ST M29W641DH, M29W641DL, M29W641DU User Manual

查询M29W641DH供应商
SUPPLY VOLTAGE
–V –V –V
ACCESS TIME: 70, 90, 100 and 120ns
PROGRAMMING TIME
– 10 µs typical – Double Word Program option
128 UNIFORM, 32-KWord MEMORY BLOCKS
PROGRAM/ERASE CONTROLLER
– Embedded Program and Erase algorithms
ERASE SUSPEND and RESUME MODES
– Read and Program another Block during
UNLOCK BYPASS PROGRAM COMMAND
– Faster Production/Batch Programm ing
WRITE PROTECT OPTIONS
– M29W641DH: WP
Highest Address Block
– M29W641DL: WP
Lowest Address Block
– M29W641DU: No Write Protection
TEMPORARY BLOCK UNPROTECTION
MODE
COMMON FLASH INTERFACE
EXTENDED MEMORY BLOCK
– Extra block used as security block or to store
LOW POWER CONSUMPTION
– Standby and Automatic Standby
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h – Device Code M29W641D: 22C7h
2.7V to 3.6V Core Power Supply
CC =
= 1.8V to 3.6V for Input/Output
CCQ
=12 V for Fast Program (optional)
PP
Erase Suspend
Pin for Write Protection of
Pin for Write Protection of
additional information
M29W641DH, M29W641DL
M29W641DU
64 Mbit (4Mb x16, Uniform Block)
3V Supply Fl ash Me m ory
PRODUCT PREVIEW
Figure 1. Packages
TSOP48 (N)
12 x 20mm
FBGA
TFBGA63 (ZA)
7 x 11mm
April 2003
This is preliminary information on a new product now in development. Details are subject to change without notice.
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M29W641DH, M29W641DL, M29W641DU
TABLE OF CONTENTS
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. TFGBA Connections (Top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Address Inputs (A0-A21). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Data Inputs/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Data Inputs/Outputs (DQ8-DQ15 ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Write Enable (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Write Protect (WP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Reset/Block Temporary Unprotect (RP).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
V
(VPP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
PP
Supply Voltage (2.7V to 3.6V).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
V
CC
V
Supply Voltage (1.8V to 3.6V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
CCQ
V
Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SS
Table 2. Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Automatic Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Special Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Protect and Chip Unprotect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Protect and Chip Unprotect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read/Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Auto Select Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Unlock Bypass Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Unlock Bypass Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Unlock Bypass Reset Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Chip Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Block Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Erase Suspend Comma nd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Erase Resume Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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M29W641DH, M29W641DL, M29W641DU
Enter Extended Block Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Exit Extended Block Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 4. Program, Erase Times and Program, Erase Enduranc e Cyc les . . . . . . . . . . . . . . . . . . . . 14
STATUS REGISTER. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Erase Timer Bit (DQ3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Alternative Toggle Bit (DQ2).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 5. Status Register Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 5. Data Polling Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 6. Data Toggle Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 6. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 7. Operating and AC Measurement Condition s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 8. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 8. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 9. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 9. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 10. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 10. Write AC Waveforms, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 11. Write AC Characteristics, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 11. Write AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 12. Write AC Characteristics, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 12. Reset/Block Temporary Unprotect AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 13. Reset/Block Temporary Unprotect AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 13. Accelerated Program Timing Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 14. TSOP48 – 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline . . . . . . . . 25
Table 14. TSOP48 – 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data . 25 Figure 15. TFBGA63 - 7x11mm, 6x8 active ball array, 0.8mm pitch, Bottom view pac kage outline 26 Table 15. TFBGA63 - 7x11mm, 6x8 active ball array, 0.8mm pitch, Package Mechanical Data . . 26
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 16. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
APPENDIX A. BLOCK ADDRESSES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 17. Block Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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APPENDIX B. COMMON FLASH INTERFACE (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 18. Query Structure Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Table 19. CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Table 20. CFI Query System Interface Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 21. Device Geometry Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Table 22. Primary Algorithm-Specific Extende d Query Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 23. Security Code Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4
APPENDIX C. EXTENDED MEMORY BLOCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Factory Locked Extended Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Customer Lockable Extended Block. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 24. Extended Block Address and Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
APPENDIX D. BLOCK PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Programmer Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
In-System Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6
Table 25. Programmer Technique Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 16. Programmer Equipment Group Protect Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 17. Programmer Equipment Chip Unprotect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 18. In-System Equipment Group Protect Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 19. In-System Equipment Chip Unprotect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 26. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
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SUMMARY DESCRIPTION
The M29W641D is a 64 M bit (4Mb x16 ) non-vola­tile memory that can be read, erased and repro­grammed. These operations can be performed
CCQ
sup-
CC
supply
PP
using a single, low voltage, 2.7V to 3.6V V ply for the circuitry and a 1.8V to 3.6V V for the Input/Output pins. An optional 12 V V power supply is provided to speed up customer programming.
On power-up the memory defaults to its Read mode where it can be read in the same way as a ROM or EPROM.
The highest address blo ck of the M 29W641DH or the lowest address block of th e M29W641DL c an be protected from accidental programming or era­sure using the WP M29W641DU does not feature the WP
pin (if WP = VIL). The
pin.
Each block can be erased indep endently so it is possible to preserve valid dat a while old data is erased. The blocks can be protected to prevent accidental Program or Erase commands from modifying the memory. Program and E rase com­mands are written to the Command Interface of the memory. An on-chip Program/Erase Controller simplifies the process of prog ramming or erasing the memory by taking care of all of the special op­erations that are required to update the memory contents. The end of a program or erase operation can be detected and any error conditions identi­fied. The command set required to control the memory is consistent with JEDEC standards.
The M29W641D has an extra block, the Extended Block, (of 32 KWords) that can be accessed using a dedicated command. The Extended Block can be protected and so is useful for storing security information. However the protec tion i s not re vers­ible, once protected the protection cannot be un­done.
Chip Enable, Output Enable and Write Enable sig­nals control the bus operation of the memory. They allow simple conne ction to most m icropro­cessors, often without additional logic.
The memory is offered in a 48-pin TSOP package (M29W641DL and M29W641DH) or in a 63- ball TF­BGA package (M29W64 1DU). All de vices a re del iv­ered with all the bits erased (set to 1) .
M29W641DH, M29W641DL, M29W641DU
Figure 2. Logic Diagram
CCQ
V
PP
16
DQ0-DQ15
AI06697b
V
V
CC
22
A0-A21
W
E
G RB RP
WP
M29W641D
V
SS
Table 1. Signal Names
A0-A21 Address Inputs DQ0-DQ7 Data Inputs/Outputs DQ8-
DQ15 E G W
RP
RB
Data Inputs/Outputs
Chip Enable Output Enable Write Enable Reset/Block Temporary Unprotect
(M29W641DH and M29W641DL only) Ready/Busy Output (M29W641DU
only)
WP
V
CC
V
CCQ
V
PP
V
SS
Write Protect Supply Voltage Supply Voltage for Input/Output Supply Voltage for Fast Program
(optional) Ground
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M29W641DH, M29W641DL, M29W641DU
Figure 3. TSOP Connections
A15 A14 A13 A12 A11
1
48
A16 V
CCQ
V
SS
DQ15 DQ7
A10 DQ14
37 36
DQ6 DQ13 DQ5 DQ12 DQ4 V
CC
DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G V
SS
E A0
A21 A20
RP
V
PP
WP A19 A18 A17
A9 A8
W
A7 A6 A5 A4 A3 A2 A1
12
M29W641D
13
24 25
AI06698
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M29W641DH, M29W641DL, M29W641DU
Figure 4. TFGBA Connections (Top view through package)
654321
A
B
NC
NC
(1)
(1)
C
D
E
F
G
H
NC
A3
A4
A2
A1
A0
(1)
A7
A17
A6
RB
V
PP
A18
A5 A20
DQ0
E
DQ8
DQ2
DQ10
W
RP
A21
A19
DQ5
DQ12
A9
A8
A10
A11
DQ7
DQ14
NC
NC
V
(1)
(1)
A13
A12
A14
A15
A16
CCQ
NC
NC
87
(1)
(1)
J
K
L
NC
M
NC
G
DQ9
V
SS
(1)
NC
(1)
NC
DQ1
(1)
(1)
DQ11
DQ3
V
CC
DQ4
Note: 1. Bal l s ar e shorted to get her via the substrate but not connec ted to the die.
DQ13
DQ6
DQ15
V
SS
NC
NC
NC
NC
(1)
(1)
AI06879
(1)
(1)
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M29W641DH, M29W641DL, M29W641DU
SIGNAL DESCRIPTIONS
See Figure 2, Logic Diagram, and T able 1, Sign al Names, for a brief overview of the signals connect­ed to this device.
Address Inputs (A0-A21). The Address Inputs select the cells i n the memory array to a ccess dur­ing Bus Read operations. During Bus Write opera­tions they control the commands sent to the Command Interface of the Program/Erase Con­troller.
Data Inputs/Outputs (DQ0-DQ7). The Data I/O outputs the data stored at the selected address during a Bus Read operation. During Bus Write operations they represent the commands sent to the Command Interface of the Program/Erase Controller.
Data Inputs/Outputs (DQ8-DQ15). The Data I/O outputs the data stored at the selected address during a Bus Read operation. During Bus Write operations the Command Register does not use these bits. When reading the Status Register these bits should be ignored.
Chip Enable (E
the memory, allowing Bus Read and Bus Write op­erations to be performed. When Chip Enable is High, V
IH
Output Enable (G
trols the Bus Read operation of the memory.
Write Enable (W
the Bus Write operation of the memory’s Com­mand Interf a c e .
Write Protect (W
available in the M29W641DH and M29W641DL only. I t provid es a hard ware metho d of pro t ecting the highest address block for the M29W641DH and the lowest address block for the M29W64 1DL. The Write Protect pin must not be left floating or unconnected.
When Write Protect is Low, V tects either the highest or low est address block; Program and Erase operations in this block are ig­nored while Write Protect is Low.
When Write Pr otect verts to the previous protection status for this block. Program and Erase operations can now modify the data in t his block unless the block is protected using Block Protection.
Ready/Busy Output (RB
is an open-drain output that can be used to identify when the device is performing a Program or Erase operation. During Program or Erase operations Ready/Busy is Low, V pedance during Read mode, Auto Select mode and Erase Suspend mode.
After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy be-
). The Chip Enable, E, activates
, all other pins are ignored.
). The Output Enable, G, con-
). The Write Enable, W, controls
P). The Write Protect pin is
, the memory pro-
IL
is High, VIH, the memory re-
). The Ready/Busy pin
. Ready/Busy is high-im-
OL
comes high-impedance. See Tabl e 13 and Figure 12, Reset/Block Temporary Unprotect AC Charac­teristics.
The use of an open-drain output allows the Ready/ Busy pins from several memories to be connected to a single pull-up resistor. A Low will then indicate that one, or more, of the memories is busy.
Reset/Block Temporary Unprotect (RP
). The
Reset/Block Temporary Unprotect pin can be used to apply a Hardware Reset to the memory or to temporarily unprotect all Blocks that hav e b een protected.
Note that if Write Protect
(WP) is at VIL, then one of the two outermost blocks will remain p rotected even if RP is at V
.
ID
A Hardware Reset is achieved by holding Reset/ Block Temporary Unprotect Low, V
. After Reset/Block Temporary Unprotect
t
PLPX
goes High, V
, the memory will be ready for Bus
IH
Read and Bus Write operations after t t
, whichever occurs las t. See Table 13 and
RHEL
, for at least
IL
PHEL
or
Figure 12, Reset/Block T emporary Unprotect AC Characteristics, for more details.
Holding RP
at VID will temporarily unprotect the protected Blocks in the memory. Program and Erase operations on all blocks will be possible. The transition from V t
V
.
PHPHH
(VPP). When the VPP pin is raised to V
PP
to VID must be slower than
IH
PPH
the memory automatically enters the Unlock By­pass mode. When the pin is returned to V
IH
or V normal operation resumes. During Unlock Bypass Program operations the memory draws I
PP
from the pin to supply the programming circuits. See the description of the Unlock Bypass comm and in the Command Interface section. The transitions from V
to VPP and from VPP to VIH must be slower
IH
than t Never raise the pin to V
, see Figure 13.
VHVPP
from any mode except
PP
Read mode, otherwise the memory may be left in an indeterminate state.
V
Supply Voltage (2.7V to 3.6V). VCC pro-
CC
vides the power supply for all operations (Read, Program and Erase).
The Command Interface is disabled when the V
CC
Supply Voltage is less than the L ockout Voltage,
. This prevents Bus Write operations from ac-
V
LKO
cidentally damaging the data during power up, power down and power surges. If the Program/ Erase Controller is programming or erasing during this time then the operation aborts and the memo­ry contents being altered will be invalid.
V
Supply Voltage (1.8V to 3.6V). V
CCQ
CCQ
pro­vides the power supply to the I/O pins and enables all Outputs to be powered indepen dently of V
CC
IL
.
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M29W641DH, M29W641DL, M29W641DU
V
can be tied to VCC or can use a separate
CCQ
supply.
V
Ground. VSS is the reference for all voltage
SS
measurements. The device f eatu res two V
SS
pins which must be both connected to the system ground.
Note: Each device in a system should have V
CC, VCCQ
and VPP decoupled from V
SS
with a
Table 2. Bus Operations
Operation E G W
Bus Read Bus Write Output Disable X Standby Read Manufacturer
Code
Read Device Code
Extended Memory Block Verify Code
Note: X = VIL or VIH.
V V
V
V
V
V
V
IL
V
IL
V
IH
V
IL
V
IL
V
IL
V
IL
IH
IH
Cell Address Data Output
IH
V
Command Address Data Input
IL
V
X Hi-Z
IH
X X X Hi-Z
A0 = VIL, A1 = VIL, A9 = VID,
V
IL
IL
IL
IH
Others V A0 = VIH, A1 = VIL, A9 = VID,
V
IH
Others V
A0 = VIH, A1 = VIH, A6 = VIL,
V
IH
A9 = V
0.1µF ceramic capacitor close to the pin for current surge protection (high frequency, in­herently low inductance ca pacitors should b e as close as possible to the device). See Figure 8, AC Measurement Load Circuit. The PCB trace widths should be sufficient to carry the required V
program and erase curr ents. S ee
PP
Table 9, DC Characteristics.
Address Inputs
A0-A21
or V
IL
IH
or V
IL
IH
, Others VIL or V
ID
IH
Data Inputs/Outputs
DQ15-DQ0
0020h
22C7h
98h (factory locked, WP protects
highest address block)
18h (not factory locked, WP
protects highest address block)
88h (factory locked, WP
lowest block)
08h (not factory locked, WP
protects lowest block)
protects
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M29W641DH, M29W641DL, M29W641DU
BUS OPERATIONS
There are five standard bus operations that control the device. These are Bus Read, Bus Wri te, Out­put Disable, Standby and Automatic Standby. See Table 2, Bus Operations, for a summary. Typically glitches of less than 5ns on Chip Enabl e o r Write Enable are ignored by t he mem ory and do not a f­fect bus operations.
Bus Read. Bus Read operations read from the memory cells, or specific registers in the Com­mand Interface. A valid Bus Read operation in­volves setting the desired address on the Address Inputs, applying a Low sig nal, V and Output Enable and keeping Write Enable High, V
. The Data Inputs/Outputs will output the
IH
value, see Figure 9, Read Mode AC W aveforms, and Table 10, Read AC Characteristics, for details of when the output becomes valid.
Bus Write. Bus Write operations write to the Command Interface. A valid Bus Write operation begins by setting the desire d address on t he Ad­dress Inputs. The Address Inputs are latched by the Command Interface on the falling edge of Chip Enable or Write Enable, whichever occurs last. The Data Inputs/Outputs a re latched by the Com­mand Interface on the rising edge of Chip Enable or Write Enable, whichever occurs first. Output En­able must remain High, V
IH
Write operation. See Figure 10 and Figure 11, Write AC Waveforms, and Table 11 and Table 12, Write AC Characteristics, for details of the timing requirements.
Output Disa bl e . The Data Inputs/Outputs are in the high impedance s tate when Output Enable is High, V
.
IH
Standby. When Chip Enable is High, V memory enters Standby mode and the Data In­puts/Outputs pins are placed in the high-imped­ance state. To reduce the S upply Current to the Standby Supply Current, I
CC2
, to Chip Enable
IL
, during the whole Bus
, the
IH
, Chip Enable should
be held within V
± 0.2V. For the Standby current
CC
level see Table 9, DC Characteristics. During program or erase operations the memory
will continue to use the Program/Erase Supply Current, I
, for Program or Erase operations un-
CC3
til the operation completes. Automatic Standby. If CMOS levels (V
± 0.2V)
CC
are used to drive the bus and the bus is inactive for 300ns or more the memory enters Automatic Standby where the internal Supply Current is re­duced to the Standby Supply Current, I
CC2
. The Data Inputs/Outputs will still output data if a Bus Read operation is in progress.
Special Bus Operations
Additional bus operations can be performed to read the Electronic Signature and also to apply and remove Block Protec tion. These bus opera­tions are intended for use by programming equip­ment and are not usually used in applications. They require V
to be applied to some pins.
ID
Electronic Signature. The memory has two codes, the manufacturer code and the device code, that can be read to identify the memory. These codes can be read by applying t he signals listed in Table 2, Bus Operations.
Block Protect and Chip Unprotect.
Groups of blocks can be protected against accidental Pro­gram or Erase. The whole chip can be unprotected to allow the data inside the blocks to be changed.
Write Protect the outermost blocks. When Write Protect at V
one of the two outer mos t blo cks is protect-
IL
(WP) can be used to protect one of
(WP) is
ed and r emai ns prote cte d r egar dle ss o f th e Bloc k Protection Status or the Reset/Block Temporary Unprotect pin statu s. For the M 29W641D H, it is the highest addressed block that can be protect­ed. For th e M29W 641DL, it i s t he l owest.
Block Protect and Chip Unprote ct operations are described in Appendix D.
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COMMAND INTERFACE
All Bus Write operations t o the me mory are in ter­preted by the Command Interface. Commands consist of one or more sequential Bus Write oper­ations. Failure to observe a valid sequence of Bus Write operations will result in the memory return­ing to Read mode. The long command sequences are imposed to maximize data security.
See Table 3 for a summary of the commands.
Read/Reset Command
The Read/Reset command returns the memory to its Read mode where it behaves like a ROM or EPROM. It also resets the errors in the Status Register. Either one or three Bus Write operations can be used to issue the Read/Reset command.
The Read/Reset command can be issued, be­tween Bus Write cycles before the start of a pro­gram or erase operation, to return the device to read mode. If the Read/Reset command is issued during the timeout of a Block erase operation then
the memory will take up to 10µs to abort. During the abort period no valid data can be read from the memory. The Read/Reset command will not abort an Erase operation when issued while in Erase Suspend.
Auto Select Command
The Auto Select command is used to read the Manufacturer Code, the Device Code , the Block Protection Status and the Extended Memory Block Verify Code. Three consecutive B us Write opera­tions are required to iss ue the Auto Select com­mand. Once the Auto Select command is issued the memory remains in Auto Select mode until a Read/Reset command is issued. Read CFI Query and Read/Reset comma nds are ac cept ed i n Aut o Select mode, all other commands are ignored.
In Auto Select mode the Manufac turer Code can be read using a Bus Read operation with A0 = V and A1 = VIL. The other address bits may be set to either V
or VIH. The Manufacturer Code f or ST-
IL
Microelectronics is 0020h. The Device Code can be read using a B us Read
operation with A0 = V address bits may be set to e ither V
and A1 = VIL. The other
IH
or VIH. The
IL
Device Code for the M29W641D is 22C7h. The Bl ock Prot ection S tatus of each block can be
read using a Bus Read operation with A0 = V A1 = V
, and A 12 -A 21 spec ify i n g t he address of
IH
IL
the bl ock. The oth er addr ess bit s may b e set t o ei­ther V
or VIH. If t h e ad dr ess ed b loc k is pro tec te d
IL
then 01h is output on Data Inputs/Outputs DQ0­DQ7, otherwise 00h is output.
Read CFI Query Command
The Read CFI Query Command is used to read data from the Common Flash Interface (CFI) Memory Area. This command is valid when the de-
M29W641DH, M29W641DL, M29W641DU
vice is in the Read Array mode, or when the device is in Autose lec ted mode .
One Bus Write cycle is required to issue the Read CFI Query Command. Once the command is is­sued subsequent Bus Read ope rations read from the Common Flash Interface Memory Area.
The Read/Reset command m ust be issued to re­turn the device to the previous mode (the Read Ar­ray mode or Autoselected mode). A second Read/ Reset command would be needed if the device is to be put in the Read Array mode from Autoselect­ed mode.
See Appendix B, Table 18 to Table 23 for details on the information contained in the Common Flash Interface (CFI) memory area.
Program Command
The Program command can be used to program a value to one address in the memory array at a time. The command requires four Bus Write oper­ations, the final write operation latches the ad­dress and data, and starts the Program/Erase Controller.
If the address falls in a pro tected block then the Program command is ignored, the data remains unchanged. The Status Register is never read and no error condition is given.
During the program operat ion the memo ry will ig­nore all commands. I t is n ot poss ible t o iss ue any command to abort or pause the operation. Typical program times are given in Table 4. Bus Read op­erations during the program o peration will output the Status Register on the Data Inputs/Outputs. See the section on the S tatus Register for more details.
After the program operation has completed the memory will return to the Read mode, unle ss an
IL
error has occurred. When an error occurs the memory will continue to output the Status Regis­ter. A Read/Reset command must be issued to re­set the error condition and return to Read mode.
Note that the Program command cannot change a bit set at ’0’ bac k to ’1’. One of the E rase Com­mands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’.
Fast Program Commands
,
There is a Fast Program command available to im­prove the programming throughput, by writing sev­eral adjacent words or bytes in parallel: the Double Word Program command.
Double Word Program Command. Th e D oub l e Word Program command is used to write a p age of two adjacent words in parallel. Th e two words must differ only for the address A0.
Three bus write cycles are necessary to issue the Double Word Program command.
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M29W641DH, M29W641DL, M29W641DU
The first bus cycle sets up the Double Word
Program Command.
The second bus cycle latches the Address and
the Data of the first word to be written.
The third bus cycle latches the Address and the
Data of the second word to be written and starts the Program/Erase Controller.
Only one bank can be programmed at any one time. The other b ank must be in Read mode or Erase Suspend.
Programming should not be attempted when V is not at V
PPH
.
PP
After programming has started, Bus Read opera­tions in the Bank being programmed output the Status Register content, while Bus Read opera­tions to the other B ank outpu t the cont ents of t he memory ar ray.
After the program operation has completed the memory will return to the Read mode, unle ss an error has occurred. When an error occurs Bus Read operations to the Bank where the command was issued will continue to output the Status Reg­ister. A Read/Reset command must be issued to reset the error condition and return t o Read mode.
Note that the Fast Program commands cannot
change a bit set at ’0’ back to ’1’. One of the Erase Commands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’.
Typical Program times are given in Tab le 4, Pro­gram, Erase Times and Program, Erase Endur­ance Cycles.
Unlock Bypass Command
The Unlock Bypass command is used in conjunc­tion with the Unlock Bypass Program command to program the memory faster than with the standard program commands. When th e cycle time to the device is long (as with some EPROM program­mers) considerable time saving can be m ade by using these commands. Three Bus Write opera­tions are required to issue the Unlock Bypass command.
Once the Unlock Bypas s command has bee n is­sued the memory enters Unlock Bypass mode. When in this mode the memory can be read as if in Read mode.
When V
is applied to the VPP pin the memory
PPH
automatically enters the Unlock Bypass mode and the Unlock Bypass Program command can be is­sued immediately.
Unlock Bypass Program Command
The Unlock Bypass Program command can be used to program one address in the memory array at a time. The command requires two B us Write operations, the final write operation latches the ad-
dress and data, and starts the Program/Erase Controller.
A Program operation initiated by issuing the Un­lock Bypass Program command is identical to a Program operation initiated by issuing the Pro­gram command. I t cannot be abo rted and a Bus Read operation will output the Status Register. See the Program Comma nd paragrap h f or further details.
Unlock Bypass Reset Command
The Unlock Bypass Rese t command can be used to return to Read/Reset mode from Unlock Bypass Mode. Two Bus Write operations are required to issue the Unlock Bypass Reset command. Read/ Reset command does not exit from Unlock Bypass Mode.
Chip Erase Command
The Chip Erase command can be used to erase the entire chip. Six Bus Write operations a re re­quired to issue the Chip Erase Command and start the Program/Erase Controller.
If any blocks are protected then these are ignored and all the other blocks are erased. If all of the blocks are protect e d th e Chip Erase op erat i on ap­pears to start but will terminate within about 100µs, leaving the data unchanged. No error condition is given when protected blocks are ignored.
During the erase operation the memory will ignore all commands, including the Erase Suspen d com­mand. It is not possible to i ssue any c ommand t o abort the operation. Typical chip erase tim es are given in Table 4. All Bus Read operations during the Chip Erase operation will output the Status Register on the Data Inputs/Outputs. See the sec­tion on the Status Register for more details.
After the Chip Erase operation has completed t he memory will return to the Read Mode, unle ss an error has occurred. When an error occurs the memory will continue to output the Status Regis­ter. A Read/Reset command must be issued to re­set the error condition and return to Read Mode.
The Chip Erase Command sets all of the bits in un­protected blocks of the memory to ’1’. All previous data is lost.
Block Erase Command
The Block Erase com mand can be used to erase a list of one or more blocks. Six Bus Write opera­tions are required to select the first block in the li st. Each additional block in the list can be selected by repeating the sixth Bus Write operation using the address of the additional block. The B lock Erase operation starts the Program/Erase Controller about 50µs after the last Bus Write operation. Once the Pr ogram /Erase Co ntroller st arts it is not possible to select any more blocks. Each addition­al block must therefore be selected within 50µs of
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M29W641DH, M29W641DL, M29W641DU
the lowest address block. The 50µs timer restarts when an additional block is selected. The Status Register can be read after the sixth Bus Write op­eration. See the Status Register section for details on how to identify if th e Program /Erase Controller has started the Block Erase operation.
If any selected blocks are protected then these are ignored and all the other selected blocks are erased. If all of the selected blocks are p rotected the Block Erase operation appears to start but will terminate within about 100µs, leaving the data un­changed. No error condition is given when protect­ed blocks are ignored.
During the Block Erase operation the me mory wi ll ignore all commands except the Erase Susp end command. Typical b lock era se tim es are g iven in Table 4. All Bus Read operations during the Block Erase ope ra tion will outp ut the S t atus R e gister on the Data Inputs/Outputs. See the section on the Status Register for more details.
After the Block Erase operation has completed the memory will return to the Read Mode, unle ss an error has occurred. When an error occurs the memory will continue to output the Status Regis­ter. A Read/Reset command must be issued to re­set the error condition and return to Read mode.
The Block Erase Command sets all of the bits in the unprotected selected blocks to ’1’. All previous data in the selected blocks is lost.
Erase Suspend Command
The Erase Suspend Command may be used to temporarily suspend a B lock Eras e operation and return the memory to Read mode. T he comm and requires one Bus Write operation.
The Program/Erase Controller will sus pend within the Erase Suspend Latency time of the Erase Sus­pend Command being issued. Once the Program/ Erase Controller has stopped the mem ory will be set to Read mode and the E ras e wi ll be s uspend­ed. If the Erase Suspend command is issued dur­ing the period when the memory is waiting for an additional block (before the Program/Er ase Con­troller starts) then the Erase is suspended immedi­ately and will start immediately when the Erase Resume Command is issued. It is not possibl e to select any further blocks to erase after the Erase Resume.
During Erase Suspend it is possible to Read and Program cells in blocks that are not being erased; both Read and Program operations behave as normal on these blocks. If any attempt is made to program in a protected block or in the suspended
block then the Program comm and is ignored and the data remains unchanged. The Status Register is not read and no error condi tion is given. Read­ing from blocks that are being erased will output the Status Register.
It is also possible to issue the Auto Select, Read CFI Query and Unlock Bypass commands du ring an Erase Suspend. The Read/Reset command must be issued to return the device to Read Array mode before the Resume command will be ac­cepte d.
Erase Resume Command
The Erase Resume command must be used to re­start the Program/Erase Controller after an Erase Suspend. The device must be in Read Array mode before the Resume command will be accepted. An erase can be suspe nded and resumed mo re t han once.
Enter Extended Block Command
The device has an extra 32 KWord block (Extend­ed Block) that can only be accessed using the En­ter Extended Block command. Three Bus write cycles are required to issue the Exte nded Block command. Once the command has been issued the device enters Extended B lock mo de where all Bus Read or Write operations to the Boot Block addresses access the Extended Block. The Ex­tended Block (with the same address as the Boot Blocks) cannot be erased, and can be t reated as one-time programmable (OTP) memory. In Ex­tended Block mode the Boot Blocks are not acces­sible.
To exit from the Extended Block mode the Exit Ex­tended Block command must be issued.
The Extended Block can be protected, however once protected the protection cannot be undone.
Exit Extended Block Com m a n d
The Exit Extended Block command is used to exit from the Extended Block mod e and ret urn the de­vice to Read mode. Four Bus Write operations are required to issue the command.
Block Protect and Chip Unprotect Commands Groups of blocks can be protected against acci-
dental Program or E rase. The whole chip can be unprotected to allow the data i nside the blocks to be changed.
Block Protect and Chip Unprote ct operations are described in Appendix D.
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