ST M48T58, M48T58Y User Manual

M48T58Y-70MH1

M48T58

M48T58Y

5.0V, 64 Kbit (8 Kb x 8) TIMEKEEPER®SRAM

FEATURES SUMMARY

INTEGRATED, ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERY

BYTEWIDE™ RAM-LIKE CLOCK ACCESS

BCD CODED YEAR, MONTH, DAY, DATE, HOURS, MINUTES, and SECONDS

FREQUENCY TEST OUTPUT FOR REAL TIME CLOCK

AUTOMATIC POWER-FAIL CHIP DESELECT and WRITE PROTECTION

WRITE PROTECT VOLTAGES (VPFD = Power-fail Deselect Voltage):

M48T58: VCC = 4.75 to 5.5V 4.5V VPFD 4.75V

M48T58Y: VCC = 4.5 to 5.5V 4.2V VPFD 4.5V

SELF-CONTAINED BATTERY and CRYSTAL IN THE CAPHAT™ DIP PACKAGE

PACKAGING INCLUDES a 28-LEAD SOIC and SNAPHAT®TOP (to be Ordered Separately)

SOIC PACKAGE PROVIDES DIRECT CONNECTION FOR A SNAPHAT HOUSING CONTAINING THE BATTERY and CRYSTAL

PIN and FUNCTION COMPATIBLE WITH JEDEC STANDARD 8 Kb x 8 SRAMs

Figure 1. 28-pin PCDIP, CAPHAT™ Package

28

1

PCDIP28 (PC)

Battery/Crystal

CAPHAT

Figure 2. 28-pin SOIC Package

SNAPHAT (SH)

Battery/Crystal

28

1

SOH28 (MH)

May 2002

1/27

M48T58, M48T58Y

TABLE OF CONTENTS

SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Logic Diagram (Figure 3.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Signal Names (Table 1.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

DIP Connections (Figure 4.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

SOIC Connections (Figure 5.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram (Figure 6.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Absolute Maximum Ratings (Table 2.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Operating and AC Measurement Conditions (Table 3.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 AC Measurement Load Circuit (Figure 7.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Capacitance (Table 4.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 DC Characteristics (Table 5.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

OPERATION MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Operating Modes (Table 6.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 READ Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 READ Mode AC Waveforms (Figure 8.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 READ Mode AC Characteristics (Table 7.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 WRITE Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 WRITE Enable Controlled, WRITE AC Waveform (Figure 9.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Chip Enable Controlled, WRITE AC Waveforms (Figure 10.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 WRITE Mode AC Characteristics (Table 8.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Data Retention Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power Down/Up Mode AC Waveforms (Figure 11.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power Down/Up AC Characteristics (Table 9.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power Down/Up Trip Points DC Characteristics (Table 10.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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M48T58, M48T58Y

CLOCK OPERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Reading the Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Register Map (Table 11.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Setting the Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Stopping and Starting the Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Calibrating the Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Battery Low Flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Century Bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Crystal Accuracy Across Temperature (Figure 12.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Clock Calibration (Figure 13.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

VCC Noise And Negative Going Transients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Supply Voltage Protection (Figure 14.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

SNAPHAT Battery Table (Table 13.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3/27

M48T58, M48T58Y

SUMMARY DESCRIPTION

The M48T58/Y TIMEKEEPER®RAM is a 8Kb x 8 non-volatile static RAM and real time clock. The monolithic chip is available in two special packages to provide a highly integrated battery backed-up memory and real time clock solution.

The M48T58/Y is a non-volatile pin and function equivalent to any JEDEC standard 8Kb x 8 SRAM. It also easily fits into many ROM, EPROM, and EEPROM sockets, providing the non-volatility of PROMs without any requirement for special WRITE timing or limitations on the number of WRITEs that can be performed.

The 28-pin, 600mil DIP CAPHAT™ houses the M48T58/Y silicon with a quartz crystal and a long life lithium button cell in a single package.

The 28-pin, 330mil SOIC provides sockets with gold plated contacts at both ends for direct connection to a separate SNAPHAT® housing containing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process. Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device surfacemounting. The SNAPHAT housing is keyed to prevent reverse insertion. The SOIC and battery/crystal packages are shipped separately in plastic antistatic tubes or in Tape & Reel form.

For the 28-lead SOIC, the battery/crystal package (e.g., SNAPHAT) part number is “M4T28BR12SH” (see Table 13, page 21).

Figure 3. Logic Diagram

 

VCC

 

 

13

8

A0-A12

 

DQ0-DQ7

W

M48T58

 

 

 

E1

M48T58Y

FT

E2

 

 

G

 

 

VSS

AI01374B

4/27

Table 1. Signal Names

A0-A12

Address Inputs

 

 

DQ0-DQ7

Data Inputs / Outputs

 

 

 

 

 

 

 

FT

Frequency Test Output (Open

Drain)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Enable 1

 

E1

 

 

 

 

 

E2

Chip Enable 2

 

 

 

 

 

 

 

 

 

 

 

Output Enable

 

 

G

 

 

 

 

 

 

 

 

 

 

 

 

WRITE Enable

 

 

W

 

 

 

VCC

Supply Voltage

 

 

VSS

Ground

ST M48T58, M48T58Y User Manual

M48T58, M48T58Y

Figure 4. DIP Connections

FT

1

 

28

VCC

A12

2

 

27

W

 

A7

3

 

26

E2

A6

4

 

25

A8

A5

5

 

24

A9

A4

6

 

23

A11

A3

7

 

22

 

 

 

 

M48T58

G

A2

8

M48T58Y

21

A10

A1

9

 

20

 

 

 

E1

 

A0

10

 

19

DQ7

DQ0

11

 

18

DQ6

DQ1

12

 

17

DQ5

DQ2

13

 

16

DQ4

VSS

14

 

15

DQ3

 

 

AI01375B

 

 

 

 

 

 

 

 

 

 

 

 

Figure 5. SOIC Connections

FT

1

 

28

VCC

A12

2

 

27

W

 

A7

3

 

26

E2

A6

4

 

25

A8

A5

5

 

24

A9

A4

6

 

23

A11

A3

7

 

22

 

 

 

 

M48T58Y

G

A2

8

21

A10

A1

9

 

20

 

 

 

E1

 

A0

10

 

19

DQ7

DQ0

11

 

18

DQ6

DQ1

12

 

17

DQ5

DQ2

13

 

16

DQ4

VSS

14

 

15

DQ3

 

 

AI01376B

 

 

 

 

 

 

 

 

 

 

 

 

Figure 6. Block Diagram

FT

 

 

OSCILLATOR AND

8 x 8 BiPORT

 

CLOCK CHAIN

 

SRAM ARRAY

 

 

 

32,768 Hz

 

 

CRYSTAL

 

A0-A12

 

POWER

 

 

8184 x 8

DQ0-DQ7

 

 

LITHIUM

SRAM ARRAY

 

 

 

CELL

 

E1

VOLTAGE SENSE

VPFD

E2

AND

W

SWITCHING

 

CIRCUITRY

 

G

 

 

VCC

VSS

AI01377C

5/27

M48T58, M48T58Y

MAXIMUM RATING

Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is

Table 2. Absolute Maximum Ratings

not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.

Symbol

Parameter

Value

Unit

 

 

 

 

TA

Ambient Operating Temperature

0 to 70

°C

 

 

 

 

TSTG

Storage Temperature (VCC Off, Oscillator Off)

–40 to 85

°C

TSLD(1,2)

Lead Solder Temperature for 10 seconds

260

°C

VIO

Input or Output Voltages

–0.3 to 7

V

 

 

 

 

VCC

Supply Voltage

–0.3 to 7

V

IO

Output Current

20

mA

 

 

 

 

PD

Power Dissipation

1

W

 

 

 

 

Note: 1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).

2.For SO package: Reflow at peak temperature of 215°C to 225°C for < 60 seconds (total thermal budget not to exceed 180°C for between 90 to 120 seconds).

CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode. CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

6/27

M48T58, M48T58Y

DC AND AC PARAMETERS

This section summarizes the operating and measurement conditions, as well as the DC and AC characteristics of the device. The parameters in the following DC and AC Characteristic tables are derived from tests performed under the Measure-

ment Conditions listed in the relevant tables. Designers should check that the operating conditions in their projects match the measurement conditions when using the quoted parameters.

Table 3. Operating and AC Measurement Conditions

Parameter

M48T58

M48T58Y

Unit

 

 

 

 

Supply Voltage (VCC)

4.75 to 5.5

4.5 to 5.5

V

 

 

 

 

Ambient Operating Temperature (TA)

0 to 70

0 to 70

°C

Load Capacitance (CL)

100

100

pF

 

 

 

 

Input Rise and Fall Times

5

5

ns

 

 

 

 

Input Pulse Voltages

0 to 3

0 to 3

V

 

 

 

 

Input and Output Timing Ref. Voltages

1.5

1.5

V

 

 

 

 

Note: Output Hi-Z is defined as the point where data is no longer driven.

Figure 7. AC Measurement Load Circuit

5V

 

 

 

 

 

 

 

 

 

 

 

1.9kΩ

 

 

 

 

 

 

 

 

 

 

 

DEVICE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

UNDER

 

 

 

 

 

 

 

 

 

 

 

OUT

 

 

 

 

 

 

 

 

 

 

 

TEST

 

 

 

 

 

 

 

 

 

 

 

 

 

1kΩ

 

 

 

 

 

 

 

 

CL

= 100pF or 5pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CL includes JIG capacitance

AI01030

Table 4. Capacitance

Symbol

Parameter(1,2)

Min

Max

Unit

CIN

Input Capacitance

 

10

pF

 

 

 

 

 

COUT(3)

Output Capacitance

 

10

pF

Note: 1. Effective capacitance measured with power supply at 5V; sampled only, not 100% tested.

2.At 25°C, f = 1MHz.

3.Outputs deselected.

7/27

M48T58, M48T58Y

Table 5. DC Characteristics

Symbol

Parameter

Test Condition(1)

 

M48T58

 

M48T58Y

Unit

 

 

 

 

 

 

Min

 

Max

 

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ILI

Input Leakage Current

 

0V VIN VCC

 

 

±1

 

 

±1

µA

 

 

 

 

 

 

 

 

 

 

ILO(2)

Output Leakage Current

0V VOUT VCC

 

 

±1

 

 

±1

µA

ICC

Supply Current

 

Outputs open

 

 

50

 

 

50

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ICC1

Supply Current (Standby)

 

 

 

E1 = VIH

 

 

3

 

 

3

mA

TTL

 

 

E2 = VIO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

= VCC – 0.2V

 

 

 

 

 

 

 

ICC2

Supply Current (Standby)

 

E1

 

 

3

 

 

3

mA

CMOS

 

E2 = VSS + 0.2V

 

 

 

 

 

 

 

 

 

 

 

 

 

VIL(3)

Input Low Voltage

 

 

 

 

 

–0.3

 

0.8

 

–0.3

0.8

V

VIH

Input High Voltage

 

 

 

 

 

2.2

 

VCC + 0.3

 

2.2

VCC + 0.3

V

 

 

 

 

 

 

 

 

 

 

 

VOL

Output Low Voltage

 

IOL = 2.1mA

 

 

0.4

 

 

0.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output Low Voltage (FT)(4)

 

IOL = 10mA

 

 

0.4

 

 

0.4

V

 

 

 

 

 

 

VOH

Output High Voltage

 

IOH = –1mA

2.4

 

 

 

2.4

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note: 1. Valid for Ambient Operating Temperature: TA = 0 to 70°C; V CC = 4.75 to 5.5V or 4.5 to 5.5V (except where noted).

2.Outputs deselected.

3.Negative spikes of –1V allowed for up to 10ns once per Cycle.

4.The FT pin is Open Drain.

8/27

M48T58, M48T58Y

OPERATION MODES

As Figure 6, page 5 shows, the static memory array and the quartz controlled clock oscillator of the M48T58/Y are integrated on one silicon chip. The two circuits are interconnected at the upper eight memory locations to provide user accessible BYTEWIDE™ clock information in the bytes with addresses 1FF8h-1FFFh. The clock locations contain the century, year, month, date, day, hour, minute, and second in 24 hour BCD format (except for the century). Corrections for 28, 29 (leap year - valid until 2100), 30, and 31 day months are made automatically. Byte 1FF8h is the clock control register. This byte controls user access to the clock information and also stores the clock calibration setting.

The eight clock bytes are not the actual clock counters themselves; they are memory locations

Table 6. Operating Modes

consisting of BiPORT™ READ/write memory cells. The M48T58/Y includes a clock control circuit which updates the clock bytes with current information once per second. The information can be accessed by the user in the same manner as any other location in the static memory array.

The M48T58/Y also has its own Power-fail Detect circuit. The control circuitry constantly monitors the single 5V supply for an out-of-tolerance condition. When VCC is out of tolerance, the circuit write protects the SRAM, providing a high degree of data security in the midst of unpredictable system operation brought on by low VCC. As VCC falls below the Battery Back-up Switchover Voltage (VSO), the control circuitry connects the battery which maintains data and clock operation until valid power returns.

 

VCC

 

 

 

 

 

 

 

 

 

 

 

 

Mode

E1

E2

 

G

 

W

DQ0-DQ7

Power

Deselect

 

VIH

X

 

X

 

X

High Z

Standby

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Deselect

4.75 to 5.5V

 

X

VIL

 

X

 

X

High Z

Standby

WRITE

VIL

VIH

 

X

VIL

DIN

Active

or

 

 

4.5 to 5.5V

 

 

 

 

 

 

 

 

 

 

 

 

READ

VIL

VIH

VIL

VIH

DOUT

Active

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

READ

 

VIL

VIH

VIH

VIH

High Z

Active

Deselect

VSO to VPFD (min)(1)

 

X

X

 

X

 

X

High Z

CMOS Standby

Deselect

VSO(1)

 

X

X

 

X

 

X

High Z

Battery Back-up Mode

Note: X = VIH or VIL; VSO = Battery Back-up Switchover Voltage. 1. See Table 10, page 16 for details.

9/27

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