Datasheet M24256-B, M24128-B Datasheet (ST)

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M24256-B M24128-B
256Kbit and 128Kbit Serial I²C Bus EEPROM
With Three Chip En able Lines
FEATURES SUMMARY
Compat ib le with I
Supports 400 kHz Protocol
Single Supply Voltage:
– 4.5V to 5.5V for M24xxx-B – 2.5V to 3.6V for M24xxx-BV – 2.5V to 5.5V for M24xxx-BW – 1.8V to 5.5V for M24xxx-BR – 1.8V to 3.6V for M24xxx-BS
Hardware Write Control
BYTE and PAGE WRITE (up to 64 Byte s)
RANDOM and SEQUENTIAL READ Modes
Self-Timed Progr a m ming Cycle
Automatic Address Incrementing
Enhanced ESD/Latch-Up Behav ior
More than 100,000 Erase/Write Cycles
– More than 1 Million Erase/Write cycles for the
products specified in Table 22
More than 40 Year Data Retention
2
C Extended Addressing
2
C Serial Interface
Figure 1. Packages
8
1
PDIP8 (BN)
8
1
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
1/25November 2002
M24256-B, M24128-B
SUMMARY DESCRIPTION
2
These I
C-compatible electrically erasable programmable memory (EEPROM) devices are organized as 32K x 8 bits (M24256-B) and 16K x 8 bits (M24128-B).
Figure 2. Logi c Diagram
V
CC
3
E0-E2
SCL
WC
M24256-B M24128-B
V
SS
SDA
AI02809
Table 1. Signal Names
E0, E1, E2 Chip Enable SDA Serial Data SCL Serial Clock
following the bus master’s 8-bit transmission. When data is read by the bus master, the bus master acknowledges the receipt of the data byte in the same way. Data transfers are terminated by a Stop condition after an Ack for Write, and after a NoAck for Read.
Power On Reset: V
Lock-Out Write Protect
CC
In order to prevent data corruption and inadvertent write operations during power up, a Power On Re­set (POR) circuit is included. The internal reset is held active until V
has reached the POR thresh-
CC
old value, and all operations are disabled – the de­vice will not respond to any command. In the same way, when V
drops from the operating voltage,
CC
below the POR threshold value, all operations are disabled and the device will not respond to any command. A stable and valid V
must be applied
CC
before applying any logic signal. When the power supply is turned on, V
from V
to VCC(min), passing through a value V
SS
CC
rises
in between. The -V and -S versions of the dev i ce, the M24xxx-BV and M24xxx-BS, i gnore all instruc­tions until a time delay of t moment that V
rises above the Vth threshold.
CC
has elapsed after the
PU
However, the correct operation of the device is not guaranteed if, by this time, V V
(min). No instructions should be s ent until the
CC
is still below
CC
later of:
afte r VCC passed the Vth threshold
–t
PU
passed the VCC(min) lev e l
–V
CC
These values are specified in Table 14.
th
WC V
CC
V
SS
These devices are compatible with the I
Write Control Supply Voltage Ground
2
C memo­ry protocol. This is a two wire serial interface that uses a bi-directional data bus and serial clock. The devices carry a built-in 4-bit Device Type Identifier code (1010) in accordance with the I
2
C bus defini-
tion. The device behaves as a slave in the I
2
C protocol, with all memory operations synchronized by the serial clock. Read and Write operations are initiat­ed by a Start condition, generated by the bus mas­ter. The Start condition is followed by a Device Select Code and RW
bit (as described in Table 2),
terminated by an acknowledge bit. When writing data to the memory, the device in-
serts an acknowledge bit during the 9
2/25
th
bit time,
Figure 3. DIP, SO and TSSOP Connections
M24256-B M24128-B
1
E0 V
2 3
E2
4
SS
Note: 1. See page 19 (onwards) for package dimensions, and how
to identify pin-1.
8 7 6 5
AI02810B
CC
WCE1 SCL SDAV
SIGNAL DESCRIPTION Serial Clock (SCL)
This input signal is used to strobe all data in and out of the device. In applications where this signal is used by slave devices to synchronize the bus to a slower clock, the bus master must have an open drain output, and a pull-up resistor must be con­nected from Serial Clock (SCL) to V
. (Figure 4
CC
indicates how the value of the pull-up resistor c an be calculated). In most applications, thoug h, this method of synchronization is no t employed, and so the pull-up resistor is not necessary, provided that the bus master has a push-pull (rather than open drain) output.
Serial Data (SDA)
This bi-directional signal is used to transfer data in or out of the device. It is an open drain output that may be wire-OR’ed with other op en drai n or open collector signals on the bus. A pull up resistor must be connected from Serial Data (SDA) to V
CC
. (Fig­ure 4 indicates how the value of the pull-up resistor can be calculated).
M24256-B, M24128-B
Chip Enable (E0, E1, E2)
These input signals are used to set the value that is to be looked for on the three least significant bits (b3, b2, b1) of the 7-bit Device Select Code. These inputs must be tied to V Device Select Code.
Write Control (WC
This input signal is useful for protecting the entire contents of the memory from inadvertent write op­erations. Write operations are disabled to the en­tire memory array when Write Control (WC driven High. When unconnected, the signal is in­ternally read as V
IL
lowed. When Write Control (WC
Select and Address bytes are acknowledged, Data bytes are not acknowledged.
or VSS, to establish the
CC
)
) is
, and Write operations are al-
) is driven High, Device
Figure 4. Maximum R
20
16
12
8
Maximum RP value (k)
4
0
10 1000
Value versus Bus Capacitance (C
L
fc = 100kHz
fc = 400kHz
100
C
(pF)
BUS
) for an I2C Bus
BUS
MASTER
V
CC
R
SDA
SCL
R
C
BUS
L
C
BUS
AI01665
L
3/25
M24256-B, M24128-B
Figure 5. I2C Bus Protocol
SCL
SDA
SCL
SDA
SCL
SDA
START
Condition
START
Condition
1 23 789
MSB
1 23 789
MSB ACK
SDA
Input
SDA
Change
STOP
Condition
ACK
STOP
Condition
AI00792B
Table 2. Device Select Code
Device Type Identifier
1
Chip Enable Address
b7 b6 b5 b4 b3 b2 b1 b0
Device Select Code 1 0 1 0 E2 E1 E0 RW
Note: 1. The most significant bit, b7, is sent first.
2. E0 , E 1 and E2 are comp ared against the respective ext ernal pins on the memory device.
2
RW
Table 3. Most Significant Byte Table 4. Least Significant Byte
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
4/25
M24256-B, M24128-B
DEVICE OPERATION
2
The device supports the I
C protocol. This is sum­marized in Figure 5. Any device that sends data on to the bus is defined to be a transmitter, a nd any device that reads the data to be a receiver. The device that controls the data transfer is kn own as the bus master, and the other as the slave device. A data transfer can only be initiated by the bus master, w h ic h will also provide t he s er ial clock for synchronization. The M24xxx-B d evice i s a lways a slave in all communication.
Start Condition
Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in the High state. A Start condition must precede any data transfer command. The devi ce continuously monitors (except duri ng a Write cycle ) Se rial Data (SDA) and Serial Clock (SCL) for a Start condition, and will not respond unless one is give n.
Stop Condition
Stop is identified by a rising edg e of Serial Data (SDA) while Serial Clock (SCL) is stable and driv­en High. A Stop condition terminates communica­tion between the device and the bus master. A Read command that is followed by NoAck can be followed by a Stop condition to force the device into the Stand-by mode. A Stop condition at the end of a Write command triggers the internal EE­PROM Wr ite cycle .
Acknowledge Bit (ACK)
The acknowledge bit is used to indicate a success­ful byte transfer. The bus transmitter, whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits of data. During the
th
clock pulse period, the receiver pulls Serial
9
Data (SDA) Low to acknowledge the receipt of the eight data bits.
Data Input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock (SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge of Serial Clock (SCL), and the Serial Data (SDA) signal
only
must change
when Serial Clock (SCL) is driv-
en Low.
Memory Addressing
To start communication betwee n the bus master and the slave device, the bus mas ter mus t initiate a Start condition. Following this, the bu s master sends the Device Select Code, shown in Tabl e 2 (on Serial Data (SDA), most significant bit first).
The Device Select Code consists of a 4-bit Device Type Identifier, and a 3-bit Chip Enable “Address” (E2, E1, E0). To address the memory array, the 4­bit Device Type Identifier is 1010b.
Up to eight memory devices can be connected on a single I
2
C bus. Each one is given a uniq ue 3-bit code on the Chip Enable (E0, E1, E2) inputs. When the Device Select Code is received on Seri­al Data (SDA), the device only responds if the Chip Enable Address is the same as the value on the Chip Enable (E0, E1, E2) inputs.
th
The 8
bit is the Read/Write bit (RW). This bit is
set to 1 for Read and 0 for Write operations. If a match occurs on the Device Select code, the
corresponding device gives an acknowledgment on Serial Data (SDA) during the 9
th
bit time. If the device does not match the Device Select code, it deselects itself from the bus, and goes into Stand­by mode.
Table 5. Operating Modes
Mode RW bit
Current Address Read 1 X 1 START, Device Select, RW
Random Address Read
Sequential Read 1 X Byte Write 0 V Page Write 0 V
Note: 1. X = V
IH
or V
.
IL
0X 1 X reSTART, Device Select, RW
WC
1
IL
IL
Bytes Initial Sequence
1
1 Similar to Current or Random Address Read
1 START, Device Select, RW = 0
64 START, Device Select, RW
START, Device Select, RW
= 1 = 0, Address
= 1
= 0
5/25
M24256-B, M24128-B
Figure 6. Wri te Mo de S e qu e nces with WC=1 (data wri te inhibi ted)
WC
ACK ACK ACK NO ACK
BYTE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN
R/W
START
WC
ACK ACK ACK NO ACK
PAGE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN 1
R/W
START
WC (cont'd)
NO ACK NO ACK
PAGE WRITE (cont'd)
DATA IN N
STOP
slot), either at the end of a Byte Write or a Page
Write Operations
Following a Start condition the bus mast er sends a Device Select Code with the RW
bit rese t to 0 . The device acknowledges this, as shown in Figure 7, and waits for two address bytes. The device re­sponds to each address byte with an acknowledge bit, and then waits for the data byte.
Writing to the memory may be inhibited if Write Control (WC with Write Control (WC
) is driven High. Any Write instruction
) driven High (during a pe­riod of time from the Start condition until the end of the two address bytes) will not modify the memory contents, and the accompanying data bytes are
not
acknowledged, as shown in Figure 6.
Each data byte in the m emory has a 16-bit (two byte wide) address. The Most Significant Byte (Ta­ble 3) is sent first, followed by t he Least Significant Byte (Table 4). Bits b15 to b0 form t he add ress of the byte in memory.
When the bus mast er generate s a Stop con dition immediately after the Ack bi t (in t he “10
th
bit” time
Write, the internal memory Write cycle is triggered. A Stop condition at any other time slot does not trigger the internal Write cycle.
During the internal Write cycle, Serial Data (SDA) is disabled internally, and the devi ce does not re­spond to any requests.
Byte Write
After the Device Select code and the address bytes, the bus master sends one dat a byte. If the addressed location is Write-protected, by Write Control (WC with NoAck, and the location is not modified. If, in­stead, the addressed location is not Write-protect­ed, the device replies with Ack. The bus ma ster terminates the transfer by generating a S top con­dition, as shown in Figure 7.
Page Write
The Page Write mode allows u p to 64 by tes to be written in a single Write cycle, provided that they are all located in the same ’row’ in the memory: that is, the most significant m emory address bits
STOP
DATA IN 2
AI01120C
) being driven High, the device replies
6/25
M24256-B, M24128-B
(b14-b6 for M24256-B, and b13-b6 for M24128-B) are the same. If more bytes are sent than will fit up to the end of the row, a condition known as ‘roll­over’ occurs. This should be avoided, as data starts to become overwritten in an implementation dependent way.
The bus master sends fr om 1 to 64 bytes of data, each of which is acknowledged by the device if
Figure 7. Wri te Mo de S e qu e nces with W
WC
BYTE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN
START
WC
C=0 (data write enabled)
ACK
R/W
ACK ACK ACK ACK
Write Control (WC) is Low. If Write Control (WC) is High, the contents of the addressed memory loca­tion are not modified, and each dat a byte is fol­lowed by a NoAck. After each by te is transferred, the internal byte address counte r (the 6 least sig­nificant address bits only) is incremented. The transfer is terminated by the bus master generat­ing a Stop condition.
ACK ACK ACK
STOP
PAGE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN 1
R/W
START
WC (cont'd)
ACKACK
PAGE WRITE (cont'd)
DATA IN N
STOP
DATA IN 2
AI01106C
7/25
M24256-B, M24128-B
Figure 8. Wri te Cy cle Pol l in g Fl owchart usin g AC K
WRITE Cycle
in Progress
START Condition
DEVICE SELECT
with RW = 0
ACK
NO
Returned
First byte of instruction with RW = 0 already decoded by the device
ReSTART
STOP
YES
Next
Operation is
Addressing the
Memory
DATA for the
WRITE Operation
Continue the
WRITE Operation
Minimizing System Delays by Polling On ACK
During the internal Write cycle, the device discon­nects itself from the bus, and writes a copy of the data from its internal latches to the memory cells. The maximum Write time (t
) is shown in Tables
w
20 and 21, but the typical time is shorter. To make use of this, a polling sequence can be used by the bus master.
The sequence, as shown in Figure 8, is: – Initial condition: a Write cycle is in progress.
YESNO
Send Address
and Receive ACK
START
Condition
YESNO
DEVICE SELECT
with RW = 1
Continue the
Random READ Operation
AI01847C
– Step 1: the bus master issues a Start condition
followed by a Device Select Code (the first byte of the new instruction).
– Step 2: if the device is busy with the internal
Write cycle, no Ack will be returned and the bus master goes back to Step 1. If the device has terminated the internal Write cycle, it responds with an Ack, indicating that the device is ready to receive the second part of the instruction (the first byte of this instruction having been sent during Step 1).
8/25
Figure 9. Read Mode Sequences
M24256-B, M24128-B
CURRENT ADDRESS READ
RANDOM ADDRESS READ
SEQUENTIAL CURRENT READ
SEQUENTIAL RANDOM READ
ACK
DEV SEL DATA OUT
R/W
START
ACK
DEV SEL * BYTE ADDR BYTE ADDR
R/W
START
ACK ACK ACK NO ACK
DEV SEL DATA OUT 1
R/W
START
ACK ACK ACK
DEV SEL * BYTE ADDR BYTE ADDR
NO ACK
STOP
ACK ACK ACK
DEV SEL * DATA OUT
R/W
START
DATA OUT N
STOP
ACK ACK
DEV SEL * DATA OUT 1
NO ACK
STOP
R/W
START
ACK NO ACK
DATA OUT N
STOP
Note: 1. The sev en m ost signific ant bits of the D evice Select Code of a Rando m Read (in the 1st and 4th bytes) must be ide n tical .
START
R/W
AI01105C
Current Address Read
Read Operations
Read operations are performed independently of the state of the Write Control (WC
) signal.
Random Address Read
A dummy Write is performed to load the address into the address counter (as shown in Figure 9) but
without
sending a Stop condition. Then, the bus master sends another Start condition, and repeats the Device Select Code, with t he RW
bit set to 1. The device acknowledges this, and outputs the contents of the addressed byte. The bus master must
not
acknowledge the byte, and terminates
the transfer with a Stop condition.
The device has an internal address counter which is incremented each time a byte is read. For the Current Address Read operation, following a Start condition, the bus master only sends a Device Se­lect Code with the RW
bit set to 1. The device ac­knowledges this, an d outputs the byt e address ed by the internal address counter. The counter is then incremented. The bus master term inates t he transfer with a Stop condition, as shown i n Figure 9,
without
acknowledging the byte.
Sequenti a l Read
This operation can be used after a Current Ad­dress Read or a Random Address Read. The bus
9/25
M24256-B, M24128-B
master
does
acknowledge the data byte output, and sends additional clock pulses so that the de­vice continues to output the next byte in sequence. To terminate the stream of bytes, the bus master must
not
acknowledge the last byte, and
must
generate a Stop condition, as shown in Figure 9. The output data comes from consecutive address-
es, with the internal address counter automatically incremented after each byte output. After the last memory address, the address counter ‘rolls-over’, and the device continues to output data from memory address 00h.
Acknowledge in Read Mode
For all Read commands, the device waits, after each byte read, for an acknowledgment during the
th
bit time. If the bus master does not drive Serial
9 Data (SDA) Low during this time, the device termi­nates the data transfer and s witches to its St and­by mode.
10/25
M24256-B, M24128-B
MAXI MUM RATIN G
Stressing the device above the rating listed in t he Absolute Maximum Ratings" table may cause per­manent damage to the device. These are stress ratings only and operation of the device at t hese or any other conditions ab ove those i ndicated in t he Operating sections of this specificat ion is not im-
Table 6. Absolute Maximum Ratings
Symbol Parameter Min. Max. Unit
T
T
STG
LEAD
Storage Temperature –65 150 °C
Lead Temperature during Soldering
PDIP: 10 seconds SO: 20 seconds (max) TSSOP: 20 seconds (max)
plied. Exposure to Absolute Maximum Rating con­ditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality docu­ments.
1
1
260 235 235
°C
V
IO
V
CC
V
ESD Electrostatic Discharge Voltage (Human Body model)
Note: 1. IPC/JEDEC J-STD-020A
2. JEDEC Std JE SD22-A114A (C1=100 pF, R1=15 00
Input or Output range
Supply Voltage
-V voltage range all other voltage ranges
-V voltage range all other voltage ranges
2
, R2=500 Ω)
–0.6 –0.6
–0.3 –0.3
4.2
6.5
4.2
6.5
–3000 3000 V
V
V
11/25
M24256-B, M24128-B
DC AND AC PARAMETERS
This section summarizes the operat ing and mea­surement conditions, and the DC and AC charac­teristics of the device. The parameters in the DC and AC Characteristic tables that follow are de­rived from tests performed under the Measure-
Table 7. Operating Conditions (M24xxx-B)
Symbol Parameter Min. Max. Unit
ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit matc h the measurem ent conditions when relying on the quoted parame­ters.
V
CC
T
A
Supply Voltage 4.5 5.5 V Ambient Operating Temperature –40 8 5 °C
Table 8. Operating Conditions (M24xxx-BV)
Symbol Parameter Min. Ma x. Unit
V
CC
T
A
Supply Voltage 2.5 3.6 V Ambient Operating Temperature –40 8 5 °C
Table 9. Operating Conditions (M24xxx-BW)
Symbol Parameter Min. Ma x. Unit
V
CC
T
A
Supply Voltage 2.5 5.5 V Ambient Operating Temperature –40 8 5 °C
Table 10. Operating Conditions (M24xxx-BR)
Symbol Parameter Min. Ma x. Unit
V
CC
T
A
Supply Voltage 1.8 5.5 V Ambient Operating Temperature –40 8 5 °C
Table 11. Operating Conditions (M24xxx-BS)
Symbol Parameter Min. Ma x. Unit
V
CC
T
A
Supply Voltage 1.8 3.6 V Ambient Operating Temperature –40 8 5 °C
Table 12. AC Measurement Conditions
Symbol Parameter Min. Ma x. Unit
12/25
C
L
Load Capacitance 100 pF Input Rise and Fall Times 50 ns
to 0.8V
Input Levels Input and Output Timing Reference Levels
0.2V
0.3V
CC
to 0.7V
CC
CC
CC
V V
Figure 10. AC Measurement I/O Waveform
M24256-B, M24128-B
Input Levels
0.8V
CC
0.2V
CC
Timing Reference Levels
Table 13. Input Parameters
Symbol
C
IN
C
IN
Z
L
Z
H
t
NS
Note: 1. TA = 25 °C, f = 400 kHz
2. Sampled only, not 100% tested.
Input Capacitanc e (SDA) 8 pF Input Capacitance (other pins) 6 pF Input Impedance
(E2, E1, E0, WC Input Impedance
(E2, E1, E0, WC Pulse width ignored
(Input Filter on SCL and SDA)
Parameter
1,2
)
)
Test Condition Min. Max. Unit
< 0.5 V 30 k
V
IN
> 0.7V
V
IN
CC
Single glitch 100 ns
Table 14. M24xxx-BV Power-Up Timing and Vth Threshol d
Symbol
Parameter
1
Test Condition Min. Max. Unit
Input and Output
0.7V
CC
0.3V
CC
AI00825B
500 k
t V
Note: 1. These pa rameters are characterized only.
Time delay to Read or Write instruction 200
PU
Threshold Voltage 1.4 1.6 V
th
Table 15. DC Characteristics (M24xxx-B)
Symbol Parameter
Input Leakage Current
I
LI
(SCL, SDA) I I
I
CC1
V
V
V
Output Leakage Current V
LO
Supply Current
CC
Stand-by Supply Current
Input Low Voltage (SCL, SDA) –0.3 0.3V
IL
Input Low Voltage
(E2, E1, E0, WC
Input High Voltage
IH
(E2, E1, E0, SCL, SDA, WC
Output Low Voltage IOL = 3 mA, VCC = 5 V 0.4 V
OL
)
)
Test Condition
(in addition to those in Table 7)
VIN= VSS orV
CC
device in Stand-by mode
= VSS or V
OUT
V
=5V, fc=400kHz (rise/fall time < 30ns)
CC
V
= VSS orVCC, VCC= 5 V
IN
SDA in Hi-Z ± 2 µA
CC,
Min. Max. Unit
± 2 µA
2mA
10 µA
CC
–0.3
0.7V
CC
0.5
VCC+1
s
µ
V
V
V
13/25
M24256-B, M24128-B
Table 16. DC Characteristics (M24xxx-BV)
Symbol Parameter
Input Leakage Current
I
LI
(SCL, SDA)
Test Condition
(in addition to those in Table 8)
VIN= VSS orV
CC
device in Stand-by mode
Min.
Max. Unit
± 2 µA
I
I
I
CC1
Output Leakage Current V
LO
Supply Current
CC
Stand-by Supply Current
V
CC
Input Low Voltage (SCL, SDA) –0.3 0.3V
V
IL
Input Low Voltage
(E2, E1, E0, WC
V
V
Input High Voltage
IH
(E2, E1, E0, SCL, SDA, WC
Output Low Voltage IOL = 2.1 mA, VCC = 2.7 V 0.4 V
OL
)
)
Table 17. DC Characteristics (M24xxx-BW)
Symbol Parameter
Input Leakage Current
I
LI
(SCL, SDA) I
I
I
CC1
V
Output Leakage Current V
LO
CC
Supply Current
V
CC
Stand-by Supply Current
Input Low Voltage (SCL, SDA) –0.3
IL
Input Low Voltage
(E2, E1, E0, WC
)
= VSS or V
OUT
SDA in Hi-Z ± 2 µA
CC,
=2.7V, fc=400kHz (rise/fall time < 30ns)
V
= VSS orVCC, VCC= 2.7 V
IN
Test Condition
(in addition to those in Table 9)
VIN= VSS orV
CC
device in Stand-by mode
= VSS or V
OUT
SDA in Hi-Z ± 2 µA
CC,
=2.5V , fc=400kHz (rise/fall time < 30ns)
V
= VSS orVCC, VCC= 2.5 V
IN
2mA 2µA
CC
–0.3
0.7V
Min.
CCVCC
0.5
+0.6
Max. Unit
± 2 µA
1mA 2µA
0.3V
CC
–0.3 0.5 V
V
V
V
V
14/25
V
V
Input High Voltage
IH
(E2, E1, E0, SCL, SDA, WC
Output Low Voltage IOL = 2.1 mA, VCC = 2.5 V 0.4 V
OL
)
0.7V
CC
VCC+1 V
Table 18. DC Characteristics (M24xxx-BR)
Symbol Parameter
Input Leakage Current
I
LI
(SCL, SDA)
Test Condition
(in addition to those in Table 10)
VIN= VSS or V
CC
device in Stand-by mode
M24256-B, M24128-B
Min.
Max. Unit
± 2 µA
Output Leakage Current V
LO
Supply Current
CC
Stand-by Supply Current
V
CC
I
I
I
CC1
Input Low Voltage (SCL, SDA) –0.3
V
IL
Input Low Voltage
(E2, E1, E0, WC
V
V
Note: 1. This is Preliminary Data
Input High Voltage
IH
(E2, E1, E0, SCL, SDA, WC
Output Low Voltage
OL
)
)
Table 19. DC Characteristics (M24xxx-BS)
Symbol Parameter
Input Leakage Current
I
LI
(SCL, SDA)
Output Leakage Current V
LO
CC
Supply Current
V
CC
Stand-by Supply Current VIN= VSS orVCC, VCC= 1.8 V
I
I
I
CC1
= VSS orV
OUT
SDA in Hi-Z ± 2 µA
CC,
=1.8V , fc=100kHz (rise/fall time < 30ns)
V
= VSS orVCC, VCC= 1.8 V
IN
I
= 0.7 mA, VCC = 1.8 V
OL
Test Condition
(in addition to those in Table 11)
VIN= VSS or V
CC
device in Stand-by mode
= VSS orV
OUT
SDA in Hi-Z ± 2 µA
CC,
=1.8V , fc=400kHz (rise/fall time < 30ns)
1
0.8
1
1
0.3 V
CC
–0.3 0.5 V
CC
VCC+1
1
0.2
Max. Unit
0.7V
Min.
± 2 µA
1
0.5
1
1
mA
µA
V
V
V
mA
µA
Input Low Voltage (SCL, SDA) –0.3
V
IL
Input Low Voltage
(E2, E1, E0, WC
V
V
Note: 1. This is Preliminary Data
Input High Voltage
IH
(E2, E1, E0, SCL, SDA, WC
Output Low Voltage
OL
0.3 V
)
)
I
= 0.7 mA, VCC = 1.8 V
OL
–0.3 0.5 V
CC
VCC+0.6
0.7V
0.2
V
CC
V
1
V
15/25
M24256-B, M24128-B
Table 20. AC Characteristics (M24xxx-B, M24xxx-BW)
Test conditions specified in Table 12 and Table 7 or 9
Symbol Alt. Parameter Min. Max. Unit
f
C
t
CHCL
t
CLCH
t
CH1CH2
t
CL1CL2
2
t
DH1DH2
2
t
DL1DL2
t
DXCX
t
CLDX
t
CLQX
3
t
CLQV
1
t
CHDX
t
DLCL
t
CHDH
t
DHDL
t
W
Note: 1. For a reST A RT condition, or fo l l o wing a Write cycl e.
2. Sampled only, not 100% tested.
3. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
4. The Write Time of 5 ms on ly applies to M24128-B an d M24 128-BW de vices bearing the process letter “B” in the package marking (on the top side of the package, on the right side), otherwise the Write Time is 10 ms. For further details, please contact your nearest ST sales offic e, and ask for a c opy of the M24128 Product Change Notice.
f
SCL
t
HIGH
t
LOW
t
R
t
F
t
R
t
F
t
SU:DAT
t
HD:DAT
t
DH
t
AA
t
SU:STA
t
HD:STA
t
SU:STO
t
BUF
t
WR
Clock Frequency 400 kHz Clock Pulse Width High 600 ns Clock Pulse Width Low 1300 ns Clock Rise Time 300 ns Clock Fall Time 300 ns SDA Rise Time 20 300 ns
SDA Fall Time 20 300 ns Data In Set Up Time 100 ns Data In Hold Time 0 ns Data Out Hold Time 200 ns Clock Low to Next Data Valid (Access Time) 200 900 ns Start Condition Set Up Time 600 ns Start Condition Hold Time 600 ns Stop Condition Set Up Time 600 ns Time between Stop Condition and Next Start
Condition
Write Time
1300 ns
10
4
or
5
ms
16/25
M24256-B, M24128-B
Table 21. AC Characteristics (M24xxx-BV, M24xxx-BR, M24xxx-BS )
Test conditions specified in Table 12 and Table 8 or 10 or 11
Symbol Alt. Parameter Min. Max. Unit
f
C
t
CHCL
t
CLCH
t
CH1CH2
t
CL1CL2
2
t
DH1DH2
2
t
DL1DL2
t
DXCX
t
CLDX
t
CLQX
3
t
CLQV
1
t
CHDX
t
DLCL
t
CHDH
t
DHDL
t
W
Note: 1. For a reST A RT condition, or fo l l o wing a Write cycl e.
2. Sampled only, not 100% tested.
3. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
f
SCL
t
HIGH
t
LOW
t
R
t
F
t
R
t
F
t
SU:DAT
t
HD:DAT
t
DH
t
AA
t
SU:STA
t
HD:STA
t
SU:STO
t
BUF
t
WR
Clock Frequency 400 kHz Clock Pulse Width High 600 ns Clock Pulse Width Low 1300 ns Clock Rise Time 300 ns Clock Fall Time 300 ns SDA Rise Time 20 300 ns
SDA Fall Time 20 300 ns Data In Set Up Time 100 ns Data In Hold Time 0 ns Data Out Hold Time 200 ns Clock Low to Next Data Valid (Access Time) 200 900 ns Start Condition Set Up Time 600 ns Start Condition Hold Time 600 ns Stop Condition Set Up Time 600 ns Time between Stop Condition and Next Start
Condition
1300 ns
Write Time 10 ms
17/25
M24256-B, M24128-B
Figure 11. AC Waveforms
SCL
SDA In
SCL
SDA In
SCL
tCHCL
tDLCL
tCHDX
START
Condition
tCHDH
STOP
Condition
tCLQV tCLQX
SDA Input
tCLCH
SDA
Change
tW
Write Cycle
tDXCXtCLDX
tCHDH tDHDL
tCHDX
START
Condition
STOP
Condition
START
Condition
SDA Out
Data Valid
AI00795C
18/25
PACKAGE MECHANICAL
PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline
M24256-B, M24128-B
b2
A2
A1AL
be
D
8
E1
1
Notes: 1. Drawing is not to scale.
E
c
eA eB
PDIP-B
PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data
Symb.
Typ. Min. Max. Typ. Min. Max.
A 5.33 0.210
A1 0.38 0.015
mm inches
A2 3.30 2.92 4.95 0.130 0.115 0.195
b 0.46 0.36 0.56 0.018 0.014 0.022
b2 1.52 1.14 1.78 0.060 0.045 0.070
c 0.25 0.20 0.36 0.010 0.008 0.014 D 9.27 9.02 10.16 0.365 0.355 0.400 E 7.87 7.62 8.26 0.310 0.300 0.325
E1 6.35 6.10 7.11 0.250 0.240 0.280
e 2.54 0.100
eA 7.62 0.300 – eB 10.92 0.430
L 3.30 2.92 3.81 0.130 0.115 0.150
19/25
M24256-B, M24128-B
SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Ou tline
h x 45˚
Note: Drawing is not to scale.
B
SO-a
A
e
D
N
1
CP
E
H
C
LA1 α
SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
Symb.
Typ. Min. Max. Typ. Min. Max.
mm inches
20/25
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157
e 1.27 0.050 – H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.020
L 0.40 0.90 0.016 0.035
α
N8 8
CP 0.10 0.004
M24256-B, M24128-B
SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Outline
Note: Drawing is not to scale.
A2
B
e
D
N
1
SO-b
CP
E
H
A
C
LA1 α
SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Mechanical Data
Symb.
Typ. Min. Max. Typ. Min. Max.
mm inches
A 2.03 0.080
A1 0.10 0.25 0.004 0.010 A2 1.78 0.070
B 0.35 0.45 0.014 0.018 C 0.20 0.008 – D 5.15 5.35 0.203 0.211 E 5.20 5.40 0.205 0.213
e 1.27 0.050 – H 7.70 8.10 0.303 0.319
L 0.50 0.80 0.020 0.031
α
10° 10°
N8 8
CP 0.10 0.004
21/25
M24256-B, M24128-B
TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline
D
8
1
CP
Notes: 1. Drawing is not to scale.
5
EE1
4
A2A
eb
A1
L1
TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mec han ical Data
Symbol
Typ. Min. Max. Typ. Min. Max.
A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413
b 0. 190 0.300 0.0075 0.0118
c 0.090 0.200 0.0035 0.0079
mm inches
c
α
L
TSSOP8AM
22/25
CP 0.100 0.0039
D 3.000 2. 900 3.100 0.1181 0.1142 0.1220
e 0.650 0.0256 – E 6 .400 6.200 6.600 0.2520 0.2441 0.2598
E1 4.400 4.300 4.500 0.1732 0.1693 0.1772
L 0.600 0. 450 0.750 0.0236 0.0177 0.0295
L1 1.000 0.0394
α
M24256-B, M24128-B
PART NUMBERING
Table 22. Ordering Information Scheme
Example: M24256 – B W MN 6 T
Device Type
2
M24 = I
Device Function
256 = 256 Kbit (32K x 8) 128 = 128 Kbit (16K x 8)
Operating Voltage
blank V W R
S = V
Package
BN = PDIP8 MN = SO8 (150 mil width)
MW DW = TSSOP8 (169 mil width)
C serial access EEPROM
4
= VCC = 4.5 to 5.5V
2
= VCC = 2.5 to 3.6V
4
= VCC = 2.5 to 5.5V
3
= VCC = 1.8 to 5.5V
= 1.8 to 3.6V
CC
1
= SO8 (200 mil width)
Temperature Range
6 = –40 to 85 °C
Option
T = Tape & Reel Packing
Note: 1. Availa bl e only on reques t ( by preference, please use M N, SO8 150 mil widt h, package inst ead.
2. Avai l able for the M24256-B onl y.
3. Avai l able for the M24128-B onl y.
4. M 24256- B an d M2 425 6-BW beari ng t he proc ess let ter “ V” in th e pac kage mark ing, a nd M 24 128-B and M 241 28- BW b ear ing the process letter “B” in the package marking (on the top side of the package, on the right side), guarantee more than 1 million Erase/ Write cycle endurance. For more in formation about thes e devices , and thei r device i dentificati on, please contact your neares t ST sales offi ce, and ask for the Product Change Notice.
For a list of available options (speed, package, etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales O f­fice.
23/25
M24256-B, M24128-B
REVISION HIST ORY
Table 23. Document Revision History
Date Rev. Description of Revision
28-Dec-1999 2.1 TSSOP8 package added
24-Feb-2000 2.2
22-Nov-2000 2.3 -V voltage range added
30-Jan-2001 2.4
01-Jun-2001 2.5
E2, E1, E0 must be tied to Vcc or Vss Low Pass Filter Time Constant changed to Glitch Filter
-V voltage range changed to 2.5V to 3.6V Lead Soldering Temperature in the Absolute Maximum Ratings table amended Write Cycle Polling Flow Chart using ACK illustration updated. SO8(wide) package added References to PSDIP8 changed to PDIP8, and Package Mechanical data updated
-R voltage range added. Package mechanical data updated for TSSOP8 and TSSOP14 packages according to JEDEC\MO-153 Document promoted from “Preliminary Data” to “Full Data Sheet”
16-Oct-2001 2.6
09-Nov-2001 2.7 Specification of Test Condition for Leakage Currents in the DC Characteristics table improved
21-Mar-2002 2.8
18-Oct-2002 3.0
20-Nov-2002 3.1
TSSOP14 package removed Absolute Max Ratings and DC characteristics updated for M24256-BV
1 million Erase/Write cycle endurance for M24256-B and M24256-BW products with process letter "V"
Document reformatted. Parameters changed are: 1 million Erase/Write cycle endurance and 5 ms write time for M24128-B and M24128-BW products with process letter "B".
Superfluous (and incorrectly present) 100kHz AC Characteristics table for M24256-BR removed.
24/25
M24256-B, M24128-B
Information furnishe d is bel i eved to be accurate and reliable. However, STM icroelectro ni cs assumes no resp onsibility for t he co nsequen ces of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or oth erwise unde r any paten t or patent ri ghts of STMi croelectronics. Spec i fications mentioned in this publ ication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authoriz ed for use as crit i cal component s i n l i fe support dev i ces or systems wi thout express written ap proval of STMic roelectronics.
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