ST M95256, M95128 User Manual

查询M95128-BN3TG供应商
256Kbit and 128Kbit Serial SPI Bus EEPROM
FEAT URES SUMMARY
Compatible with SPI Bus Serial Interfa c e
(Positive Clock SPI Modes)
Single Supply Voltage:
High Speed
10MHz Clock Rate, 5ms Write Time
Status Register
Hardware Protection of the Status Register
BYTE and PAGE WRITE (up to 64 Bytes)
Self-Timed Programming Cycle
Adjustable Size Read-Only EEPROM Area
Enhanced ESD Protection
More than 100000 Erase/Write Cycles
More than 40-Year Data Retention
M95256 M95128
With High Speed Clock
Figure 1. Packages
8
1
PDIP8 (BN)
0.25 mm frame
8
Table 1. Product List
Reference Part Number
M95256
M95128
M95256 M95256-W M95256-R M95128 M95128-W M95128-R
1
SO8 (MN)
150 mil width
8
1
SO8 (MW)
200 mil width
TSSOP8 (DW)
169 mil width
1/39October 2004
M95256, M95128
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. DIP, SO and TSSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Output (Q). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Write Protect (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
CONNECTING TO THE SPI BUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Bus Master and Memory Devices on the SPI Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SPI Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
OPERATING FEATURES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power On Reset: VCC Lock-Out Write Protect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Active Power and Standby Power Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Hold Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6. Hold Condition Activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
WIP bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SRWD bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3. Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Data Protection and Protocol Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4. Write-Protected Block Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Write Enable (WREN) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/39
M95256, M95128
Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 9. Write Disable (WRDI) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read Status Register (RDSR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
WIP bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SRWD bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10.Read Status Register (RDSR) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 6. Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11.Write Status Register (WRSR) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12.Read from Memory Array (READ) Sequen ce . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Write to Memory Array (WRITE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Figure 13.Byte Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 14.Page Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
POWER-UP AND DELIVERY STATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Power-up State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 7. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 8. Operating Conditions (M95xxx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 9. Operating Conditions (M95xxx-W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 10. Operating Conditions (M95xxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 11. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 15.AC Measurement I/O Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 12.Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 13. DC Characteristics (M95xxx, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 14. DC Characteristics (M95xxx, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 15. DC Characteristics (M95xxx-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 16. DC Characteristics (M95xxx-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 17. DC Characteristics (M95xxx-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 18. AC Characteristics (M95xxx, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 19. AC Characteristics (M95xxx, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 20. AC Characteristics (M95xxx-W, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 21. AC Characteristics (M95xxx-W, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 22. AC Characteristics (M95xxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 16.Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 17.Hold Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 18.Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3/39
M95256, M95128
Figure 19.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 33
Table 23. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data. . . . . . . . . . 33
Figure 20.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 34
Table 24. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data 34
Figure 21.SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Outline. . . . . . 35
Table 25. SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Mechanical Data 35
Figure 22.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 36
Table 26. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanica l Data . . . . . . . . . . . . 36
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 27.Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 28. Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4/39
M95256, M95128
SUMMARY DESCRIPTION
These electrically erasable programmable memo­ry (EEPROM) devices are accessed by a high speed SPI-compatible bus. The memory array is organized as 32768 x 8 bit (M95256) and 16384 x 8 bit (M95128).
The device is accessed by a simple serial interface that is SPI-compatible. The bus signa ls are C, D and Q, as shown in Table 2. and Figu re 2..
The device is selected when Chip Select (S en Low. Communications with the devi ce can be interrupted using Hold (HOLD
).
Figure 2. Logic Diagram
V
CC
D C S
W
HOLD
M95xxx
) is tak-
Q
Figure 3. DIP, SO and TSSOP Connections
M95xxx
SV
1 2
W
3 4
SS
Note: See PACKAGE MECHANICAL section for package dimen-
sions, and how to identify pi n-1.
8 7 6 5
AI01790D
CC
HOLDQ C DV
Table 2. Signal Names
C Serial Clock D Serial Data Input Q Serial Data Output
S Chip Select
Write Protect
W HOLD
Hold
V
CC
V
SS
AI01789C
V
SS
Supply Voltage Ground
5/39
M95256, M95128
SIGNAL DESCRIPTION
During all operations, VCC must be held stable and within the specified valid range: V
(max).
V
CC
All of the input and out put signals must be held High or Low (according to voltages of V or VOL, as specified in Table 13. to Table 17.). These signals are described next.
Serial Data Output (Q). This output signal is used to transfer data serially out of the device. Data is shifted out on the falling edge of Serial Clock (C).
Serial Data Input (D). This input signal is used to transfer data serially into the device. It receives in­structions, addresses, and the data to be written. Values are latched on the rising edge of Serial Clock (C).
Serial Clock (C). This input signal provides the timing of the serial interface. Instructions, address­es, or data present at Serial Data Input (D) are latched on the rising edge of Serial Clock (C). Data on Serial Data Output (Q) changes after the falling edge of Serial Clock (C).
Chip Select (S
). When this input signal is High,
the device is des elected and Serial Data Ou tput
(min) to
CC
, VOH, V
IH
(Q) is at high impedance. Unless an internal Write cycle is in progress, the device will be in the Stand­by Power mode. Drivi ng Chip Select ( S lects the device, placing it in the Active Power mode.
IL
After Power-up, a falling edge on Chip Select (S is required prior to the start of any instruction.
Hold (HOLD
). The Hold (HOLD) signal is used to
pause any serial communications with the device without deselecting the device.
During the Hold condition, the Serial Data Output (Q) is high impedanc e, and Serial D ata Input (D) and Serial Clock (C) are Don’t Care.
To start the Hold condition, the device must be se­lected, wit h Ch ip Select (S
Write Protect (W
). The main purpose of this in-
) driven Low.
put signal is to freeze the size of the area of mem­ory that is protected against Write instructions (as specified by the values in the BP1 and BP0 bits of the Status Register).
This pin must be driven e ither High or Low, and must be stable during all write instructions.
) Low se-
)
6/39
CONNECTI NG TO THE SPI BUS
These devices are fully compatible with the SPI protocol.
All instructions, addresses and input data bytes are shifted in to the device, most significant bit first. The Serial Data Input (D) is sampled on the first rising edge of the Serial Clock (C) after Chip Selec t ( S
) goes Low.
All output data bytes are shifted out of the device, most significant bit first. The Serial Data Output
Figure 4. Bus Master and Memory Devices on the SPI Bus
(Q) is latched on the first fa lling edge of the Serial Clock (C) after the instruction (such as the Read from Memory Array and Read Status Re gister in­structions) have been clocked into the device.
Figure 4 . shows three devices, con nected to an
MCU, on a SPI bus. Only one device is selected at a time, so only one de vice drives the Serial Data Output (Q) line at a time, all the o thers be ing high impedance.
M95256, M95128
SPI Interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
Bus Master
(ST6, ST7, ST9,
ST10, Others)
CS3 CS2 CS1
Note: The Write Protect (W) and Hold (HOLD) signals should be drive n, High or Low as appropriate.
SDO SDI SCK
CQD
SPI Memory
Device
S
CQD
SPI Memory
Device
HOLD
W
S
HOLD
W
CQD
SPI Memory
Device
S
W
AI03746D
HOLD
7/39
M95256, M95128
SPI Modes
These devices can be drive n by a microcont roller with its SPI peripheral running in either of the two following modes:
CPOL=0, CPHA=0 – CPOL=1, CPHA=1 For these two modes, input data is latc hed in on
the rising edge of Serial Clock (C), and output data
Figure 5. SPI Mo de s S upported
CPHA
CPOL
0
0
1
1
C
C
D
Q
MSB
is avai lable from t he falling edge of S erial Clock (C).
The difference between the two modes, as shown in Figure 5., is the clock polarity when the bus master is in Stand-by mode and not transferring data:
C remains at 0 for (CPOL=0, CPHA=0) – C remains at 1 for (CPOL=1, CPHA=1)
MSB
AI01438B
8/39
OPERATING FEAT URES
Power-up
When the power supply is turned on, V from V
During this time, the Chip Select (S lowed to follow the V
to VCC.
SS
) must be al-
voltage. It must not be al-
CC
lowed to float, but should be connected to V a suitable pull-up resistor.
As a built in safety feature, Chip Select (S sensitive as well a s level sens itive. After P ower­up, the device does not become s elected until a falling edge has first been detected on Chip Select
). This ensures that Ch ip Select (S) must have
(S been High, prior to going Low to start the first op­eration.
Power On Reset: V
Lock-Out Write Protect
CC
In order to prevent data corruption and inadvertent Write instructions during Power-up, a Power On Reset (POR) circuit is included. The internal reset is held active until V
has reached the Power On
CC
Reset (POR) threshold voltage, and all operations are disabled – the device will not respond to any instruction. In the same way, when V
CC
the operating voltage, below the Power On Reset (POR) threshold voltage, all operations are dis­abled and the device will not res pond to any in­struction.
A stable and valid V
must be applied before ap-
CC
plying any logic signal.
Power-down
At Power-down, the device must be deselected. Chip Select (S voltage applied on V
) should be allowed to follow the
.
CC
Active Power and Standb y Power M ode s
When Chip Select (S
) is Low, the device is select-
ed, and in the Active Power mode. The device
rises
CC
via
CC
) is edge
drops from
M95256, M95128
consumes I
17..
When Chip Select (S lected. If an Erase/Write cycle is not currently in progress, the device then goes in to the Standby Power mode, and the device cons umption drops
CC1
.
to I
Hold Condition
The Hold (HOLD rial communications with the device without reset­ting the clocking sequence.
During the Hold condition, the Serial Data Output (Q) is high impedanc e, and Serial D ata Input (D) and Serial Clock (C) are Don’t Care.
To enter the Hold condition, the device must be selecte d, with Chip Selec t (S
Normally, the device is kept selected, for the whole duration of the Hold condition. Deselecting the de­vice while it is in the Hold condition, has the effect of resetting the state of the device, and this mech­anism can be used if it is required to reset any pro­cesses that had been in progress.
The Hold condition starts when the Hold (HOLD signal is driven Low at the same time as Serial Clock (C) already being Low (as shown in Figure
6.).
The Hold condition ends when the Hold (HOLD signal is driven High at the same time as Serial Clock (C) already being Low.
Figure 6 . also shows what happens if the rising
and falling edges are not timed to coincide with Serial Clock (C) being Low.
, as specified in Table 13. to Table
CC
) is High, the device is dese-
) signal is used to pause any se-
) Low.
)
)
Figure 6. Hold Condition Activation
C
HOLD
Hold
Condition
Hold
Condition
AI02029D
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M95256, M95128
Status Register
Figure 7. shows the position of the Status Register
in the control logic of the d evice. The Status Reg­ister contains a number of status and cont rol bits that can be read or set (as appropriate) by specific instructions.
WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write or Write Status Register cycle.
WEL bit. The Write Enable Latch (WEL) bit i ndi­cates the status of the internal Write Enable Latch.
BP1, BP0 bits. The Block Protect (BP1, BP0) bits are non-volatile. They define the size of the area to be software protected against Write instructions.
SRWD bit. The Status Register Write Disable (SRWD) bit is operated in conjunction with the Write Protect (W
) signal. The Status Register Write Disable (SRWD) bit an d Write Protect (W signal allow the device to be put in the Hardware Protected mode. In this mode, the non-volatile bits of the Status Register (SRWD, BP1, BP0) become read-only bits.
Table 3. Status Register Format
b7 b0
SRWD 0 0 0 BP1 BP0 WEL WIP
Status Register Write Protect
Block Protect Bits
Write Enable Latch Bit
Write In Progress Bit
Data Protec ti on a n d Protocol Cont rol
Non-volatile memory devices can be used in envi­ronments that are particularly noisy, and within ap­plications that could experience problems if memory bytes are corrupted. Consequently, the
device features the following data protection mechanisms:
Write and Write Status Register instructions
are checked that they consist of a number of clock pulses that is a multiple of eight, before they are accepted for execution.
All instructions that modify data must be
preceded by a Write Enable (WREN) instruction to set the Write Enable Latch (WEL) bit. This bit is returned to its reset state by the following events:
Power-up – Write Disable (WRDI) instruction
completion
Write Status Register (WRSR) instruction
completion
)
Write (WRITE) instruction completion
The Block Protect (BP1, BP0) bits allow part of
the memory to be configured as read-only. This is the Software Protected Mode (SPM).
The Write Protect (W) signal allows the Block
Protect (BP1, BP0) bits to be protected. This is the Hardware Protected Mode (HPM).
For any instruction to be accepted, and e xe cuted, Chip Select (S
) must be driven High after the rising edge of Serial Clock (C) for the last bit of the in­struction, and before the next rising edge of Serial Clock (C).
Two points need to be no ted in the p revious sen­tence:
The ‘last bit of the instruction’ can be the
eighth bit of the instruction code, or the eighth bit of a data byte, depending on the instruction (except for Read Status Register (RDSR) and Read (READ) instructions).
The ‘next rising edge of Serial Clock (C)’ might
(or might not) be the next bus transaction for some other device on the SPI bus.
Table 4. Write-Protected Block Size
Status Register Bits
BP1 BP0 M95256 M95128
0 0 none none none 0 1 Upper quarter 6000h - 7FFFh 3000h - 3FFFh 1 0 Upper half 4000h - 7FFFh 2000h - 3FFFh 1 1 Whole memory 0000h - 7FFFh 0000h - 3FFFh
10/39
Protected Block
Array Addresses Protected
MEMOR Y ORGANIZ ATION
The memory is organized as shown in Figure 7..
Figure 7. Block Diagram
M95256, M95128
HOLD
W
S
C
D
Q
Control Logic
I/O Shift Register
Address Register
and Counter
Y Decoder
High Voltage
Generator
Data
Register
1 Page
Status
Register
Size of the Read only EEPROM area
X Decoder
AI01272C
11/39
M95256, M95128
INSTRUCTIONS
Each instruction starts with a single-byte code, as summarized in Table 5..
If an invalid instruction is s ent (one not con tained in Table 5.), the device automatically deselects it­self.
Table 5. Instruction Set
Instruc
tion
WREN Write Enable 0000 0110 WRDI Write Disable 0000 0100 RDSR Read Status Register 0000 0101 WRSR Write Status Register 0000 0001 READ Read from Memory Array 0000 0011 WRITE Write to Memory Array 0000 0010
Description
Instruction
Format
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