INCLUDES a 28-PIN SOIC and a 32-LEAD
TSOP (SNAPHAT TOP TO BE ORDERED
SEPARATELY)
■ SOIC PACKAGE PROVIDES DIRECT
CONNECTION for a SNAPHAT TOP WHICH
CONTAINS the BATTERY
■ SNAPHAT
HOUSING (BATTERY) IS
REPLACEABLE
PFD
PFD
≤ 4.75V
≤ 4.50V
32
1
PMDIP32 (PM)
Module
32
1
TSOP II 32
(10 x 20mm)
Surface Mount Chip Set Solution (CS)
Figure 1. Logic Diagram
V
CC
M48Z512A
M48Z512AY
SNAPHAT (SH)
Battery
SOH28
Table 1. Signal Names
A0-A18Address Inputs
DQ0-DQ7Data Inputs / Outputs
EChip Enable
GOutput Enable
WWrite Enable
V
CC
V
SS
Supply Voltage
Ground
A0-A18
W
19
M48Z512A
M48Z512AY
E
G
V
SS
8
DQ0-DQ7
AI02043
1/17March 2000
M48Z512A, M48Z512AY
Table 2. Absolute Maximum Ratings
SymbolParameterValueUnit
T
A
T
STG
T
BIAS
(2)
T
SLD
V
IO
V
CC
Note: 1. Stresses greater thanthose listed under ”Absolute MaximumRatings” maycause permanent damage to the device. This is astress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational section
of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect
reliability.
2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.
Ambient Operating Temperature0 to 70°C
Storage Temperature (VCCOff)–40 to 70°C
Temperature Under Bias–40 to 70°C
Lead Solder Temperature for 10 seconds260°C
Input or Output Voltages–0.3 to 7V
Supply Voltage–0.3 to 7V
(1)
Table 3. Operating Modes
Mode
Deselect
WriteV
Read
ReadV
V
CC
4.75V to 5.5V
or
4.5V to 5.5V
EGWDQ0-DQ7Power
V
IH
IL
V
IL
IL
XXHigh ZStandby
XVILD
V
IL
V
IH
V
IH
V
IH
IN
D
OUT
High ZActive
Active
Active
Deselect
Deselect≤ V
Note: 1. X = VIHor VIL;VSO= Battery Back-up Switchover Voltage.
A15
A173
W
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5DQ1
DQ4
DQ3V
DESCRIPTION
The M48Z512A/512AY ZEROPOWERRAM is a
non-volatile 4,194,304 bit Static RAM organized
as 524,288 words by 8 bits. The device combines
an internal lithium battery, a CMOS SRAM and a
control circuit in a plastic 32 pin DIP Module.
For surface mount environments ST provides a
Chip Set solution consisting of a 28 pin 330mil
SOIC NVRAM Supervisor (M40Z300) and a 32 pin
TSOP Type II (10 x 20mm) LPSRAM (M68Z512)
packages.
The unique design allows the SNAPHAT battery
package to be mounted on top of the SOIC package after the completion of the surface mount process. Insertion of the SNAPHAT housing after
reflow prevents potential battery damage due to
the high temperatures required for device surfacemounting. The SNAPHAT housing is keyed toprevent reverse insertion.
The SNAPHAT battery package is shipped separately in plastic anti-static tubes or in Tape & Reel
form. The part number is ”M4Zxx-BR00SH1”.
2/17
Figure 3. Block Diagram
M48Z512A, M48Z512AY
V
CC
A0-A18
POWER
VOLTAGE SENSE
E
AND
SWITCHING
CIRCUITRY
INTERNAL
BATTERY
The M48Z512A/512AY also has itsown Power-fail
Detect circuit.The controlcircuitry constantlymonitors the single 5V supply for an out of tolerance
condition. When VCCis out oftolerance, the circuit
write protects the SRAM, providing a high degree
of data security in the midst of unpredictable system operation brought on by low VCC.AsVCCfalls
below approximately 3V, the control circuitry connects the battery which maintains data until valid
power returns.
The ZEROPOWER RAM replaces industry standard SRAMs. It provides the nonvolatility of
PROMs without any requirement for special write
512K x
SRAM ARRAY
E
8
V
SS
DQ0-DQ7
W
G
AI02045
timing or limitations on the number of writes that
can be performed.
The M48Z512A/512AY has its own Power-fail Detect Circuit. The control circuitry constantly monitors the single 5V supply for an out of tolerance
condition. When VCCis out of tolerance, the circuit
write protects the SRAM, providing a high degree
of data security in the midst of unpredictable system operations brought on by low VCC.AsV
falls below approximately 3V, the control circuitry
connectsthe battery whichsustains data untilvalid
power returns.
CC
3/17
M48Z512A, M48Z512AY
Figure 4. Hardware Hookup for SMT Chip Set
(2)
M40Z300
E1
E2
E3
E4
V
SS
V
CON
CON
CON
CON
OUT
RST
BL
SNAPHAT
BATTERY
THS
(3)
E
A
B
(1)
V
CC
E2
M68Z512
E
A0-A18
W
DQ0-DQ7
V
SS
AI03631
Note: 1. For pin connections, see individual data sheets for M40Z300 and M68Z512 at www.st.com.
2. Connect THS pin to V
3. SNAPHAT top ordered separately.
Table 4. AC Measurement Conditions
OUT
if 4.2V ≤ V
≤ 4.5V (M48Z512AY) or connect THS pin to VSSif 4.5V ≤ V
PFD
Figure 5. AC Testing Load Circuit
Input Rise and Fall Times≤ 5ns
Input Pulse Voltages0 to 3V
Input and Output Timing Ref. Voltages1.5V
Note that Output Hi-Z is defined as the point where dataisno longer
driven.
DEVICE
UNDER
TEST
1kΩ
CLincludes JIG capacitance
≤ 4.75V (M48Z512A).
PFD
5V
1.9kΩ
CL= 100pF or
OUT
5pF
AI01030
4/17
M48Z512A, M48Z512AY
Table 5. Capacitance
(1, 2)
(TA=25°C, f = 1MHz)
SymbolParameterTest ConditionMinMaxUnit
C
IN
C
IO
Note: 1. Effective capacitance measured with power supply at 5V.
2. Sampled only, not 100% tested.
3. Outputs deselected.
Input Capacitance
(3)
Input / Output Capacitance
V
V
OUT
IN
=0V
=0V
10pF
10pF
Table 6. DC Characteristics
(TA= 0 to 70 °C; VCC= 4.75V to 5.5V or 4.5V to 5.5V)
SymbolParameterTest ConditionMinMaxUnit
(1)
I
LI
I
LO
I
CC
I
CC1
I
CC2
V
IL
V
IH
V
OL
V
OH
Note: 1. Outputs deselected.
Input Leakage Current
(1)
Output Leakage Current
Supply CurrentE = VIL, Outputs open115mA
Supply Current (Standby) TTL
Supply Current (Standby) CMOS
Input Low Voltage–0.30.8V
Input High Voltage2.2VCC+ 0.3V
Output Low Voltage
Output High VoltageIOH= –1mA2.4V
0V ≤ V
0V ≤ V
E ≥ V
I
OL
IN
OUT
E=V
– 0.2V
CC
= 2.1mA
≤ V
≤ V
IH
CC
CC
±1µA
±1µA
10mA
5mA
0.4V
Table 7. Power Down/Up TripPoints DC Characteristics
(1)
(TA= 0 to 70 °C)
SymbolParameterMinTypMaxUnit
V
PFD
V
SO
t
DR
Note: 1. All voltages referenced to VSS.
2. At 25 °C.
Power-fail Deselect Voltage
Battery Back-up Switchover Voltage3V
(2)
Data Retention Time10YEARS
M48Z512A4.54.64.75V
M48Z512AY4.24.34.5V
5/17
M48Z512A, M48Z512AY
Table 8. Power Down/Up AC Characteristics
(TA= 0 to 70 °C)
SymbolParameterMinMaxUnit
(1)
t
F
t
FB
t
WP
t
R
V
(max) to V
(2)
PFD
V
(min) to VSOVCCFallTime
PFD
PFD
Write Protect Time from VCC=V
VSOto V
(max) VCCRise Time
PFD
(min) VCCFall Time
PFD
300µs
10µs
40150µs
0µs
t
ER
Note: 1. V
2. V
E Recovery Time40120ms
(max) to V
PFD
(min).
es V
PFD
(min) to VSOfall time of less than tFBmay cause corruption of RAM data.
PFD
(min) fall time of less than tFmay result indeselection/write protection not occurring until 200µs after VCCpass-
PFD
Figure 6. Power Down/Up Mode AC Waveforms
V
CC
V
(max)
PFD
V
(min)
PFD
V
SO
tF
tFB
tWP
E
OUTPUTS
VALIDVALID
(PER CONTROL INPUT)
tDR
DON’T CARE
HIGH-Z
tR
tER
RECOGNIZEDRECOGNIZED
(PER CONTROL INPUT)
6/17
AI01031
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