– 2 Apk LDO with foldback for VTT
– Remote VTT sensing
– High-Z VTT output in S3
– Ceramic output capacitors supported
– ±15 mA low noise buffered reference
Applications
■ DDR2/3 memory supply
■ Notebook computers
■ Handheld and PDAs
■ CPU and chipset I/O supplies
■ SSTL18, SSTL15 and HSTL bus termination
current sensing using low side
SENSE
DS(ON)
PM6670S
VFQFPN-24 4x4
Description
The device PM6670S is a complete DDR2/3
power supply regulator designed to meet JEDEC
specifications.
It integrates a constant on-time (COT) buck
controller, a 2 Apk sink/source low drop out
regulator and a 15 mA low noise buffered
reference.
The COT architecture assures fast transient
response supporting both electrolytic and ceramic
output capacitors. An embedded integrator
control loop compensates the DC voltage error
due to the output ripple.
The 2 Apk sink/source linear regulator provides
the memory termination voltage with fast load
transient response.
The device is fully compliant with system sleep
states S3 and S4/S5, providing LDO output high
impedance in suspend-to-RAM and tracking
discharge of all outputs in suspend-to-disk.
1VTTGNDLDO power ground. Connect to negative terminal of VTT output capacitor.
2VTTSNS
3DDRSEL
4VTTREF
5SGND
6AVCC
7VREF
8VOSC
9VSNS
10MODE
LDO remote sensing. Connect as close as possible to the load via a low
noise PCB trace.
DDR voltage selector (if MODE is tied to VCC) or pulse-skip/no-audible
pulse-skip selector in adjustable mode (MODE voltage lower than 3 V). See
Section 7.1.4: Mode-of-operation selection on page 30.
Low noise buffered DDR reference voltage. A 22 nF (minimum) ceramic
bypass capacitor is required in order to achieve stability.
Ground reference for analog circuitry, control logic and VTTREF buffer.
Connect together with the thermal pad and VTTGND to a low impedance
ground plane. See the Application Note for details.
+5 V supply for internal logic. Connect to +5 V rail through a simple RC
filtering network.
High accuracy output voltage reference (1.237 V) for multilevel pins setting.
It can deliver up to 50 μA. Connect a 100 nF capacitor between VREF and
SGND in order to enhance noise rejection.
Frequency selection. Connect to the central tap of a resistor divider to set
the desired switching frequency. The pin cannot be left floating. See
Section 7: Device description on page 20
VDDQ output remote sensing. Discharge path for VDDQ in Non-Tracking
Discharge. Input for internal resistor divider that provides VDDQ/2 to
VTTREF and VTT. Connect as close as possible to the load via a low noise
PCB trace.
Mode of operation selector. If MODE pin voltage is higher than 4 V, the fixed
output mode is selected. If MODE pin voltage is lower than 4 V, it is used as
negative input of the error amplifier. See Section 7.1.4: Mode-of-operation
selection on page 30.
11COMP
12DSCG
13S5
14S3
15PG
16PGNDPower ground for the switching section.
17LGATELow-side gate driver output.
6/54Doc ID 14432 Rev 4
DC voltage error compensation Input for the switching section. Refer
Section 7.1.4: Mode-of-operation selection on page 30.
Discharge mode selection. Refer to Section 7.1.8: VDDQ output discharge
on page 34 for tracking/non-tracking discharge or no-discharge options.
Switching controller enable. Connect to S5 system status signal to meet S0S5 power management states compliance. See Section 7.3: S3 and S5
power management pins on page 38, S5 pin can't be left floating.
Linear regulator enable. Connect to S3 system status signal to meet S0-S5
power management states compliance. See Section 7.3: S3 and S5 power
management pins on page 38, S3 pin can't be left floating.
Power Good signal (open drain output). High when VDDQ output voltage is
within ±10 % of nominal value.
PM6670SPin settings
Table 2.Pin functions (continued)
N°PinFunction
18VCC+5 V low-side gate driver supply. Bypass with a 100 nF capacitor to PGND.
Current sense input for the switching section. This pin must be connected
19CSNS
20PHASESwitch node connection and return path for the high-side gate driver.
21HGATEHigh-side gate driver output
22BOOT
23LDOIN
24VTT
through a resistor to the drain of the synchronous rectifier (R
set the current limit threshold.
Bootstrap capacitor connection. Positive supply input of the high-side gate
driver.
Linear regulator input. Connect to VDDQ in normal configuration or to a
lower supply to reduce the power dissipation. A 10 μF bypass ceramic
capacitor is suggested for noise rejection enhancement. See Section 7:
Device description on page 20
LDO linear regulator output. Bypass with a 20 μF (2x10 μF MLCC) filter
capacitor.
1. Free air operating conditions unless otherwise specified. Stresses beyond those listed under “absolute
maximum ratings” may cause permanent damage to the device. Exposure to absolute maximum rated
conditions for extended periods may affect device reliability.
2. PHASE to SGND up to -2.5 V for t < 10 ns
Power dissipation @TA = 25 °C2.3W
(2)
-0.3 to 38
-0.3 to V
CC
AVC C
AVC C
AVC C
+0.3
+ 0.3
+ 0.3
+ 0.3
V
3.2 Thermal data
Table 4.Thermal data
SymbolParameterValueUnit
R
thJA
T
STG
T
A
T
J
8/54Doc ID 14432 Rev 4
Thermal resistance junction to ambient 42°C/W
Storage temperature range- 50 to 150°C
Operating ambient temperature range- 40 to 85°C
Junction operating temperature range- 40 to 125°C
PM6670SElectrical data
3.3 Recommended operating conditions
Table 5.Recommended operating conditions
Val ues
SymbolParameter
MinTypMax
Unit
V
AVC C
V
VCC
IN
Input voltage range4.5-28
IC supply voltage4.5-5.5
IC supply voltage4.5-5.5
VV
Doc ID 14432 Rev 49/54
Electrical characteristicsPM6670S
4 Electrical characteristics
TA = 0 °C to 85 °C, VCC = AVCC = +5 V and LDOIN connected to VDDQ output if not
otherwise specified
Table 6.Electrical characteristics
SymbolParameterTest condition
Supply section
I
IN
I
STR
I
SH
UVLO
Operating current
Operating current in STR
Operating current in
shutdown
AVCC under voltage lockout
upper threshold
AVCC under voltage lockout
lower threshold
UVLO hysteresis70mV
(a)
S3, S5, MODE and DDRSEL
connected to AVCC, no load on VTT
and VTTREF outputs.
VCC connected to AVCC
S5, MODE and DDRSEL connected
to AVCC, S3 tied to SGND, no load
on VTTREF.
VCC connected to AVCC
S3 and S5 tied to SGND.
Discharge mode active.
VCC connected to AVCC
Val ues
Unit
MinTypMax
0.82
mA
0.61
110μA
4.14.254.4
V
3.854.04.1
ON-time (SMPS)
t
ON
On-time duration
MODE and
DDRSEL
high,
V
= 2 V
VSNS
VOSC
VOSC = 500 mV390450510
OFF-time (SMPS)
t
OFFMIN
Minimum Off time300350ns
Volt a g e re f e ren c e
Voltage accuracy4.5 V < V
Load regulation-50 μA< I
< 25 V1.2241.2371.249V
IN
< 50 μA-44mV
VREF
Undervoltage lockout fault
threshold
a. TA = TJ. All parameters at operating temperature extremes are guaranteed by design and statistical analysis
(not production tested)
10/54Doc ID 14432 Rev 4
= 300 mV650750850
800
ns
PM6670SElectrical characteristics
Table 6.Electrical characteristics (continued)
Val ues
SymbolParameterTest condition
MinTypMax
VDDQ output
Unit
MODE connected to AVCC,
DDRSEL tied to SGND, No load
MODE and DDRSEL connected to
AVCC, no load
V
VDDQ
VDDQ output voltage, DDR3
VDDQ output voltage, DDR2
Feedback accuracy-1.51.5%
Current limit and zero crossing comparator
I
CSNS
CSNS input bias current110120130μA
Comparator offset-66mV
Positive current limit threshold
Rsense = 1 kΩ
V
- V
PGND
CSNS
Fixed negative current limit
threshold
V
ZC,OFFS
Zero crossing comparator
offset
High and low side gate drivers
HGATE high state (pull-up)2.03
HGATE driver on-resistance
HGATE low state (pull-down)1.82.7
LGATE high state (pull-up)1.42.1
LGATE driver on-resistance
LGATE low state (pull-down)0.60.9
UVP/OVP protections and PGOOD SIGNAL (SMPS only)
1.5
V
1.8
120mV
110mV
-11-51mV
Ω
OVPOver voltage threshold112115118
UVPUnder voltage threshold677073
Power Good upper threshold107110113
PGOOD
Power Good lower threshold 869093
I
PG,LEAK
V
PG,LOW
PG leakage currentPG forced to 5 V1μA
PG low-level voltageI
= 4 mA150250mV
PG,SINK
Soft start section (SMPS)
Soft-start ramp time
(4 steps current limit)
1.534ms
Soft-start current limit step30μA
Doc ID 14432 Rev 411/54
%
Electrical characteristicsPM6670S
Table 6.Electrical characteristics (continued)
Val ues
SymbolParameterTest condition
Soft end section
VDDQ discharge resistance
in non-tracking discharge
mode
VTT discharge resistance in
non-tracking discharge mode
VTTREF discharge
resistance in non-tracking
discharge mode
VDDQ output threshold
synchronous for final tracking
to non-tracking discharge
transition
LDO section
V
TT
I
LDOIN,ON
I
LDOIN,
STR
I
LDOIN,
STD
I
VTTSNS,
BIAS
I
VTTSNS,
LEAK
I
VTT,LEAK
V
LDO input bias current in
full-on state
LDO input bias current in
suspend-to-RAM state
LDO input bias current in
suspend-to-disk state
VTTSNS bias current
VTTSNS leakage current
VTT leakage current
LDO linear regulator output
voltage (DDR2)
LDO linear regulator output
voltage (DDR3)
VTT
LDO output accuracy respect
to VTTREF
S3 = S5 = +5 V, No load on VTT 110
S3 = 0 V, S5 = +5 V,
No Load on VTT
S3 = S5 = 0 V, No Load on VTT1
S3 = +5 V, S5 = +5 V,
V
VTTSNS
= V
VSNS
/2
S3 = 0 V, S5 = +5 V,
V
VTTSNS
= V
VSNS
/2
S3 = 0 V, S5 = +5 V,
= V
V
VTT
S3 = S5= +5 V, I
VSNS
/2
VTT
= 0 A,
MODE = DDRSEL = +5 V
S3 = S5= +5 V, I
VTT
= 0 A,
MODE = +5 V, DDRSEL = 0 V
S3 = S5 = MODE = + 5 V,
-1 mA < I
VTT
< 1 mA
S3 = S5 = MODE = +5 V,
-1 A < I
VTT
< 1 A
S3 = S5 = MODE = +5 V,
-2 A < I
VTT
< 2 A
MinTypMax
152535
152535
11.52 kΩ
0.20.40.6V
10
-1010
0.9
0.75
-2020
-2525
-3535
Unit
Ω
μA
1
1
V
mV
12/54Doc ID 14432 Rev 4
PM6670SElectrical characteristics
Table 6.Electrical characteristics (continued)
Val ues
SymbolParameterTest condition
V
I
VTT,CL
LDO source current limit
LDO sink current limit
VTT
V
VTT
V
VTT
V
VTT
< 1.10*(V
> 1.10*(V
> 0.90*(V
< 0.90*(V
/2)22.33
VSNS
/2)11.151.4
VSNS
/2)-3-2.3-2
VSNS
/2)-1.4-1.15-1
VSNS
VTTREF section
MinTypMax
Unit
A
VTTREF output voltageI
V
VTTREF
VTTREF output voltage
accuracy respect to VSNS/2
I
VTTREF
VTTREF current limitVTTREF= 0 or VSNS±40mA
Power management section
Turn OFF level0.4
S3,S5
Turn ON level1.6
MODE pin high level
threshold
V
MODE
MODE pin low level
threshold
DDRSEL pin high level
threshold
V
DDRSEL
DDRSEL pin middle level
window
DDRSEL pin low level
threshold
DSCG pin high level
threshold
V
DSCG
I
IN,LEAK
I
IN3,LEAK
I
OSC,
LEAK
DSCG pin middle level
window
DSCG pin low level
threshold
Logic inputs leakage currentS3, S5 = 5 V10
Multilevel inputs leakage
current
VOSC input leakage currentVOSC = 500 mV1
Thermal shutdown
T
SHDN
1. Guaranteed by design. Not production tested.
Shutdown temperature
(1)
VSNS
= 0 A, V
VTTREF
= 1.8 V
VSNS
< 15 mA,
VTTREF
-15 mA < I
V
MODE, DDRSEL and
DSCG = 5 V
= 1.8 V0.9V
-22%
V
AVC C
-0.7
VAVCC -
1.3
V
AVC C
-0.8
1.0
V
AVC C
-0.8
1.02.0
VAVCC -
1.5
0.5
0.5
10
150°C
μA
V
Doc ID 14432 Rev 413/54
Typical operating characteristicsPM6670S
pg
pg
5 Typical operating characteristics
Figure 3.Efficiency vs
100
100
90
90
80
80
70
70
60
60
50
50
40
40
Efficiency (%)
Efficiency (%)
30
30
20
20
10
10
0
0
0.0010.010.1110
0.0010.010.1110
load - 1.5 V and 1.8 V, V
Output current (A)
Output current (A)
= 12 V
IN
DDR2 -ForcedPWM
DDR2 - Forced PWM
DDR2 -No-Audible P-S
DDR2 - No-Audible P-S
DDR2 -Pulse-Skip
DDR2 - Pulse-Skip
DDR3 -ForcedPWM
DDR3 - Forced PWM
DDR3 -No-Audible P-S
DDR3 - No-Audible P-S
DDR3 -Pulse-Skip
DDR3 - Pulse-Skip
Figure 4.Switching frequency vs
load - 1.8 V, VIN = 12 V
500
500
450
450
400
400
350
350
300
300
250
250
200
200
150
150
100
100
Swiching frequency (kHz)
Swiching frequency (kHz)
50
50
0
0
0.0010.010.1110
0.0010.010.1110
Forced PWM
Forced PWM
No-Audible P-S
No-Audible P-S
Pulse-Skip
Pulse-Skip
Output current (A)
Output current (A)
Figure 5.Switching frequency vs
500
500
450
450
400
400
350
350
300
300
250
250
Switching frequency(kHz)
Switching frequency (kHz)
200
200
150
150
0.05.010.015.020.025.030.0
0.05.010.015.020.025.030.0
Figure 7.VDDQ line regulation, 1.8 V, 7 AFigure 8.VDDQ line regulation, 1.5 V, 7 A