81.4V
Forced bottom ref voltageREFMODE = 100.5V
Forced common mode voltageREFMODE = 10.21.1V
SymbolParameterTest conditionsMinTypMaxUnit
(2)
(1)
Fin= 1.5 Msps
±0.4LSB
Vin at -1 dBFS
Fs=1.5 Msps
±3LSB
Guaranteed
DNLDifferential non-linearity
INLIntegral non-linearity
Monotonicity and no missing
codes
1. See Figure 33 and Chapter 4 for more information. This parameter is not tested.
2. See Figure 34 and Chapter 4 for more information. This parameter is not tested.
Doc ID 13317 Rev 711/39
Electrical characteristicsRHF1401
Table 10.Digital inputs and outputs
SymbolParameterTest conditionsMinTypMaxUnit
Clock input
CTClock thresholdDV
CA
Square clock amplitude
(DC component = 1.25 V)
= 2.5 V1.25V
CC
DV
= 2.5 V0.82.5Vpp
CC
Digital inputs
V
IL
V
IH
Logic "0" voltageV
Logic "1" voltageV
= 2.5 V0
CCBE
= 2.5 V
CCBE
0.75 x
V
CCBE
0.25 x
V
CCBE
V
CCBE
Digital outputs
V
OL
V
OH
I
OZ
C
L
Table 11.Dynamic characteristics
Logic "0" voltageI
= -10 µA00.25V
OL
Logic "1" voltageIOH = 10 µA
High impedance leakage
current
Output load capacitance
OEB set to V
High CLK
frequencies
V
CCBE
-0.25
IH
-1515µA
15pF
SymbolParameterTest conditionsMinTypMaxUnit
SFDRSpurious free dynamic range
SNRSignal to noise ratio6670dB
THDTotal harmonic distortion7086dB
SINAD
Signal to noise and distortion
ratio
F
= 15 MHz
in
= 20 Msps
F
s
V
at -1 dBFS
in
internal references
= 6 pF
C
L
7091dBFS
6570dB
ENOBEffective number of bits10.611.5bits
V
V
V
Higher values of SNR, SINAD and ENOB can be obtained by increasing the full-scale range
of the analog input if the sampling frequency allows it.
12/39Doc ID 13317 Rev 7
RHF1401Electrical characteristics
G
2.4 Results for differential input
Setup
●AVCC = DVCC = VCCBI = VCCBE = 2.5V
●VREFP = 1 V
●VREFM = 0 V
●INCM = Vin/2
●REFMODE = 1 (internal references are disabled)
●Vin = full scale - 0.3 dB
●Ta mb = 2 5 C °
●A square clock is applied
Unless other test conditions are specified.
Figure 12. Differential configuration
External 1V
REFP
GENERATOR
ENERATOR
Dierential
input signal
C
f
VIN
2.5 V
VCCBE
VCCBI
AVCC
DVCC
VOCM
VOCM
External
C
is a filter capacitor to cut the HF noise. Its value is 10 nF for input frequencies equal to or
f
INCM
VINB
REFM
Ground
AM04565
below 20 kHz. The value of the capacitor is divided by two when the input frequency is
multiplied by 2.
Doc ID 13317 Rev 713/39
Electrical characteristicsRHF1401
1 M
Figure 13. ENOB vs. input frequencyFigure 14. SINAD vs. input frequency
12
11.6
11.2
Fs =
10 ksps
ENOB (bits)
10.8
100 ksps
1 Msps
10.4
10
10E+0100E+01E+310E+3100E+31E+610E+6100E+6
10 Msps
30 Msps
Input frequency
-60
-62
-64
-66
-68
SINA D (dB)
-70
-72
-74
-76
1E+11E+21E+31E+41E+51E+61E+71E+8
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
30 Msps
Input freq uenc y
Figure 15. THD vs. input frequencyFigure 16. SNR vs. input frequency
-60
Fs =
-65
10 ksps
100 ksps
1 Msps
-70
10 Msps
30 Msps
-75
THD (dB)
-80
-85
76
74
72
70
68
SNR (dB)
66
64
62
Fs =
10 ksps
100 ksps
sps
10 Msps
30 Msps
-90
1E+11E+21E+31E+41E+51E+61E+71E+8
Input frequency
60
1E+11E+21E+31E+41E+51E+61E+71E+8
Input frequenc y
Figure 17. SFDR vs. input frequencyFigure 18. Consumption vs. input frequency
90
85
80
75
SFDR (dB)
70
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
65
60
1E+11E+21E+31E+41E+51E+61E+71E+8
30 Msps
Input frequency
120
110
100
90
80
70
er cons umption (mW)
60
Po
50
40
30
1E+11E+21E+31E+41E+51E+61E+71E+8
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
30 Msps
Input frequency
14/39Doc ID 13317 Rev 7
RHF1401Electrical characteristics
50 kHz
50 kHz
50 kH
o
Figure 19. ENOB vs. sampling frequencyFigure 20. SINAD vs. sampling frequency
12
11.5
11
ENOB (bits)
10.5
10
1E+41E+51E+61E+71E+8
Fin =
10 Hz
1 kHz
2 MHz
10 MHz
S ampling frequenc y
-60
-62
-64
Fin =
10 Hz
1 kHz
-66
-68
SINAD (dB)
50 kHz
2 MHz
10 MHz
-70
-72
-74
1E+41E+51E+61E+71E+8
Sampling frequency
Figure 21. THD vs. sampling frequencyFigure 22. SNR vs. sampling frequency
-60
-65
Fin =
10 Hz
-70
1 kHz
50 kHz
2 MHz
-75
THD (dB)
10 MHz
-80
-85
76
74
72
70
68
SNR (dB)
66
64
62
Fin =
10 Hz
1 kHz
2 MHz
10 MHz
-90
1E+41E+51E+61E+71E+8
S ampling frequency
60
1E+41E+51E+61E+71E+8
S ampling frequenc y
Figure 23. SFDR vs. sampling frequencyFigure 24. Power consumption vs. sampling
frequency
90
85
80
75
SFDR (dB)
70
65
60
1E+41E+51E+61E+71E+8
Fin =
10 Hz
1 kHz
2 MHz
10 MHz
z
S ampling frequency
180
160
140
120
100
80
wer cons umption (mW)
P
60
40
20
1E+41E+51E+61E+71E+8
Fin =
10 Hz
1 kHz
50 kHz
2 MHz
10 MHz
S ampling frequency
Doc ID 13317 Rev 715/39
Electrical characteristicsRHF1401
1 Msps
Figure 25. ENOB vs. VREFPFigure 26. SINAD vs. VREFP
12.5
12
11.5
11
Fs =
10 ksps
ENOB (bits)
10.5
100 ksps
10 Msps
10
20 Msps
25 Msps
30 Msps
9.5
0.80.911.11.21.31.4
35 Msps
External Vrefp (V)
-50
Fs =
10 ksps
-55
100 ksps
1 Msps
10 Msps
-60
20 Msps
25 Msps
30 Msps
35 Msps
-65
SINAD (dB)
-70
-75
-80
0.80.911.11.21.31.4
External Vrefp (V )
Figure 27. SNR vs. VREFPFigure 28. THD vs. VREFP
80
75
70
Fs =
10 ksps
65
SNR (dB)
60
55
0.80.911.11.21.31.4
100 ksps
1 Msps
10 Msps
20 Msps
25 Msps
30 Msps
35 Msps
External Vrefp (V )
-50
-55
-60
-65
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
20 Msps
25 Msps
30 Msps
35 Msps
-70
THD (dB)
-75
-80
-85
-90
0.80.911.11.21.31.4
External Vrefp (V )
Figure 29. ENOB vs. sine clock, diff. inputFigure 30. Clock threshold vs. temperature
12
11.5
11
ENOB (bits)
10.5
10
1 Msps10 Msps100 Msps
Sampling frequency
Fin =
10 Hz
1 kHz
50 kHz
2 MHz
10 MHz
16/39Doc ID 13317 Rev 7
RHF1401Electrical characteristics
10 k
e
100 k
Figure 31. ENOB vs. temperature Figure 32. Power consumption vs. temp.
is a filter capacitor to cut the HF noise. Its value is 10 nF for input frequencies equal to or
f
input signal
C
External
f
INCM
below 20 kHz. The value of the capacitor is divided by two when the input frequency is
multiplied by 2.
18/39Doc ID 13317 Rev 7
RHF1401Electrical characteristics
100ksps
Figure 36. ENOB vs. Fin, single-endedFigure 37. SINAD vs. Fin, single-ended
11.5
11
10.5
10
ENOB (bits)
9.5
9
1E+11E+21E+31E+41E+51E+61E+71E+8
Fs =
10 ksps
1 Msps
10 Msps
30 Msps
Input frequency
-50
Fs =
10 ksps
-55
-60
SINAD (dB )
-65
-70
1E+11E+21E+31E+41E+51E+61E+71E+8
100 ksps
1 Msps
10 Msps
30 Msps
Input frequenc y
Figure 38. THD vs. Fin, single-endedFigure 39. SNR vs. Fin, single-ended
-55
-60
-65
-70
THD (dB)
-75
-80
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
30 Msps
70
67
64
SNR (dB)
61
58
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
30 Msps
-85
1E+11E+21E+31E+41E+51E+61E+71E+8
Input frequency
55
1E+11E+21E+31E+41E+51E+61E+71E+8
Input frequency
Figure 40. SFDR vs. Fin, single-endedFigure 41. Power consumption vs. Fin
85
80
75
70
SFDR (dB)
65
60
55
1E+11E+21E+31E+41E+51E+61E+71E+8
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
30 Msps
Input frequency
120
100
Fs =
80
60
er cons umption (mW )
Po
40
20
1E+11E+21E+31E+41E+51E+61E+71E+8
10 ksps
100 ksps
1 Msps
10 Msps
30 Msps
Input frequency
Doc ID 13317 Rev 719/39
Electrical characteristicsRHF1401
100 k
Fs =
Figure 42.ENOB vs. Vin, Fin 1 kHz, Vrefp = 0.8 VFigure 43.ENOB vs Vin, Fin = 2 MHz, Vrefp = 0.8 V
11.5
Fin = 1 kHz - VREFP=0.8V
11.0
10.5
10.0
ENOB (bits)
9.5
9.0
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
20 Msps
25 Msps
30 Msps
1.01.11.21.31.41.51.6
Vin (Vpp)
11.5
Fin = 2MHz - VR EFP=0.8V
11.0
10.5
10.0
ENOB (bits)
Fs =
2 Msps
10 Msps
9.5
20 Msps
25 Msps
30 Msps
9.0
1.01.11.21.31.41. 51.6
Vin (Vpp)
Figure 44.ENOB vs. Vin, Fin 1 kHz, Vrefp = 1.0 VFigure 45.ENOB vs Vin, Fin = 2 MHz, Vrefp = 1.0 V
11.5
Fin = 1kHz - VREFP=1.0V
11.0
10.5
11.5
Fin = 2MHz - VREFP=1.0V
11.0
10.5
10.0
ENOB (bits)
9.5
9.0
Fs =
10 ksps
sps
1 Msps
10 Msps
20 Msps
25 Msps
30 Msps
1.01.11.21.31.41.51.6
Vin (Vpp)
10.0
ENOB (bits)
9.5
9.0
Fs =
2 Msps
10 Msps
20 Msps
25 Msps
30 Msps
1.01.11.21.31.41.51.6
Vin (Vpp)
Figure 46.ENOB vs. Vin, Fin 1 kHz, Vrefp = 1.2 VFigure 47.ENOB vs Vin, Fin = 2 MHz, Vrefp = 1.2 V
11.5
Fin = 1kHz - VREFP=1.2V
11.0
10.5
10.0
ENOB (bits)
9.5
9.0
Fs =
10 ksps
100ksps
1 Msps
10 Msps
20 Msps
25 Msps
30 Msps
1.01.11.21.31.41.51.6
Vin (Vpp)
11.5
F in = 2 MH z - V R E FP =1.2 V
11.0
10.5
ENOB (bits)
10.0
2 Msps
10 Msps
9.5
20 Msps
25 Msps
30 Msps
9.0
1.01.11.21.31.41.51.6
Vin (Vpp)
20/39Doc ID 13317 Rev 7
RHF1401Electrical characteristics
Figure 48.ENOB vs. Vin, Fin 1 kHz, Vrefp = 1.4 VFigure 49.ENOB vs Vin, Fin = 2 MHz, Vrefp = 1.4 V
11.5
Fin = 1kHz - VREFP=1.4V
11.0
10.5
10.0
ENOB (bits)
9.5
9.0
1.01.11.21.31.41.51.6
Vin (Vpp)
Fs =
10 ksps
100 ksps
1 Msps
10 Msps
20 Msps
25 Msps
30 Msps
11.5
Fin = 2MHz - VR EFP=1.4V
11.0
10.5
10.0
ENOB (bits)
9.5
9.0
1.01.11.21.31.41.51.6
Fs =
2 Msps
10 Msps
20 Msps
25 Msps
30 Msps
Vin (V pp)
Doc ID 13317 Rev 721/39
User manualRHF1401
3 User manual
3.1 Optimizing the power consumption
The polarization current in the input stage is set by an external resistor (R
). When
pol
selecting the resistor value, it is possible to optimize the power consumption according to
the sampling frequency of the application. For this purpose, an external R
resistor is
pol
placed between the IPOL pin and the analog ground.
The values in Figure 50 are achieved with VREFP = 1 V, VREFM = 0 V, INCM = 0.5 V and
the input signal is 2 Vpp with a differential DC connection. If the conditions are changed, the
Rpol resistor varies slightly.
Figure 50 shows the optimum Rpol resistor value to obtain the best ENOB value. It also
shows the minimum and maximum values to get good results. ENOB decreases by
approximately 0.2 dB when you change Rpol from optimum to maximum or minimum.
If Rpol is higher than the maximum value, there is not enough polarization current in the
analog stage to obtain good results. If Rpol is below the minimum, THD increases
significantly.
Therefore, the total dissipation can be adjusted across the entire sampling range to fulfill the
requirements of applications where power saving is critical.
For sampling frequencies below 2 MHz, the optimum resistor value is approximately
400 kOhms.
Figure 50. Rpol values vs. F
1000
S
max im um
optimum
minimum
100
is tor (k Ohms )
10
R pol res
1
0510152025303540
S ampling frequenc y (Ms ps )
The power consumption depends on the Rpol value and the sampling frequency. In
Figure 51, it is shown with the internal references disabled (REFMODE = 1) and Rpol
defined in Figure 50 as the optimum.
22/39Doc ID 13317 Rev 7
RHF1401User manual
o
Figure 51. Power consumption values vs. Fs with internal references disabled
200
180
160
140
120
100
nsumption (mW)
80
60
40
Power c
20
0
0510152025303540
S ampling frequency (MHz)
Doc ID 13317 Rev 723/39
User manualRHF1401
3.2 Driving the analog input
The input frequency can range from DC to tens of MHz.
The input stages (VIN and VINB) have a special design that limits the input amplitude. For
each of them, the maximum input voltage is 1.6 V for low sampling frequencies and less for
high sampling frequencies. The low voltage is ground.
In differential mode, high sampling limitation is seen in Figure 25.
For all input frequencies,it is mandatory to add a capacitor on the PCB (between VIN and
VINB) to cut the HF noise. The lower the frequency, the higher the capacitor.
The full-scale range is twice the difference between Vrep and Vrefm.
The RHF1401 is designed to obtain optimum performance when driven on differential inputs
with a differential amplitude of two volts peak-to-peak (2 V
). This is the result of 1 Vpp on
pp
the VIN and VINB inputs in phase opposition.
The RHF1401 is specifically designed to meet sampling requirements forintermediate
frequency (IF)input signals. In particular, the track-and-hold in the first stage of the pipeline
is designed to minimize the linearity limitations as the analog frequency increases.
24/39Doc ID 13317 Rev 7
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V
Figure 53. 2 Vpp differential input
1 V
INCM
1 Vp -p
VIN
REFP
REFMODE
2.5
INCM
1 Vp -p
VIN -VINB (2 Vp-p)
VINB
INCM
0.5V
REFM
Ground
AM04570
Figure 54 shows a differential input solution. The input signal is fed to the transformer’s
primary, while the secondary drives both ADC inputs. The transformer must be matched
with generator output impedance: 50 Ω in this case for proper matching with a 50 Ω
generator. The tracks between the secondary and VIN and VINB pins must be as short as
possible.
Figure 54. Differential implementation using a balun
50 Ω track
Analog input signal
(50 Ω output)
ADT1 -1
1:1
Short track
33 pF
VIN
50 Ω
VINB
INCM
External
470 nF* ceramic
(as close as possible
to the transformer)
*the use of a ceramic technology is
preferable for a large bandwidth
stability of the capacitor
100 nF* ceramic
(as close as
possible to
INCM pin)
INCM
(optional)
AM04571
The input common-mode voltage of the ADC (INCM) is connected to the center tap of the
transformer’s secondary in order to bias the input signal around the common voltage (see
Table 7 on page 11).The INCM is decoupled to maintain a low noise level on this node.
Ceramic technology for decoupling provides good capacitor stability across a wide
bandwidth.
The RHF1401 is designed for use in a differential input configuration. Nevertheless, it can
achieve good performance in a single-ended input configuration.In single-ended,
performances depend on the input voltage, input frequency, voltage of references and
sampling frequency (refer to Figure 42.toFigure 49.)
Some applications may require a single-ended input, which can easily be achieved with the
configuration shown in Figure 56. However, with this type of configuration, a degradation in
the rated performance of the RHF1401 may occur compared with a differential
configuration. A sufficiently decoupled DC reference should be used to bias the RHF1401
inputs. An AC-coupled analog input can also be used and the DC analog level set with a
high value resistor R (6 kΩ to 100 kΩ) connected to a proper DC source. Cin and R behave
like a high-pass filter and are calculated to set the lowest possible cut-off frequency.
100 nF ceramic*
(as close as possible
to INCM pin)
External INCM
(optional)
AM04572
470 pF
ceramic*
Short track
100 nF
ceramic*
*the use of a ceramic technology is
preferable for a large bandwidth
stability of the capacitor
Figure 57. AC-coupling single-ended input configuration for low frequencies
50 Ω track
Analog input signal
(50 Ω output)
50 Ω
Cin
C
Short track
R
R
Short track
VIN
INCM
VINB
*ceramic technology for a large
bandwidth stability of the capacitor
100 nF ceramic*
(as close as possible
to INCM pin)
External INCM
(optional)
AM04573
The C capacitor is efficient in reducing noise at high frequencies. When coupled with the
resistors, R and C together behave like a high-pass filter. For example, if R = 10 k and
C = 33 pF, the cut-off frequency of this filter equals 482 kHz.
Doc ID 13317 Rev 727/39
User manualRHF1401
INCM
3.3 Reference connections
3.3.1 Internal references
In the standard configuration, the ADC is biased with two internal reference voltages. There
are two voltage references: VREFP and INCM. They should be decoupled to minimize low
and high frequency noise. Both are enabled when the REFMODE pin is set to 0.
The VREFM pin has no internal reference and must be connected to a voltage reference. It
is usually connected to the analog ground.
Figure 58. Internal reference setting
As close as possible
to the ADC pins
3.3.2 External references
External reference voltages can be used for specific applications requiring even better
linearity or enhanced temperature behavior or different voltage values (see Table 7: Internal
reference voltage on page 11). Internal references are disabled when the REFMODE pin is
equal to 1. In this case, external references must be applied to the device.
The external voltage references with the configuration shown in Figure 59 and Figure 60
can be used to obtain optimum performance. Decoupling is achieved by using ceramic
capacitors, which provide optimum linearity versus frequency.
VIN
VINB
REFMODE
VREFP
INCM
VREFM
100 nF*
100 nF*
*the use of a cerami c technology is
preferable for a large bandwidth
stability of the capacitor.
470 nF*
470 nF*
AM04574
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RHF1401User manual
Figure 59. External reference settingFigure 60. Example with zeners
VIN
VINB
REFMODE
VCCA VREFP
INCM
VREFM
As close as possible
to the ADC pins
100 nF*
100 nF*
470 nF*
470 nF*
DC
source
DC
source
AM04575
VIN
VINB
As close as possible
As close as possible
to the ADC pins
to the ADC pins
VCCA VREFP
INCM
REFMODE
VREFM
100 nF*
100 nF*
100 nF*
100 nF*
R
R1
R2
470 nF*
470 nF*
470 nF*
470 nF*
AM04576
Note:*The use of ceramic technology is preferable to ensure large bandwidth stability of the
capacitor.
In multi-channel applications, the high impedance input (when REFMODE = 1) of the
references allows one to drive several ADCs with only two voltage reference devices.
The voltage of the analog input common mode (INCM) should stay close to V
REFP
/2. Higher
levels introduce more distortion.
Doc ID 13317 Rev 729/39
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3.4 Clock input
The quality of the converter very much depends on the accuracy of the clock input in terms
of jitter. The use of a low-jitter, crystal-controlled oscillator is recommended.
The following points should also be considered.
●The clock’s power supplies must be independent of the ADC’s output supplies to avoid
digital noise modulation at the output.
●When powered-on, the circuit needs several clock periods to reach its normal operating
conditions.
Figure 61. Clock input schematic
Square clock
DVcc/2
Sine clock
DVcc/2
CLK
Short track
50 Ω clock generator
50 Ω
CLK
Short track
50 Ω
AM04577
The signal applied to the CLK pin is critical to obtain full performance from the RHF1401.
Below 10 MHz, the sine clock does not have transition times fast enough to achieve good
performances. It is recommended to use a square signal with fast transition times and to
place proper termination resistors as close as possible to the device.
The sampling instant is determined by the clock signal’s rising edge. The jitter associated
with this instant must be as low as possible to avoid SNR degradation on fast moving input
signals. To make sure any error is less than 0.5 LSB, the total jitter T
must satisfy the
j
following condition for a full-scale input signal.
j
πF
⋅⋅
n1+
2
in
1
-------------------------------------- -
<
T
For example, the total jitter with a 14-bit resolution for a 10 MHz full-scale input should be no
more than 1 picosecond (rms).
In most cases, the clock signal jitter is responsible for noise. Therefore, you must pay
attention to the clock signal when fast signals are acquired with a low frequency clock.
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3.5 Operating modes
Extra functionalities are provided to simplify the application board as much as possible. The
operating modes offered by the RHF1401 are described in Tab le 1 3.
Table 13.RHF1401 operating modes
InputsOutputs
Analog input differential
amplitude
(V
(V
(VIN-V
XXHHZ
1. High impedance.
) above maximum range
IN-VINB
) below minimum range
IN-VINB
) within range
INB
3.5.1 Digital inputs
Data format select bit (DFSB): when set to low level (VIL), the digital input DFSB provides
a two’s complement digital output MSB. This can be of interest when performing some
further signal processing. When set to high level (V
output coding.
Output enable bit (OEB): when set to low level (V
set to high level (V
converter goes on sampling. When OEB is set to a low level again, the data arrives on the
output with a very short T
Figure 11 on page 10 summarizes this functionality.
DFSB OEBORDRMost significant bit (MSB)
HLHCLKD13
LLHCLK D13 complemented
HLHCLKD13
LLHCLK D13 complemented
HLLCLKD13
LLLCLK D13 complemented
(1)
IH
), all digital outputs remain active. When
), all digital output buffers are in a high impedance state while the
IH
delay. This feature enables the chip select of the device.
on
IL
HZ (all digital outputs are in high
HZ
impedance)
), DFSB provides standard binary
Reference mode control (REFMODE): this allows the internal or external settings of the
voltage references VREFP and INCM. REFMODE = 0 for internal references,
REFMODE = 1 for external references (and disables both references VREFP and INCM).
3.5.2 Digital outputs
Out of range (OR): this function is implemented on the output stage in order to set an "out-
of-range" flag whenever the digital data is over the full-scale range. Typically, there is a
detection of all data at ‘0’ or all data at ‘1’. It sets an output signal OR, which is in a low level
state (V
data is out of range.
Data ready (DR): the Data Ready output is an image of the clock being synchronized on the
output data (D0 to D13). This is a very helpful signal that simplifies the synchronization of
the measurement equipment of the controlling DSP. Like all other digital outputs, DR goes
into high impedance when OEB is set to a high level, as shown in Figure 11 on page 10.
) when the data stays within the range, or in a high-level state (VOH) when the
OL
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3.5.3 Digital output load considerations
The features of the internal output buffers limit the maximum load on the digital data output.
In particular, the shape and amplitude of the Data Ready signal, toggling at the clock
frequency, can be weakened by a higher equivalent load.
In applications that impose higher load conditions, it is recommended to use the falling edge
of the master clock instead of the Data Ready signal. This is possible because the output
transitions are internally synchronized with the falling edge of the clock.
Figure 62. Output buffer fall timeFigure 63. Output buffer rise time
25
25
20
15
10
Fall time (nS)
5
0
0 1020304050
VCCBE=2.5V
VCCBE=3.3V
load capacitor (pF)
3.6 PCB layout precautions
●The use of dedicated analog and digital ground planes on the PCB is recommended for
high-speed circuit applications to provide low parasitic inductance and resistance.
AGND is connected to the analog ground plane and DGND, GNDBI, GNDBE are
connected to the digital ground plane.
●To minimize the transition current when the output changes, the capacitive load at the
digital outputs must be reduced as much as possible by using the shortest-possible
routing tracks. One way to reduce the capacitive load is to remove the ground plane
under the output digital pins and layers at high sampling frequencies.
●The separation of the analog signal from the clock signal and digital outputs is
mandatory to prevent noise from coupling onto the input signal.
●Power supply bypass capacitors must be placed as close as possible to the IC pins to
improve high-frequency bypassing and reduce harmonic distortion.
●All leads must be as short as possible, especially for the analog input, so as to
decrease parasitic capacitance and inductance.
●Choose the smallest-possible component sizes (SMD).
20
15
10
Rise time (nS)
5
0
0 1020304050
VCCBE=2.5V
VCCBE=3.3V
load capacitor (pF)
32/39Doc ID 13317 Rev 7
RHF1401Definitions of specified parameters
4 Definitions of specified parameters
4.1 Static parameters
Differential non-linearity (DNL)
The average deviation of any output code width from the ideal code width of 1 LSB.
Integral non-linearity (INL)
An ideal converter exhibits a transfer function that is a straight line from the starting code to
the ending code. The INL is the deviation from this ideal line for each transition.
4.2 Dynamic parameters
Spurious free dynamic range (SFDR)
The ratio between the power of the worst spurious signal (not always a harmonic) and the
amplitude of the fundamental tone (signal power) over the full Nyquist band.
Expressed in dBc.
Total harmonic distortion (THD)
The ratio of the rms sum of the first five harmonic distortion components to the rms value of
the fundamental line. Expressed in dB.
Signal to noise ratio (SNR)
The ratio of the rms value of the fundamental component to the rms sum of all other spectral
components in the Nyquist band (F
harmonics. Reported in dB.
/2) excluding DC, fundamental and the first five
s
Signal-to-noise and distortion ratio (SINAD)
A similar ratio to the SNR but that includes the harmonic distortion components in the noise
figure (not the DC signal). Expressed in dB. From SINAD, the effective number of bits
(ENOB) can easily be deduced using the formula:
SINAD = 6.02
When the analog input signal is not full-scale (FS) but has an A
expression becomes:
SINAD = 6.02
×
ENOB + 1.76 dB
×
ENOB + 1.76 dB + 20 log (A0 / FS)
amplitude, the SINAD
0
Analog input bandwidth
The maximum analog input frequency at which the spectral response of a full power signal
is reduced by 3 dB. Higher values can be achieved with smaller input levels.
Pipeline delay
The delay between the initial sample of the analog input and the availability of the
corresponding digital data output on the output bus. Also called data latency. Expressed as
a number of clock cycles.
Doc ID 13317 Rev 733/39
Package informationRHF1401
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
Added Note: on page 31 and in the "Pin connections" diagram on the
cover page.
Added Table 1: Device summary on cover page.
Updated curves in Section 2.3: Electrical characteristics (after
300 kRad).
Modified Section 3.1: Optimizing the power consumption.
Modified Section 3.2: Driving the analog input.
Modified Section 3.3.1: Internal references.
Modified Section 3.3.2: External references.
Modified Section 3.6: PCB layout precautions.
38/39Doc ID 13317 Rev 7
RHF1401
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