Intended for analog and digital satellite receivers,
the LNBP is a monolithic linear voltage regulator,
assembled in the DFN8 (5 x 6) and IPPAK
packages, specifically designed to provide the
powering voltages and the interfacing signals to
the LNB down-converter. The regulator output
can be logic controlled for 13 V or 18 V (typ.) by
means of the EN/VSEL 3-state pin for remotely
controlling the LNB. When the IC is powered and
put in standby (EN/VSEL pin at high impedance),
the regulator output is disabled. In order to reduce
power dissipation, the LNBP10L/11L versions (on
DFN package) feature 2 supply inputs: V
V
. These pins must be powered, respectively,
CC2
at 15 V (min.) and 22 V (min.), and an internal
switch will automatically select the appropriate
supply voltage according to the selected output
voltage. The LNBP8L/9L versions (in the IPPAK
package) have only one supply input pin, which
CC1
and
LNBP8L, LNBP9L
LNBP10L, LNBP11L
IPPAK
must be supplied at 22 V (min.). Additionally, the
LNBP10L/11L versions have the LLC pin to
increment the selected output voltage value by 1
V (typ.) to compensate for the excess voltage
drop along the coaxial cable (LLC pin HIGH). An
analog 22 kHz modulation input pin (EXTM) is
available in the LNBP8L and LNBP10L versions.
An appropriate DC blocking capacitor must be
used to couple the modulating signal source to
the EXTM pin. The LNBP10L/11L versions are
also equipped with over-current dynamic
protection: as soon as an overload is detected the
output is shut down for the time T
determined by the capacitor connected between
the CEXT pin and GND. After the time has
elapsed, the output is resumed for a time T
(1/12)*T
(typ.). If the overload is still present,
OFF
the protection circuit will cycle again through T
and T
T
ON+TOFF
until the overload is removed. A typical
ON
value is 1100 ms when a 4.7 µF
external capacitor is used on the C
dynamic operation can greatly reduce the power
dissipation in short-circuit condition, while
ensuring excellent power-on startup even with
highly capacitive loads on the LNB outputs. The
device is packaged in the IPPAK for through-hole
mounting and in the DFN8 (5 x 6) for surface
mounting. Both package solutions are offered in
two versions: with ten pins (LNBP9L/11L) to use
with the integrated 22 kHz tone generator, or with
the EXTM pin (LNBP8L/10L) to use external 22
kHz sources. All versions have built-in thermal
protection to prevent overheating damage.
Figure 2.Pin connections (top view for IPPAK, bottom view for DFN8)
IPPAK
Table 1.Pin description
Pin n° (DFN)
LNBP10/11L
1-
21
32OUTPUT
4, ePAD3, ePADGROUNDGROUND
64EN/VSEL
55EXTM/TEN
Pin n°
(IPPAK)
LNBP8/9L
NamePin function
VCC1
(not available for
IPPAK)
VCC2
pin for
(V
CC
IPPAK)
Supply input 1: 15 V to 25 V supply. For DFN package it is
automatically selected when V
V
supplied at 22 V min.
Supply input 2: 22 V to 25 V supply. For DFN package it is
automatically selected when V
V
supplied at 22 V min.
Output: regulator output. It is 13 V typ when EN/VSEL LOW and
18 V typ when EN/VSEL HIGH.
Enable and output voltage selection 3-state pin: logic control
input 3-state pin for the remote controlling of the LNB; if LOW
V
IC is set in shut down mode (V
Tone enable (LNBP9-11): logic control input to enable internal
tone generator.
External modulation (LNBP8-10): Needs DC decoupling to the
AC source. If not used can be left floating.
and V
CC1
and V
CC1
= 13 V, when HIGH V
OUT
are internally connected together to pin 1 to be
CC2
are internally connected together to the pin 1 to be
CC2
DFN8 (5 x 6 mm)
= 13 V. For IPPAK package
OUT
= 18 V. For IPPAK package
OUT
= 18 V, if left at high impedance the
OUT
OUT
= 0 V)
8NALLCLLC: logic control input to add 1 V typ.
C
: timing capacitor used by the dynamic overload protection.
7NAC
EXT
EXT
Typical application is 4.7 µF for a 1100 ms cycle
4/21Doc ID 15153 Rev 2
LNBP8L, LNBP9L, LNBP10L, LNBP11LMaximum ratings
3 Maximum ratings
Table 2.Absolute maximum ratings
SymbolParameterValueUnit
VCC1, VCC2Input voltages-0.3 to 28V
VCC1-OUTPUTVCC1 voltage with respect to OUTPUT voltage
VCC2-OUTPUTVCC2 voltage with respect to OUTPUT voltage
EN/VSEL, TEN,
LLC
EXTMExternal modulation input voltage -0.3 to 1V
OUTPUTOutput voltage-0.3 to 25V
T
STG
ESD
DFN package
Logic input voltage-0.3 to 7V
Storage temperature range-50 to 150°C
ESD rating with human body model (HBM) for all pins except 1, 2, 62kV
ESD rating with human body model (HBM) for pins 1, 2, 61.5
(1)
(1)
-0.3 to 25V
-0.3 to 25V
ESD
IPPAK package
1. Exposure beyond the VCC1 and VCC2 with respect to OUTPUT absolute-maximum-rated voltages during OUTPUT pin
overload or short-circuit to GROUND may cause permanent damage to the device.
ESD rating with human body model (HBM) for all pins except 1, 42kV
ESD rating with human body model (HBM) for pins 1, 41.5
Note:Absolute maximum ratings are those values beyond which damage to the device may occur.
These are stress ratings only and functional operation of the device at these conditions is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability. All voltage values are with respect to network ground terminal unless
otherwise stated.
Figure 3.Single input supply voltage solution for IPPAK package versions
D1
D1
D1
C1
C1
C1
C1
10µF
10µF
10µF
10µF
C4
C4
C4
C4
10µF
10µF
10µF
10µF
D1
1N4001
1N4001
1N4001
1N4001
MCU I/Os
MCU I/Os
MCU I/Os
MCU I/Os
D3 1N4001
D3 1N4001
D3 1N4001
D3 1N4001
MCU I/Os
MCU I/Os
MCU I/Os
MCU I/Os
C2
C2
C2
C2
220nF
220nF
220nF
220nF
D1 1N4001
D1 1N4001
D1 1N4001
D1 1N4001
C2
C2
C2
C2
220nF
220nF
220nF
220nF
C5
C5
C5
C5
220nF
220nF
220nF
220nF
VCC
VCC
VCC
VCC
LNBP8/9L
LNBP8/9L
LNBP8/9L
LNBP8/9L
EN/VSEL (Tristate )
EN/VSEL (Tristate)
EN/VSEL (Tristate )
EN/VSEL (Tristate)
EXTM or TEN
EXTM or TEN
EXTM or TEN
EXTM or TEN
GND
GND
GND
GND
VCC1
VCC1
VCC1
VCC1
VCC2
VCC2
VCC2
VCC2
LNBP10/11L
LNBP10/11L
LNBP10/11L
LNBP10/11L
LLC
LLC
LLC
LLC
EN/VSEL (Tristate)
EN/VSEL (Tristate
EN/VSEL (Tristate)
EN/VSEL (Tristate
EXTM or TEN
EXTM or TEN
EXTM or TEN
EXTM or TEN
GND
GND
GND
GND
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
CEXT
CEXT
CEXT
CEXT
D2
D2
D2
D2
1N5818
1N5818
1N5818
1N5818
D2
D2
D2
D2
1N5818
1N5818
1N5818
1N5818
23V
23V
23V
23V
C1
C1
C1
C1
10µF
10µF
10µF
10µF
Figure 4.Dual input supply voltage solution for DFN8 (5 x 6 mm) package versions
16V
16V
16V
16V
23V
23V
23V
23V
LNB OUTPUT
LNB OUTPUT
LNB OUTPUT
LNB OUTPUT
C3
C3
C3
C3
100nF
100nF
100nF
100nF
LNB OUTPUT
LNB OUTPUT
LNB OUTPUT
LNB OUTPUT
C3
C3
C3
C3
100nF
100nF
100nF
100nF
C6
C6
C6
C6
4.7µF
4.7µF
4.7µF
4.7µF
Figure 5.Single input supply voltage solution for DFN8 (5 x 6 mm) package versions
D1
D1
D1
23V
23V
23V
23V
C1
C1
C1
C1
10µF
10µF
10µF
10µF
D1
1N4001
1N4001
1N4001
1N4001
R1
R1
R1
R1
15 Ohm >3W
15 Ohm >3W
15 Ohm >3W
15 Ohm >3W
MCU I/Os
MCU I/Os
MCU I/Os
MCU I/Os
C2
C2
C2
C2
220nF
220nF
220nF
220nF
C4
C4
C4
C4
220nF
220nF
220nF
220nF
VCC1
VCC1
VCC1
VCC1
VCC2
VCC2
VCC2
VCC2
LNBP10/11L
LNBP10/11L
LNBP10/11L
LNBP10/11L
LLC
LLC
LLC
LLC
EN/VSEL (Tristate )
EN/VSEL (Tristate )
EN/VSEL (Tristate )
EN/VSEL (Tristate )
EXTM or TEN
EXTM or TEN
EXTM or TEN
EXTM or TEN
GND
GND
GND
GND
OUTPUT
OUTPUT
OUTPUT
OUTPUT
CEXT
CEXT
CEXT
CEXT
D2
D2
D2
D2
1N5818
1N5818
1N5818
1N5818
LNB OUTPUT
LNB OUTPUT
LNB OUTPUT
LNB OUTPUT
C3
C3
C3
C3
100nF
100nF
100nF
100nF
C5
C5
C5
C5
4.7µF
4.7µF
4.7µF
4.7µF
Note:In a single supply configuration with the DFN package, an R1 resistor in the 12-15 Ω range
is recommended to reduce device power dissipation during the 13 V output condition. The
resistor can be omitted, but the power dissipation will increase.
8/21Doc ID 15153 Rev 2
LNBP8L, LNBP9L, LNBP10L, LNBP11LDetailed description and application hints
6 Detailed description and application hints
The LNBPxx is made up of several functional blocks (see Figure 1 on page 3), as described
below:
1.The oscillator is activated by setting the ENT pin (enable tone) = H, and is factorytrimmed at 22 kHz ± 2 kHz, eliminating the need to use external trimming. The rising
and falling edges are maintained in the 5 to 15 µs range (10 µs typ.), to avoid RF
pollution of the receiver. The duty cycle is 50% typ. It modulates the DC output with a ±
0.325 V typ. amplitude and 0 V average. The presence of this signal usually gives the
LNB information about the band to be received.
2. The 3-state enable & V
IC to shutdown mode, depending on the voltage applied on the EN/VSEL pin.
When EN/VSEL is set high (EN/VSEL > 2.2 V), an 18 V output voltage is selected;
when the EN/VSEL is set low (EN/VSEL < 0.8 V), a 13 V output voltage is selected.
If the EN/VSEL pin is left floating (high impedance) or if the pin is set in a range from
1.2 V to 1.8 V (1.5 V typ.), the IC goes into shutdown mode and the output voltage will
be set to 0 V.
This feature changes the LNB polarization type. The LNB switches to horizontal or
vertical polarization depending on the supply voltage it gets from the receiver.
3. For the DFN package, in order to keep the power dissipation of the device as low as
possible, the input selector automatically selects V
when 13 V output is selected (i.e. EN/VSEL is low). If the 18 V output is selected (i.e.
EN/VSEL is high), the V
I
= 350 mA is:
OUT
P
= (23 - 18) x 0.35 = 1.75 W
D
with V
P
= (16 - 13) x 0.35 = 1.05 W
D
with V
For IPPAK package, V
= 23 V (voltage on the V
CC2
= 16 V (voltage on the V
CC1
CC1
single input voltage line (22 V min.) to the V
dissipation is 13 V output. For example: at I
V
pin):
CC
P
= (23 - 13) x 0.35 = 3.5 W
D
4. The line length compensation function is useful when the antenna is connected to the
receiver by a long coaxial cable that adds a considerable DC voltage drop. When the
LCC pin is H, the output voltage selected is increased by about 1 V. This function is
available for the DFN package only.
5. The reference drives all the internal blocks that require a high-precision thermally
compensated voltage source.
6. The LNBPxx has two different protection features, and both turn off the outputs. The
first one protects against overheating (i.e. for T
overload conditions (i.e. for output current > 550 mA) or short-circuit:
a) In the thermal protection case the output is disabled until the chip temperature has
fallen below 140 °C typ. and the LNBPxx output is restored.
b) The overload protection case occurs when output current request is ≥ 500 mA. For
the DFN package only, the IC features dynamic overload and short-circuit
protection. When an overload occurs the device limits the output current for the
selection block, selects the two output voltages or sets the
OUT
; that is, the lowest input voltage,
CC1
input pin is selected. For example, power dissipation at
CC2
and V
pin) and V
CC2
pin) and V
CC1
are internally connected and must be supplied from a
CC2
pin. In this case the worst case power
CC
OUT
= 18 V, and
OUT
= 13 V
OUT
= 350 mA and V
≥ 150 °C), and the second against
J
= 23 V (voltage on the
CC
Doc ID 15153 Rev 29/21
Detailed description and application hintsLNBP8L, LNBP9L, LNBP10L, LNBP11L
time TON depending on the C
has elapsed, the output goes low for a time of T
power dissipated by the device low in overload conditions, and avoids the need for
an oversized heat sink in this condition. For the IPPAK package, when the
overload or the short-circuit occurs, the device clamps the output current in a
range between 550 mA and 850 mA.
7. EXTM modulates the V
The following equation is used to calculate the peak-to-peak voltage of V
Equation 1
V
(AC) = V
OUT
where V
V
EXTM
Figure 6.EXTM application circuit
23V
C1
10µF
. G
OUT
EXTM
D1
1N4001
(AC) and V
C2
220nF
(AC) x G
EXTM
EXTM
is the external modulation gain.
value (see Figure 24 and Figure 25). When TON
EXT
by means of a capacitor connected in series (see Figure 6).
OUT
EXTM
(AC) are, respectively, the peak-to-peak voltage of V
VCC
OUTPUT
LNBP8/9L
= 12 x TON. This keeps the
OFF
OUT
LNB OUTPUT
D2
1N5818
C3
100nF
:
OUT
and
EN/VSEL (Tristate)
Vextm
C4
1µF
EXTM
GND
6.1 Input voltage protection
In some cases two or more receivers share the same coaxial cable, rendering their outputs
hard-paralleled, so the same voltage is present at the outputs of the receivers. If a receiver
is not disconnected at the mains, a current will flow from the OUTPUT to the V
pins, depending the EN/VSEL pin setting. To avoid this, two diodes (only one for the IPPAK
package) in series are recommended at input pins V
diodes do not cause a change at V
, but only a voltage drop, which can be minimized by
OUT
using Schottky diodes. Diodes used in Figure 4 and Figure 5 must withstand a continuous
current of almost 1 A and a breakdown voltage of 30 V (suggested type is 1N4001 or
BYV10-30). Be aware that the minimum voltage needed at the V
considering the voltage drop across the input diodes).
6.2 Single supply for the DFN package
If only one power supply source is available, the V
same power source without affecting the performance of other circuits, at the cost of higher
power losses in the device and higher heat sink surface. Also, in order to reduce the power
dissipation in the device, an appropriate-value resistor can be inserted in series with the
CC1
and V
CC1
and V
or V
CC1
(see Figure 3). These
CC2
pins must be respected,
CC
pins can be powered by the
CC2
CC2
10/21Doc ID 15153 Rev 2
LNBP8L, LNBP9L, LNBP10L, LNBP11LDetailed description and application hints
V
line (see Figure 5). This resistor must be dimensioned considering that the minimum
CC1
voltage on the V
For example, with I
pin must be >= 16 V (15 V if LLC is not used).
CC1
= 500 mA:
OUT
Equation 2
--
--
16)(23
16)(23
V
V
f
≤
≤
R
R
f
10x500
10x500
≅
≅
12 Ω
-3
-3
12 Ω
Where V
is the forward voltage of the input diode D1 (see Figure 5).
f
Power dissipated in this resistor is:
Equation 3
2
2
-
-
32
32
===
RP
RP
D
D
It is recommended to bypass the V
I
I
OUT
OUT
CC1
and V
()
()
pins using 220 nF electrolytic capacitors.
CC2
===
3 W10*500*12*
3 W10*500*12*
6.3 IPPAK mounting and thermal considerations
First, it should be noted that the tab is directly connected to the GND pin, so care must be
taken when the device is connected to a heat-sink. If the heat sink is at a different voltage
than the ground, an electrical insulator must be added between the tab and the heat sink at
the cost of an increase in the thermal resistance. For better thermal performance, an
isolated heat sink or connection to ground is recommended.
Several clips can be used depending on the heat sink type:
●Saddle clips (Figure 7) for slim heat sinks
●U-clips (Figure 8) for thick heat sinks
●Dedicated clips for special shaped heat sinks
Figure 7.IPPAK mounted with a saddle clip
Doc ID 15153 Rev 211/21
Detailed description and application hintsLNBP8L, LNBP9L, LNBP10L, LNBP11L
Figure 8.IPPAK mounted with a U-clip
Note that the thickness of the IPPAK package (2.3 +/- 0.1 mm) is similar to that of the SOT32 and SOT-82 (2.55 +/- 0.15 mm). The same clips can also be used for these packages.
The junction-to-ambient thermal resistance for the IPPAK can be calculated as follows:
Equation 4
R
= R
TH-JA
where: R
data
), R
TH-JC
TH-CH
+ R
TH-JC
TH-CH
is the junction-to-case thermal resistance of the IPPAK (see Ta bl e 4 : Th er ma l
is the case-to-heat sink thermal resistance and the R
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at:
ECOPACK
Figure 26. IPPAK package dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
www.st.com.
16/21Doc ID 15153 Rev 2
0075222
LNBP8L, LNBP9L, LNBP10L, LNBP11LPackage mechanical data
Table 6.IPPAK mechanical data
(mm.)
Dim.
Min.Typ.Max.
A2.202.40
A10.901.10
B0.400.60
B25.205.40
B30.70
B50.30
B61
C0.450.60
C20.480.60
D66.20
E6.406.60
e1.27
G4.905.25
G12.382.70
H15.9016.30
L99.40
L10.801.20
L20.801
V110°
Note:1Controlling dimensions: millimeter.
2Burrs larger than 0.25 mm are not allowed on the upper surface of the dissipater (FRONT)
on the lower surface (REAR) the maximum allowed is: 0.05 mm.
3The side of the dissipater to be connected to the external dissipater must be flat within 30 µ
4The leads size is comprehensive of the thickness of the leads finishing material.
5Package outline exclusive of any mold flashes dimensions and metal burrs.
6Max resin gate protrusion: 0.5 mm.
7Max resin protrusion: 0.25 mm.
8The maximum bent leads allowed, in any direction, is: # 2° if the devices are packed in tube.
LNBP8L, LNBP9L, LNBP10L, LNBP11LOrdering information
9 Ordering information
Table 7.Order codes
Order codes
Part numbers
DFN8 (5 x 6 mm)IPPAK
LNBP8LLNBP8LITTape and reel
LNBP9LLNBP9LITTape and reel
LNBP10LLNBP10LPURTape and reel
LNBP11LLNBP11LPURTape and reel
Packing
Doc ID 15153 Rev 219/21
Revision historyLNBP8L, LNBP9L, LNBP10L, LNBP11L
10 Revision history
Table 8.Document revision history
DateRevisionChanges
11-Nov-20081Initial release.
25-Aug-20102Document status promoted from preliminary data to datasheet.
20/21Doc ID 15153 Rev 2
LNBP8L, LNBP9L, LNBP10L, LNBP11L
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